CN106198383A - The nondestructive detection system of a kind of small size component top layer microfissure and method - Google Patents
The nondestructive detection system of a kind of small size component top layer microfissure and method Download PDFInfo
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- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
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Abstract
The nondestructive detection system of small size component top layer microfissure, blocks including master system, dynamic strain indicator, foil gauge, vibration table, power amplifier, random waveform, charge amplifier, acceleration transducer, oscillograph；Master system includes strain waveform read module, strain identification module, voltage waveform read module, voltage identification module and grade modular converter that shakes.The lossless detection method of small size component top layer microfissure includes being clamped in by small size component on the exciting table top of vibration table moving component；First master system gathers the modal strain peak value of the undressed small size component processed, then the modal strain peak value of the small size component after gathering processed, if the modal strain peak value collected in the case of two kinds is unequal, i.e. show that the top layer of small size component creates microfissure.The present invention has can determine the advantage whether small size component top layer produces microfissure fast and accurately.
Description
Technical field
The present invention relates to technical field of nondestructive testing, refer in particular to the Non-Destructive Testing system of a kind of small size component top layer microfissure
System and method.
Technical background
Along with the fast development of minute manufacturing technology, small size component has been widely used in mechanical engineering field
In, but small size component can be acted on by various external factor during processing and manufacturing, can make small size component table
Layer introduces microfissure, seriously governs the raising of small size component quality, it is therefore necessary to detect small size component,
Determining whether small size component top layer produces microfissure, this has very important meaning to the subsequent applications of small size component
Justice.Now widely used microfissure detection method mainly includes Electron Microscopy, acoustic emission testing technology and surpasses
Sound detection technology.But Electron Microscopy belongs to destructive detection method, needs to prepare sample, then carries out corrosion treatmentCorrosion Science,
Just it is observed that the microscopic appearance of small size component, and then determine whether small size component top layer produces microfissure.Acoustic emission
Detection technique belongs to Dynamic Non-Destruction Measurement, it is possible to small size component carries out Non-Destructive Testing, but sound is sent out in actual detection
Penetrate signal the faintest, be easily subject to the interference of external factor, reduce the precision of detection.Ultrasonic detecting technology falls within
Dynamic Non-Destruction Measurement, it is possible to small size component is carried out Non-Destructive Testing, but ultrasonic detecting technology is to material incipient fatigue damage
Produced microfissure is the most insensitive, reduces the precision of detection.In order to determine that small size component top layer is fast and accurately
No generation microfissure, the present invention proposes nondestructive detection system and the method for a kind of small size component top layer microfissure.
Summary of the invention
In order to determine whether small size component top layer produces microfissure fast and accurately, the present invention proposes a kind of little chi
The nondestructive detection system of very little component top layer microfissure and method.
The nondestructive detection system of small size component top layer microfissure, including master system, dynamic strain indicator, strain
Sheet, vibration table, power amplifier, random waveform are blocked, charge amplifier, acceleration transducer, oscillograph.
Master system controls random waveform generation card output amplitude and frequency all independence and continuously adjustable sine excitation
Signal；The sine excitation signal of random waveform generation card output is via power amplifier inputted vibration platform, thus drives vibration table
Produce vibration；Acceleration transducer is arranged on small size component, and the outfan of acceleration transducer is defeated with charge amplifier
Entering passage to connect, the output channel of charge amplifier is connected with oscillographic input channel, and oscillographic output channel is with upper
Machine system connects；Strain gauge adhesion is on small size component, and the outfan of foil gauge is connected with the input channel of dynamic strain indicator,
The output channel of dynamic strain indicator is connected with master system.
Master system includes the strain waveform read module obtaining the strain waveform that dynamic strain indicator collects, from strain
Waveform obtains the strain identification module of modal strain peak value ε (μ ε), obtains the voltage waveform of the voltage waveform of oscilloscope display
Read module, obtains the voltage identification module of voltage peak U (V) from voltage waveform, and voltage peak is converted to output
Grade modular converter that shakes of level of shaking.
Shake and grade modular converter is preset with the Sensitirity va1ue s (pC/ms of acceleration transducer-2), charge amplifier input is logical
The sensitivity coefficient S (pC/Unit) in road, amplification coefficient F (Unit/V)；The shake transformational relation of level and voltage peak of output is:Wherein a represents that output is shaken level, and output level of shaking is shown to use by the display interface of master system
Family.
