CN206251434U - A kind of internal layer thick copper plate edges of boards choker bar - Google Patents
A kind of internal layer thick copper plate edges of boards choker bar Download PDFInfo
- Publication number
- CN206251434U CN206251434U CN201621444888.9U CN201621444888U CN206251434U CN 206251434 U CN206251434 U CN 206251434U CN 201621444888 U CN201621444888 U CN 201621444888U CN 206251434 U CN206251434 U CN 206251434U
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- China
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- choker bar
- boards
- wiring board
- internal layer
- thick copper
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Abstract
The utility model is related to a kind of internal layer thick copper plate edges of boards choker bar, the choker bar to be uniformly arranged in wiring board edge, water conservancy diversion raceway groove is left between adjacent choker bar, it is characterised in that towards the one side on the inside of wiring board at least provided with a groove on the choker bar.By setting groove on choker bar, can control circuit board edge gummosis, edges of boards can be reduced again and big copper face phenomenon occurs, so as to the plate bursting problem for effectively preventing thick copper printed wiring board from occurring due to big copper face heat build-up, improve product quality.
Description
Technical field
The utility model is related to printed wiring board to manufacture field, and in particular to a kind of internal layer thick copper plate edges of boards choked flow
Block.
Background technology
As electronics industry is developed rapidly, in fields such as automobile, industrial equipment, electronic communications to high voltage, high current
The demand of printed wiring board is more and more, i.e. the application of multi-layer thick copper printed board is more and more.Multilayer described in the utility model
Thick copper printed board refers to the thick printed wiring board more than 70um of copper, and this wiring board can bear the work of high-voltage large current
Environment.At present, when producing the internal layer in such multi-layer sheet, because interlayer needs filler more, to prevent gummosis, internal layer edges of boards are usually
Choked flow is carried out with square choker bar.Another aspect interlayer needs filler more, is all substantially two or more than two high content PP pieces,
Not so glue lack of fill is easily caused, causes the phenomenons such as thickness of slab inequality Uniform, plate bursting, and when being pressed using multiple high contents PP
Easily there is slide plate phenomenon, riveted or hot melt pattern must be taken to be fixed before pressing.
Current edges of boards choker bar is typically designed using strip, and this design can form big copper face phenomenon in edges of boards edge, due to
Copper（Only 17pm/ DEG C of CTE) with the coefficient of thermal expansion of resin Z-direction（CTE it is) too wide in the gap, thus big copper face area is in powerful heat（Refer to
Integration of the temperature to the time）In be easy to pile up temperature, if temperature is not distributed not go out may result in plate bursting.On the other hand, rise
The rivet hole site of fixation can also be located at edges of boards edge, i.e., big copper face region, general rivet hole hole wall processing is all relatively rough,
Base material be perforated after easy moisture absorption in process, moisture cannot in time discharge and will also result in plate bursting and finally influence after plating bound edge
The quality of finished product wiring board, or even because plate bursting is scrapped.
Utility model content
In order to solve the above problems, the utility model can effectively prevent plate bursting in process of production there is provided a kind of
Internal layer thick copper plate edges of boards choker bar.
The utility model is realized using following scheme：
A kind of internal layer thick copper plate edges of boards choker bar, the choker bar is uniformly arranged in wiring board edge, adjacent choker bar it
Between leave water conservancy diversion raceway groove, towards the one side on the inside of wiring board at least provided with a groove on the choker bar.
Further, the groove is square.
Further, the groove is uniformly distributed on choker bar.
Further, the choker bar is square.
Further, the wiring board is copper thick more than more than 70um printed wiring boards.
Compared with prior art, the utility model has the advantages that：
By setting groove on choker bar, can control circuit board edge gummosis, edges of boards can be reduced again and big copper occurs
Face phenomenon, so as to the plate bursting problem for effectively preventing thick copper printed wiring board from occurring due to big copper face heat build-up, improves product product
Matter.
Brief description of the drawings
Fig. 1 is the choked flow block structural diagram of the present embodiment.
Fig. 2 is the use state figure for being carried out example.
Specific embodiment
For ease of skilled artisan understands that the utility model, below in conjunction with specific embodiments and the drawings to this practicality
It is new to be described in further detail.
