CN205705626U - A kind of wafer cutting, thinning protecting film - Google Patents
A kind of wafer cutting, thinning protecting film Download PDFInfo
- Publication number
- CN205705626U CN205705626U CN201620350009.XU CN201620350009U CN205705626U CN 205705626 U CN205705626 U CN 205705626U CN 201620350009 U CN201620350009 U CN 201620350009U CN 205705626 U CN205705626 U CN 205705626U
- Authority
- CN
- China
- Prior art keywords
- base material
- film
- material film
- thinning
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 21
- 239000000463 material Substances 0.000 claims abstract description 28
- 239000005025 cast polypropylene Substances 0.000 claims abstract description 15
- 239000010410 layer Substances 0.000 claims description 21
- 239000012792 core layer Substances 0.000 claims description 3
- 238000005266 casting Methods 0.000 abstract description 9
- 239000003292 glue Substances 0.000 abstract description 7
- 239000011248 coating agent Substances 0.000 abstract description 6
- 238000000576 coating method Methods 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 6
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 239000010408 film Substances 0.000 description 37
- 239000003595 mist Substances 0.000 description 4
- 238000005096 rolling process Methods 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Dicing (AREA)
Abstract
This utility model relates to technical field of semiconductors; disclose a kind of wafer cutting, thinning protecting film; include anti-sticking layer, sandwich layer and glue-line successively; anti-sticking layer and sandwich layer i.e. cast polypropylene (CPP) base material film is to be prepared by casting machine coextrusion casting, and on base material film, coating UV visbreaking glue i.e. can get finished product protection film subsequently.This utility model so that anti-sticking layer obtains a kind of coarse body structure surface, thus protecting film is also easy to uncoiling in the case of high peeling force, it is to avoid because uncoiling power is excessive, cause film stripping to deform；Select CPP will be superior to PE base material film as base material film, temperature tolerance and intensity, the process conditions of requirements at the higher level can be met；The thickness uniformity that casting technique prepares CPP base material film is high, can improve degree of accuracy and the yields of wafer processing.
Description
Technical field
This utility model relates to technical field of semiconductors, particularly relates to a kind of wafer cutting, thinning protecting film.
Background technology
At present, semiconductor crystal wafer is being cut or in thinning process, common processing method has two kinds:
1, being to use the viscous protecting film of height, be overlying on crystal column surface under conditions of heating, after cutting, wafer is taken off in freezing again, is finally carried out wafer.But in cutting process, owing to local temperature is higher, the adhesive layer often resulting in protecting film comes off in wafer surface, need substantial amounts of solvent to go to clean, and wafer can be brought damage by some solvent, and bring the pollution of environment.
2, being to use UV visbreaking protecting film, initial peeling force is high, after attaching wafer is processed, irradiates through UV, and peeling force drastically reduces, it is simple to wafer finished product takes off from protecting film.But owing to initial peeling force is big, may result in protecting film during uncoiling owing to uncoiling power is excessive, cause thin film stretcher strain, affect follow-up use.The existing UV universal base material of visbreaking protecting film is PE film, owing to its intensity and temperature tolerance are the best, the highest for technique fitness with rapid changepl. never-ending changes and improvements.
Along with more and more higher to environmental requirement, UV visbreaking protecting film may be the trend of future development, and the defect that it is faced now, it is worth solving.
Utility model content
The deficiency existed for prior art, this utility model purpose is to provide a kind of wafer cutting, thinning protecting film.
To achieve these goals, this utility model is to realize by the following technical solutions: a kind of wafer cutting, thinning protecting film, it is characterised in that be made up of anti-sticking layer, sandwich layer and glue-line successively；Anti-sticking layer and sandwich layer constitute base material film, and this base material film is made up of cast polypropylene.
The cutting of aforesaid wafer, thinning protecting film, described base material film thickness is 25～200 μm；The base material film thickness uniformity ± 3%, hot strength > 20 Mpa.
The cutting of aforesaid wafer, thinning protecting film, there is certain roughness on the surface of anti-sticking layer, and Surface haze is 30%～50%, and anti-sticking layer thickness is 5～50 μm.
The cutting of aforesaid wafer, thinning protecting film, core layer thickness is 20～150 μm.
