CN206057160U - A kind of nondestructive detection system of small size component top layer microfissure - Google Patents
A kind of nondestructive detection system of small size component top layer microfissure Download PDFInfo
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- CN206057160U CN206057160U CN201621052112.2U CN201621052112U CN206057160U CN 206057160 U CN206057160 U CN 206057160U CN 201621052112 U CN201621052112 U CN 201621052112U CN 206057160 U CN206057160 U CN 206057160U
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- small size
- size component
- strain
- microfissure
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Abstract
The nondestructive detection system of small size component top layer microfissure, including master system, dynamic strain indicator, foil gauge, vibration table, power amplifier, random waveform generation card, charge amplifier, acceleration transducer, oscillograph；There is card output sine excitation signal in master system control random waveform；There is the sine excitation signal of card output via power amplifier inputted vibration platform in random waveform, so as to drive vibration table to produce vibration；Acceleration transducer is arranged on small size component, and the outfan of acceleration transducer is connected with the input channel of charge amplifier, and the output channel of charge amplifier is connected with oscillograph, and oscillograph is connected with master system；On small size component, the outfan of foil gauge is connected strain gauge adhesion with the input channel of dynamic strain indicator, and the output channel of dynamic strain indicator is connected with master system.This utility model has the advantages that fast and accurately determine whether small size component top layer produces microfissure.
Description
Technical field
This utility model is related to technical field of nondestructive testing, refers in particular to a kind of lossless inspection of small size component top layer microfissure
Examining system and method.
Background technology
Along with the fast development of minute manufacturing technology, small size component has been widely used in mechanical engineering field
In, but small size component can be acted on by various external factor during processing and manufacturing, can cause small size component table
Layer introduces microfissure, seriously governs the raising of small size component quality, it is therefore necessary to which small size component is detected,
Determine whether small size component top layer produces microfissure, this subsequent applications to small size component has very important meaning
Justice.Now widely used microfissure detection method mainly includes Electron Microscopy, acoustic emission testing technology and surpasses
Sound detection technology.But Electron Microscopy belongs to destructive detection method, need to prepare sample, then carry out corrosion treatmentCorrosion Science,
Just it is observed that the microscopic appearance of small size component, and then determine whether small size component top layer produces microfissure.Acoustic emission
Detection technique belongs to Dynamic Non-Destruction Measurement, Non-Destructive Testing can be carried out to small size component, but sound is sent out in actual detection
Penetrate signal generally fainter, easily disturbed by external factor, reduce the precision of detection.Ultrasonic detecting technology falls within
Dynamic Non-Destruction Measurement, can carry out Non-Destructive Testing, but ultrasonic detecting technology to material incipient fatigue damage to small size component
Produced microfissure is simultaneously insensitive, reduces the precision of detection.In order to fast and accurately determine that small size component top layer is
No generation microfissure, the utility model proposes a kind of nondestructive detection system of small size component top layer microfissure and side
Method.
Utility model content
In order to fast and accurately determine whether small size component top layer produces microfissure, the utility model proposes a kind of
The nondestructive detection system and method for small size component top layer microfissure.
The nondestructive detection system of small size component top layer microfissure, including master system, dynamic strain indicator, strain
There is card, charge amplifier, acceleration transducer, oscillograph in piece, vibration table, power amplifier, random waveform.
Card output amplitude master system control random waveform occurs and frequency is independent and continuously adjustable sine excitation
Signal；There is the sine excitation signal of card output via power amplifier inputted vibration platform in random waveform, so as to drive vibration table
Produce vibration；Acceleration transducer is arranged on small size component, and the outfan of acceleration transducer is defeated with charge amplifier
Enter passage connection, the output channel of charge amplifier is connected with oscillographic input channel, oscillographic output channel with it is upper
Machine system connects；On small size component, the outfan of foil gauge is connected strain gauge adhesion with the input channel of dynamic strain indicator,
The output channel of dynamic strain indicator is connected with master system.
Master system includes the strain waveform read module for obtaining the strain waveform that dynamic strain indicator is collected, from strain
The strain identification module of modal strain peak value ε (μ ε) is obtained in waveform, the voltage waveform of the voltage waveform of oscilloscope display is obtained
Read module, obtains the voltage identification module of voltage peak U (V) from voltage waveform, and voltage peak is converted to output
The vibration level modular converter of vibration level.
