CN206185697U - Intelligent abrasive disc machine - Google Patents
Intelligent abrasive disc machine Download PDFInfo
- Publication number
- CN206185697U CN206185697U CN201621252517.0U CN201621252517U CN206185697U CN 206185697 U CN206185697 U CN 206185697U CN 201621252517 U CN201621252517 U CN 201621252517U CN 206185697 U CN206185697 U CN 206185697U
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- China
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- mill
- bistrique
- motor
- adjustable column
- lapping machine
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- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The utility model discloses an intelligent abrasive disc machine, comprises a workbench, including a motor, an end cap, a controller, and a cover plate, a speed reducer, mill and bistrique, the workstation top is provided with the display screen, first regulation post, the mill, camera and second regulation post, be provided with the horizontal pole between first regulation post and the second regulation post, be provided with the bistrique base on the horizontal pole, be provided with the bistrique on the bistrique base, be provided with the motor in the workstation, be provided with the reduction gear on the motor, reduction gear and mill are connected, be provided with the air suction opening in the bistrique base, be provided with dust extraction around the mill, be provided with horizontal adjusting device on the horizontal pole, the dull polish rugosity of mill sets up to three kinds, respectively for roughly grinding sand, partly finish grindes sand and correct grinding sand, is provided with the manually operation device on the workstation, is provided with first scale mark and second scale mark on the first regulation post and on the second regulation post respectively. It is efficient that this abrasive disc machine in use has the abrasive disc, and work load is few, advantages such as abrasive disc precision height.
Description
Technical field
The utility model is related to a kind of wafer lapping machine, more particularly to a kind of intelligent wafer lapping machine.
Background technology
In the quality determination of chemical products, electronic product and industrial materials, often to use wafer lapping machine, grinding sets
The class that makes preparations for sowing is a lot, substantially using directly grinding or easy slide fixture carry out machine using vacuum suction core wafer manually
Tool is ground.It is ground manually extremely inefficient, workload is big, and Simple mechanical is ground due to the limitation of machine, causes to be ground low precision.
Utility model content
For above-mentioned existing grinding, machine efficiency is low, workload big and the problem of grinding low precision, and the utility model will
The technical problem of solution is to provide a kind of intelligent wafer lapping machine.
In order to solve the above technical problems, the technical solution of the utility model is：A kind of intelligent wafer lapping machine, including work
Platform, motor, decelerator, mill and bistrique, workbench top are provided with display screen, the first adjustable column, mill, camera and the
Two adjustable columns, are provided with cross bar between first adjustable column and the second adjustable column, bistrique base, institute are provided with the cross bar
State and bistrique is provided with bistrique base, motor is provided with the workbench, decelerator, the deceleration are provided with the motor
Device and mill are connected, and the workbench left side is provided with computer control system.
The preferred scheme of such scheme is:Air suction opening is provided with the bistrique base, is provided with around the mill
Dust exhaust apparatus, for inhaling the dust produced during grinding, reduces the pollution of environment.
The preferred scheme of such scheme is:First longitudinal direction tune is respectively arranged with first adjustable column and the second adjustable column
Regulating device and second longitudinal direction adjusting means, are moved up and down for adjusting cross bar, and lateral adjustment device is provided with the cross bar, are used
In regulation bistrique base side-to-side movement.
The preferred scheme of such scheme is:The frosted rugosity of the mill is set to be included roughly grinding sand, half fine grinding sand and fine grinding
Sand.
The preferred scheme of such scheme is:Hand-operating device is provided with the workbench, for manually operated grinding
Machine.
The preferred scheme of such scheme is:On first adjustable column and it is respectively arranged with the first scale on the second adjustable column
Line and the second graduation mark, for determining the regulation being ground highly.
Beneficial effect：Using above-mentioned technical proposal, a kind of intelligent wafer lapping machine of the present utility model in the course of the work, is counted
Calculation machine control system controls the distance and the rotating speed of motor of first longitudinal direction adjusting means and the up and down motion of second longitudinal direction adjusting means
To control the size of grinding, the precision of so grinding can be higher, computer control system control lateral adjustment device or so fortune
Dynamic, bistrique moves to the top of camera, and the effect of grinding is confirmed by camera, reduces workload.The frosted rugosity of mill sets
Coarse sand is set to, half fine grinding sand and fine grinding sand the need for meeting different product in the case of without changing mill, facilitate behaviour
Make.Hand-operating device is provided with work, coordinating can also be manual with the graduation mark on the second adjustable column on the first adjustable column
Operation, convenient use.Air suction opening and dust exhaust apparatus are respectively arranged with bistrique base and mill, increase pick-up performance, reduce ring
The pollution in border.
Brief description of the drawings
Fig. 1 is a kind of structural representation of intelligent wafer lapping machine of the utility model；
Fig. 2 is the top view of mill in the utility model.
In figure：1- computer control systems, 2- display screens, 3- first longitudinal direction adjusting meanss, the adjustable columns of 4- first, 5- is horizontal
Bar, 6- air suction openings, 7- bistrique bases, 8- bistriques, 9- mills, 10- dust exhaust apparatuses, 11- cameras, 12- workbench, 13- is laterally adjusted
Regulating device, 14- decelerators, 15- motors, 16- second longitudinal direction adjusting meanss, the adjustable columns of 17- second, 18- manual regulating devices,
The graduation marks of 19- first, the graduation marks of 20- second, 21- corase grind sand, 22- partly refines sand, 23- fine grinding sand.