The cutting of aforesaid wafer, thinning protecting film, bondline thickness is 5～20 μm.
This utility model has the beneficial effect that:
1. anti-sticking layer has a kind of coarse body structure surface so that protecting film is prone to uncoiling in the case of height is viscous, it is to avoid because uncoiling power is excessive, cause film stripping to deform；
2. select CPP will be superior to PE base material film as base material film, temperature tolerance and intensity, the process conditions of requirements at the higher level can be met；
3. casting technique prepares the thickness uniformity height of CPP base material film, can improve degree of accuracy and the yields of wafer processing.
Accompanying drawing explanation
Fig. 1 is wafer of the present utility model cutting, thinning protecting film structural representation；
Each label in figure: anti-sticking layer 1, sandwich layer 2, glue-line 3.
Detailed description of the invention
For the technological means making this utility model realize, creation characteristic, reach purpose and be easy to understand with effect, below in conjunction with detailed description of the invention, this utility model is expanded on further.
Wafer cutting, thinning protecting film, be made up of base material film and glue-line；
Above-mentioned base material film is CPP base material film, is prepared by casting machine coextrusion casting, and thickness is 25～200 μm.
Above-mentioned base material film is made up of anti-sticking layer and sandwich layer, anti-sticking layer thickness 5～50 μm, core layer thickness 20～150 μm；
Above-mentioned anti-sticking layer, is provided with the surface with certain roughness, and mist degree is 30%～50%.
The above-mentioned CPP base material film thickness uniformity ± 3%, hot strength > 20 Mpa, normally use at 120 DEG C；
Above-mentioned glue-line is preferably UV and irradiates inharmonious pressure sensitive adhesive (can also be other pressure sensitive adhesive), and thickness is 5～20 μm.
Embodiment 1:
Seeing Fig. 1, wafer cutting, thinning protecting film include anti-sticking layer 1, sandwich layer 2, glue-line 3 successively.Preparing mist degree by coextrusion casting is 30%, and thickness is the CPP base material film of 40 um.
The wafer cutting film UV-260 formula for a product glue slit choosing Kunshan Zi Lan Electron Material Co., Ltd is coated on CPP base material, and dry glue coating thickness is 5 um.
Warehouse can be entered, it should be noted that anti-light package and storage after finished product rolling.
Embodiment 2:
Preparing mist degree by coextrusion casting is 40%, and thickness is the CPP base material film of 80 um.
Coating on CPP base material by inharmonious for UV glue slit, dry glue coating thickness is 10 um.
Warehouse can be entered, it should be noted that anti-light package and storage after finished product rolling.
Embodiment 3:
Preparing mist degree by coextrusion casting is 50%, and thickness is the CPP base material film of 120 um.
Coating on CPP base material by inharmonious for UV glue slit, dry glue coating thickness is 20 um.
Warehouse can be entered, it should be noted that anti-light package and storage after finished product rolling.
Of the present utility model ultimate principle and principal character and of the present utility model advantage have more than been shown and described.Skilled person will appreciate that of the industry; this utility model is not restricted to the described embodiments; described in above-described embodiment and description, principle of the present utility model is simply described; on the premise of without departing from this utility model spirit and scope; this utility model also has various changes and modifications, in the range of these changes and improvements both fall within claimed this utility model.This utility model claims scope and is defined by appending claims and equivalent thereof.
Claims (5)
1. a wafer cutting, thinning protecting film, it is characterised in that be made up of anti-sticking layer, sandwich layer and glue-line successively；Anti-sticking layer and sandwich layer constitute base material film, and this base material film is made up of cast polypropylene.
Wafer the most according to claim 1 cutting, thinning protecting film, it is characterised in that described base material film thickness is 25～200 μm；The base material film thickness uniformity ± 3%, hot strength > 20 Mpa.
Wafer the most according to claim 1 cutting, thinning protecting film, it is characterised in that there is certain roughness on the surface of anti-sticking layer, and Surface haze is 30%～50%, and anti-sticking layer thickness is 5～50 μm.
Wafer the most according to claim 1 cutting, thinning protecting film, it is characterised in that core layer thickness is 20～150 μm.