Sensitirity va1ue s (the pC/ms of acceleration transducer are preset with vibration level modular converter-2), charge amplifier input is logical
The sensitivity coefficient S (pC/Unit) in road, amplification coefficient F (Unit/V)；Exporting vibration level with the transformational relation of voltage peak is：Wherein a represents output vibration level, and output vibration level is shown to user by the display interface of master system.
Further, acceleration transducer is piezoelectric acceleration transducer.
Further, foil gauge is three-dimensional strain rosette clockwise.
Further, dynamic strain indicator is high-precision multi-path dynamic strain indicator.
Technology design of the present utility model is：By master system, dynamic strain indicator, foil gauge, vibration table, power amplification
Small size component top layer microfissure constituted and card, charge amplifier, acceleration transducer and oscillograph in device, random waveform there is
Nondestructive detection system；Small size component is clamped on the exciting table top of vibration table moving component；Master system is gathered first
The modal strain peak value of the undressed small size component for processing, then collection processed after small size component mould
State strains peak value, if the small size after the modal strain peak value of the undressed small size component for processing is not equal to processed
The modal strain peak value of component, that is, show that the top layer of small size component generates microfissure.
The beneficial effects of the utility model are：
1st, the nondestructive detection system of the small size component top layer microfissure set up by this utility model is to small size structure
Part detected, is capable of determining that small size component top layer whether there is microfissure.
2nd, the nondestructive detection system of the small size component top layer microfissure set up by this utility model can be to little chi
Very little component carries out Non-Destructive Testing, will not produce damage to small size component.
3rd, the nondestructive detection system of the small size component top layer microfissure set up by this utility model can be to little chi
Very little component is detected under the resonant frequency of its multiple bending vibration, it is ensured that the reliability of testing result.
4th, before and after the nondestructive detection system of the small size component top layer microfissure set up by this utility model is to processing
Small size component detected that detection process takes short, quickly can determine little under the resonant frequency of its bending vibration
Whether size members top layer produces microfissure, is conducive to improving detection efficiency.
5th, the nondestructive detection system of the small size component top layer microfissure that this utility model is set up enters to small size component
During row detection, detection process is controlled by master system, without the need for manual operation, is reduced workload, is improve work
Efficiency.
Description of the drawings
The nondestructive detection system schematic diagram of Fig. 1 a small size components top layer microfissure.
Fig. 1 b vibration table schematic diagrams.
Fig. 2 three-dimensionals strain rosette schematic diagram clockwise.
Small size component schematic diagrams of the Fig. 3 without microfissure.
Fig. 4 has the small size component schematic diagram of microfissure.
The Numerical results of Fig. 5 a modal displacements.
The Numerical results of Fig. 5 b modal strains.
The experimental results of Fig. 6 modal strains.
Specific embodiment
Referring to the drawings, further illustrate this utility model：
The nondestructive detection system of 2 top layer microfissure of small size component, including master system, dynamic strain indicator, strain
There is card, charge amplifier, acceleration transducer 3, oscillograph in piece 1, vibration table, power amplifier, random waveform.
Card output amplitude master system control random waveform occurs and frequency is independent and continuously adjustable sine excitation
Signal；There is the sine excitation signal of card output via power amplifier inputted vibration platform in random waveform, so as to drive vibration table
Produce vibration；Acceleration transducer 3 is arranged on small size component 2, outfan and the charge amplifier of acceleration transducer 3
Input channel connects, and the output channel of charge amplifier is connected with oscillographic input channel, oscillographic output channel with it is upper
Position machine system connection；Foil gauge 1 is pasted onto on small size component 2, the outfan of foil gauge 1 and the input channel of dynamic strain indicator
Connection, the output channel of dynamic strain indicator are connected with master system.
Master system includes the strain waveform read module for obtaining the strain waveform that dynamic strain indicator is collected, from strain
The strain identification module of modal strain peak value ε (μ ε) is obtained in waveform, the voltage waveform of the voltage waveform of oscilloscope display is obtained
Read module, obtains the voltage identification module of voltage peak U (V) from voltage waveform, and voltage peak is converted to output
The vibration level modular converter of vibration level.
