CN205863147U - A kind of Novel silicon slice cleans device - Google Patents
A kind of Novel silicon slice cleans device Download PDFInfo
- Publication number
- CN205863147U CN205863147U CN201620578957.9U CN201620578957U CN205863147U CN 205863147 U CN205863147 U CN 205863147U CN 201620578957 U CN201620578957 U CN 201620578957U CN 205863147 U CN205863147 U CN 205863147U
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- China
- Prior art keywords
- spray
- water
- bar
- silicon chip
- silicon slice
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- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
This utility model provides a kind of Novel silicon slice and cleans device, including the feed pipe connected with external water source and at least one spray module being arranged on feed pipe, each spray module includes water supply arm, water leg, spray bar and control valve, one end of described water supply arm is connected with described feed pipe, the other end is connected with described water leg, described control valve is arranged on described water supply arm, described spray bar is connected with described water leg, being provided with multiple spray head in described spray bar, multiple spray heads are evenly distributed in spray bar.Water distribution problem of non-uniform when this utility model solves cleaning silicon chip, makes cleaning more completely, thoroughly, improves the yield rate of silicon chip, it is achieved that preferably cleaning performance.
Description
Technical field
This utility model relates to a kind of cleaning device, particularly relates to a kind of Novel silicon slice and cleans device.
Background technology
Currently, China's theCourse of PV Industry is rapid, and the solaode year output of China ranks the first in the whole world.The sun
Silicon solar cell, multi-element compounds thin-film solar cells, polymer multi-layer can be divided into by battery according to the difference of material therefor
Modified electrode type solaode, nano-crystalline solar battery, organic solar batteries, wherein silicon solar cell is to send out at present
Open up the most ripe, occupy leading position in the application.
Solar silicon wafers through section, chamfering, grind, in the course of processing such as polishing, surface can be subject in various degree
Pollute, such as granule, metal and Organic substance.Particle contamination includes white residue, dust, antibacterial, microorganism, organic colloid fiber etc.,
Various defect can be caused.Metallic pollution includes heavy metal gold, copper, ferrum, chromium etc., and they are main with covalent bond, Fan De on silicon chip
China's three kinds of forms such as gravitation and electron transfer exist, and this pollution can destroy the integrity of very thin oxide layer, increases leakage current
Density, result results in microstructural defects or haze defect.Organic contamination includes photoresist, organic solvent residual thing, synthesis
Wax contacts device with people, instrument, vessel bring oils and fats or fiber.If handling these pollutions well, device performance
Can be affected significantly.Therefore, silicon chip needs to clean before being diffused operation, eliminates each pollutant, and silicon chip is clear
The clean level washed directly affects the yield rate of solaode, Performance And Reliability.
People have developed a variety of process that can be used for Wafer Cleaning and technology now, common are: chemistry
Ablution, ultrasonic cleaning method and vacuum high-temperature facture.These methods and technology are widely used in silicon chip processing and device manufacture
In Wafer Cleaning.Existing silicon chip cleaning device silicon chip surface Water spray in cleaning process is uneven, causes silicon chip surface
Having substantial amounts of liquor residue, cleaning performance is the best.Defect in view of above-mentioned prior art, it is desirable to provide a kind of water spray is uniform and clear
Wash effective silicon chip cleaning device.
Utility model content
This utility model provides a kind of Novel silicon slice and cleans device, including the feed pipe connected with external water source and setting
At least one spray module on feed pipe, each spray module includes water supply arm, water leg, spray bar and control valve,
One end of described water supply arm is connected with described feed pipe, and the other end is connected with described water leg, and described control valve is arranged on institute
Stating on water supply arm, described spray bar is connected with described water leg, and described spray bar is provided with multiple spray head, multiple sprays
Head is evenly distributed in spray bar.
Further, described spray head protrudes from described spray bar.
Further, described spray head offering multiple spray apertures, multiple spray apertures are evenly distributed on spray head.
Preferably, a diameter of the 0.1～1mm of described spray apertures.
Further, described spray bar is provided with multiple groove, and multiple grooves are evenly distributed in spray bar, each two phase
Between adjacent groove, a spray head is installed.
Further, described groove is for guiding the water in described water leg to flow into described spray apertures, and described spray apertures is used
In spraying water on silicon chip surface to be cleaned, silicon chip to be cleaned is carried out.
Further, described device also includes cover plate, and described cover plate covers whole water legs of described spray module.
Compared with prior art, this utility model has the advantages that
The spray bar of this utility model silicon chip cleaning device is provided with equally distributed spray head, and spray head is provided with uniformly
The spray apertures of distribution, the water in feed pipe pipeline uniformly sprays on silicon chip surface to be cleaned, to be cleaned by spray apertures
Silicon chip be carried out, solve existing silicon chip cleaning device silicon chip surface Water spray problem of non-uniform in cleaning process,
Make cleaning more completely, thoroughly, improve the yield rate of silicon chip, it is achieved that preferably cleaning performance.