Specific embodiment
The specific embodiment practical to this is described further below in conjunction with the accompanying drawings.Herein it should be noted that right
It is used to help understand the utility model in the explanation of these implementation methods, but does not constitute to restriction of the present utility model.Additionally,
As long as involved technical characteristic does not constitute conflict just each other in the utility model disclosed below each implementation method
Can be mutually combined.
As shown in figure 1, a kind of intelligent wafer lapping machine of the present embodiment, including work 12, motor 15, decelerator 14, mill
Disk 9 and bistrique 8, the top of workbench 12 are provided with display screen 2, the first adjustable column 4, mill 9, the adjustable column 17 of camera 11 and second,
Cross bar 5 is provided between first adjustable column 4 and the second adjustable column 17, bistrique base 7 is provided with cross bar 5, set on bistrique base 7
It is equipped with bistrique 8, workbench 12 and is provided with motor 15, decelerator 14 is provided with motor 15, decelerator 14 and mill 9 is connected,
The left side of workbench 12 is provided with computer control system 1.
Wherein, 7 air suction opening 6 is provided with bistrique base, dust exhaust apparatus 10 is provided with around mill 9, for inhaling in mill
The dust produced during piece, reduces the pollution of environment.
Wherein, first longitudinal direction adjusting means 3 and second longitudinal direction are respectively arranged with the first adjustable column 4 and the second adjustable column 17
Adjusting means 16, moves up and down for adjusting cross bar, lateral adjustment device is provided with the cross bar, for adjusting bistrique base
Side-to-side movement.
Wherein, the frosted rugosity of mill 9 is set includes roughly grinding sand 21, half fine grinding sand 22 and fine grinding sand 23.
Wherein, hand-operating device 18 is provided with workbench 12, for manually operated wafer lapping machine.
Wherein, on the first adjustable column 4 and the first graduation mark 19 and the second graduation mark are respectively arranged with the second adjustable column 17
50, for determining the regulation being ground highly.
In sum, a kind of intelligent wafer lapping machine provided by the utility model in the course of the work, computer controls system
System controls first longitudinal direction adjusting means and the distance of second longitudinal direction adjusting means up and down motion and the rotating speed of motor to control grinding
Size, so grinding precision can be higher, computer control system control lateral adjustment device side-to-side movement, bistrique movement
To the top of camera, the effect of grinding is confirmed by camera, reduce workload.The frosted rugosity of mill is set to coarse sand, and half
Fine grinding sand and fine grinding sand, without change mill in the case of meet different product the need for, facilitate operation.Set in work
There is hand-operating device, coordinating can also be manually operated with the graduation mark on the second adjustable column on the first adjustable column, convenient use.
Air suction opening and dust exhaust apparatus are respectively arranged with bistrique base and mill, increase pick-up performance, reduce the pollution of environment.
Implementation method of the present utility model is explained in detail above in association with accompanying drawing, but the utility model is not limited to be retouched
The implementation method stated.For a person skilled in the art, it is right in the case where the utility model principle and spirit is not departed from
These implementation methods carry out various changes, modification, replacement and modification, still fall within protection domain of the present utility model.
Claims (6)
1. a kind of intelligent wafer lapping machine, including workbench, motor, decelerator, mill and bistrique, it is characterised in that：The work
Platform top is provided with display screen, the first adjustable column, mill, camera and the second adjustable column, first adjustable column and the second regulation
Cross bar is provided between post, bistrique base is provided with the cross bar, bistrique, the workbench are provided with the bistrique base
Motor is inside provided with, decelerator is provided with the motor, the decelerator and mill are connected, the workbench left side is provided with meter
Calculation machine control system.
2. a kind of intelligent wafer lapping machine according to claim 1, it is characterised in that：Dust suction is provided with the bistrique base
Hole, dust exhaust apparatus is provided with around the mill.
3. a kind of intelligent wafer lapping machine according to claim 1, it is characterised in that：First adjustable column and the second regulation
First longitudinal direction adjusting means and second longitudinal direction adjusting means are respectively arranged with post, lateral adjustments dress is provided with the cross bar
Put.
4. a kind of intelligent wafer lapping machine according to claim 1, it is characterised in that：The frosted rugosity of the mill includes thick
Frosted, half fine grinding sand and fine grinding sand.
5. a kind of intelligent wafer lapping machine according to claim 1, it is characterised in that：Behaviour manually is provided with the workbench
Make device.
6. a kind of intelligent wafer lapping machine according to claim 1, it is characterised in that：Adjusted with second on first adjustable column
The first graduation mark and the second graduation mark are respectively arranged with segmented column.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621252517.0U CN206185697U (en) | 2016-11-16 | 2016-11-16 | Intelligent abrasive disc machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621252517.0U CN206185697U (en) | 2016-11-16 | 2016-11-16 | Intelligent abrasive disc machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206185697U true CN206185697U (en) | 2017-05-24 |
Family
ID=58727371
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621252517.0U Active CN206185697U (en) | 2016-11-16 | 2016-11-16 | Intelligent abrasive disc machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206185697U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108857670A (en) * | 2018-06-30 | 2018-11-23 | 绍兴上虞恒发摩配厂 | A kind of boundless hair processing unit of Intelligent clutch |
-
2016
- 2016-11-16 CN CN201621252517.0U patent/CN206185697U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108857670A (en) * | 2018-06-30 | 2018-11-23 | 绍兴上虞恒发摩配厂 | A kind of boundless hair processing unit of Intelligent clutch |
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