CN206074993U - A kind of semi-automatic exposure production line - Google Patents
A kind of semi-automatic exposure production line Download PDFInfo
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- CN206074993U CN206074993U CN201620634672.2U CN201620634672U CN206074993U CN 206074993 U CN206074993 U CN 206074993U CN 201620634672 U CN201620634672 U CN 201620634672U CN 206074993 U CN206074993 U CN 206074993U
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- bit platform
- exposure
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Abstract
This utility model is related to flexible circuit board exposure technique field, more particularly to a kind of semi-automatic exposure production line, including alignment device and exposure device, the alignment device is included to bit platform, it is described that CCD para-position mechanism is provided with to bit platform, the lower end to bit platform arranges and drives the XY adjustment mechanisms that XY axial adjustment is carried out to bit platform, the exposure device includes exposure stage, the production line also includes the drive mechanism that will be moved to bit platform below exposure stage, this utility model can realize being accurately positioned for base material, and it is automatically moved into exposure at exposure device, without the need for manually operating, efficiency high, reduces cost.
Description
Technical field
This utility model is related to flexible circuit board exposure technique field, more particularly to a kind of semi-automatic exposure production line.
Background technology
（FPC）It is in flexible circuitry board manufacturing process, increasingly fierce with competition, the reduction of cost and production efficiency
Raising becomes more and more important, how to shorten the production cycle, improve production efficiency, increases utilization rate of equipment and installations, and reduces cost puts into,
Becoming increasingly is worth the problem of thinking.
Manufacture in flow process operation in FPC at present, it is particularly in the exposure process of FPC, most of still by artificial
Carry out, first by manually alignment operation being carried out to base material, the good base material of para-position is carried to into exposure by operator again then
Expose at ray machine.
There are two groups of defects in existing operator scheme：1. artificial operation para-position, aligning accuracy are low；2. need by artificial
Base material is carried at exposure device, efficiency is low, cost of labor is high.
The content of the invention
The purpose of this utility model is to provide a kind of semi-automatic exposure production line, this practicality for the deficiencies in the prior art
It is new to realize being accurately positioned for base material, and exposure at exposure device is automatically moved into, without the need for manually operate, efficiency high, drop
Low cost.
This utility model is achieved through the following technical solutions, a kind of semi-automatic exposure production line, including para-position dress
Put and exposure device, the alignment device is included to bit platform, it is described that CCD para-position mechanism, the para-position are provided with to bit platform
The lower end of platform arranges and drives the XY adjustment mechanisms that XY axial adjustment is carried out to bit platform, the exposure device to include exposure stage,
The production line also includes the drive mechanism that will be moved to bit platform below exposure stage.
Preferably, the side to bit platform is provided with base material discharging frame and for by the base material on base material discharging frame
It is positioned over to the automatic charging device on bit platform.
Preferably, the automatic charging device includes feeding manipulator.
Preferably, the side of the exposure stage is provided with finished product discharging frame and for will put to the finished product on bit platform
The automatic blanking device being placed on finished product discharging frame.
Preferably, the automatic blanking device includes blanking mechanical hand.
Preferably, the CCD para-position mechanism includes four cameras, four cameras are respectively positioned at four to bit platform
Individual angle.
The beneficial effects of the utility model：A kind of semi-automatic exposure production line, including alignment device and exposure device, it is described
Alignment device is included to bit platform, described that CCD para-position mechanism is provided with to bit platform, and the lower end to bit platform arranges and drives
The XY adjustment mechanisms of XY axial adjustment are carried out to bit platform, the exposure device includes exposure stage, the production line also includes will be right
Bit platform is moved to the drive mechanism below exposure stage, and first base material is positioned over to, on bit platform, the film being positioned over exposure
On optical platform, base material is positioned over to, after bit platform, XY adjustment mechanisms are carried out to substrate location according to CCD para-position mechanism image positioning
Adjustment so that substrate location is accurate, after adjusting substrate location, will be moved to exposure device to bit platform by drive mechanism and enter
Row exposure, obtains finished product, without the need for manually operating, efficiency high, and reduces cost.
Description of the drawings
Fig. 1 is process flow schematic diagram of the present utility model.
Specific embodiment
Below in conjunction with the accompanying drawings 1, and specific embodiment is described further to this utility model.
As shown in figure 1, a kind of semi-automatic exposure production line, including alignment device and exposure device, the alignment device bag
Include to bit platform 1, described that CCD para-position mechanism 2 is provided with to bit platform 1, the lower end to bit platform 1 arranges and drives para-position to put down
Platform 1 carries out the XY adjustment mechanisms of XY axial adjustment, and the exposure device includes exposure stage 3, and the production line also includes putting down para-position
Platform 1 is moved to the drive mechanism 4 below exposure stage 3.
The present embodiment is positioned over base material to, on bit platform 1, the film being positioned in exposure stage 3 first, and base material is placed
After to bit platform 1, XY adjustment mechanisms are adjusted to substrate location according to CCD para-position mechanism 2 image positioning so that base material position
Put accurate, after adjusting substrate location, exposure device will be moved to bit platform 1 by drive mechanism 4 and be exposed, and be obtained into
Product, without the need for manually operating, efficiency high, reduces cost.
