CN103369934A - Cooling device and server with cooling device - Google Patents
Cooling device and server with cooling device Download PDFInfo
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- CN103369934A CN103369934A CN2013103009215A CN201310300921A CN103369934A CN 103369934 A CN103369934 A CN 103369934A CN 2013103009215 A CN2013103009215 A CN 2013103009215A CN 201310300921 A CN201310300921 A CN 201310300921A CN 103369934 A CN103369934 A CN 103369934A
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- evaporation
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- heat exchanger
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- evaporating
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Abstract
The invention relates to a cooling device and a server. The cooling device comprises an evaporating cavity (1) provided with an evaporating inlet and an evaporating outlet and a heat exchanger (2) provided with a heat exchanger inlet and a heat exchanger outlet. The heat exchanger inlet is communicated with the evaporating outlet. The heat exchanger outlet is communicated with the evaporating inlet. Fluoride with the boiling point ranging from 30 DEG C to 60 DEG C is contained in the evaporating cavity (1) and serves as a cooling medium. In addition, the evaporating cavity (1) is filled with the cooling medium to the three fourths of the volume of the evaporating cavity (1). The server is provided with the cooling device. The fluoride with the boiling point ranging from 30 DEG C to 60 DEG C serves as the cooling medium, undergoes phase change and takes away heat. Compared with water cooling, more heat can be taken away, the better cooling effect is achieved, and the cooling medium is not filled into the evaporating cavity to the full. Thus, the evaporating cooling medium is easier to collect and a space for steam to flow is provided, wherein the steam is generated when the cooling medium evaporates.
Description
Technical field
The present invention relates to a kind of cooling device and have the server of this cooling device.
Background technology
Along with developing rapidly of high density server machine room, traditional air-cooled pattern can't satisfy the cooling requirement of data center.Asetek, CoolerMaster and some external producers have begun one's study and have produced the transfer efficiency that some water-cooled cold heads improve heat at present.This mode of utilizing cooling by water can effectively reduce the thermal component surface temperature, for further developing of high density server lays the foundation.
The cold head of at present studying on the market and selling, cooling working medium wherein adopts the pattern of cooling fluid+high purity water more, because it directly cools off CPU, exist high purity water and leak the hidden danger that jeopardizes server complete machine safety, and itself is still for to utilize the sensible heat of water to take away heat, if the heat exchange amount is excessive, the problem that the volume of water system own is excessive.
Summary of the invention
For the one or more problems that exist in the correlation technique, the object of the present invention is to provide a kind of cooling device and have the server of this cooling device, compare with water-cooled, have better cooling effect.
For achieving the above object, provide a kind of cooling device, comprising: evaporation cavity has evaporation entrance and evaporation outlet; Heat exchanger has heat exchanger entrance and heat exchanger exit; Wherein, heat exchanger entrance is communicated with the evaporation outlet, and heat exchanger exit is communicated with the evaporation entrance; Accommodate in the evaporation cavity boiling point at 30-60 ℃ fluoride as refrigerant, and refrigerant is filled 3/4ths of evaporation cavity volume at the most.
Preferably, evaporation cavity has the evaporation cavity body, and the lid of capping evaporation cavity body, and the evaporation outlet is arranged on the lid, and lid draws in to the evaporation outlet.
Preferably, lid is rectangular pyramid shape, and the evaporation outlet is arranged on the vertex of a cone place of taper.
Preferably, evaporation cavity has the first surface relative with the evaporation outlet, and first surface is long to be 190mm, and wide is 56mm, and first surface is 12mm to the height of evaporation outlet.
Preferably, be provided with circulating pump between heat exchanger exit and the evaporation entrance.
Preferably, refrigerant is fluoride nontoxic, insulation.
On the other hand, provide a kind of server, have aforesaid cooling device.
Preferably, evaporation cavity contacts with element to be cooled in the server.
Preferably, the first surface of evaporation cavity contacts with element to be cooled in the server.
Than prior art, beneficial effect of the present invention is:
1. adopt boiling point at 30-60 ℃ fluoride as refrigerant, undergo phase transition, take away heat, compare with water-cooled, can take away more heat, cooling effect is better.
2. refrigerant does not fill up whole evaporation cavity, is easier to collect the refrigerant of evaporation.
3. draw in towards the evaporation exit at the steam (vapor) outlet place of evaporation cavity, and the steam that therefore can the guiding refrigerant evaporation forms flows into and evaporates mouth, and can not be stacked into other positions of evaporation outlet place face.
4. refrigerant adopts fluoride nontoxic, insulation, even leakage problem occurs, also can not cause danger.
Description of drawings
Fig. 1 is the schematic diagram of cooling device of the present invention;
Fig. 2 is the schematic diagram of evaporation cavity in the cooling device of the present invention.
Embodiment
Below in conjunction with accompanying drawing the specific embodiment of the invention is described.
