CN205657909U - A printed circuit board - Google Patents
A printed circuit board Download PDFInfo
- Publication number
- CN205657909U CN205657909U CN201620408719.3U CN201620408719U CN205657909U CN 205657909 U CN205657909 U CN 205657909U CN 201620408719 U CN201620408719 U CN 201620408719U CN 205657909 U CN205657909 U CN 205657909U
- Authority
- CN
- China
- Prior art keywords
- ennation
- printed substrate
- mainboard
- pad
- ground plane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The utility model provides a printed circuit board, it includes the mainboard, the mainboard is provided with installation face and bottom surface, installation face is used for installing components and parts, the bottom surface is provided with the pad, installation face with set up the power plane and the ground plane of mutual insulation between the bottom surface, still set up the ennation, the ennation with the ground plane is connected and is extended to keep away from the bottom surface one side of installation face. When the scheme is adopted, the utility model discloses a design the ennation of being connected with the conducting layer for the heat of conducting layer can give off through the ennation, thereby has reached better radiating effect, makes a printed circuit board can bear most volume components and parts that density is bigger.
Description
Technical field
This utility model relates to PCB field, in particular, a kind of printed substrate.
Background technology
PCB(Printed Circuit Board, printed substrate) it is important electronic unit, it is the supporter of electronic devices and components, is the carrier of electronic devices and components electrical connection.Owing to it is to use electron printing to make, therefore it is referred to as circuit and " prints " plate or circuit " prints " plate.After electronic equipment uses printed board, concordance due to similar printed board, thus avoid the mistake of artificial wiring, and the automatic plug-in mounting of electronic devices and components or attachment, automatic tin soldering can be realized, automatically detect, ensure that the quality of electronic equipment, improve labor productivity, reduce cost, and be easy to maintenance.
But, how PCB is carried out innovative design, is still the technical issues that need to address.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of new printed substrate.
The technical solution of the utility model is as follows: a kind of printed substrate, it includes mainboard；Described mainboard is provided with installed surface and bottom surface, and described installed surface is used for mounting related components, and described bottom surface is provided with pad, arranges bus plane and the ground plane of mutually insulated between described installed surface and described bottom surface；Also setting up ennation, described ennation is connected with described ground plane and extends to the side away from described installed surface, the described bottom surface.
Preferably, described bottom surface arranges multiple described pad, and pad described at least the one of described ennation and described bottom surface electrically connects setting.
Preferably, described ennation connects the ground wire of described printed substrate.
Preferably, described printed substrate is additionally provided with the first insulation net being coated with described ennation, is used for isolating described ennation.
Preferably, the screening area of described insulation net is less than 0.5 square millimeter.
Preferably, described printed substrate arranges multiple described ennation.
Preferably, described printed substrate is additionally provided with the second insulation net being coated with whole described ennations, is used for isolating whole described ennation.
Preferably, described ennation is cylinder, prism or pyramid.
Preferably, the height of described ennation is less than 1 centimetre.
Preferably, described ennation is flake, and its thickness is less than 100 microns.
Use such scheme, the ennation that this utility model is connected with conductive layer so that the heat of conductive layer can be distributed by ennation, thus has reached more preferable radiating effect so that printed substrate can carry the greater number components and parts that density is bigger by design.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of this utility model one embodiment.
Detailed description of the invention
Below in conjunction with the accompanying drawings and specific embodiment, this utility model is described in detail, the following examples can be applied in combination, and, this utility model may utilize various forms and realizes, it is not limited to this specification each specific embodiment described, it is provided that the purpose of these embodiments is more thoroughly to readily appreciate disclosure of the present utility model all sidedly.Needing further exist for explanation, when a certain structure is fixed on another structure, including this structure being directly or indirectly fixed on this another structure, or this structure being fixed on this another structure by other intermediate structures one or more.When a structure connects another structure, including this structure being directly or indirectly connected to this another structure, or this structure is connected to this another structure by other intermediate structures one or more.Further, described "and/or" include " with " with two kinds of possible embodiments of "or".