The present embodiment XY adjustment mechanisms include being arranged at the adjustment platform to below bit platform 1, and the upper end for adjusting platform sets
It is equipped with and the straight line driving mechanism for carrying out Y direction movement to bit platform 1 along slide rail, straight line driving mechanism can be driven to use
Screw mandrel and servo motor, one end of screw mandrel are connected with servo motor driven, the other end of screw mandrel with bit platform 1 is connected；
Positioned at the straight line driving mechanism that the lower end of adjustment platform is provided with driving adjustment platform that X-direction movement is carried out along slide rail,
The straight line driving mechanism is also the kind of drive using screw mandrel and servo motor.
4 drive mechanism of the present embodiment drive mechanism can be using linear module etc..
In the present embodiment, the side to bit platform 1 is provided with base material discharging frame 5 and for by base material discharging frame 5
Base material be positioned over to the automatic charging device 6 on bit platform 1, the automatic charging device 6 includes feeding manipulator, first will
Base material is stacked to base material discharging frame 5, then base material is placed on on bit platform 1 by one piece one piece of feeding manipulator, need not
Artificial loading, efficiency high reduce cost of labor.
In the present embodiment, the side of the exposure stage 3 is provided with finished product discharging frame 7 and for by bit platform 1
Finished product is positioned over the automatic blanking device 8 on finished product discharging frame 7, and the automatic blanking device 8 includes blanking mechanical hand, exposed
Afterwards, it is finished product to the base material on bit platform 1, finished product is set on product discharging frame 7 from relaying to bit platform 1 by blanking mechanical hand again,
Without the need for artificial loading, efficiency high, cost of labor is reduced.
In the present embodiment, the CCD para-position mechanism 2 includes four cameras, and four cameras are respectively positioned to bit platform 1
Four angles, to taking pictures to the mark points on bit platform 1, four cameras correspondence is to four on bit platform 1 for camera first
Mark points are in tetragon；After band base material is placed to bit platform 1, then the mark points on base material are taken pictures, four camera correspondences
On base material, four mark points are in tetragon, when two tetragons overlap, are then that base material is placed, if do not overlapped, pass through
XY adjustment mechanisms are accurately adjusted.
Above content is only preferred embodiment of the present utility model, for one of ordinary skill in the art, according to this reality
With new thought, will change in specific embodiments and applications, this specification content should not be construed as
To restriction of the present utility model.
Claims (6)
1. a kind of semi-automatic exposure production line, it is characterised in that：Including alignment device and exposure device, the alignment device includes
To bit platform（1）, it is described to bit platform（1）It is provided with CCD para-position mechanism（2）, it is described to bit platform（1）Lower end arrange drive
To bit platform（1）The XY adjustment mechanisms of XY axial adjustment are carried out, the exposure device includes exposure stage（3）, the production line also wraps
Including will be to bit platform（1）It is moved to exposure stage（3）The drive mechanism of lower section（4）.
2. a kind of semi-automatic exposure production line according to claim 1, it is characterised in that：It is described to bit platform（1）Side
Side is provided with base material discharging frame（5）With for by base material discharging frame（5）On base material be positioned over to bit platform（1）On it is automatic on
Material device（6）.
3. a kind of semi-automatic exposure production line according to claim 2, it is characterised in that：The automatic charging device（6）
Including feeding manipulator.
4. a kind of semi-automatic exposure production line according to claim 1, it is characterised in that：The exposure stage（3）Side
Side is provided with finished product discharging frame（7）With for will be to bit platform（1）On finished product be positioned over finished product discharging frame（7）On it is automatic under
Material device（8）.
5. a kind of semi-automatic exposure production line according to claim 4, it is characterised in that：The automatic blanking device（8）
Including blanking mechanical hand.
6. a kind of semi-automatic exposure production line according to claim 1, it is characterised in that：The CCD para-position mechanism（2）Bag
Four cameras are included, four cameras are respectively positioned to bit platform（1）Four angles.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620634672.2U CN206074993U (en) | 2016-06-24 | 2016-06-24 | A kind of semi-automatic exposure production line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620634672.2U CN206074993U (en) | 2016-06-24 | 2016-06-24 | A kind of semi-automatic exposure production line |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206074993U true CN206074993U (en) | 2017-04-05 |
Family
ID=58421533
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620634672.2U Active CN206074993U (en) | 2016-06-24 | 2016-06-24 | A kind of semi-automatic exposure production line |
Country Status (1)
| Country | Link |
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| CN (1) | CN206074993U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110972402A (en) * | 2019-11-19 | 2020-04-07 | 信丰福昌发电子有限公司 | A automatic alignment exposure equipment for HDI circuit board inlayer dry film |
-
2016
- 2016-06-24 CN CN201620634672.2U patent/CN206074993U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110972402A (en) * | 2019-11-19 | 2020-04-07 | 信丰福昌发电子有限公司 | A automatic alignment exposure equipment for HDI circuit board inlayer dry film |
| CN110972402B (en) * | 2019-11-19 | 2020-11-06 | 信丰福昌发电子有限公司 | A automatic alignment exposure equipment for HDI circuit board inlayer dry film |
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