Choker bar described in the utility model 1 is square, is provided with groove 2.Groove 2 is also square.Multiple baffles
Assist side edge is uniformly distributed, gap is left per between two neighboring choker bar, as water conservancy diversion raceway groove 3, as shown in Figure 2.
During making, direct-on-line road plate edge forms choker bar and water conservancy diversion raceway groove after being etched again by graphic printing to copper foil layer.Pressure
During conjunction, choker bar can stop that the PP glue after the melting of wiring board both sides is largely excessive, after water conservancy diversion raceway groove 3 is available for PP pieces to melt, on a small quantity
Unnecessary glue outflow, so that circuit board pressing more uniform ground.
Using choked flow is realized with reeded choker bar in the utility model, edges of boards can be reduced and big copper face phenomenon occur, from
And thick copper printed wiring board can be effectively prevented due to plate bursting problem caused by big copper face heat build-up；Has reeded choker bar simultaneously
Also the hole position of edges of boards shop bolt can be avoided, is easy to punch operation, reduce plate bursting problem caused by hole wall hygroscopic effect.
In the present embodiment, a quantity for choker bar upper groove 2 is 2, according to specific service condition, groove 2
Quantity can be 1 or more than 2, and be evenly distributed on choker bar.
Although being carried out with reference to embodiments above to description of the present utility model, it is familiar with the art
Personnel many replacements, modifications and variations can be carried out according to above-mentioned content, be obvious.Therefore, it is all such
Substitute, improvement and change are included in scope of the appended claims.
Claims (5)
1. a kind of internal layer thick copper plate edges of boards choker bar, the choker bar is uniformly arranged in wiring board edge, between adjacent choker bar
Leave water conservancy diversion raceway groove, it is characterised in that towards the one side on the inside of wiring board at least provided with a groove on the choker bar.
2. internal layer thick copper plate edges of boards choker bar according to claim 1, it is characterised in that the groove is square.
3. internal layer thick copper plate edges of boards choker bar according to claim 1, it is characterised in that the groove on choker bar
Even distribution.
4. internal layer thick copper plate edges of boards choker bar according to claim 1, it is characterised in that the choker bar is square.
5. internal layer thick copper plate edges of boards choker bar according to claim 1, it is characterised in that the wiring board is copper thickness 70um
Printed wiring board above.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621444888.9U CN206251434U (en) | 2016-12-27 | 2016-12-27 | A kind of internal layer thick copper plate edges of boards choker bar |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621444888.9U CN206251434U (en) | 2016-12-27 | 2016-12-27 | A kind of internal layer thick copper plate edges of boards choker bar |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206251434U true CN206251434U (en) | 2017-06-13 |
Family
ID=59009063
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621444888.9U Active CN206251434U (en) | 2016-12-27 | 2016-12-27 | A kind of internal layer thick copper plate edges of boards choker bar |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206251434U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110418508A (en) * | 2019-07-15 | 2019-11-05 | 宁波华远电子科技有限公司 | A kind of production method of copper base circuit board |
-
2016
- 2016-12-27 CN CN201621444888.9U patent/CN206251434U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110418508A (en) * | 2019-07-15 | 2019-11-05 | 宁波华远电子科技有限公司 | A kind of production method of copper base circuit board |
| CN110418508B (en) * | 2019-07-15 | 2021-08-31 | 宁波华远电子科技有限公司 | Manufacturing method of copper substrate circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PP01 | Preservation of patent right |
Effective date of registration: 20181204 Granted publication date: 20170613 |
|
| PP01 | Preservation of patent right | ||
| PD01 | Discharge of preservation of patent |
Date of cancellation: 20190603 Granted publication date: 20170613 |
|
| PD01 | Discharge of preservation of patent | ||
| PP01 | Preservation of patent right |
Effective date of registration: 20190603 Granted publication date: 20170613 |
|
| PP01 | Preservation of patent right | ||
| PD01 | Discharge of preservation of patent |
Date of cancellation: 20191203 Granted publication date: 20170613 |
|
| PD01 | Discharge of preservation of patent |