CN2062116U

CN2062116U - Large power semiconductor cooling device

Info

Publication number: CN2062116U
Application number: CN 89219116
Authority: CN
Inventors: 奚旸
Original assignee: ENERGY RESEARCH INSTITUTE OF JIANGXI ACADEMY OF SCIENCES
Current assignee: ENERGY RESEARCH INSTITUTE OF JIANGXI ACADEMY OF SCIENCES
Priority date: 1989-12-25
Filing date: 1989-12-25
Publication date: 1990-09-12

Abstract

The utility model discloses a large power semiconductor cooling device, comprising a positive plate, a negative plate, and a condensing fin tube, characterized in that two polar plates are respectively connected with the evaporating cavity cover of the polar plate in the mode of the sealing. An evaporating cavity is communicated with the condensing fin tube and is charged with working mediums which can generate the change of the phase under the working temperature. The utility model makes the polar plates of the semiconductor directly dip inside the working mediums for reinforcing the cooling effect. A positive cooling device and a negative cooling device are mutually independent; the insulation problem of the device can be avoided.

Description

Large power semiconductor cooling device

The utility model relates to a kind of cooling device of high power semi-conductor, more particularly, relates to a kind of heat pipe cooling device.

Semiconductor element is when work, and the heat that its dissipation power produced must be taken away rapidly by the cooling device of outside, in case junction temperature raises and half guiding element is damaged.Advantages such as it is fast to adopt heat pipe to have a heat transfer rate as semi-conductive cooling device, and thermal resistance is little are Gu this is widely adopted.Fig. 1 is the structural representation of the high-power silicon rectifier diode cooling device of Japanese mitsubishi electric Co., Ltd. production.The structure of this cooling device is to attach cooler (2) (being commonly called as chill) on the two-plate of semiconductor (1), charges into the heat of vaporization that the working media in the cooler (2) is produced by contiguous semiconductor (1), thereby has absorbed the latter's heat.The steam that is produced enters condenser (4) by insulated tube (3), carries out heat exchange with on every side coolant, reaches the purpose of cooling heat dissipation.Its weak point is: 1, contacted with the semiconductor pole plate is the metal surface of cooler (2), and working media can only absorb heat from the inner surface of cooler (2).Therefore, from the semiconductor pole plate to having a contact heat resistance and a metal heat-conducting thermal resistance the working media.These two thermal resistances greatly reduce cooling effect.2, the shared condensers of a plurality of semiconductor elements (4) have brought the Insulation Problems between positive and negative two-plate.This not only has very high requirement to the resistivity of working media, and needs the one section isolated pipe (3) (generally adopting earthenware) of pegging graft on the metallic conduit of working media circulation, also brings harmful effect for the mechanical strength of cooling device and sealing reliability etc.In addition, the shared condensers of a plurality of semiconductor elements (4) make corresponding the increasing of conveyance conduit of heat, cause solder joint, and weld seam is many.At work,, whole cooling device can't be worked, cause the damage of all semiconductor elements as long as there is place's weld seam to leak.The purpose of this utility model is will overcome the deficiencies in the prior art and provide a kind of simple in structure, good cooling results, the semiconductor cooling device that reliability is high.

The purpose of this utility model can reach by following measure: a kind of cooling device of high power semi-conductor, comprise positive and negative pole plate and condensing fin pipe, it is characterized in that two-plate constitutes separate evaporation cavity with the evaporation cavity lid that attaches to sealing means on the pole plate respectively, evaporation cavity communicates with the condensing fin pipe, in be filled with under working temperature and can produce the phase transformation working media.

The purpose of this utility model can also reach by following measure: the pole plate of described cooling device has groove or intensive aperture being positioned on the surface of evaporation cavity.The working media that charges into is fluorine Lyons or acetone.The evaporation cavity lid attaches to threaded connection mode or conical surface connecting mode and constitutes evaporation cavity on the pole plate.

The drawing of accompanying drawing is described as follows:

Fig. 1 is the structural representation of prior art cooling device;

Fig. 2 is a structural representation of the present utility model.

Below with reference to accompanying drawing the utility model is described in further detail:

With reference to accompanying drawing, the utility model has been abandoned cooler of the prior art (4), and positive and negative pole plate (6) is covered (9) sealed attachment with evaporation cavity respectively, consists of separate evaporation cavity (10). Evaporation cavity (10) is communicated with condensing fin pipe (7), and the inside is filled with two-phase working media (8). The heat that produces during semiconductor work is dispersed in the evaporation cavity (10) by pole plate (6). Working media (8) in the evaporation cavity (10) directly evaporates from the upper absorbing heat of pole plate (6), and its steam enters in the condensing fin pipe (7). Be condensed into liquid and be back to again evaporation cavity (10), finish the phase-change heat-exchange process. The Main Function of pole plate (6) is conduction and as the evaporating surface of heat transmission. In order to improve the efficient of explosive evaporation, the surface (5) that is positioned at evaporation cavity (10) at pole plate (6) has groove. Groove can be annular or rectilinear. These grooves also can replace with forms such as intensive aperture or other irregular rough surfaces. The Main Function of evaporation cavity lid (9) is the evaporation cavity (10) that forms a sealing with pole plate (6). The connecting mode of it and pole plate (6) is a lot, available thread connection, or cone link, or the welding of edge shell type etc., as long as guarantee the requirement of its sealing and bearing strength and contact area, the making material of condensing fin pipe (7) can adopt the fast material of heat conduction, such as copper. Its length, diameter and radical etc. can decide according to dissipated power and the craftmanship factor of semiconductor element, and this belongs to the category of conventional design. Working media (8) in cooling device as thermophore. It produces the flow process of evaporation, condensation phase change and vapour phase, liquid phase in airtight container. The employed working media of the utility model (8) can be fluorine Lyons, Such as R₁₁₃、R ₁₁Deng, also acetone, water or ammoniacal liquor.

Embodiment: rated operational current is 1000 amperes a silicon rectifier diode, and its dissipation power is 800 watts.By 500 watts of calculating of every pole plate dissipation power, can satisfy the heat radiation needs with the condensing fin pipe of 20 millimeters of long 200 millimeters, diameters.The pole plate inner surface adopts ring channel structures, and pole plate adopts the conical surface to connect with the evaporation cavity lid.Working media is an acetone.The radiating mode of condensing fin pipe is air-cooled.

The utility model contrast prior art has the following advantages:

1, the pole plate of semiconductor element directly is immersed in the working media, has reduced thermal contact resistance and metal heat-conducting thermal resistance between the metal surface, and heat transfer, cooling effect are strengthened, thereby has improved the load capacity of semiconductor element.

2, the cooling device at the positive and negative the two poles of the earth of semiconductor separates fully, does not have Insulation Problems, to the also no requirement (NR) of insulating properties of working media.

3, owing to be that single semiconductor element is cooled off, cooling device is independence mutually, and it is little to make it volume, simple in structure, manufacturing, installation, maintenance convenience, reliability height.Even indivedual cooling devices break down the also unlikely work that influences other semiconductor elements.

Claims

1, a kind of cooling device of high power semi-conductor, comprise positive and negative pole plate (6) and condensing fin pipe (7), it is characterized in that two-plate (6) respectively the evaporation cavity with attach to pole plate (6) with sealing means on lid (9) constitute separate evaporation cavity (10), evaporation cavity (10) communicates with condensing fin pipe (7), in be filled with the working media (8) that under working temperature, can produce phase transformation.

2, cooling device according to claim 1 is characterized in that described pole plate (6) has groove on the surface that is positioned at evaporation cavity (10) (5).

3, cooling device according to claim 1 is characterized in that described pole plate (6) has intensive aperture on the surface that is positioned at evaporation cavity (10) (5).

4, cooling device according to claim 1 is characterized in that described working media (8) is fluorine Lyons.

5, cooling device according to claim 1 is characterized in that described working media (8) is an acetone.

6, cooling device according to claim 1 is characterized in that described evaporation cavity lid (9) attaches to pole plate (6) with threaded connection mode and goes up formation evaporation cavity (10).

7, cooling device according to claim 1 is characterized in that described evaporation cavity lid (9) attaches to pole plate (6) with conical surface connecting mode and goes up formation evaporation cavity (10).