Sensitirity va1ue s (the pC/ms of acceleration transducer 3 are preset with vibration level modular converter-2), charge amplifier input is logical
The sensitivity coefficient S (pC/Unit) in road, amplification coefficient F (Unit/V)；Exporting vibration level with the transformational relation of voltage peak is：Wherein a represents output vibration level, and output vibration level is shown to use by the display interface of master system
Family.
Further, acceleration transducer 3 is piezoelectric acceleration transducer.
Further, foil gauge 1 is three-dimensional strain rosette clockwise.
Further, dynamic strain indicator is high-precision multi-path dynamic strain indicator.
The lossless detection method of 2 top layer microfissure of small size component is comprised the following steps：
(1) small size component 2 is clamped on the exciting table top 5 of vibration table moving component 4；Acceleration transducer 3 is pacified
It is mounted on small size component 2；Foil gauge 1 is pasted onto on small size component 2；Connect signal link；Switch on power.
(2) the sensitivity coefficient S (pC/Unit) of charge amplifier input channel is set in vibration level modular converter, is amplified
Coefficient F (Unit/V), the Sensitirity va1ue s (pC/ms of acceleration transducer 3-2)。
(3) voltage waveform read module obtains the voltage waveform of oscilloscope display；Voltage identification module is from voltage waveform
Obtain voltage peak U (V)；Vibration level is exported in vibration level modular converter with the transformational relation of voltage peak is：
(4) strain waveform read module obtains the strain waveform that dynamic strain indicator is collected；Strain identification module is from strain
Modal strain peak value ε (μ ε) is obtained in waveform.
(5) master system determines the resonant frequency f of the bending vibration of small size component 2 automatically by frequency sweep methodi(Hz)
(i=1,2 ..., N, N are positive integer).
(6) the slow gain knob for adjusting power amplifier causes power amplifier to export constant electric current I (A), drives
Vibration table carries out exciting under the resonant frequency of its bending vibration to small size component 2, and master system obtains small size component 2
The modal strain peak value of output.
Specifically, the undressed small size component 2 for processing is clamped in the actuating vibration table of vibration table moving component 4 first
On face 5, then according to the process described in step (1)-(6) carries out exciting to the undressed small size component 2 for processing, collection is not
The modal strain peak value of the small size component 2 that processed is crossed；After this, the small size component 2 after processed is filled
It is sandwiched on the exciting table top 5 of vibration table moving component 4, then according to after the process described in step (1)-(6) is to processed
Small size component 2 carry out exciting, gather the modal strain peak value of the small size component 2 after processed；If undressed place
The modal strain peak value of the small size component 2 managed be not equal to processed after small size component 2 modal strain peak value,
Show that the top layer of small size component 2 generates microfissure.
It is the undressed small size component 2 for processing that 2 top layer of the small size component produces the determination foundation of microfissure
Modal strain peak value be not equal to processed after small size component 2 modal strain peak value.
The signal link includes that master system and random waveform occur the signal link between card；Random waveform occurs
Signal link between card and power amplifier；Signal link between power amplifier and vibration table；Foil gauge 1 should with dynamic
Become the signal link between instrument；Signal link between dynamic strain indicator and master system；Acceleration transducer 3 is put with electric charge
Signal link between big device；Signal link between charge amplifier and oscillograph；Between oscillograph and master system
Signal link；The power supply include master system, random waveform occur card, power amplifier, vibration table, charge amplifier,
Oscillograph and dynamic strain indicator.
In step (5), master system determines the resonant frequency of the bending vibration of small size component 2 automatically by frequency sweep method
fi(Hz) (i=1,2 ..., N, N are positive integer) comprise the following steps：
(5.1) numerical value model analyses are carried out by ANSYS finite element softwares to small size component 2, obtains small size component 2
Bending vibration resonant frequency fsi(Hz) (i=1,2 ..., N, N are positive integer).