Wafer the most according to claim 1 cutting, thinning protecting film, it is characterised in that bondline thickness is 5～20 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620350009.XU CN205705626U (en) | 2016-04-25 | 2016-04-25 | A kind of wafer cutting, thinning protecting film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620350009.XU CN205705626U (en) | 2016-04-25 | 2016-04-25 | A kind of wafer cutting, thinning protecting film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205705626U true CN205705626U (en) | 2016-11-23 |
Family
ID=57295644
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620350009.XU Active CN205705626U (en) | 2016-04-25 | 2016-04-25 | A kind of wafer cutting, thinning protecting film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205705626U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108556440A (en) * | 2017-12-29 | 2018-09-21 | 广东德冠薄膜新材料股份有限公司 | The polypropylene film and its preparation method and application of the hot compound resin layer containing roughing in surface |
| CN109760394A (en) * | 2019-02-26 | 2019-05-17 | 上海百卡新材料科技有限公司 | A kind of environment-friendly type ground in wafer processing |
-
2016
- 2016-04-25 CN CN201620350009.XU patent/CN205705626U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108556440A (en) * | 2017-12-29 | 2018-09-21 | 广东德冠薄膜新材料股份有限公司 | The polypropylene film and its preparation method and application of the hot compound resin layer containing roughing in surface |
| CN108556440B (en) * | 2017-12-29 | 2019-03-12 | 广东德冠薄膜新材料股份有限公司 | The polypropylene film and its preparation method and application of the hot compound resin layer containing roughing in surface |
| CN109760394A (en) * | 2019-02-26 | 2019-05-17 | 上海百卡新材料科技有限公司 | A kind of environment-friendly type ground in wafer processing |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10319942B2 (en) | OLED device, packaging method thereof, and packaging apparatus | |
| CN204874381U (en) | Ultra violet radiation solidifies peelable cutting processing procedure protection film | |
| CN108724865B (en) | Carrier film for 3D product, composite film comprising carrier film and method for attaching film | |
| CN203957485U (en) | The composite handling arrangement of dry compound machine for flexible package | |
| CN205705626U (en) | A kind of wafer cutting, thinning protecting film | |
| JP2013029754A (en) | Polarizing plate roll and manufacturing method thereof | |
| CN207330823U (en) | A kind of acrylate swellable tape | |
| US11731412B2 (en) | Production method for film laminate | |
| US9937336B2 (en) | Method of manufacturing a conical-projections-sheet packaging body | |
| CN103862516A (en) | Double-faced adhesive film die-cutting process | |
| JP6170678B2 (en) | Semiconductor wafer processing sheet and method for manufacturing the same | |
| CN105742173A (en) | Processing method for ultra-thin wafer | |
| JP2008003115A (en) | Method of manufacturing fpd | |
| CN104952702B (en) | Semiconductor devices and preparation method thereof | |
| CN103305141B (en) | Protecting film and manufacture method thereof | |
| KR100615217B1 (en) | Method of manufacturing flat panel display device | |
| CN105643318B (en) | A kind of cellular material machine installation clamping method | |
| CN106848111A (en) | Stack film and manufacturing method thereof | |
| CN209259996U (en) | A kind of antistatic wafer is thinned, protective film is used in cutting | |
| CN108587501A (en) | A kind of wafer cutting expansion protective film and preparation method thereof | |
| CN113604167A (en) | Non-silicon transfer protective film and preparation method thereof | |
| CN201999886U (en) | High-flexibility and ultra-thick protection film | |
| CN205621711U (en) | A supporting component for bearing weight of wafer | |
| CN103451655B (en) | With film etch process and application and with the obtained Metal Flake component of its processing | |
| CN107057593A (en) | A kind of anti-scratch antistatic protection film |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: No. 3123, Huanqing Road, Yushan Town, Kunshan City, Suzhou City, Jiangsu Province Patentee after: Boyi Xincheng Polymer Materials Co.,Ltd. Address before: 215300, No. 1798 Zhonghua Garden West Road, High tech Zone, Kunshan City, Suzhou City, Jiangsu Province Patentee before: KUNSHAN BYE POLYMER MATERIAL Co.,Ltd. |