An example of the present utility model is, as it is shown in figure 1, a kind of printed substrate, it includes mainboard；Described mainboard is provided with installed surface 100 and bottom surface 200, and described installed surface is used for mounting related components, and described bottom surface is provided with pad, arranges bus plane 300 and the ground plane 500 of mutually insulated between described installed surface and described bottom surface；Also setting up ennation 600, described ennation is connected with described ground plane and extends to the side away from described installed surface, the described bottom surface.Insulating barrier 400 it is provided with between bus plane and ground plane.
Such as, a kind of printed substrate, it includes mainboard；Described mainboard is provided with installed surface and bottom surface, and such as, described mainboard is lamina, and its one side is for externally display or shows or is installed on the installed surface above installation site, and another side is the most externally to show or toward the bottom surface of installation site；Described installed surface is used for mounting related components, and described bottom surface is provided with pad, arranges bus plane and the ground plane of mutually insulated between described installed surface and described bottom surface.Pad is i.e. for the grommet of welding component pin.And for example, described installed surface and described bottom surface are provided with pad.Described pad connects described bus plane or described ground plane, and such as, pad described at least connects described bus plane, and, pad described at least connects described ground plane.
And for example, described mainboard is doubling plate or multi-layer sheet, and its one side is for externally display or shows or is installed on above installation site, and for described installed surface, another side is the most externally to show or toward the bottom surface of installation site；At least one of which conductive layer is set between described installed surface and described bottom surface；Conductive layer includes bus plane and ground plane.Be provided with interval between each layer conductive layer, such as between plate；Such as, arranged by described spacer insulator between each layer conductive layer.And for example, arranging at least one of which bus plane and at least one of which ground plane between described installed surface and described bottom surface, each layer bus plane is electrically connected to each other, and each layer ground plane is electrically connected to each other, arbitrary described bus plane is arranged with the insulation of each described ground plane, and arbitrary described ground plane is arranged with the insulation of each described bus plane.
Such as, described printed substrate includes mainboard；Described mainboard is provided with installed surface and bottom surface.Such as, described printed substrate also sets up ennation, and described ennation is connected with described ground plane and extends to the side away from described installed surface, the described bottom surface.So, the ennation being connected with ground plane by design so that the heat of ground plane can be distributed by ennation, thus has reached more preferable radiating effect so that printed substrate can carry the greater number components and parts that density is bigger.Such as, described ground plane is wholely set with each described ennation, and the extended each described ennation of the most described ground plane to described bottom surface is away from the side of described installed surface；And for example, having more grounded layers, in each described ennation, some described ennations and one layer of ground plane are wholely set, and some described ennations are wholely set with another layer of ground plane, by that analogy.And for example, having three layers of described ground plane, in each described ennation, some described ennations are wholely set with ground floor ground plane, and some described ennations are wholely set with second layer ground plane, remain described ennation and are wholely set with third layer ground plane.
In order to heat-transfer effect is better achieved, it is preferred that described bottom surface arranges multiple described pad, pad described at least the one of described ennation and described bottom surface electrically connects setting.And/or, described ennation connects the ground wire of described printed substrate.Such as, pad described in the one of each described ennation and described bottom surface is connected setting, and and for example, each described pad of described bottom surface connects ennation described in respectively.Such as, in each described ennation, each described ennation be at least connected with described bottom surface one described in pad, and each described pad of described bottom surface connects ennation described in.Described connection, connects, as such, it is possible to the heat of pad is dispelled the heat by ennation including contact or wire.Preferably, described bottom surface arranges multiple described pad, and the most some described pads are the ground pad for ground connection, and i.e. it connects ground wire；Ground pad described at least the one of described ennation and described bottom surface is connected setting.Such as, in each described ennation, each described ennation be at least connected with described bottom surface one described in ground pad, and each described ground pad of described bottom surface connects ennation described in.And for example, described ennation is connected with described ground plane and extends to the side away from described installed surface, the described bottom surface.And for example, described ground pad is connected with described ground plane.