(5.2) there is initial excited frequency f of card in master system control random waveform0iIt is set to (fsi- 100) Hz, with
10Hz is stepped up the output frequency that random waveform occurs card for step-length；When master system records each excited frequency respectively
Act on vibration level a on small size component 2；Master system obtains frequency during vibration level a maximum；Master system records this
Frequency, and it is designated as f1i(Hz)。
(5.3) the initial excited frequency that master system control random waveform occurs card is set to (f1i- 10) Hz, with 1Hz
The output frequency that random waveform occurs card is stepped up for step-length；Master system is acted on when recording each excited frequency respectively
Vibration level a on small size component 2；Master system obtains frequency during vibration level a maximum；Master system records the frequency
Rate, and it is designated as fi(Hz)。
The small size component 2 (for representing the undressed small size component 2 for processing) without microfissure and Fig. 4 to Fig. 3
Small size component 2 with microfissure (for representing the small size component 2 after processed) carries out top layer microfissure
Non-Destructive Testing research.The length of the small size component 2 shown in Fig. 3 and Fig. 4 is 230mm, and width is 210mm, thickness
6mm is, for the ease of the small size component 2 shown in Fig. 3 and Fig. 4 to be clamped in the exciting table top 5 of vibration table moving component 4
On, it is 80mm that the distance between the installing hole that radius is 4mm, installing hole are left on the small size component 2 shown in Fig. 3 and Fig. 4,
The length of the microfissure in Fig. 4 is 2mm, and width is 0.2mm, and thickness is 0.2mm.Initially with the technique study of numerical analysis
Impact of the presence of microfissure to modal displacement and modal strain, have studied along specific direction (the i.e. length of small size component 2
Degree direction) modal displacement and modal strain the regularity of distribution, wherein the small size component 2 without microfissure and splitting with microcosmic
The regularity of distribution of the modal displacement of the small size component 2 of stricture of vagina is as shown in Figure 5 a；Small size component 2 without microfissure and have it is micro-
See the regularity of distribution of modal strain of the small size component 2 of crackle as shown in Figure 5 b.From Fig. 5 a, the little chi without microfissure
The mode of the first-order flexure displacement vibration shape of very little component 2 and the small size component with microfissure 2 and the five rank bending displacement vibration shapes
Shift value overlaps, though at the microfissure first-order flexure displacement vibration shape and the five rank bending displacement vibration shapes mode
Shift value is not also changed significantly, and shows that modal displacement is to microfissure and insensitive.From Fig. 5 b, without microfissure
The first-order flexure strain vibration shape and the five rank bending strain vibration shapes of small size component 2 and the small size component with microfissure 2
Modal strain value beyond microfissure where substantially overlap, but the first-order flexure strain at the microfissure
The modal strain value of the vibration shape and the five rank bending strain vibration shapes but there occurs significantly mutation, show that modal strain to microfissure is
It is sensitive, and mutation of the modal strain value of the five rank bending strain vibration shapes at microfissure become apparent from, and this shows to pass through
The modal strain value of the small size component 2 after the undressed small size component 2 for processing of detection and processed can be detected
Whether the top layer for going out small size component 2 generates microfissure, and detects that the modal strain value of the high-order strain vibration shape can be carried
The precision of high detection microfissure.
Fig. 2 is the schematic diagram of described three-dimensional strain rosette clockwise, and the strain rosette has 3 groups of strain corals, can perceive little
Modal strain during 2 Non-Destructive Testing of size members on 3 directions；Strain coral 1 is overlapped with x-axis, and strain coral 2 is in 45 ° with x-axis
Angle, strain coral 3 are overlapped with y-axis；Center circle diameters of the D for three-dimensional strain rosette clockwise.
The small size component 2 (for representing the undressed small size component 2 for processing) without microfissure and Fig. 4 in Fig. 3
Surface (the microfissure of the small size component 2 with microfissure (for representing the small size component 2 after processed)
Place) respectively paste Fig. 2 shown in three-dimensional strain rosette clockwise, then according to the lossless inspection of 2 top layer microfissure of small size component
Survey method institute comprising the step of carry out experimentation, gather respectively the small size component 2 without microfissure modal strain value and
The modal strain value of the small size component 2 with microfissure, and the modal strain value on three directions collecting is carried out
Following process：Wherein ε1、ε2And ε3Three-dimensional strain rosette clockwise shown in Fig. 2 collect three
Modal strain value on individual direction, is as a result shown in Fig. 6.The definition of relative deviation in Fig. 6 isFrom
Fig. 6 it is found that be capable of detecting when whether the top layer of small size component 2 generates microfissure by sensed-mode strain value,
And by detecting that high-order strains the accuracy of detection that the modal strain value of the vibration shape can improve microfissure.In addition, pass through
The modal strain value of the multiple strain vibration shapes of detection can also improve the accuracy of detection of microfissure.
