TWI735787B - Circuit board and manufacturing method thereof - Google Patents
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本發明係關於一種電路板及其製造方法，其晶片無需使用錫膏固定於金屬線路。The invention relates to a circuit board and a manufacturing method thereof, the chip of which does not need to use solder paste to be fixed to the metal circuit.
晶片等電子元件為電子電路中的基本元素，連接電子元件至電路板最常為使用焊接技術，透過焊接可將電子元件電氣連接並得到支撐及固定於電路板上。設置晶片時常用的焊接為表面貼焊(Surface Mount Technology，SMT)，其係將晶片等電子元件貼附於電路板後，使用回焊(reflow)將晶片固定連結至電路板上，回焊係一種將錫膏加熱至焊點後進行焊接，即為焊接的一種。表面貼焊之技術利於生產出輕薄短小的電子產品，且利於大量生產。Electronic components such as chips are the basic elements in electronic circuits. Soldering technology is most commonly used to connect electronic components to circuit boards. Through soldering, electronic components can be electrically connected and supported and fixed on the circuit board. The commonly used soldering when setting up the chip is Surface Mount Technology (SMT). After attaching the chip and other electronic components to the circuit board, the chip is fixedly connected to the circuit board using reflow. The reflow system is One type of soldering is soldering after heating the solder paste to the solder joints. The surface mount technology is conducive to the production of light, thin and short electronic products, and is conducive to mass production.
表面貼焊所使用的回焊技術包含紅外線回焊(infrared reflow)、蒸氣相回焊(vapor phase reflow)、浸漬軟焊(soldering dip)及熱風式回焊(convention reflow)；其中，紅外線回焊為早期的回焊技術，現今皆已使用熱風式回焊。The reflow technology used in surface mount welding includes infrared reflow, vapor phase reflow, soldering dip and convention reflow; among them, infrared reflow As an early reflow technique, hot air reflow has been used today.
焊接時會使用錫膏，又稱焊錫膏或旱膏，其內容物主要為錫粉及助焊劑。錫粉包含有錫、銀、銅及鉍(Bi)等金屬合金，係用以提升焊接後的牢固力。助焊劑包含活性劑、松香、有機溶劑及增稠劑等化學藥劑，係用以讓錫粉之金屬合金在高溫時不易被氧化，且能去除氧化物並隔絕異物。When soldering, solder paste, also known as solder paste or dry paste, is used, and its contents are mainly tin powder and flux. Tin powder contains metal alloys such as tin, silver, copper, and bismuth (Bi), which are used to improve the firmness after welding. The flux contains chemical agents such as activator, rosin, organic solvent and thickener, which is used to prevent the metal alloy of tin powder from being oxidized at high temperature, and can remove oxides and isolate foreign matter.
此外，鑒於對環保議題的重視，許多廠商致力於開發無鹵素及無鉛錫膏，以減少電子產品在製造及回收時對環境的汙染。In addition, in view of the importance of environmental issues, many manufacturers are committed to the development of halogen-free and lead-free solder pastes to reduce environmental pollution during the manufacturing and recycling of electronic products.
晶片設置在電路板會產生不良率之情況，其原因多半出自於焊接時的錫膏印刷不佳。錫膏的使用量、在印刷時的高度、面積、體積及平整度都會對最終的製品有所影響。而當錫膏印刷不良時，會對電子元件造成毀損，並產生架橋(bridge)、偏移(shift)或高度偏差等問題。此外，錫膏的選擇必須考量到表面絕緣阻抗(RSI)、電子遷移、焊錫性、耐塌崩性、助焊劑的殘留性及銅腐蝕性等多項因素。The defect rate of chip placement on the circuit board is mostly due to poor solder paste printing during soldering. The amount of solder paste used, the height, area, volume and flatness during printing will all affect the final product. When the solder paste is poorly printed, it will damage the electronic components and cause problems such as bridges, shifts, or height deviations. In addition, the selection of solder paste must take into account multiple factors such as surface insulation resistance (RSI), electron migration, solderability, collapse resistance, flux residue, and copper corrosion.
為改善上述之問題，本發明欲提供一種無錫膏設置晶片於電路板之方法，由於無錫膏之焊接步驟，可減化製程，以減少製造成本，且利於環境保護。In order to improve the above-mentioned problems, the present invention intends to provide a method for placing a chip on a circuit board without solder paste. Due to the soldering step without solder paste, the manufacturing process can be reduced, the manufacturing cost is reduced, and the environmental protection is facilitated.
