CN205774780U - Stacking-type Sputting film-plating apparatus - Google Patents

Stacking-type Sputting film-plating apparatus Download PDF

Info

Publication number
CN205774780U
CN205774780U CN201620673701.6U CN201620673701U CN205774780U CN 205774780 U CN205774780 U CN 205774780U CN 201620673701 U CN201620673701 U CN 201620673701U CN 205774780 U CN205774780 U CN 205774780U
Authority
CN
China
Prior art keywords
room
substrate
sheet
carrying room
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn - After Issue
Application number
CN201620673701.6U
Other languages
Chinese (zh)
Inventor
戴秀海
范滨
余海春
王德智
余龙
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Optorun Shanghai Co Ltd
Original Assignee
Optorun Shanghai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Optorun Shanghai Co Ltd filed Critical Optorun Shanghai Co Ltd
Priority to CN201620673701.6U priority Critical patent/CN205774780U/en
Application granted granted Critical
Publication of CN205774780U publication Critical patent/CN205774780U/en
Withdrawn - After Issue legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Physical Vapour Deposition (AREA)

Abstract

This utility model relates to optical film technology field, especially a kind of stacking-type Sputting film-plating apparatus, it is characterized in that: the side of described vacuum film coating chamber is provided with carrying room, the inner chamber of described carrying room and the intracavity inter-connection of described vacuum film coating chamber, connectivity part between both inner chambers is conveyance mouth, described enter, slice room is connected with described carrying room respectively, the inner chamber of described carrying room with described enter, the intracavity inter-connection of slice room, described carrying room with described enter, connectivity part between chamber, slice indoor is respectively CD feeding port and piece mouth, by carrying room with enter, the cooperation of slice room, realize the handling of described substrate.The utility model has the advantages that: improve substrate handler efficiency;Be conducive in vacuum film coating chamber, arrange multiple sputtering source, improve plated film efficiency;Compact conformation, floor space are little, operation cost is low.

Description

Stacking-type Sputting film-plating apparatus
Technical field
This utility model relates to optical film technology field, especially a kind of stacking-type Sputting film-plating apparatus.
Background technology
Improve plated film efficiency and coating quality, the expansion plated film scope of application are the targets that technical field of vacuum plating is pursued. In recent years, the electronics market such as smart mobile phone, panel computer is flourish;Correspondingly, the quality-improving of these intelligent terminal Also the coating technique of touch screen needed for this series products is proposed requirements at the higher level.Among these, how to realize large area (such as, 17 inches) high speed of substrate, uniform coated be one of coating technique developing focus.
At present, the application of automatization's continuous way magnetron sputtering coater is the most increasingly extensive.For large-area substrates plated film, two Individual main technical specification is film thickness uniformity and production capacity.In order to promote coating film thickness uniformity, can be at vacuum film coating chamber Rotary work frame is installed in central area, and substrate is vertically placed with the side-wall outer side at cylindrical workpiece frame, is revolved by substrate The mode turned promotes film thickness uniformity.Sputtering target material is then arranged on the sidewall of vacuum film coating chamber.For planar substrates, above-mentioned In work rest rotary course, on substrate, the radius of turn of each point is different, may result in sputtering target material to planar substrates not The distance of co-located, thus cause the inconsistent of thicknesses of layers;It is apparent from, for the substrate of specific dimensions, work rest interior Film thickness uniformity on the least then planar substrates in footpath is the poorest.Therefore, for the vacuum film coating chamber of aforementioned installation rotary work frame, Increase further its internal diameter, the radius of curvature of work rest periphery shared by each substrate can be made bigger, be more beneficial for realizing good Uniformity.
Increase along with vacuum coating cavity, it is necessary to be pointed to the sputtering target material on the sidewall of cavity surrounding, ion source Etc. carrying out rational deployment.In general, sputtering target material quantity should be many to meet the requirement of plated film speed as far as possible, improve plated film effect Rate.Meanwhile, the sidewall in cavity surrounding also needs to configure ion source, evaporation source, upper slice (entering sheet) passage, bottom sheet (slice) passage Deng functional part, to meet specific film-forming process demand and the needs of automated handling substrate.The handling of film plating substrate are impacts One key factor of plated film efficiency.In vacuum sputtering film plating machine, a carrying room can be set, upper slice and bottom sheet all remove from this Room is sent to pass through.Detailed process is, in the case of rotatable workpiece frame shelfful, work rest is rotated by self, and by machinery Hands, can take off the substrate having plated film from work rest successively;Thereafter, the substrate taken off is carried to plated film by carrying room Outside cavity;Then, non-film plating substrate is carried in plated film cavity by carrying room, and work rest rotates again by self, and By mechanical hand, non-film plating substrate is placed sequentially in work rest corresponding plated film station.In this substrate conveyance mode, although By the help of mechanical hand, upper and lower process can be carried out under vacuum conditions, vacuum film coating chamber need not vacuum breaker again, but by Being completely separate operation in upper and lower process, in a handling substrate flow process, rotatable workpiece frame needs to rotate two weeks, with complete Become the exchange of substrate on all stations, the longest.Another kind of upper and lower sheet mode is both-end pattern, i.e. at vacuum film coating chamber On two conveyance mouths are set: arrival end and the port of export, corresponding two ports, a carrying room is respectively set.So, work rest is passed through Rotation and the cooperation of mechanical hand, upper and lower can carry out simultaneously, save handling time.But for large area substrates, two Carrying room region shared by the internal diameter of vacuum coating cavity is relatively big, have impact on putting of the functional parts such as sputtering target material, because of This, have impact on plated film improved efficiency.
Summary of the invention
The purpose of this utility model is according to above-mentioned the deficiencies in the prior art, it is provided that stacking-type Sputting film-plating apparatus, On the basis of vacuum film coating chamber only arranges a carrying room, arrange into sheet room and slice room, in conjunction with film-coating workpiece frame rotation and The manipulation of mechanical hand, completes the handling of substrate, improves substrate handler efficiency.
This utility model purpose realizes being completed by techniques below scheme:
A kind of stacking-type Sputting film-plating apparatus, for substrate is carried out plated film, described coating apparatus at least includes Vacuum Deposition Film room, entering sheet room and slice room, the inner chamber of described vacuum film coating chamber is the plated film space of described substrate, described divides into and out of sheet room Yong Yu be into and out of sheet, it is characterised in that:
The side of described vacuum film coating chamber is provided with carrying room, and the inner chamber of described carrying room is interior with described vacuum film coating chamber Chamber is connected, and the connectivity part between both inner chambers is conveyance mouth, is provided with transport mechanism, described transporter in described carrying room Structure realizes the described conveyance cause for gossip that is transported through in described carrying room of the described substrate and shows described carrying room and described Vacuum Deposition Substrate exchange between film room;
Described be connected with described carrying room respectively into and out of sheet room, the inner chamber of described carrying room with described into and out of sheet room Intracavity inter-connection, described carrying room and described connectivity part between chamber, sheet indoor are respectively CD feeding port and piece mouth, in institute State and be respectively arranged with Jin Pian mechanism and slice mechanism into and out of sheet indoor, described realize described substrate respectively in institute into and out of sheet mechanism State into and out of being transported through in sheet room described existing described into and out of the substrate between sheet room and described carrying room into and out of sheet cause for gossip Exchange.
Described vacuum coating indoor are provided with rotatable substrate frame, and described substrate frame has the described substrate of some carryings Station, described transport mechanism coordinates described rotatable substrate frame to realize the handling of substrate.
The transport mechanism of described carrying room includes mechanical hand and screw mandrel module, wherein said mechanical hand be used for realizing described in remove Sending the substrate between room and described vacuum film coating chamber to exchange, described screw mandrel module is used for realizing described substrate in described carrying room Conveying.
It is divided into described described Jin Pian mechanism, slice mechanism into and out of sheet room and all includes mechanical hand and belt conveyor, Wherein said mechanical hand is described into and out of the substrate exchange between sheet room and described carrying room, described belt conveyor for realizing Structure should with realize described substrate in described conveying in sheet room.
The utility model has the advantages that: improve substrate handler efficiency;Be conducive in vacuum film coating chamber, arrange multiple spattering Penetrate source, improve plated film efficiency;Compact conformation, floor space are little, operation cost is low.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Detailed description of the invention
This utility model feature and other correlated characteristic are described in further detail by embodiment below in conjunction with accompanying drawing, So that the understanding of technical staff of the same trade:
As it is shown in figure 1, labelling 1-28 is expressed as in figure: vacuum film coating chamber 1, substrate frame 2, substrate 3, rotating mechanism 4, coating source 5, ion source 6, evaporation source 7, vacuum pump 8, carrying room 9, conveyance mouth 10, carrying room mechanical hand 11, leading screw mould Group 12, enter sheet room 13, slice room 14, CD feeding port 15, piece mouth 16, enter sheet room mechanical hand 17, enter sheet room belt conveyor 18, slice room mechanical hand 19, slice room belt conveyor 20, substrate position 21, substrate position 22, substrate position 23, substrate position 24, Enter sheet room valve 25, slice room valve 26, substrate position 27, substrate position 28.
Embodiment: as it is shown in figure 1, stacking-type Sputting film-plating apparatus includes vacuum film coating chamber 1, vacuum coating in the present embodiment The inner chamber of room 1 is as the plated film space of substrate 3.The center of vacuum film coating chamber 1 is provided with substrate frame 2, in substrate frame 2 It is provided with substrate position 27 and the substrate position 28 of some carrying substrates 3.Rotating mechanism 4 it is provided with, rotation in the center of substrate frame 2 Rotation mechanism 4 external connection power so that substrate frame 2 can rotate under the driving of rotating mechanism 4, thus ensure to be carried in substrate frame 3 The plated film homogeneity of substrate.The inwall of vacuum film coating chamber 1 is respectively arranged with some coating sources 5, ion source 6, evaporation source 7 With vacuum pump 8, wherein coating source 5 and evaporation source 7 are sputtering source, and ion source 6 is used for exciting coating source 5 and evaporation source 7, vacuum Pump 8 is for by the inner chamber evacuation of vacuum film coating chamber 1.
As it is shown in figure 1, be provided with carrying room 9, the inner chamber of carrying room 9 and vacuum film coating chamber 1 in the side of vacuum film coating chamber 1 Intracavity inter-connection, connectivity part between the two for conveyance mouth 10.At conveyance mouth 10, valve can be set, by the keying of valve Control the connected state between vacuum film coating chamber 1 and carrying room 9, it is ensured that the vacuum film coating chamber 1 vacuum when plated film.In conveyance It is provided with in room 9 and there is the carrying room mechanical hand 11 pushed with clamping function and there is the leading screw module 12 of conveying function, wherein Leading screw module 12 is used for substrate 3 from closing on the position being transported to close on conveyance mouth 10 into and out of the position of sheet room, carrying room machinery In substrate 3 is transported to vacuum film coating chamber 1 by hands 11 and be installed among the station in substrate frame 2.So, in vacuum coating Room 1 is only provided with a conveyance mouth 10, it is to avoid multiple conveyance mouth occupy-places, is conducive in vacuum film coating chamber 1, arrange multiple spattering Penetrate source, improve plated film efficiency.
As it is shown in figure 1, be respectively arranged with into sheet room 13 and slice room 14 in the both sides of carrying room 9, enter sheet room 13, slice room The inner chamber of 14 connects with the inner chamber composition of carrying room 9 respectively, and carrying room 9 and the connectivity part entered between sheet room 13 are CD feeding port 15, Connectivity part between carrying room 9 and slice room 14 is piece mouth 16.Uncoated substrate 3 enters via CD feeding port 15 from entering sheet room 13 Enter carrying room 9 and be installed in substrate frame 2 via conveyance mouth 10 by the carrying room mechanical hand 11 in carrying room 9, completing The substrate 3 of plated film is then unloaded from substrate frame 2 by carrying room mechanical hand 11, returns carrying room 9 via conveyance mouth 10 internal, so After return to slice room 14 via piece mouth 16 again.Enter sheet room 13, carrying room 9, slice room 14 may be contained within the same of vacuum film coating chamber 1 Side, has compact conformation, floor space is little, operation cost is a low advantage.
As it is shown in figure 1, be provided with into sheet room mechanical hand 17 in entering sheet room 13, enter sheet room belt conveyor 18, enter sheet It is provided with the substrate position of some carrying substrates 3 on room belt conveyor 18, enters sheet room belt conveyor 18 and can will not plate The substrate 3 of film is delivered to substrate position 21 from its substrate position 22, and substrate position 21 is close in into sheet room mechanical hand 17 so that enter sheet room machine Tool hands 17 can capture the non-film plating substrate 3 being positioned on substrate position 21 and be transported to the leading screw module of carrying room 9 via CD feeding port 15 On 12.It is provided with into sheet room valve 25 at the end entering sheet room 13, enters sheet room valve 25 for isolating ambient atmosphere, by opening and closing Enter sheet room valve 25 to control into sheet room 13 and extraneous connected state;When substrate 3 needs to be externally routed to entering into sheet room 13 During the belt conveyor 18 of sheet room, enter sheet room valve 25 and open, and when substrate 3 needs to be transported among carrying room 9 and by removing When sending room mechanical hand 11 to be transported in vacuum film coating chamber 1, enter sheet room valve 25 and close, enter the internal evacuation in sheet room 13 simultaneously, protect Demonstrate,prove its internal vacuum identical with the vacuum in vacuum film coating chamber 1, it is to avoid vacuum film coating chamber 1 loses vacuum state and needs weight New evacuation.
As it is shown in figure 1, the internal structure of slice room 14 is identical with the internal structure entering sheet room 13, including slice room mechanical hand 19, slice room belt conveyor 20, slice room belt conveyor 20 is provided with the substrate position of some carrying substrates 3, goes out The substrate 3 of plated film can be delivered to substrate position 24 from its substrate position 23 by sheet room belt conveyor 20, and substrate position 23 is close in Slice room mechanical hand 19, slice room mechanical hand 19 can capture the film plating substrate 3 being positioned on leading screw module 12 and be placed into On slice room belt conveyor 20, export to outward via slice room belt conveyor 20.The effect of slice room valve 26 and The effect of slice room valve 25 is identical, therefore repeats no more.
The present embodiment has a following film plating process:
1, enter sheet room 13 and enter sheet: non-film plating substrate 3 from enter enter at sheet room valve 25 internal into sheet room 13 and be carried on into On sheet room belt conveyor 18.Along entering the sheet room belt conveyor 18 conveying direction from 22 to substrate position, substrate position 21, Non-film plating substrate 3 is transported on substrate position 21 one by one, now enters sheet room mechanical hand 17 and captures one by one and be positioned on substrate position 21 Non-film plating substrate 3 is also passed through CD feeding port 15 and is placed on the substrate position on the leading screw module 12 of carrying room 9, and this substrate position refers to Be the substrate position being close in CD feeding port 15.
2, carrying room 9 load: while entering the conveyance of sheet room mechanical hand 17, leading screw module 12 rotates forward, non-film plating substrate 3 with The rotation leading screw module is transported to be close in the substrate position of carrying room mechanical hand 11 from the substrate position being close in CD feeding port 15, Carrying room mechanical hand 11 is captured non-film plating substrate 3 and is attached it in substrate frame 2 by conveyance mouth 10.Now, utilization has It is two in substrate frame 2 that the substrate frame 2 of rotating mechanism 4 completes the installation of non-film plating substrate 3, i.e. substrate position 27 and substrate position 28 Adjacent stations, when substrate 3 is already installed on time on the position of substrate position 27, drives substrate frame 2 to revolve counterclockwise by rotating mechanism 4 Turning, make substrate position 28 alignment conveyance mouth 10, carrying room mechanical hand 11 just can carry out the installation of the non-film plating substrate of next block 3.
3, carrying room 9 unloading piece: after substrate 3 plated film completes, carrying room mechanical hand 11 is by transporting mouth 10 by plated film Substrate 3 takes off from substrate frame 2 and is placed on leading screw module 12, and now leading screw module 12 inverts, and makes film plating substrate 3 from silk The substrate position closing on carrying room mechanical hand 11 on thick stick module 12 is delivered to close on the substrate position of piece mouth 16.
4, slice room 14 slice: slice room mechanical hand 19 captures the film plating substrate on leading screw module 12 by piece mouth 16 3 and be placed on slice room belt conveyor 20.Along slice room belt conveyor 20 from 23 to substrate position, substrate position 24 Conveying direction, film plating substrate 3 is transported on substrate position 24 one by one, is exported to outward by slice room valve 26 afterwards.
On the basis of vacuum film coating chamber 1 only arranges a carrying room 9, arrange into sheet room 13 and slice room 14, in conjunction with base Rotating and the manipulation of each mechanical hand of horse 2, completes the handling of substrate 3, improves the handling efficiency of substrate 3.
The present embodiment is in the specific implementation: because ensureing that the conveyance flow process of carrying room 9 is uninterruptedly impact entirety carrying effect The key condition of rate, the motion of other mechanisms can be carried out, such as under the conditions of meeting this parallel: enters sheet room 13 and slice room 14 Flow process can carry out simultaneously.
Although design and the embodiment of this utility model purpose is elaborated by above example referring to the drawings, But those skilled in the art will realize that under the precondition limiting scope without departing from claim, still may be used This utility model is made various modifications and variations, such as: the concrete structure of each parts, relative position etc., therefore at this most one by one Repeat.

Claims (4)

1. a stacking-type Sputting film-plating apparatus, for substrate is carried out plated film, described coating apparatus at least includes vacuum coating Room, entering sheet room and slice room, the inner chamber of described vacuum film coating chamber is the plated film space of described substrate, described into and out of sheet room respectively For into and out of sheet, it is characterised in that:
The side of described vacuum film coating chamber is provided with carrying room, the inner chamber phase of the inner chamber of described carrying room and described vacuum film coating chamber Connection, the connectivity part between both inner chambers is conveyance mouth, is provided with transport mechanism in described carrying room, and described transport mechanism is real Show the described conveyance cause for gossip that is transported through in described carrying room of the described substrate and show described carrying room and described vacuum film coating chamber Between substrate exchange;
Described it is connected with described carrying room respectively into and out of sheet room, the inner chamber of described carrying room and the described inner chamber into and out of sheet room Being connected, described carrying room and described connectivity part between chamber, sheet indoor are respectively CD feeding port and piece mouth, described It is respectively arranged with Jin Pian mechanism and slice mechanism into and out of sheet indoor, described realizes described substrate respectively described into and out of sheet mechanism Described hand over into and out of the substrate between sheet room and described carrying room into and out of being transported through in sheet room is described into and out of sheet cause for gossip is existing Change.
A kind of stacking-type Sputting film-plating apparatus the most according to claim 1, it is characterised in that: described vacuum coating indoor set Being equipped with rotatable substrate frame, described substrate frame has the station of the described substrate of some carryings, described transport mechanism coordinates institute State rotatable substrate frame and realize the handling of substrate.
A kind of stacking-type Sputting film-plating apparatus the most according to claim 1, it is characterised in that: the transporter of described carrying room Structure includes mechanical hand and screw mandrel module, and wherein said mechanical hand is for realizing between described carrying room and described vacuum film coating chamber Substrate exchanges, and described screw mandrel module is for realizing the conveying in described carrying room of the described substrate.
A kind of stacking-type Sputting film-plating apparatus the most according to claim 1, it is characterised in that: it is divided into described into and out of sheet The described Jin Pian mechanism of room, slice mechanism all include that mechanical hand and belt conveyor, wherein said mechanical hand are used for realizing institute State into and out of between sheet room and described carrying room substrate exchange, described belt conveyor should with realize described substrate described Conveying in sheet room.
CN201620673701.6U 2016-06-30 2016-06-30 Stacking-type Sputting film-plating apparatus Withdrawn - After Issue CN205774780U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201620673701.6U CN205774780U (en) 2016-06-30 2016-06-30 Stacking-type Sputting film-plating apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201620673701.6U CN205774780U (en) 2016-06-30 2016-06-30 Stacking-type Sputting film-plating apparatus

Publications (1)

Publication Number Publication Date
CN205774780U true CN205774780U (en) 2016-12-07

Family

ID=58129054

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201620673701.6U Withdrawn - After Issue CN205774780U (en) 2016-06-30 2016-06-30 Stacking-type Sputting film-plating apparatus

Country Status (1)

Country Link
CN (1) CN205774780U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105887030A (en) * 2016-06-30 2016-08-24 光驰科技(上海)有限公司 Stack type sputter coating device and coating method thereof
CN107663625A (en) * 2017-10-20 2018-02-06 爱发科豪威光电薄膜科技(深圳)有限公司 Lacing film feed device and optical coating apparatus

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105887030A (en) * 2016-06-30 2016-08-24 光驰科技(上海)有限公司 Stack type sputter coating device and coating method thereof
CN105887030B (en) * 2016-06-30 2018-07-31 光驰科技(上海)有限公司 Stacking-type Sputting film-plating apparatus and its film plating process
CN107663625A (en) * 2017-10-20 2018-02-06 爱发科豪威光电薄膜科技(深圳)有限公司 Lacing film feed device and optical coating apparatus

Similar Documents

Publication Publication Date Title
JPH07273166A (en) Device to transfer substrate
US8870513B2 (en) Vacuum treatment apparatus
CN102936100B (en) Rotary type continuous coating device and method thereof
CN205774780U (en) Stacking-type Sputting film-plating apparatus
JP2010077487A (en) Apparatus for manufacturing organic el device and method for manufacturing the same, and film deposition apparatus and film deposition method
JPH10130825A (en) Vacuum treatment device for depositing thin film
CN105887030B (en) Stacking-type Sputting film-plating apparatus and its film plating process
EA034967B1 (en) Process line for vacuum formation of thin-film coatings (embodiments)
US20230374663A1 (en) Apparatus and method for processing substrate
CN101567311B (en) Vacuum processing apparatus, vacuum processing method, electronic device, and electronic device manufacturing method
CN104213086B (en) Double-arm automatic substrate loading type sputter coating method and device
US20050241586A1 (en) Vacuum vapor deposition apparatus
TW201230235A (en) Vacuum processing apparatus and method for forming organic film
CN106011765A (en) Magnetron sputtering vacuum coating equipment
CN111778488A (en) Sputtering coating equipment compatible with substrates of different shapes
KR101409808B1 (en) Substrate treatment system
CN214422739U (en) Continuous automatic conveying sputtering film forming device with revolution and rotation structure
CN208240622U (en) For loading and unloading the load lock chamber and array base plate processing system of carried base board
CN212316232U (en) Sputtering coating equipment compatible with substrates of different shapes
JP4557418B2 (en) Multi-layer film forming equipment
CN112267101A (en) Continuous automatic conveying sputtering film forming device with revolution and rotation structure
CN101942643A (en) Method for continuously producing non-centralized positioning workpieces by using single-inlet and outlet sputtering machine
KR20140084527A (en) Apparatus and method for transferring substrate
CN112249685B (en) Mechanism for carrying out rapid alternate carrying of substrates and carrying method thereof
CN204125527U (en) A kind of both arms auto loading formula Sputting film-plating apparatus

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
AV01 Patent right actively abandoned
AV01 Patent right actively abandoned

Granted publication date: 20161207

Effective date of abandoning: 20180731