In order to avoid conduction or appearance are unexpected, it is preferred that described printed substrate is additionally provided with the first insulation net being coated with described ennation, is used for isolating described ennation.Preferably, the screening area of described insulation net is less than 0.5 square millimeter.In order to heat-transfer effect is better achieved, it is preferred that described printed substrate arranges multiple described ennation.Preferably, described printed substrate is additionally provided with the second insulation net being coated with whole described ennations, is used for isolating whole described ennation.And for example, described printed substrate also sets up the second insulation net for isolating whole described ennation, and each described ennation is each passed through a grid of described second insulation net.Having such as, array arranges some described ennations, and isolates whole described ennations by described second insulation net.Such as, described second insulation net has " well " glyph grid, and described ennation is four prisms cylinder, and its cross section is slightly less than the grid of described second insulation net, so that each described ennation is each passed through a grid of described second insulation net.
In order to heat-transfer effect is better achieved, it is preferred that described ennation is cylinder, prism or pyramid.And/or, the height of described ennation is less than 1 centimetre.Or, described ennation is flake, and its thickness is less than 100 microns.Such as, arranging multiple flake ennation, each flake ennation interval is arranged.And for example, the ennation that multiple height is 0.5 to 0.8 centimetre is set.Such as, array arranges multiple described ennation.
In order to obtain more preferable radiating effect, such as, it is additionally provided with fan, is used for accelerating heat loss through convection.Preferably, it is additionally provided with the wind guide tank of the air outlet connecting described fan, for controlling the air-out direction of described fan so that heat loss through convection effect is higher.Such as, the air-out notch of described wind guide tank has rectangular shape or annular shape, such as, form " a returning " font, it is preferred that the marginal position of marginal position or close described mainboard that the air-out notch of described wind guide tank is arranged at described mainboard is arranged.Such as, the air-out notch of described wind guide tank is arranged at the marginal position of described bottom surface of described mainboard or the marginal position near the described bottom surface of described mainboard is arranged.
In order to realize the design of stereosopic printing wiring board, and more components and parts are set to form stereo circuit structure, such as, described printed substrate also sets up bending structure, described bending structure includes that side plate and kink, described side plate are fixed on described mainboard by described kink.So, it is fixed on the bending structure of mainboard by design, defines the stereosopic printing wiring board being easily achieved, such that it is able to arrange various components and parts on mainboard and side plate, on the basis of this stereosopic printing wiring board, be advantageously implemented further innovative design.
Such as, described kink is compliant member, and such as, described kink is rubber part；And for example, a part for described kink is compliant member, and such as, a part for described kink is rubber part；Such as, described kink includes intermediate structure and both ends structure, and end construction is compliant member, and such as it is rubber part.And/or, described bending structure also includes the extension for heat radiation.Such as, described printed substrate is metal core board, and the bending of described metal core board is arranged, and a part is described mainboard, and a part is described side plate, and part is described kink therebetween.Such as, described printed substrate is aluminum central layer or copper core plate.And for example, the metal-cored extension dew of described metal core board is put, and forms described extension.And for example, the metal-cored extension dew of described metal core board is put and has some breach, forms some described extensions, each discontinuous setting of described extension.
In order to avoid interfering or contact between each onboard components and parts, such as, described side plate forms 80 ~ 120 degree of angles with described mainboard.Preferably, described side plate forms 90 ~ 100 degree of angles with described mainboard.Such as, described side plate forms an angle of 90 degrees with described mainboard.
For the ease of manufacturing, it is preferred that described bending structure is one-body molded with described mainboard.Such as, plate body bending being designed, a part is described mainboard, and a part is described side plate, and part is described kink therebetween.In order to avoid interfering or contact between each onboard components and parts, it is preferred that described kink is arc or L-shaped.Such as, described kink is arc and its radian is 1 to 1.35.For adapting to innovation and the manufacture of various industrialization products, it is preferred that arrange bending structure described in two groups.And for example, bending structure described in a group is only set.And for example, bending structure described in four groups is set.
For the ease of manufacturing, it is preferred that described mainboard is rectangle.Preferably, bending structure described in two groups is respectively arranged at the both sides that described mainboard is adjacent.Or, bending structure described in two groups is respectively arranged at the both sides that described mainboard is relative.Preferably, bending structure described in two groups is symmetrical arranged.