是以，本發明之目的為一種電路板之製造方法，其包含提供一基板；於該基板上使用金屬粉或金屬漿形成未固化金屬線路，並設置一或複數個晶片於該未固化金屬線路上；及燒結該未固化金屬線路，使該未固化金屬線路形成固化金屬線路，且該晶片會與該固化金屬線路固定連接。Therefore, the object of the present invention is a method for manufacturing a circuit board, which includes providing a substrate; using metal powder or metal paste on the substrate to form an uncured metal circuit, and arranging one or more chips on the uncured metal circuit On; and sintering the uncured metal circuit so that the uncured metal circuit forms a solidified metal circuit, and the chip will be fixedly connected with the solidified metal circuit.
本發明之另一目的為一種具有晶片之電路板，其包含一基板及一或複數個晶片。其中，該基板上係具有由使用未固化的金屬粉或金屬漿經由燒結固化而成的金屬線路，及該晶片為經由該燒結而成的金屬線路固定連接於該基板上。Another object of the present invention is a circuit board with chips, which includes a substrate and one or more chips. Wherein, the substrate is provided with a metal circuit formed by sintering and solidifying by using uncured metal powder or metal paste, and the chip is fixedly connected to the substrate by the metal circuit formed by the sintering.
進一步地，該燒結溫度為120~350℃；於較佳實施例中，該燒結溫度為220~320℃。Further, the sintering temperature is 120-350°C; in a preferred embodiment, the sintering temperature is 220-320°C.
進一步地，該金屬線路之表面形成的方法包含噴墨印刷法、網印印刷法、平版印刷法、雷射金屬沉積3D列印或電子束3D列印。Further, the method for forming the surface of the metal circuit includes inkjet printing, screen printing, offset printing, laser metal deposition 3D printing, or electron beam 3D printing.
進一步地，該基板包含陶瓷基板、金屬基板、陶瓷金屬複合板、橡膠基板或玻璃基板。Further, the substrate includes a ceramic substrate, a metal substrate, a ceramic metal composite board, a rubber substrate or a glass substrate.
相較於習知電路板之製造方法，本發明之優勢在於本發明之電路板之製造方法，並未使用錫膏進行焊接將晶片固定於電路板，因此可節省焊接製程及錫膏成本，此外對環境具有保護。Compared with the conventional circuit board manufacturing method, the advantage of the present invention is that the circuit board manufacturing method of the present invention does not use solder paste for soldering to fix the chip on the circuit board, so the soldering process and the cost of solder paste can be saved. Protect the environment.
本發明所稱之「包含或包括」意指不排除一或多個其他組件、步驟、操作和/或元素的存在或添加至所述之組件、步驟、操作和/或元素。「一」意指該物的語法對象為一或一個以上(即，至少為一)。The term "comprising or including" as used in the present invention means that one or more other components, steps, operations and/or elements are not excluded or added to the described components, steps, operations and/or elements. "One" means that the grammatical object of the thing is one or more than one (ie, at least one).
以下實施方式不應視為過度地限制本發明。本發明所屬技術領域中具有通常知識者可在不背離本發明之精神或範疇的情況下對本文所討論之實施例進行修改及變化，而仍屬於本發明之範圍。The following embodiments should not be regarded as excessively limiting the present invention. Those with ordinary knowledge in the technical field to which the present invention pertains can modify and change the embodiments discussed herein without departing from the spirit or scope of the present invention, and still fall within the scope of the present invention.
本發明之電路板之製造方法，其包含提供一基板；於該基板上使用金屬粉或金屬漿形成未固化金屬線路，並設置一或複數個晶片於該未固化金屬線路上；及燒結該未固化金屬線路，使該未固化金屬線路形成固化金屬線路，且該晶片會與該固化金屬線路固定連接。The method for manufacturing a circuit board of the present invention includes providing a substrate; using metal powder or metal paste to form an uncured metal circuit on the substrate, and arranging one or more chips on the uncured metal circuit; and sintering the uncured metal circuit The solidified metal circuit makes the uncured metal circuit form a solidified metal circuit, and the chip will be fixedly connected with the solidified metal circuit.
本發明中，所述的基板包含陶瓷基板、金屬基板、金屬陶瓷複合基板、橡膠基板或玻璃基板。In the present invention, the substrate includes a ceramic substrate, a metal substrate, a metal ceramic composite substrate, a rubber substrate or a glass substrate.