Referring to Fig. 1, a kind of cooling device, comprise evaporation cavity 1 and heat exchanger 2, be filled with refrigerant in the evaporation cavity 1, and the loading of refrigerant is at most 3/4ths of evaporation cavity 1 volume, when cooling device carries out cooling work, refrigerant evaporation in the evaporation cavity 1, the steam that thereupon produces will flow out from the evaporation outlet that evaporation cavity 1 has, the heat exchanger entrance inflow heat exchanger that has from heat exchanger 2, and with exchanger heat exchange, the heat exchanger exit from heat exchanger 2 flows back to evaporation cavity 1 through the evaporation entrance afterwards.Obviously, the evaporation outlet is communicated with heat exchanger entrance, and the evaporation entrance is communicated with heat exchanger exit.Further, refrigerant adopts boiling point at 30-60 ℃ fluoride.
By the above-mentioned cooling device of the present invention, adopt boiling point at 30-60 ℃ fluoride as refrigerant, refrigerant undergoes phase transition, and takes away heat, compares with water-cooled, can take away more heat, cooling effect is better.And refrigerant does not fill up whole evaporation cavity, is easier to collect the refrigerant of evaporation.
Preferably, above-mentioned fluoride can be: CF
3CHCl
2, C
4F
9OCH
3, C
3H
7Br, C
3Cl
2HF
5, C
2Cl
2H
3F, C
2Cl
3F
3In any one or a few.In addition, evaporation cavity 1 is annular seal space preferably, and internal pressure is less than external pressure, so the boiling point of the refrigerant in the evaporation cavity 1 also can reduce, and is the easier evaporation of refrigerant.Certainly, the pressure in the evaporation cavity 1 also can be equal to or greater than external pressure, and the boiling point of that refrigerant also can improve accordingly.By the pressure in the control evaporation cavity 1, can control the boiling point of evaporation cavity 1 interior refrigerant.
Further referring to Fig. 2, preferably, the above-mentioned evaporation cavity of the present invention has: evaporation cavity body 5 and lid 6, lid 6 covers evaporation cavity body 5, the evaporation outlet is arranged on the lid 6, and lid 6 is to the gathering of evaporation exit, as shown in Figure 2, above-mentioned lid 6 can be rectangular pyramid shape, and the evaporation outlet is arranged on the vertex of a cone place of rectangular pyramid.Should be appreciated that lid becomes the indication of rectangular pyramid shape preferred embodiment a kind of, for example, the capping of dome-type also goes for the present invention.And for example, lid 6 can also be to converge along a bit, and is drawn into taper shape to a direction, as long as can realize capping evaporation cavity body 5, and lid 6 can realize that the steam that 5 interior evaporations produce to the evaporation cavity body guides, and guides it to flow into the evaporation outlet, just can be applied to the present invention.Further, lid 6 and evaporation cavity body 5 can also be one-body molded, and lid 6 can have various shape, comprises irregular shape, and it can be realized mainly finally that steam to the generation in the evaporation cavity 4 guides and get final product.
Referring to Fig. 1, preferred first surface 3 of evaporation cavity, this first surface 3 is the relative face of evaporation outlet, the shape of this first surface 3 can be with respect to the shape of above-mentioned lid 6 and decide, for example, when lid 6 was rectangular pyramid shape, that first surface 3 is quadrangle preferably; When lid 6 was hemisphere, first surface 3 was preferably circular.Should be appreciated that above-mentioned is preferred mode, is not limited to the present invention.Further, the shape of first surface 3 equally also will adapt to element to be cooled, and for example cooling device is lowered the temperature to CPU for server, the shape of first surface 3 is preferably corresponding with the shape of CPU so, certainly, these all are preferred embodiment, are not limited to the present invention.
Preferred first surface 3 adopts the long 190mm that is, wide is the rectangle face of 56mm.Further, first surface 3 is 12mm to the height of evaporation outlet.Should be appreciated that these sizes are preferred embodiment a kind of, be not used in restriction the present invention.For example when cooling device is used for CPU cooling to server, use first surface 3 to contact with CPU, so the length of first surface 3 and widely just can decide according to the size of CPU.In addition, first surface 3 also can according to deciding in the practical application, can not be interpreted as just this size of the above-mentioned 12mm of the present invention to the height of evaporation outlet.
Continuation also is provided with circulating pump 4 referring to Fig. 1 between heat exchanger exit and evaporation entrance, think that the refrigerant after the heat exchanger heat release provides the power that flows back to evaporation cavity 1.
On the other hand, the present invention also provides a kind of server, has above-mentioned cooling device, and element to be cooled in the evaporation cavity of cooling device and the server contacts, and for example element to be cooled is CPU; What wherein contact with element to be cooled is the first surface 3 of evaporation cavity.
The above-mentioned refrigerant of mentioning can be nontoxic, non-conductive, high-flash and to the free from corrosion any any liquid that can realize refrigerant purpose among the present invention of parts (such as evaporation cavity) of contact.
The above is the preferred embodiments of the present invention only, is not limited to the present invention, and for a person skilled in the art, the present invention can have various modifications and variations.Within the spirit and principles in the present invention all, any modification of doing, be equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (9)
1. cooling device comprises: evaporation cavity (1) has evaporation entrance and evaporation outlet;
Heat exchanger (2) has heat exchanger entrance and heat exchanger exit; Wherein, described heat exchanger entrance is communicated with described evaporation outlet, and described heat exchanger exit is communicated with described evaporation entrance;
It is characterized in that, accommodate in the described evaporation cavity (1) boiling point at 30-60 ℃ fluoride as refrigerant, and described refrigerant is filled 3/4ths of described evaporation cavity (1) volume at the most.
2. cooling device according to claim 1 is characterized in that,
Described evaporation cavity (1) has evaporation cavity body (5), and the lid (6) of the described evaporation cavity body of capping, and described evaporation outlet is arranged on the described lid (6), and described lid (6) draws in to described evaporation outlet.
3. cooling device according to claim 2 is characterized in that,
Described lid (6) is rectangular pyramid shape, and described evaporation outlet is arranged on the vertex of a cone place of described taper.
4. cooling device according to claim 1 is characterized in that,
Described evaporation cavity (1) has the first surface (3) relative with described evaporation outlet, and described first surface (3) is long to be 190mm, and wide is 56mm, and described first surface (3) is 12mm to the height of described evaporation outlet.
5. cooling device according to claim 1 is characterized in that,
Be provided with circulating pump (4) between described heat exchanger exit and the described evaporation entrance.
6. cooling device according to claim 1 is characterized in that,
Described refrigerant is fluoride nontoxic, insulation.
7. a server is characterized in that, has each described cooling device among the claims 1-6.
8. server according to claim 7 is characterized in that,
Described evaporation cavity (1) contacts with element to be cooled in the described server.
9. server according to claim 8 is characterized in that,
The first surface (3) of described evaporation cavity (1) contacts with element to be cooled in the described server.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013103009215A CN103369934A (en) | 2013-07-17 | 2013-07-17 | Cooling device and server with cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013103009215A CN103369934A (en) | 2013-07-17 | 2013-07-17 | Cooling device and server with cooling device |
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| Publication Number | Publication Date |
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| CN103369934A true CN103369934A (en) | 2013-10-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2013103009215A Pending CN103369934A (en) | 2013-07-17 | 2013-07-17 | Cooling device and server with cooling device |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104602486A (en) * | 2014-12-22 | 2015-05-06 | 曙光信息产业(北京)有限公司 | Liquid-cooled server |
| CN104615220A (en) * | 2014-12-25 | 2015-05-13 | 曙光信息产业(北京)有限公司 | Cooling system and server system |
| CN105630115A (en) * | 2015-12-23 | 2016-06-01 | 曙光信息产业(北京)有限公司 | Cooling system of server |
| CN106527634A (en) * | 2016-10-28 | 2017-03-22 | 曙光信息产业(北京)有限公司 | Liquid cooling server |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2062116U (en) * | 1989-12-25 | 1990-09-12 | 江西省科学院能源研究所 | Large power semiconductor cooling device |
| CN101093818A (en) * | 2001-09-20 | 2007-12-26 | 英特尔公司 | Modular capillary pumped loop cooling system |
| US20090100848A1 (en) * | 2007-10-22 | 2009-04-23 | Sanyo Electric Co., Ltd. | Electronic device cooling system and electronic device cooling apparatus |
| US20120137718A1 (en) * | 2010-12-01 | 2012-06-07 | Fujitsu Limited | Cooling apparatus and electronic apparatus |
-
2013
- 2013-07-17 CN CN2013103009215A patent/CN103369934A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2062116U (en) * | 1989-12-25 | 1990-09-12 | 江西省科学院能源研究所 | Large power semiconductor cooling device |
| CN101093818A (en) * | 2001-09-20 | 2007-12-26 | 英特尔公司 | Modular capillary pumped loop cooling system |
| US20090100848A1 (en) * | 2007-10-22 | 2009-04-23 | Sanyo Electric Co., Ltd. | Electronic device cooling system and electronic device cooling apparatus |
| US20120137718A1 (en) * | 2010-12-01 | 2012-06-07 | Fujitsu Limited | Cooling apparatus and electronic apparatus |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104602486A (en) * | 2014-12-22 | 2015-05-06 | 曙光信息产业(北京)有限公司 | Liquid-cooled server |
| CN104615220A (en) * | 2014-12-25 | 2015-05-13 | 曙光信息产业(北京)有限公司 | Cooling system and server system |
| CN105630115A (en) * | 2015-12-23 | 2016-06-01 | 曙光信息产业(北京)有限公司 | Cooling system of server |
| CN106527634A (en) * | 2016-10-28 | 2017-03-22 | 曙光信息产业(北京)有限公司 | Liquid cooling server |
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Effective date of registration: 20160316 Address after: 300384 Tianjin city Xiqing District Huayuan Industrial Zone (outer ring) Haitai Huake Street No. 15 1-3 Applicant after: Sugon Information Industry Co., Ltd. Address before: 100193 Beijing, Haidian District, northeast Wang West Road, building 8, No. 36 Applicant before: Dawning Information Industry (Beijing) Co., Ltd. |
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Application publication date: 20131023 |
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