For beneficially innovative design and be easy to manufacture, such as, described printed substrate also sets up splice plate, and described mainboard has splice bits, and described splice plate has stitching section, and described splice plate is fixed on the described splice bits of described mainboard by described stitching section.So, the splice plate of mainboard it is fixed on by design, improve the autgmentability of printed substrate, at plane space or solid space, mainboard can be carried out splicing to extend, such that it is able to arrange various components and parts on mainboard and splice plate, extend printed substrate at this on the basis of, it is advantageously implemented further innovative design.
In order to realize various splicing design, it is preferred that described splice plate is generally aligned in the same plane with described mainboard.Or, described splice plate forms 60 ~ 150 degree of angles with described mainboard.Such as, described splice plate forms 80 ~ 100 degree of angles with described mainboard.Such as, described splice plate forms an angle of 90 degrees with described mainboard.For the ease of realizing quickly and effectively splicing, it is preferred that described stitching section is spirally connected or snapping is fixed on described splice bits.Or, described stitching section interference fit is fixed on described splice bits.
In order to preferably obtain the convenient performance of splicing and improve the alternative of splicing, it is preferred that described splice plate has multiple described stitching section, and described mainboard arranges the described splice bits of multiple correspondence.Preferably, described printed substrate arranges two described splice plates.Preferably, two described splice plates are symmetrical arranged relative to described mainboard.Preferably, described printed substrate arranges splice plate described at least three, and described mainboard splices multiple described splice plate respectively.
For reaching illuminating effect, such as, it is additionally provided with LED, forms a LED light device.Such as, described LED is arranged at described installed surface and is connected to pad described at least.Preferably, multiple described LED is set.
In order to reach good illuminating effect, it is preferred that multiple described LED arrange line by line.Such as, multiple described LED are arranged as two row.Or, multiple described LED are arranged as three row.
In order to reach good brightness of illumination, it is preferred that described LED is high-powered LED lamp.For avoiding light excessively to concentrate, it is preferred that the light-emitting area of described high-powered LED lamp is provided with diffusing structure, described diffusing structure is fixed on described installed surface.Such as, described diffusing structure is writing board shape.And/or, described diffusing structure is part spherical in shape.And/or, described diffusing structure arranges some waveform grooves, and each described waveform groove is asymmetric and non-interconnected is arranged.Such as, unordered some waveform grooves are set；And for example, each described waveform groove arranges inlay in some Part-spherical.And for example, each described waveform groove is annular.And for example, each described waveform groove is increased radioactivity.As such, it is possible to reach preferable light dispersion effect.
In order to avoid light direct irradiation, improve dispersion effect, it is preferred that described LED light device also sets up lampshade, and its cover sets described mainboard.In order to improve radiating effect, it is preferred that described lampshade arranges thermal vias.Such as, described lampshade arranges multiple described thermal vias.Such as, described thermal vias is circular or cylindrical.And/or, described lampshade arranges heat radiation groove.Preferably, described lampshade arranges multiple described heat radiation groove.Such as, described heat radiation groove is strip or prismatic.
In order to avoid light direct irradiation, improve dispersion effect, it is preferred that described lampshade arranges scattering layer.Preferably, described scattering layer has some cavity body.Such as, described cavity body is not vacuum, has gas inside it；And for example, described cavity body is formed for injecting gas.Such as, described gas is air or nitrogen.Preferably, described cavity body is randomly provided.Or, described cavity body is uniformly arranged.So, both improved dispersion effect, and be easy to again produce.
For the ease of installing, it is preferred that described LED light device also sets up support, and described mainboard is fixed on described support.Preferably, described support arranges mounting groove, and described mounting groove is fixed in described mainboard grafting.Such as, described support arranges pair of parallel described mounting groove.
For ease of fixing splice plate, it is preferred that the most extended supporting construction of described support, described supporting construction is away from the described splice plate of the fixing connection in end of described support.Such as, described splice plate is fixedly attached to few two described supporting constructions.Preferably, described LED light device arranges multiple described splice plate, the most extended multiple supporting constructions of described support, and each described supporting construction is fixing connects splice plate described in.Preferably, described supporting construction has the inner cavity of hollow.Preferably, described supporting construction is spirally connected with described splice plate away from the end of described support.Preferably, described supporting construction is away from end and the described splice plate grafting of described support.
Further, embodiment of the present utility model also includes, each technical characteristic of the various embodiments described above, the printed substrate being mutually combined formation or the illuminator with described printed substrate or have the LED light device of described printed substrate.
It should be noted that above-mentioned each technical characteristic continues to be mutually combined, form various embodiments the most enumerated above, be accordingly to be regarded as the scope that this utility model description is recorded；Further, for those of ordinary skills, can be improved according to the above description or be converted, and all these modifications and variations all should be belonged to the protection domain of this utility model claims.
Claims (10)
1. a printed substrate, it is characterised in that include mainboard；
Described mainboard is provided with installed surface and bottom surface, and described installed surface is used for mounting related components, and described bottom surface is provided with pad, arranges bus plane and the ground plane of mutually insulated between described installed surface and described bottom surface；
Also setting up ennation, described ennation is connected with described ground plane and extends to the side away from described installed surface, the described bottom surface.
The most according to claim 1, printed substrate, it is characterised in that described bottom surface arranges multiple described pad, pad described at least the one of described ennation and described bottom surface electrically connects setting.
Printed substrate the most according to claim 2, it is characterised in that described ennation connects the ground wire of described printed substrate.
Printed substrate the most according to claim 1, it is characterised in that described printed substrate is additionally provided with the first insulation net being coated with described ennation, is used for isolating described ennation.
Printed substrate the most according to claim 4, it is characterised in that the screening area of described insulation net is less than 0.5 square millimeter.
Printed substrate the most according to claim 1, it is characterised in that described printed substrate arranges multiple described ennation.
Printed substrate the most according to claim 6, it is characterised in that described printed substrate is additionally provided with the second insulation net being coated with whole described ennations, is used for isolating whole described ennation.
Printed substrate the most according to claim 1, it is characterised in that described ennation is cylinder, prism or pyramid.
Printed substrate the most according to claim 8, it is characterised in that the height of described ennation is less than 1 centimetre.
The most according to claim 1, printed substrate, it is characterised in that described ennation is flake, its thickness is less than 100 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620408719.3U CN205657909U (en) | 2016-05-09 | 2016-05-09 | A printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620408719.3U CN205657909U (en) | 2016-05-09 | 2016-05-09 | A printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205657909U true CN205657909U (en) | 2016-10-19 |
Family
ID=57400984
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620408719.3U Expired - Fee Related CN205657909U (en) | 2016-05-09 | 2016-05-09 | A printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205657909U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105813377A (en) * | 2016-05-09 | 2016-07-27 | 深圳爱易瑞科技有限公司 | Printed circuit board |
-
2016
- 2016-05-09 CN CN201620408719.3U patent/CN205657909U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105813377A (en) * | 2016-05-09 | 2016-07-27 | 深圳爱易瑞科技有限公司 | Printed circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9320168B2 (en) | Control apparatus, in particular for a motor vehicle | |
| CN104221471B (en) | The powered construction of organic EL module and organic EL module | |
| CN202182365U (en) | LED light strip, side light type backlight module and display | |
| CN102889489B (en) | Lamp strip structure and light source device | |
| CN105873365A (en) | Circuit board | |
| CN203722909U (en) | Flexible circuit board and LED light bar | |
| CN205657909U (en) | A printed circuit board | |
| CN205755028U (en) | A kind of three-dimensional circuit board | |
| CN205746068U (en) | A kind of intelligent LED panel light illuminator | |
| CN205746332U (en) | A kind of LED heat radiation street lamp | |
| CN205746444U (en) | A kind of energy-saving LED road lamp | |
| CN205755059U (en) | A kind of circuit board | |
| CN105338737A (en) | Circuit board assembly and mobile phone camera module | |
| CN105805576A (en) | Intelligent illuminating device provided with LED panel lamps | |
| CN107062118A (en) | A kind of OLED screen body mounting and fixing bracket, OLED screen body device and automobile tail light | |
| CN105822966A (en) | