CN205793642U - A kind of flexible circuit board BGA conductive via structure - Google Patents
A kind of flexible circuit board BGA conductive via structure Download PDFInfo
- Publication number
- CN205793642U CN205793642U CN201620521868.0U CN201620521868U CN205793642U CN 205793642 U CN205793642 U CN 205793642U CN 201620521868 U CN201620521868 U CN 201620521868U CN 205793642 U CN205793642 U CN 205793642U
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- China
- Prior art keywords
- conductive
- hole
- pad
- bga
- conductive hole
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Structure Of Printed Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The open a kind of flexible circuit board BGA conductive via structure of this utility model, including the most adjacent first line plate and the second wiring board, described first line plate and the second wiring board are bonding by prepreg, described first line plate and the second wiring board are respectively arranged with the BGA pad of correspondence, described BGA pad includes the most corresponding round dot pad of at least two, described first line plate and the second wiring board are respectively arranged with the first conductive hole and the second conductive hole is connected to round dot pad, described first conductive hole and the second conductive hole are blind hole, described prepreg is provided with the middle conductive hole corresponding with the first conductive hole and the second conductive hole.This utility model by arranging conductive blind hole at the BGA pad back side, and is connected the BGA pad of multilayer circuit board by conductive blind hole, effectively saves wiring space, improving product precision.
Description
Technical field
This utility model relates to wiring board and manufactures field, is specifically related to a kind of flexible circuit board BGA conductive via structure.
Background technology
In information age today, along with the fast development of electronics industry, the product such as computer, mobile phone becomes increasingly popular.
People are more and more to the functional requirement of the function of electronic product, increasingly stronger to performance requirement, and volume requirement is increasingly
Little, weight demands is more and more lighter.This just promotes electronic product to develop to multi-functional, high-performance and miniaturization, lightness direction.For
Realizing this target, the characteristic size of IC chip will be more and more less, and complexity is continuously increased, and then, the I/O number of circuit is just
Can get more and more, the I/O density of encapsulation will be continuously increased.In order to adapt to this demand for development, the high density envelope of some advanced persons
Packing technique arises at the historic moment, and BGA package technology is exactly one of them.
The full name Ball Grid Array(welded ball array encapsulation of BGA), it is to make array in the bottom of packaging body substrate
Soldered ball is as I/O end and printed substrate (PCB) mutual connection of circuit.The device using this technology to encapsulate is a kind of surface mount
Device.
Along with the wiring of capacitive screen of mobile phone product is more and more accurate, portioned product IC begins with BGA and designs, and BGA pad
Centre-to-centre spacing is more and more less, causes difficult wiring, cannot be punched in the middle of BGA.Existing BGA pad is in middle punched conducting just
Reverse side circuit, but for the BGA centre distance product less than 0.5mm, it is contemplated that also have the pin making blind hole connection components and parts,
BGA pad then adds via PAD without position, the serious further development hindering science and technology.
Utility model content
In view of this, the open a kind of flexible circuit board BGA conductive via structure of this utility model.
The purpose of this utility model is achieved through the following technical solutions:
A kind of flexible circuit board BGA conductive via structure, including the most adjacent first line plate and the second wiring board, described
First line plate and the second wiring board are bonding by prepreg, and it is right that described first line plate and the second wiring board are respectively arranged with
The BGA pad answered, described BGA pad includes the most corresponding round dot pad of at least two, described first line plate and second
Wiring board is respectively arranged with the first conductive hole and the second conductive hole is connected to round dot pad, described first conductive hole and the second conduction
Hole is blind hole, and described prepreg is provided with the middle conductive hole corresponding with the first conductive hole and the second conductive hole.
Utility model works principle is as follows:
First conductive hole, the second conductive hole and middle conductive hole correspondence connect into a conductive hole, and conductive hole two ends connect respectively
Connect the round dot pad of first line plate and the second wiring board, connection first line plate and the second wiring board.First conductive hole and
Two conductive holes are set to blind hole, then the first conductive hole and the second conductive hole only touch round dot pad bottom surface, and do not punch round dot
Pad, after arranging the pin blind hole of mounting related components pin again, carries out welding firm, no on round dot pad to component's feet
Have influence on the use of conductive hole, though the round dot pad that BGA centre-to-centre spacing is less than 0.5mm, it is also possible to conductive hole is set, improves line
The precision that road plate BGA pad is arranged, improves the precision of product.
Further, described middle conductive hole is provided with conductive pole, and described conductive pole extends to the round dot at conductive pole two ends
Pad.
The more and more accurate and intensity of BGA pad in view of wiring board development, round dot number of pads is more and more collects
In, BGA pad center, away from the least for 0.5mm, arrange conductive pole at middle conductive hole, is effectively improved the intensity of BGA pad,
Improve the intensity of wiring board, thus improve the folding resistance of flexible circuit board, improve the life-span of product.
Further, described conductive pole is column structure, and conductive pole two ends are provided with circular arc projection and connect round dot pad.
Thering is provided a kind of flexible circuit board in view of this utility model, when flexible circuit board bending, circular arc projection all the time can
The contact of enough round dot pad bottom surfaces, has more preferable electric conductivity than the cylinder that two ends are plane, has been greatly reinforced flexible circuit board
Conductive effect during bending, supports more preferable bending angle.
This utility model, relative to prior art, has a following beneficial effect:
This utility model by arranging conductive blind hole at the BGA pad back side, and passes through conductive blind hole to multilayer circuit board
BGA pad connects, and effectively saves wiring space, improving product precision.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Detailed description of the invention
Make to retouch the most in detail to this utility model below in conjunction with embodiment for the ease of it will be appreciated by those skilled in the art that
State:
Embodiment 1
The present embodiment provides a kind of flexible circuit board BGA conductive via structure, as it is shown in figure 1, include the most adjacent first
Wiring board 1 and the second wiring board 2, described first line plate 1 and the second wiring board 2 are bonding by prepreg 3, described First Line
Road plate 1 and the second wiring board 2 are respectively arranged with the BGA pad of correspondence, and described BGA pad includes that at least two is the most corresponding
Round dot pad 4, described first line plate 1 and the second wiring board 2 is respectively arranged with the first conductive hole and the second conductive hole is connected to
Round dot pad 4, described first conductive hole and the second conductive hole are blind hole, described prepreg 3 be provided with the first conductive hole and
The middle conductive hole that second conductive hole is corresponding.
Described middle conductive hole is provided with conductive pole 5, and described conductive pole 5 extends to the round dot pad 4 at conductive pole 5 two ends.
Described conductive pole 5 is column structure, and conductive pole 5 two ends are provided with circular arc projection and connect round dot pad 4.
Be more than wherein specific implementation of the present utility model, therefore it describes more concrete and detailed, but can not be
And it is interpreted as the restriction to this utility model the scope of the claims.It should be pointed out that, for the person of ordinary skill of the art,
Without departing from the concept of the premise utility, it is also possible to make some deformation and improvement, these obviously replace shape
Formula belongs to protection domain of the present utility model.
Claims (3)
1. a flexible circuit board BGA conductive via structure, it is characterised in that: include the most adjacent first line plate and the second line
Road plate, described first line plate and the second wiring board are bonding by prepreg, and described first line plate and the second wiring board divide
Not being provided with the BGA pad of correspondence, described BGA pad includes the most corresponding round dot pad of at least two, described First Line
Road plate and the second wiring board are respectively arranged with the first conductive hole and the second conductive hole is connected to round dot pad, described first conductive hole
And second conductive hole be blind hole, described prepreg is provided with conduction in the middle of corresponding with the first conductive hole and the second conductive hole
Hole.
A kind of flexible circuit board BGA conductive via structure the most according to claim 1, it is characterised in that: conduction in the middle of described
Hole is provided with conductive pole, and described conductive pole extends to the round dot pad at conductive pole two ends.
A kind of flexible circuit board BGA conductive via structure the most according to claim 2, it is characterised in that: described conductive pole is
Column structure, conductive pole two ends are provided with circular arc projection and connect round dot pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620521868.0U CN205793642U (en) | 2016-06-01 | 2016-06-01 | A kind of flexible circuit board BGA conductive via structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620521868.0U CN205793642U (en) | 2016-06-01 | 2016-06-01 | A kind of flexible circuit board BGA conductive via structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205793642U true CN205793642U (en) | 2016-12-07 |
Family
ID=58135453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620521868.0U Expired - Fee Related CN205793642U (en) | 2016-06-01 | 2016-06-01 | A kind of flexible circuit board BGA conductive via structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205793642U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107951483A (en) * | 2017-11-21 | 2018-04-24 | 阿木（深圳）新科技有限公司 | Electrocardiographicmonitoring monitoring electrode and signal acquisition jacket |
-
2016
- 2016-06-01 CN CN201620521868.0U patent/CN205793642U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107951483A (en) * | 2017-11-21 | 2018-04-24 | 阿木（深圳）新科技有限公司 | Electrocardiographicmonitoring monitoring electrode and signal acquisition jacket |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161207 Termination date: 20200601 |