Content described in this specification embodiment is only enumerating for the way of realization to utility model design, and this practicality is new
The protection domain of type is not construed as being only limitted to the concrete form stated by embodiment, protection domain of the present utility model also and
In those skilled in the art according to this utility model design it is conceivable that equivalent technologies mean.
Claims (2)
1. the nondestructive detection system of small size component top layer microfissure, including master system, dynamic strain indicator, foil gauge,
There is card, charge amplifier, acceleration transducer, oscillograph in vibration table, power amplifier, random waveform；
Card output amplitude master system control random waveform occurs and frequency is independent and continuously adjustable sine excitation signal；
There is the sine excitation signal of card output via power amplifier inputted vibration platform in random waveform, shake so as to drive vibration table to produce
It is dynamic；Acceleration transducer is arranged on small size component, the outfan of acceleration transducer and the input channel of charge amplifier
Connection, the output channel of charge amplifier is connected with oscillographic input channel, oscillographic output channel and master system
Connection；On small size component, the outfan of foil gauge is connected strain gauge adhesion with the input channel of dynamic strain indicator, and dynamic should
The output channel for becoming instrument is connected with master system；
Master system includes the strain waveform read module for obtaining the strain waveform that dynamic strain indicator is collected, from strain waveform
The strain identification module of middle acquisition modal strain peak value ε (μ ε), the voltage waveform for obtaining the voltage waveform of oscilloscope display read
Module, obtains the voltage identification module of voltage peak U (V) from voltage waveform, and voltage peak is converted to output vibration level
Vibration level modular converter；
Sensitirity va1ue s (the pC/ms of acceleration transducer are preset with vibration level modular converter-2), charge amplifier input channel
Sensitivity coefficient S (pC/Unit), amplification coefficient F (Unit/V)；Exporting vibration level with the transformational relation of voltage peak is：Wherein a represents output vibration level, and output vibration level is shown to user by the display interface of master system.
2. the nondestructive detection system of small size component top layer as claimed in claim 1 microfissure, it is characterised in that：Acceleration
Sensor is piezoelectric acceleration transducer, and foil gauge is three-dimensional strain rosette clockwise, and dynamic strain indicator is high-precision multi-path
Dynamic strain indicator.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201621052112.2U CN206057160U (en) | 2016-09-13 | 2016-09-13 | A kind of nondestructive detection system of small size component top layer microfissure |
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| CN201621052112.2U CN206057160U (en) | 2016-09-13 | 2016-09-13 | A kind of nondestructive detection system of small size component top layer microfissure |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106198383A (en) * | 2016-09-13 | 2016-12-07 | 上海海事大学 | The nondestructive detection system of a kind of small size component top layer microfissure and method |
| CN108037507A (en) * | 2017-11-16 | 2018-05-15 | 中南大学 | A kind of ultrasonic mima type microrelief detection system being used under deep-sea mining reverberant ambiance |
| CN110849973A (en) * | 2019-12-03 | 2020-02-28 | 上海海事大学 | High-frequency vibration system and method for nondestructive testing of micro-cracks on surface layer of small-size component |
-
2016
- 2016-09-13 CN CN201621052112.2U patent/CN206057160U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106198383A (en) * | 2016-09-13 | 2016-12-07 | 上海海事大学 | The nondestructive detection system of a kind of small size component top layer microfissure and method |
| CN108037507A (en) * | 2017-11-16 | 2018-05-15 | 中南大学 | A kind of ultrasonic mima type microrelief detection system being used under deep-sea mining reverberant ambiance |
| CN110849973A (en) * | 2019-12-03 | 2020-02-28 | 上海海事大学 | High-frequency vibration system and method for nondestructive testing of micro-cracks on surface layer of small-size component |
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