本發明中，所述的陶瓷基板之材料可為硼矽酸系玻璃粉末及各種金屬氧化物、碳化物、氮化物、硼化物、矽化物或其等之組合，例如碳化矽(SiC)、氮化矽(Si3 N4 )、氮化鋁(AIN)、氧化鋁(Al2 O3 )、碳化鈦(TiC)、硼化鈦(TiB2 )、碳化硼(B4 C)、鋯酸鈦酸鉛及鐵酸錳等，本發明不限於此等，且可為任一種或二種以上之組合使用。In the present invention, the material of the ceramic substrate can be borosilicate glass powder and various metal oxides, carbides, nitrides, borides, silicides or combinations thereof, such as silicon carbide (SiC), nitrogen Silicon (Si 3 N 4 ), aluminum nitride (AIN), aluminum oxide (Al 2 O 3 ), titanium carbide (TiC), titanium boride (TiB 2 ), boron carbide (B 4 C), titanium zirconate Lead acid, manganese ferrite, etc., the present invention is not limited to these, and any one or a combination of two or more can be used.
本發明中，所述的金屬基板之材料可為銅、鋁、銅合金或鋁合金，例如該銅合金包含銅鋅合金、銅錫合金、銅鋁合金、銅矽合金或銅鎳合金；該鋁合金包含鋁矽合金、鋁鎂矽合金、鋁銅合金、鋁鎂合金、鋁錳合金、鋁鋅合金或鋁鋰合金；其中，以鋁、鋁合金、銅或銅合金為較佳；該金屬基層之金屬可為前述任一種或二種以上所組合之金屬，且本發明不限於此等。In the present invention, the material of the metal substrate can be copper, aluminum, copper alloy or aluminum alloy. For example, the copper alloy includes copper-zinc alloy, copper-tin alloy, copper-aluminum alloy, copper-silicon alloy or copper-nickel alloy; Alloys include aluminum-silicon alloy, aluminum-magnesium-silicon alloy, aluminum-copper alloy, aluminum-magnesium alloy, aluminum-manganese alloy, aluminum-zinc alloy or aluminum-lithium alloy; among them, aluminum, aluminum alloy, copper or copper alloy is preferred; the metal base layer The metal may be any one or a combination of two or more of the foregoing metals, and the present invention is not limited to these.
本發明中，所述的金屬陶瓷複合基板可為上述之陶瓷材料及金屬材料複合而成之基板；較佳地，所述的金屬陶瓷複合基板之結構包含一金屬基板、以及設置於該金屬基層外側的陶瓷層，且本發明不限於此等。In the present invention, the cermet composite substrate may be a substrate composed of the above-mentioned ceramic materials and metal materials; preferably, the structure of the cermet composite substrate includes a metal substrate and a metal base layer The outer ceramic layer, and the present invention is not limited to this.
本發明中，所述的橡膠基板可為通用的樹脂基板，其材料包含酚醛樹脂(Phenolic)、聚亞醯胺樹脂(Polyimide)、環氧樹脂(Epoxy)、聚四氟乙烯(Polytetrafluorethylene；PTFE；TEFLON)或B-三氮樹脂(BismaleimideTriazine；BT)等熱固性樹脂，且本發明不限於此等。In the present invention, the rubber substrate can be a general resin substrate, and its material includes phenolic resin (Phenolic), polyimide resin (Polyimide), epoxy resin (Epoxy), polytetrafluoroethylene (Polytetrafluorethylene; PTFE; TEFLON) or B-trinitrogen resin (Bismaleimide Triazine; BT) and other thermosetting resins, and the present invention is not limited to these.
本發明中，所述的玻璃基板之材料可為氧化銦錫(ITO)、含氟氧化錫璃(SnO2 :F)(FTO)等光學用玻璃，且本發明不限於此等。In the present invention, the material of the glass substrate can be optical glass such as indium tin oxide (ITO), fluorine-containing tin oxide glass (SnO 2 :F) (FTO), and the present invention is not limited to these.
本發明中，所述的金屬粉末及金屬漿形成未固化金屬線路之方法可為習知的印刷電路方法，例如噴墨印刷法、網印印刷法及平版印刷法，或是積層製造之3D列印，例如雷射金屬沉積3D列印及電子束3D列印，將製備金屬線路的金屬粉末印製於該陶瓷層表面，且本發明不限於，並以雷射金屬沉積3D列印及電子束3D列印為較佳；其中，該金屬粉末及金屬漿包含金屬、合金或複合金屬等，例如銀、銅、金、鋁、鈉、鉬、鎢、鋅、鎳、鐵、鉑、錫、鉛、銀銅、鎘銅、鉻銅、鈹銅、鋯銅、鋁鎂矽、鋁鎂、鋁鎂鐵、鋁鋯、鐵鉻鋁合金等一種或二種以上所混合的金屬粉末，且本發明不限於此等，其中金屬粉末以鋁、金、銀及銅為較佳。In the present invention, the method for forming the uncured metal circuit with the metal powder and the metal paste can be a conventional printed circuit method, such as inkjet printing, screen printing, and lithography, or a 3D line made by layering. Printing, such as laser metal deposition 3D printing and electron beam 3D printing, the metal powder for preparing metal circuits is printed on the surface of the ceramic layer, and the present invention is not limited to laser metal deposition 3D printing and electron beam 3D printing is preferred; wherein, the metal powder and metal paste include metals, alloys or composite metals, such as silver, copper, gold, aluminum, sodium, molybdenum, tungsten, zinc, nickel, iron, platinum, tin, lead , Silver copper, cadmium copper, chromium copper, beryllium copper, zirconium copper, aluminum-magnesium-silicon, aluminum-magnesium, aluminum-magnesium-iron, aluminum-zirconium, iron-chromium-aluminum and other metal powders, and the present invention does not Limited to these, among them, the metal powder is preferably aluminum, gold, silver, and copper.
本發明中，所述的固化金屬線路之厚度為0.5至40μm，例如0.5μm、1μm、5μm、10μm、15μm、20μm、25μm、30μm、35μm或40μm；線徑寬度為0.5μm以上，且固化金屬線路亦可為全面分布基板之上。 In the present invention, the thickness of the solidified metal circuit is 0.5 to 40μm, such as 0.5μm, 1μm, 5μm, 10μm, 15μm, 20μm, 25μm, 30μm, 35μm or 40μm; the wire diameter width is 0.5μm or more, and the solidified metal The circuit can also be distributed on the substrate.
本發明中，所述的晶片包含IC晶片、裸晶晶片、LED晶片、自轉輪二極體(Free Wheeling Diode；FWD)或絕緣閘極雙極電晶體(Insulated Gate Bipolar Transistor；IGBT)等不同功能之晶片，且本發明不限於此等；此外，晶片之類型可包含水平晶片、垂直晶片、覆晶晶片、晶圓級封裝晶片(CSP)等，且本發明不限於此等。 In the present invention, the chip includes IC chip, bare crystal chip, LED chip, Free Wheeling Diode (FWD) or Insulated Gate Bipolar Transistor (IGBT), etc. Functional chips, and the invention is not limited to these; in addition, the types of chips can include horizontal chips, vertical chips, flip-chip chips, wafer level package chips (CSP), etc., and the invention is not limited to these.
本發明中，所述的燒結溫度為120~350℃，例如120℃、130℃、140℃、150℃、160℃、170℃、180℃、190℃、200℃、210℃、220℃、230℃、240℃、250℃、260℃、270℃、280℃、290℃、300℃、310℃、320℃、330℃、340℃或350℃；其中，以220~320℃為較佳。若燒結溫度過高時會對晶片及基板造成損傷，影響電性功能及減少使用壽命，而若燒結溫度過低時則會造成線路接著不完全或斷路等問題。 In the present invention, the sintering temperature is 120~350℃, such as 120℃, 130℃, 140℃, 150℃, 160℃, 170℃, 180℃, 190℃, 200℃, 210℃, 220℃, 230 ℃, 240℃, 250℃, 260℃, 270℃, 280℃, 290℃, 300℃, 310℃, 320℃, 330℃, 340℃ or 350℃; among them, 220~320℃ is preferred. If the sintering temperature is too high, it will damage the chip and the substrate, affect the electrical functions and reduce the service life. If the sintering temperature is too low, it will cause problems such as incomplete circuit connection or open circuit.
本發明之電路板可用於任意之需電路板操作之電子裝置或電子產品中，例如發光二極體、電腦、智慧型手機、平板電腦或音響等，且本發明不限於此等。 The circuit board of the present invention can be used in any electronic device or electronic product that requires circuit board operation, such as light-emitting diodes, computers, smart phones, tablet computers, or audio, etc., and the present invention is not limited to these.
在下文中，將利用具體實施例特別描寫本發明所揭示之內容。然而，本發明所揭示之內容不限制於下列範例。 In the following, specific embodiments will be used to specifically describe the content disclosed by the present invention. However, the content disclosed in the present invention is not limited to the following examples.
實例1.本發明之電路板之製造方法Example 1. The manufacturing method of the circuit board of the present invention
請參閱圖1，係本發明之電路板之製造方包含提供一基板1；於該基板1上使用噴墨印刷機3將金屬漿噴塗於該基板1上，形成未固化金屬線路2’，並設置複數個LED晶片4於該未固化金屬線路上；隨後，於200℃下進行燒結，
該未固化金屬線路2’則會形成固化金屬線路2，而該LED晶片4會與該固化金屬線路2固定連接於該基板上。
Please refer to FIG. 1, the manufacturer of the circuit board of the present invention includes providing a
實例2.本發明之具有晶片之電路板作為LED電子元件Example 2. Circuit board with chip of the present invention as LED electronic component
請參閱圖2，其係將實施例1所獲得之電路板進而設置二個電極5於該基板兩側，並與該固化金屬線路2進行電性導通，即LED晶片可發光，即獲得LED電子元件。
Please refer to Fig. 2, which is the circuit board obtained in Example 1 and two
綜上所述，本發明之電路板及其製造方法，由於無須使用錫膏進行焊接將晶片固定於電路板，既可利於製程上減少焊接步驟以及錫膏成本，且可減少對環境的汙染，因此本發明之電路板及其製造方法具有產業利用性。 To sum up, the circuit board and the manufacturing method of the present invention do not need to use solder paste for soldering to fix the chip on the circuit board, which can help reduce the soldering steps and the cost of solder paste in the manufacturing process, and can reduce environmental pollution. Therefore, the circuit board and the manufacturing method of the present invention have industrial applicability.
以上已將本發明做一詳細說明，惟以上所述者，僅為本發明之一較佳實施例而已，當不能以此限定本發明實施之範圍，即凡依本發明申請專利範圍所作之均等變化與修飾，皆應仍屬本發明之專利涵蓋範圍內。 The present invention has been described in detail above, but what is described above is only a preferred embodiment of the present invention, and should not be used to limit the scope of implementation of the present invention, that is, everything made in accordance with the scope of the patent application of the present invention is equal Changes and modifications should still fall within the scope of the patent of the present invention.
1‧‧‧基板2’‧‧‧未固化金屬線路2‧‧‧固化金屬線路3‧‧‧噴墨印刷機4‧‧‧晶片5‧‧‧電極1‧‧‧Substrate 2’‧‧‧Uncured
圖1為本發明之電路板之製造方法。Fig. 1 is a manufacturing method of the circuit board of the present invention.
圖2為本發明之具有晶片之電路板之實施態樣。Fig. 2 is an embodiment of the circuit board with a chip according to the present invention.
1‧‧‧基板 1‧‧‧Substrate
2’‧‧‧未固化金屬線路 2’‧‧‧Uncured metal circuit
2‧‧‧固化金屬線路 2‧‧‧Solid metal circuit
3‧‧‧噴墨印刷機 3‧‧‧Inkjet Printer
4‧‧‧晶片 4‧‧‧Chip
Claims (8)
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| TW107120112A TWI735787B (en) | 2018-06-12 | 2018-06-12 | Circuit board and manufacturing method thereof |
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|---|---|---|---|
| TW107120112A TWI735787B (en) | 2018-06-12 | 2018-06-12 | Circuit board and manufacturing method thereof |
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| Publication Number | Publication Date |
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| TW202002736A TW202002736A (en) | 2020-01-01 |
| TWI735787B true TWI735787B (en) | 2021-08-11 |
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| TW107120112A TWI735787B (en) | 2018-06-12 | 2018-06-12 | Circuit board and manufacturing method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112996274A (en) * | 2021-02-24 | 2021-06-18 | 广州立景创新科技有限公司 | Surface mounting method and semiconductor device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM487591U (en) * | 2013-12-06 | 2014-10-01 | Dsam Applied Materials Ind Co Ltd | Printed circuit board |
| CN107371325A (en) * | 2017-07-13 | 2017-11-21 | 安捷利电子科技（苏州）有限公司 | A kind of method that sensor and printed circuit board are connected using conductive silver paste |
| TWI610601B (en) * | 2016-03-08 | 2018-01-01 | 訊芯電子科技(中山)有限公司 | A double sided copperizing ceramic circuit board and manufacturing method thereof |
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2018
- 2018-06-12 TW TW107120112A patent/TWI735787B/en active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM487591U (en) * | 2013-12-06 | 2014-10-01 | Dsam Applied Materials Ind Co Ltd | Printed circuit board |
| TWI610601B (en) * | 2016-03-08 | 2018-01-01 | 訊芯電子科技(中山)有限公司 | A double sided copperizing ceramic circuit board and manufacturing method thereof |
| CN107371325A (en) * | 2017-07-13 | 2017-11-21 | 安捷利电子科技（苏州）有限公司 | A kind of method that sensor and printed circuit board are connected using conductive silver paste |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112996274A (en) * | 2021-02-24 | 2021-06-18 | 广州立景创新科技有限公司 | Surface mounting method and semiconductor device |
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| Publication number | Publication date |
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| TW202002736A (en) | 2020-01-01 |
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