Accompanying drawing explanation
Fig. 1 is the front schematic view of this utility model silicon chip cleaning device.
Fig. 2 is the side schematic view of this utility model silicon chip cleaning device.
In figure: 1-feed pipe, 2-control valve, 3-water supply arm, 4-cover plate, 5-water leg, 6-spray bar, 7-spray head,
8-groove.
Detailed description of the invention
Below in conjunction with the accompanying drawing in this utility model embodiment, the technical scheme in this utility model embodiment is carried out
Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of this utility model rather than whole
Embodiment.Based on the embodiment in this utility model, those of ordinary skill in the art are not making the premise of creative work
Lower obtained every other embodiment, broadly falls into the scope of this utility model protection.
Embodiment 1:
Seeing the front schematic view that Fig. 1 and Fig. 2, Fig. 1 are this utility model silicon chip cleaning device, Fig. 2 is this utility model
The side schematic view of silicon chip cleaning device.This utility model provides a kind of Novel silicon slice and cleans device, including with external water source
The feed pipe 1 of connection and at least one spray module being arranged on feed pipe 1, each spray module includes water supply arm 3, collection
Tank 5, spray bar 6 and control valve 2, one end of described water supply arm 3 is connected with described feed pipe 1, and the other end catchments with described
Groove 5 connects, and described control valve 2 is arranged on described water supply arm 3, and described spray bar 6 is connected with described water leg 5, described spray
Being provided with multiple spray head 7 on water bar 6, multiple spray heads 7 are evenly distributed in spray bar 6.
Described Novel silicon slice cleans device and includes feed pipe 1 and 3 spray modules, is provided with 3 controls in described spray module
Valve processed 5,3 spray bars 6 of 2,3 water legs and 48 spray heads 7.
Described spray head 7 protrudes from described spray bar 6.
Offering multiple spray apertures on described spray head 7, multiple spray apertures are evenly distributed on spray head 7.
A diameter of 0.1mm of described spray apertures.
Described spray bar 6 is provided with multiple groove 8, and multiple grooves 8 are evenly distributed in spray bar 6, and each two is adjacent recessed
One spray head 7 is installed between groove 8.
Described groove 8 is for guiding the water in described water leg 5 to flow into described spray apertures, and described spray apertures is for clear to treating
Spray water on the silicon chip surface washed, silicon chip to be cleaned is carried out.
Described device also includes that cover plate 4, described cover plate 4 cover whole water legs 5 of described spray module.
Embodiment 2:
Seeing the front schematic view that Fig. 1 and Fig. 2, Fig. 1 are this utility model silicon chip cleaning device, Fig. 2 is this utility model
The side schematic view of silicon chip cleaning device.This utility model provides a kind of Novel silicon slice and cleans device, including with external water source
The feed pipe 1 of connection and at least one spray module being arranged on feed pipe 1, each spray module includes water supply arm 3, collection
Tank 5, spray bar 6 and control valve 2, one end of described water supply arm 3 is connected with described feed pipe 1, and the other end catchments with described
Groove 5 connects, and described control valve 2 is arranged on described water supply arm 3, and described spray bar 6 is connected with described water leg 5, described spray
Being provided with multiple spray head 7 on water bar 6, multiple spray heads 7 are evenly distributed in spray bar 6.
Described Novel silicon slice cleans device and includes feed pipe 1 and 8 spray modules, is provided with 8 controls in described spray module
Valve processed 5,8 spray bars 6 of 2,8 water legs and 128 spray heads 7.
Described spray head 7 protrudes from described spray bar 6.
Offering multiple spray apertures on described spray head 7, multiple spray apertures are evenly distributed on spray head 7.
A diameter of 1mm of described spray apertures.
Described spray bar 6 is provided with multiple groove 8, and multiple grooves 8 are evenly distributed in spray bar 6, and each two is adjacent recessed
One spray head 7 is installed between groove 8.
Described groove 8 is for guiding the water in described water leg 5 to flow into described spray apertures, and described spray apertures is for clear to treating
Spray water on the silicon chip surface washed, silicon chip to be cleaned is carried out.
Described device also includes that cover plate 4, described cover plate 4 cover whole water legs 5 of described spray module.