Further, acceleration transducer is piezoelectric acceleration transducer.
Further, foil gauge is three-dimensional strain rosette clockwise.
Further, dynamic strain indicator is high-precision multi-path dynamic strain indicator.
The lossless detection method of small size component top layer microfissure comprises the following steps:
(1) small size component is clamped on the exciting table top of vibration table moving component；Acceleration transducer is arranged on
On small size component；Strain gauge adhesion is on small size component；Connect signal link；Switch on power.
(2) the sensitivity coefficient S (pC/Unit) of charge amplifier input channel is set in grade modular converter that shakes, amplifies
Coefficient F (Unit/V), the Sensitirity va1ue s (pC/ms of acceleration transducer-2)。
(3) voltage waveform read module obtains the voltage waveform of oscilloscope display；Voltage identification module obtains from voltage waveform
Take voltage peak U (V)；The shake transformational relation of level and voltage peak of output in grade modular converter of shaking is:
(4) strain waveform read module obtains the strain waveform that dynamic strain indicator collects；Strain identification module is from strain
Waveform obtains modal strain peak value ε (μ ε).
(5) master system determines the resonant frequency f of bending vibration of small size component automatically by frequency sweep methodi(Hz)(i
=1,2 ..., N, N are positive integer).
(6) slowly the gain knob of regulation power amplifier makes power amplifier export constant electric current I (A), drives
Vibration table carries out exciting under the resonant frequency of its bending vibration to small size component, and it is defeated that master system obtains small size component
The modal strain peak value gone out.
Specifically, first the undressed small size component processed is clamped in the exciting table top of vibration table moving component
On, then according to the process described in step (1)-(6) carries out exciting to the undressed small size component processed, gather undressed
The modal strain peak value of the small size component processed；After this, the small size component after processed is clamped in shakes
On the exciting table top of dynamic platform moving component, then according to the process described in step (1)-(6) is to the small size after processed
Component carries out the modal strain peak value of the small size component after exciting, collection processed；If the undressed little chi processed
The modal strain peak value of very little component is not equal to the modal strain peak value of the small size component after processed, i.e. shows small size
The top layer of component creates microfissure.
It is the undressed small size component processed that described small size component top layer produces the determination foundation of microfissure
Modal strain peak value is not equal to the modal strain peak value of the small size component after processed.
Described signal link include master system and random waveform block between signal link；Random waveform occurs
Signal link between card and power amplifier；Signal link between power amplifier and vibration table；Foil gauge is answered with dynamic
Become the signal link between instrument；Signal link between dynamic strain indicator and master system；Acceleration transducer is put with electric charge
Signal link between big device；Signal link between charge amplifier and oscillograph；Between oscillograph and master system
Signal link；Described power supply include master system, random waveform block, power amplifier, vibration table, charge amplifier,
Oscillograph and dynamic strain indicator.
In step (5), master system determines the resonant frequency of the bending vibration of small size component automatically by frequency sweep method
fi(Hz) (i=1,2 ..., N, N are positive integer) comprise the following steps:
(5.1) by ANSYS finite element software, small size component is carried out numerical value model analysis, obtain small size component
The resonant frequency f of bending vibrationsi(Hz) (i=1,2 ..., N, N are positive integer).
(5.2) master system controls random waveform and initial excited frequency f of card occurs0iIt is set to (fsi-100) Hz, with
10Hz is the output frequency that step-length is stepped up that random waveform occurs to block；When master system records each excited frequency respectively
Act on grade a that shakes on small size component；Master system obtain shaking grade a maximum time frequency；Master system records this
Frequency, and it is designated as f1i(Hz)。
(5.3) master system control random waveform occurs the initial excited frequency of card to be set to (f1i-10) Hz, with 1Hz
It is stepped up random waveform for step-length and the output frequency of card occurs；Effect when master system records each excited frequency respectively
Grade a that shakes on small size component；Master system obtain shaking grade a maximum time frequency；Master system records this frequency,
And it is designated as fi(Hz)。
The present invention technology design be: by master system, dynamic strain indicator, foil gauge, vibration table, power amplifier,
Random waveform is blocked, charge amplifier, acceleration transducer and oscillograph constitute small size component top layer microfissure
Nondestructive detection system；Small size component is clamped on the exciting table top of vibration table moving component；First master system gathers not
The modal strain peak value of the small size component that processed is crossed, the then mode of the small size component after gathering processed
Strain peak value, if the modal strain peak value of the undressed small size component processed is not equal to the small size structure after processed
The modal strain peak value of part, i.e. shows that the top layer of small size component creates microfissure.
The invention has the beneficial effects as follows:
1, small size component is entered by the nondestructive detection system of the small size component top layer microfissure set up by the present invention
Row detection, it is possible to determine whether small size component top layer exists microfissure.
2, the nondestructive detection system of the small size component top layer microfissure set up by the present invention can be to small size structure
Part carries out Non-Destructive Testing, small size component will not be produced damage.
3, the nondestructive detection system of the small size component top layer microfissure set up by the present invention can be to small size structure
Part detects under the resonant frequency of its multiple bending vibrations, it is ensured that the reliability of testing result.
4, the nondestructive detection system of the small size component top layer microfissure set up by the present invention to processing before and after little
Size members detects under the resonant frequency of its bending vibration, and detection process is the shortest, it is possible to quickly determine small size
Whether component top layer produces microfissure, is conducive to improving detection efficiency.
5, small size component is examined by the nondestructive detection system of the small size component top layer microfissure that the present invention sets up
During survey, detection process is controlled by master system, it is not necessary to manual operation, decreases workload, improves the efficiency of work.
Accompanying drawing explanation
The nondestructive detection system schematic diagram of Fig. 1 a small size component top layer microfissure.
Fig. 1 b vibration table schematic diagram.
Fig. 2 three-dimensional strain rosette clockwise schematic diagram.
Fig. 3 is without the small size component schematic diagram of microfissure.
Fig. 4 has the small size component schematic diagram of microfissure.
The Numerical results of Fig. 5 a modal displacement.
The Numerical results of Fig. 5 b modal strain.
The experimental results of Fig. 6 modal strain.
Detailed description of the invention
Referring to the drawings, the present invention is further illustrated:
The nondestructive detection system of small size component 2 top layer microfissure, including master system, dynamic strain indicator, strain
Sheet 1, vibration table, power amplifier, random waveform are blocked, charge amplifier, acceleration transducer 3, oscillograph.
Master system controls random waveform generation card output amplitude and frequency all independence and continuously adjustable sine excitation
Signal；The sine excitation signal of random waveform generation card output is via power amplifier inputted vibration platform, thus drives vibration table
Produce vibration；Acceleration transducer 3 is arranged on small size component 2, the outfan of acceleration transducer 3 and charge amplifier
Input channel connects, and the output channel of charge amplifier is connected with oscillographic input channel, and oscillographic output channel is with upper
Position machine system connects；Foil gauge 1 is pasted onto on small size component 2, the outfan of foil gauge 1 and the input channel of dynamic strain indicator
Connecting, the output channel of dynamic strain indicator is connected with master system.
Master system includes the strain waveform read module obtaining the strain waveform that dynamic strain indicator collects, from strain
Waveform obtains the strain identification module of modal strain peak value ε (μ ε), obtains the voltage waveform of the voltage waveform of oscilloscope display
Read module, obtains the voltage identification module of voltage peak U (V) from voltage waveform, and voltage peak is converted to output
Grade modular converter that shakes of level of shaking.
Shake and grade modular converter is preset with the Sensitirity va1ue s (pC/ms of acceleration transducer 3-2), charge amplifier input is logical
The sensitivity coefficient S (pC/Unit) in road, amplification coefficient F (Unit/V)；The shake transformational relation of level and voltage peak of output is:Wherein a represents that output is shaken level, and output level of shaking is shown to use by the display interface of master system
Family.
Further, acceleration transducer 3 is piezoelectric acceleration transducer.
Further, foil gauge 1 is three-dimensional strain rosette clockwise.
Further, dynamic strain indicator is high-precision multi-path dynamic strain indicator.
The lossless detection method of small size component 2 top layer microfissure comprises the following steps:
(1) small size component 2 is clamped on the exciting table top 5 of vibration table moving component 4；Acceleration transducer 3 is pacified
It is contained on small size component 2；Foil gauge 1 is pasted onto on small size component 2；Connect signal link；Switch on power.
(2) the sensitivity coefficient S (pC/Unit) of charge amplifier input channel is set in grade modular converter that shakes, amplifies
Coefficient F (Unit/V), the Sensitirity va1ue s (pC/ms of acceleration transducer 3-2)。
(3) voltage waveform read module obtains the voltage waveform of oscilloscope display；Voltage identification module is from voltage waveform
Obtain voltage peak U (V)；The shake transformational relation of level and voltage peak of output in grade modular converter of shaking is:
(4) strain waveform read module obtains the strain waveform that dynamic strain indicator collects；Strain identification module is from strain
Waveform obtains modal strain peak value ε (μ ε).
(5) master system determines the resonant frequency f of bending vibration of small size component 2 automatically by frequency sweep methodi(Hz)
(i=1,2 ..., N, N are positive integer).
(6) slowly the gain knob of regulation power amplifier makes power amplifier export constant electric current I (A), drives
Vibration table carries out exciting under the resonant frequency of its bending vibration to small size component 2, and master system obtains small size component 2
The modal strain peak value of output.
Specifically, first the undressed small size component 2 processed is clamped in the actuating vibration table of vibration table moving component 4
On face 5, then according to the process described in step (1)-(6) carries out exciting to the undressed small size component 2 processed, gather not
The modal strain peak value of the small size component 2 that processed is crossed；After this, the small size component 2 after processed is filled
It is sandwiched on the exciting table top 5 of vibration table moving component 4, then according to after the process described in step (1)-(6) is to processed
Small size component 2 carry out exciting, gather the modal strain peak value of small size component 2 after processed；If undressed place
The modal strain peak value of the small size component 2 managed is not equal to the modal strain peak value of the small size component 2 after processed,
I.e. show that the top layer of small size component 2 creates microfissure.
It is the undressed small size component 2 processed that described small size component 2 top layer produces the determination foundation of microfissure
Modal strain peak value be not equal to the modal strain peak value of the small size component 2 after processed.
Described signal link include master system and random waveform block between signal link；Random waveform occurs
Signal link between card and power amplifier；Signal link between power amplifier and vibration table；Foil gauge 1 is answered with dynamic
Become the signal link between instrument；Signal link between dynamic strain indicator and master system；Acceleration transducer 3 is put with electric charge
Signal link between big device；Signal link between charge amplifier and oscillograph；Between oscillograph and master system
Signal link；Described power supply include master system, random waveform block, power amplifier, vibration table, charge amplifier,
Oscillograph and dynamic strain indicator.
In step (5), master system determines the resonant frequency of the bending vibration of small size component 2 automatically by frequency sweep method
fi(Hz) (i=1,2 ..., N, N are positive integer) comprise the following steps:
(5.1) by ANSYS finite element software, small size component 2 is carried out numerical value model analysis, obtain small size component 2
The resonant frequency f of bending vibrationsi(Hz) (i=1,2 ..., N, N are positive integer).
(5.2) master system controls random waveform and initial excited frequency f of card occurs0iIt is set to (fsi-100) Hz, with
10Hz is the output frequency that step-length is stepped up that random waveform occurs to block；When master system records each excited frequency respectively
Act on grade a that shakes on small size component 2；Master system obtain shaking grade a maximum time frequency；Master system records this
Frequency, and it is designated as f1i(Hz)。
(5.3) master system control random waveform occurs the initial excited frequency of card to be set to (f1i-10) Hz, with 1Hz
It is stepped up random waveform for step-length and the output frequency of card occurs；Effect when master system records each excited frequency respectively
Grade a that shakes on small size component 2；Master system obtain shaking grade a maximum time frequency；Master system records this frequency
Rate, and it is designated as fi(Hz)。
To Fig. 3 without the small size component 2 (for representing the undressed small size component 2 processed) of microfissure and Fig. 4
The small size component 2 (small size component 2 after representing processed) with microfissure carries out top layer microfissure
The research of Non-Destructive Testing.The length of the small size component 2 shown in Fig. 3 and Fig. 4 is 230mm, and width is 210mm, thickness
It is 6mm, for the ease of the small size component 2 shown in Fig. 3 and Fig. 4 being clamped in the exciting table top 5 of vibration table moving component 4
On, the small size component 2 shown in Fig. 3 and Fig. 4 leaves the installing hole that radius is 4mm, the distance between installing hole is 80mm,
The a length of 2mm of the microfissure in Fig. 4, width is 0.2mm, and thickness is 0.2mm.Technique study initially with numerical analysis
The existence of microfissure, on modal displacement and the impact of modal strain, have studied along specific direction (the i.e. length of small size component 2
Degree direction) modal displacement and the regularity of distribution of modal strain, wherein without microfissure small size component 2 with there is microcosmic split
The regularity of distribution of the modal displacement of the small size component 2 of stricture of vagina is as shown in Figure 5 a；Without the small size component 2 of microfissure with have micro-
See the regularity of distribution of modal strain of the small size component 2 of crackle as shown in Figure 5 b.From Fig. 5 a, without the little chi of microfissure
Very little component 2 and there is the first-order flexure displacement vibration shape of small size component 2 and the mode of the five rank bending displacement vibration shapes of microfissure
Shift value overlaps, though the first-order flexure displacement vibration shape and the mode of the five rank bending displacement vibration shapes at microfissure
Shift value does not changes significantly, and shows that modal displacement is to microfissure insensitive.From Fig. 5 b, without microfissure
Small size component 2 and there are the first-order flexure strain vibration shape of small size component 2 of microfissure and the five rank bending strain vibration shapes
Modal strain value place beyond microfissure is substantially and overlaps, but first-order flexure strain at microfissure
The modal strain value of the vibration shape and the five rank bending strain vibration shapes but there occurs significantly sudden change, shows that microfissure is by modal strain
Sensitive, and the sudden change that the modal strain value of the five rank bending strain vibration shapes is at microfissure becomes apparent from, and this shows to pass through
The modal strain value detecting the small size component 2 after the undressed small size component 2 processed and processed can detect
Whether the top layer going out small size component 2 creates microfissure, and the modal strain value detecting the high-order strain vibration shape can carry
The precision of high detection microfissure.
The schematic diagram of the three-dimensional strain rosette clockwise that Fig. 2 is described, this strain rosette has 3 groups of strain corals, it is possible to perception is little
Modal strain on 3 directions during size members 2 Non-Destructive Testing；Strain coral 1 overlaps with x-axis, and strain coral 2 and x-axis are 45 °
Angle, strain coral 3 overlaps with y-axis；D is the center circle diameter of three-dimensional strain rosette clockwise.
At Fig. 3 without the small size component 2 (for representing the undressed small size component 2 processed) of microfissure and Fig. 4
There is the surface (microfissure of the small size component 2 (small size component 2 after representing processed) of microfissure
Place) paste the three-dimensional strain rosette clockwise shown in Fig. 2 respectively, then according to the lossless inspection of small size component 2 top layer microfissure
The step that survey method is comprised carries out experimentation, gather respectively the modal strain value of the small size component 2 without microfissure with
There is the modal strain value of the small size component 2 of microfissure, and the modal strain value on three directions collected is carried out
Following process:Wherein ε1、ε2And ε3Collect for the strain rosette clockwise of the three-dimensional shown in Fig. 2
Three directions on modal strain value, result is shown in Fig. 6.In Fig. 6, the definition of relative deviation is
From Fig. 6 it is found that be capable of detecting when whether the top layer of small size component 2 creates microcosmic and split by sensed-mode strain value
Stricture of vagina, and the accuracy of detection of microfissure can be improved by the modal strain value of the detection high-order strain vibration shape.In addition, logical
Cross and detect the modal strain value of multiple strain vibration shape and also be able to improve the accuracy of detection of microfissure.
Content described in this specification embodiment is only enumerating of the way of realization to inventive concept, the protection of the present invention
Scope is not construed as being only limitted to the concrete form that embodiment is stated, protection scope of the present invention is also and in art technology
Personnel according to present inventive concept it is conceivable that equivalent technologies means.
Claims (6)
1. the nondestructive detection system of small size component top layer microfissure, including master system, dynamic strain indicator, foil gauge,
Vibration table, power amplifier, random waveform are blocked, charge amplifier, acceleration transducer, oscillograph.
Master system controls random waveform generation card output amplitude and frequency all independence and continuously adjustable sine excitation signal；
The sine excitation signal of random waveform generation card output is via power amplifier inputted vibration platform, thus drives vibration table to produce and shake
Dynamic；Acceleration transducer is arranged on small size component, the outfan of acceleration transducer and the input channel of charge amplifier
Connecting, the output channel of charge amplifier is connected with oscillographic input channel, oscillographic output channel and master system
Connect；Strain gauge adhesion is on small size component, and the outfan of foil gauge is connected with the input channel of dynamic strain indicator, dynamically should
The output channel becoming instrument is connected with master system.
Master system includes the strain waveform read module obtaining the strain waveform that dynamic strain indicator collects, from strain waveform
The strain identification module of middle acquisition modal strain peak value ε (μ ε), the voltage waveform of the voltage waveform obtaining oscilloscope display reads
Module, obtains the voltage identification module of voltage peak U (V) from voltage waveform, and voltage peak is converted to output shakes level
Grade modular converter that shakes.
Shake and grade modular converter is preset with the Sensitirity va1ue s (pC/ms of acceleration transducer-2), charge amplifier input channel
Sensitivity coefficient S (pC/Unit), amplification coefficient F (Unit/V)；The shake transformational relation of level and voltage peak of output is:Wherein a represents that output is shaken level, and output level of shaking is shown to use by the display interface of master system
Family.
2. the nondestructive detection system of small size component top layer as claimed in claim 1 microfissure, it is characterised in that: acceleration
Sensor is piezoelectric acceleration transducer, and foil gauge is three-dimensional strain rosette clockwise, and dynamic strain indicator is high-precision multi-path
Dynamic strain indicator.
3. use the nondestructive detection system detection microfissure of small size component top layer as claimed in claim 1 microfissure
Method comprises the following steps:
(1) small size component is clamped on the exciting table top of vibration table moving component；Acceleration transducer is arranged on little chi
On very little component；Strain gauge adhesion is on small size component；Connect signal link；Switch on power.
(2) the sensitivity coefficient S (pC/Unit) of charge amplifier input channel, amplification coefficient F are set in grade modular converter that shakes
(Unit/V), the Sensitirity va1ue s (pC/ms of acceleration transducer-2)。
(3) voltage waveform read module obtains the voltage waveform of oscilloscope display；Voltage identification module obtains from voltage waveform
Voltage peak U (V)；The shake transformational relation of level and voltage peak of output in grade modular converter of shaking is:
(4) strain waveform read module obtains the strain waveform that dynamic strain indicator collects；Strain identification module is from strain waveform
Middle acquisition modal strain peak value ε (μ ε).
(5) master system determines the resonant frequency f of bending vibration of small size component automatically by frequency sweep methodi(Hz) (i=1,
2 ..., N, N are positive integer).
(6) slowly the gain knob of regulation power amplifier makes power amplifier export constant electric current I (A), drives vibration
Platform carries out exciting under the resonant frequency of its bending vibration to small size component, and master system obtains small size component output
Modal strain peak value.
4. the lossless detection method of small size component top layer as claimed in claim 3 microfissure, it is characterised in that: described little
Size members top layer produces the determination of microfissure according to the modal strain peak value for the undressed small size component processed not
Modal strain peak value equal to the small size component after processed.
5. the lossless detection method of small size component top layer as claimed in claim 3 microfissure, it is characterised in that: described letter
Number line include master system and random waveform block between signal link；There is card and power amplifier in random waveform
Between signal link；Signal link between power amplifier and vibration table；Signal between foil gauge and dynamic strain indicator
Line；Signal link between dynamic strain indicator and master system；Signal between acceleration transducer and charge amplifier
Line；Signal link between charge amplifier and oscillograph；Signal link between oscillograph and master system；Described electricity
Source include master system, random waveform block, power amplifier, vibration table, charge amplifier, oscillograph and dynamic strain
Instrument.
6. the lossless detection method of small size component top layer as claimed in claim 3 microfissure, it is characterised in that: step
(5), in, master system determines the resonant frequency f of the bending vibration of small size component automatically by frequency sweep methodi(Hz) (i=1,
2 ..., N, N are positive integer) comprise the following steps:
(5.1) by ANSYS finite element software, small size component is carried out numerical value model analysis, obtain the bending of small size component
The resonant frequency f of vibrationsi(Hz) (i=1,2 ..., N, N are positive integer).
(5.2) master system controls random waveform and initial excited frequency f of card occurs0iIt is set to (fsi-100) Hz, with 10Hz
It is stepped up random waveform for step-length and the output frequency of card occurs；Effect when master system records each excited frequency respectively
Grade a that shakes on small size component；Master system obtain shaking grade a maximum time frequency；Master system records this frequency,
And it is designated as f1i(Hz)。
(5.3) master system control random waveform occurs the initial excited frequency of card to be set to (f1i-10) Hz, with 1Hz as step
There is the output frequency of card in the long random waveform that is stepped up；Master system acts on little when recording each excited frequency respectively
Grade a that shakes in size members；Master system obtain shaking grade a maximum time frequency；Master system records this frequency, and remembers
For fi(Hz)。
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| CN108469436A (en) * | 2018-03-15 | 2018-08-31 | 中国航空工业集团公司沈阳飞机设计研究所 | A kind of crack of metal surface detection method and detecting system |
| CN110849973A (en) * | 2019-12-03 | 2020-02-28 | 上海海事大学 | High-frequency vibration system and method for nondestructive testing of micro-cracks on surface layer of small-size component |
| CN111855798A (en) * | 2020-06-30 | 2020-10-30 | 嘉峪关天源新材料有限责任公司 | Detection device and detection method for edge defects of bonded composite board |
| CN113063343A (en) * | 2021-03-23 | 2021-07-02 | 南京云起共振电力科技有限公司 | Rotating shaft crack detection method based on strain signal waveform distortion evaluation |
Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101498688A (en) * | 2009-02-25 | 2009-08-05 | 中国海洋大学 | Ocean platform integral lossless detection method based on structural vibration |
| CN102226783A (en) * | 2011-03-25 | 2011-10-26 | 北京工业大学 | Device and method for detecting pipeline closed cracks based on vibro-acoustic modulation technology |
| CN102759487A (en) * | 2012-07-06 | 2012-10-31 | 北京大学 | Partial stiffness method based composite material non-destructive detection system and detection method |
| CN103293223A (en) * | 2013-03-04 | 2013-09-11 | 江苏省特种设备安全监督检验研究院镇江分院 | Characteristic guided wave based butt weld nondestructive testing system |
| CN103336054A (en) * | 2013-06-03 | 2013-10-02 | 北京工业大学 | Ultrasonic Lamb wave-based butt weld nondestructive testing method |
| CN103760243A (en) * | 2014-02-26 | 2014-04-30 | 长沙理工大学 | Microcrack nondestructive testing device and method |
| CN103757197A (en) * | 2014-01-25 | 2014-04-30 | 浙江大学 | High-frequency vibration aging system and method for eliminating residual stress of small-size component |
| CN103773945A (en) * | 2014-01-25 | 2014-05-07 | 浙江大学 | Real-time vibration-aging vibration level testing system and automatic adjustment method |
| CN104897353A (en) * | 2015-06-23 | 2015-09-09 | 中国航空工业集团公司西安飞机设计研究所 | Member damage detection method |
| CN105543469A (en) * | 2015-12-25 | 2016-05-04 | 常州大学 | System and method for determining vibration aging excitation frequency |
| CN105698012A (en) * | 2016-01-15 | 2016-06-22 | 北京工业大学 | Pipe flaw guided circumferential wave nondestructive testing method based on transverse-wave straight probes |
| CN105783799A (en) * | 2016-03-03 | 2016-07-20 | 四川升拓检测技术股份有限公司 | Ballastless track plate seam depth non-destructive detection method and equipment based on vibration |
| CN105861811A (en) * | 2016-04-28 | 2016-08-17 | 上海海事大学 | Online quantitative evaluation system and method for vibration aging effect |
| CN105910986A (en) * | 2016-06-20 | 2016-08-31 | 中核(天津)科技发展有限公司 | High polymer material internal defect nondestructive detecting device |
| CN205749240U (en) * | 2016-06-20 | 2016-11-30 | 中核(天津)科技发展有限公司 | A kind of macromolecular material internal flaw the cannot-harm-detection device |
| CN206057160U (en) * | 2016-09-13 | 2017-03-29 | 上海海事大学 | A kind of nondestructive detection system of small size component top layer microfissure |
-
2016
- 2016-09-13 CN CN201610819486.0A patent/CN106198383A/en active Pending
Patent Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101498688A (en) * | 2009-02-25 | 2009-08-05 | 中国海洋大学 | Ocean platform integral lossless detection method based on structural vibration |
| CN102226783A (en) * | 2011-03-25 | 2011-10-26 | 北京工业大学 | Device and method for detecting pipeline closed cracks based on vibro-acoustic modulation technology |
| CN102759487A (en) * | 2012-07-06 | 2012-10-31 | 北京大学 | Partial stiffness method based composite material non-destructive detection system and detection method |
| CN103293223A (en) * | 2013-03-04 | 2013-09-11 | 江苏省特种设备安全监督检验研究院镇江分院 | Characteristic guided wave based butt weld nondestructive testing system |
| CN103336054A (en) * | 2013-06-03 | 2013-10-02 | 北京工业大学 | Ultrasonic Lamb wave-based butt weld nondestructive testing method |
| CN103757197A (en) * | 2014-01-25 | 2014-04-30 | 浙江大学 | High-frequency vibration aging system and method for eliminating residual stress of small-size component |
| CN103773945A (en) * | 2014-01-25 | 2014-05-07 | 浙江大学 | Real-time vibration-aging vibration level testing system and automatic adjustment method |
| CN103760243A (en) * | 2014-02-26 | 2014-04-30 | 长沙理工大学 | Microcrack nondestructive testing device and method |
| CN104897353A (en) * | 2015-06-23 | 2015-09-09 | 中国航空工业集团公司西安飞机设计研究所 | Member damage detection method |
| CN105543469A (en) * | 2015-12-25 | 2016-05-04 | 常州大学 | System and method for determining vibration aging excitation frequency |
| CN105698012A (en) * | 2016-01-15 | 2016-06-22 | 北京工业大学 | Pipe flaw guided circumferential wave nondestructive testing method based on transverse-wave straight probes |
| CN105783799A (en) * | 2016-03-03 | 2016-07-20 | 四川升拓检测技术股份有限公司 | Ballastless track plate seam depth non-destructive detection method and equipment based on vibration |
| CN105861811A (en) * | 2016-04-28 | 2016-08-17 | 上海海事大学 | Online quantitative evaluation system and method for vibration aging effect |
| CN105910986A (en) * | 2016-06-20 | 2016-08-31 | 中核(天津)科技发展有限公司 | High polymer material internal defect nondestructive detecting device |
| CN205749240U (en) * | 2016-06-20 | 2016-11-30 | 中核(天津)科技发展有限公司 | A kind of macromolecular material internal flaw the cannot-harm-detection device |
| CN206057160U (en) * | 2016-09-13 | 2017-03-29 | 上海海事大学 | A kind of nondestructive detection system of small size component top layer microfissure |
Non-Patent Citations (1)
| Title |
|---|
| 张开鹏: "结构损伤识别方法研究", 《中国博士学位论文全文数据库 工程科技Ⅱ辑》 * |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107287408A (en) * | 2017-07-03 | 2017-10-24 | 上海海事大学 | High-frequency percussion vibrational system and method for eliminating residual stress |
| CN107219168A (en) * | 2017-08-02 | 2017-09-29 | 贵州工程应用技术学院 | A kind of advance damage intelligent injury detector |
| CN107219168B (en) * | 2017-08-02 | 2024-03-29 | 贵州工程应用技术学院 | Pre-damage intelligent damage detector |
| CN108469436A (en) * | 2018-03-15 | 2018-08-31 | 中国航空工业集团公司沈阳飞机设计研究所 | A kind of crack of metal surface detection method and detecting system |
| CN110849973A (en) * | 2019-12-03 | 2020-02-28 | 上海海事大学 | High-frequency vibration system and method for nondestructive testing of micro-cracks on surface layer of small-size component |
| CN111855798A (en) * | 2020-06-30 | 2020-10-30 | 嘉峪关天源新材料有限责任公司 | Detection device and detection method for edge defects of bonded composite board |
| CN113063343A (en) * | 2021-03-23 | 2021-07-02 | 南京云起共振电力科技有限公司 | Rotating shaft crack detection method based on strain signal waveform distortion evaluation |
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