CN206003767U - A kind of Ultrathin packaging device - Google Patents
A kind of Ultrathin packaging device Download PDFInfo
- Publication number
- CN206003767U CN206003767U CN201620939990.XU CN201620939990U CN206003767U CN 206003767 U CN206003767 U CN 206003767U CN 201620939990 U CN201620939990 U CN 201620939990U CN 206003767 U CN206003767 U CN 206003767U
- Authority
- CN
- China
- Prior art keywords
- plastic casing
- chip
- packaging device
- pin
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 13
- 239000004033 plastic Substances 0.000 claims abstract description 29
- 239000011521 glass Substances 0.000 claims abstract description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 238000005538 encapsulation Methods 0.000 abstract description 2
- 239000002994 raw material Substances 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000005007 epoxy-phenolic resin Substances 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model provides a kind of Ultrathin packaging device, and with a plane lead frame, two chips and its respective encapsulation plastic casing, being respectively provided between chip and pin respective is bonded connecting line.Each chip and respective slide glass area, bonding line, pin end are encapsulated in inside a plastic casing.The thickness of lead frame is 0.15 0.3mm, and the thickness of plastic casing can be 0.5 15mm.Two chip common leads frameworks of the utility model, save the usage amount of raw material；Electrically connect reliable between two chips, electric signal synchronism is higher.
Description
Technical field
The utility model is related to the electronic devices and components for encapsulating and combinations thereof product.
Background technology
Electronic devices and components are usually that individually separated production is self-existent, then respective packaging part link together dress
Join, form certain integrated circuit.Relatively time-consuming waste material is assembled, and the reliability of electrical connection for easily occurring each other is not high enough
Situation.
A kind of ultra-thin MEMS chip of number of patent application Vacuum Package that has been 2013102856498 disclosure of the invention and its plus
Work method, comprises the steps：（1）Selection standard wafer material is used as substrate layer；（2）Individual layer or many is made on substrate layer
Layer cabling；（3）On structure sheaf, deposited metal layer is simultaneously graphical, then etches the groove of certain depth；（4）Using Jin-gold altogether
Substrate layer and structure sheaf are carried out the technical process such as being bonded by brilliant bonding method, can only do and exert on the volume of single components and parts reduces
Power, when which is linked together with other components and parts, the advantage that volume can become larger, thin again can not be embodied.
Content of the invention
Utility model purpose：A kind of compact conformation is provided, electrically connects the relatively low common leads framework of reliability, manufacturing cost
Double packagings.
Technical scheme：
The Ultrathin packaging device that the utility model is provided, with a plane lead frame（Containing two chips and its
Slide glass area, two pin area and its pin, each pin area have 2 or 3 pins）, two chips are corresponding to be drawn
Respective bonding connecting line is respectively provided between pin；Each chip and respective slide glass area, bonding line, the encapsulation of pin end
Inside respective plastic casing.
It is preferred that first chip is IC element, diode or IGBT, 2 pins are contained in first pin area, respectively with
Two electrodes of first chip are connected；Second chip is electric capacity, and 2 pins are contained in second pin area, respectively with electricity
Two electrodes for holding are connected.
Connecting line is bonded for tinned wird or silver-coated copper wire between chip and its pin, be connected firmly, electric conductivity excellent
Different.
The upper surface of the upper surface of first plastic casing and second plastic casing is parallel to the same of lead frame
In plane, the lower surface of the lower surface of first plastic casing and second plastic casing is not in approximately the same plane.
The upper surface of plastic casing has 0-9 ° of draw taper, the lower surface of plastic casing and its side tool with its side
There is 1-10 ° of draw taper, be easy to cast molding and the demoulding.
The thickness of lead frame is 0.15-0.3mm, and the thickness of plastic casing can be 0.5-15mm.
The width of plastic casing is more than the width 0.4-4mm of lead frame.
The main material of lead frame is preferably the good red copper of electric conductivity, and the material preferably insulating properties of plastic casing is good
Good epoxy resin or phenolic resin.
Beneficial effect：
Two chip common leads frameworks, save the usage amount of raw material, and cost is relatively low.Draw by first between two chips
Pin area is connected, and electrical connection is reliable, is less prone to the problem of electrode welding rosin joint.Electric signal synchronism between two chips
Height, is less prone to distorted signals or mistake.Plane lead frame ensures that the installing space for needing during this period is less, easily
Make the accurate microelectronic industry components and parts of comparison.
Description of the drawings
Fig. 1 is an overlooking the structure diagram of the present utility model；
Fig. 2 is a side structure schematic view of the present utility model；
In figure, the width of 1- plastic casing；First plastic casing of 2-；3- the first chip slide glass area；The first pin area of 4-；
Second plastic casing of 5-；6- the second chip slide glass area；7- second pin area；8- draw taper；9- upper surface；10- side；
11- lower surface；The thickness of 12- plastic casing；The thickness of 13- lead frame.
Specific embodiment
A kind of Ultrathin packaging device as shown in Figure 1, 2, with a plane lead frame, containing two chips and
Its slide glass area 3 and 6, two pin area 4 and 7, being respectively provided between two chips and its pin respective are bonded connecting line；Per
One chip and respective slide glass area, bonding line, pin end are encapsulated in inside respective plastic casing 2 and 5.First plastic cement
The upper surface of the upper surface of housing 2 and second plastic casing 5 is in the same plane parallel to lead frame.Plastic casing 2
With 5 upper surface 9 and draw taper 8 of its side 10 with 3-9 °, the lower surface 11 of plastic casing is with its side 10 with 5-
10 ° of draw taper.The thickness 13 of lead frame is 0.15-0.3mm, and the thickness 12 of plastic casing is 0.5-15mm.
Claims (6)
1. a kind of Ultrathin packaging device, with a plane lead frame, it is characterised in that：Containing two chips and its load
Section, two pin area and its respective pin, are respectively provided with respective bonding connection between the corresponding pin of two chips
Line；Each chip and respective slide glass area, bonding line, pin end are encapsulated in inside respective plastic casing.
2. a kind of Ultrathin packaging device as claimed in claim 1, it is characterised in that：First chip is IC element, second
Chip is electric capacity.
3. a kind of Ultrathin packaging device as claimed in claim 1 or 2, it is characterised in that：Being bonded between chip and its pin
Connecting line is tinned wird or silver-coated copper wire.
4. a kind of Ultrathin packaging device as claimed in claim 1 or 2, it is characterised in that：The upper surface of first plastic casing
With the upper surface of second plastic casing in the same plane parallel to lead frame.
5. a kind of Ultrathin packaging device as claimed in claim 4, it is characterised in that：The upper surface of plastic casing and its side tool
There is 0-9 ° of draw taper, the lower surface of plastic casing has 1-10 ° of draw taper with its side.
6. a kind of Ultrathin packaging device as described in claim 1,2 or 5, it is characterised in that：The thickness of lead frame is 0.15-
0.3mm, the thickness of plastic casing is 0.5-15mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620939990.XU CN206003767U (en) | 2016-08-25 | 2016-08-25 | A kind of Ultrathin packaging device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620939990.XU CN206003767U (en) | 2016-08-25 | 2016-08-25 | A kind of Ultrathin packaging device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206003767U true CN206003767U (en) | 2017-03-08 |
Family
ID=58197582
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620939990.XU Ceased CN206003767U (en) | 2016-08-25 | 2016-08-25 | A kind of Ultrathin packaging device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206003767U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107731573A (en) * | 2017-10-29 | 2018-02-23 | 西安空间无线电技术研究所 | A kind of pulse storage capacitor method for packing and encapsulating structure |
-
2016
- 2016-08-25 CN CN201620939990.XU patent/CN206003767U/en not_active Ceased
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107731573A (en) * | 2017-10-29 | 2018-02-23 | 西安空间无线电技术研究所 | A kind of pulse storage capacitor method for packing and encapsulating structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 226000 No. 99, Zilang Road, Chongchuan Development Zone, Nantong City, Jiangsu Province Patentee after: Nantong Huada microelectronics Group Co.,Ltd. Patentee after: Saizhuo Electronic Technology (Shanghai) Co.,Ltd. Address before: 226000 No. 99, Zilang Road, Chongchuan Development Zone, Nantong City, Jiangsu Province Patentee before: NANTONG HUADA MICROELECTRONICS GROUP Co.,Ltd. Patentee before: SENTRONIC TECHNOLOGY (SHANGHAI) Co.,Ltd. |
|
| IW01 | Full invalidation of patent right | ||
| IW01 | Full invalidation of patent right |
Decision date of declaring invalidation: 20230331 Decision number of declaring invalidation: 560643 Granted publication date: 20170308 |