Operation principle of the present utility model is as follows:
Described feed pipe 1 connects with external water source, and after described control valve 2 being opened, the water in described feed pipe 1 pipeline leads to
Crossing described water supply arm 3 and flow into described water leg 5, described cover plate 4 covers whole water legs 5 of described spray module, described spray
Water bar 6 is connected with described water leg 5, and described spray bar 6 is provided with multiple groove 8, and multiple grooves 8 are evenly distributed on spray bar 6
On, a spray head 7 is installed between each two adjacent grooves 8, described spray head 7 offers multiple spray apertures, multiple sprays
Drenching hole to be evenly distributed on spray head 7, described groove 8 guides the water in described water leg 5 uniformly to be sprayed by described spray apertures
On silicon chip surface to be cleaned, silicon chip to be cleaned is carried out.
Compared with prior art, this utility model has the advantages that
The spray bar of this utility model silicon chip cleaning device is provided with equally distributed spray head, and spray head is provided with uniformly
The spray apertures of distribution, the water in feed pipe pipeline uniformly sprays on silicon chip surface to be cleaned, to be cleaned by spray apertures
Silicon chip be carried out, solve existing silicon chip cleaning device silicon chip surface Water spray problem of non-uniform in cleaning process,
Make cleaning more completely, thoroughly, improve the yield rate of silicon chip, it is achieved that preferably cleaning performance.
The above is preferred implementation of the present utility model, its objective is to be to allow the ordinary skill people in this area
Member will appreciate that content of the present utility model and implements according to this, can not limit protection domain of the present utility model with this；Every
The change of the equivalence done by the essence according to this utility model content or modification, all should contain at protection model of the present utility model
In enclosing.
Claims (7)
1. a Novel silicon slice cleans device, it is characterised in that includes the feed pipe (1) connected with external water source and is arranged on confession
At least one spray module on water pipe (1), each spray module include water supply arm (3), water leg (5), spray bar (6) and
Control valve (2), one end of described water supply arm (3) is connected with described feed pipe (1), and the other end is connected with described water leg (5),
Described control valve (2) is arranged on described water supply arm (3), and described spray bar (6) is connected with described water leg (5), described spray
Being provided with multiple spray head (7) on water bar (6), multiple spray heads (7) are evenly distributed in spray bar (6).
Novel silicon slice the most according to claim 1 cleans device, it is characterised in that described spray head (7) protrudes from described
Spray bar (6).
Novel silicon slice the most according to claim 2 cleans device, it is characterised in that offer many on described spray head (7)
Individual spray apertures, multiple spray apertures are evenly distributed on spray head (7).
Novel silicon slice the most according to claim 3 clean device, it is characterised in that described spray apertures a diameter of 0.1～
1mm。
Novel silicon slice the most according to claim 3 cleans device, it is characterised in that described spray bar (6) is provided with multiple
Groove (8), multiple grooves (8) are evenly distributed in spray bar (6), are provided with a spray between each two adjacent grooves (8)
Head (7).
Novel silicon slice the most according to claim 5 cleans device, it is characterised in that described groove (8) is used for guiding described
Water in water leg (5) flows into described spray apertures, and described spray apertures is for spraying water on silicon chip surface to be cleaned, to be cleaned
Silicon chip be carried out.
Novel silicon slice the most according to claim 1 cleans device, it is characterised in that described device also includes cover plate (4), institute
State cover plate (4) and cover whole water legs (5) of described spray module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620578957.9U CN205863147U (en) | 2016-06-15 | 2016-06-15 | A kind of Novel silicon slice cleans device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620578957.9U CN205863147U (en) | 2016-06-15 | 2016-06-15 | A kind of Novel silicon slice cleans device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205863147U true CN205863147U (en) | 2017-01-04 |
Family
ID=57639051
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620578957.9U Expired - Fee Related CN205863147U (en) | 2016-06-15 | 2016-06-15 | A kind of Novel silicon slice cleans device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205863147U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107700269A (en) * | 2017-10-27 | 2018-02-16 | 浙江荣晟环保纸业股份有限公司 | A kind of slurry concentration adjusting means of paper making equipment |
| CN110620069A (en) * | 2019-10-21 | 2019-12-27 | 深圳市思坦科技有限公司 | System and method for wet processing of wafers |
-
2016
- 2016-06-15 CN CN201620578957.9U patent/CN205863147U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107700269A (en) * | 2017-10-27 | 2018-02-16 | 浙江荣晟环保纸业股份有限公司 | A kind of slurry concentration adjusting means of paper making equipment |
| CN110620069A (en) * | 2019-10-21 | 2019-12-27 | 深圳市思坦科技有限公司 | System and method for wet processing of wafers |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210909 Address after: 215151 No. 17, Shiyang Road, high tech Zone, Suzhou, Jiangsu Patentee after: Suzhou Baoxin Intelligent Manufacturing Co.,Ltd. Address before: 215151 No. 17, Shiyang Road, Hushuguan Economic Development Zone, high tech Zone, Suzhou, Jiangsu Patentee before: SUZHOU BOAMAX TECHNOLOGIES INDUSTRIAL Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170104 |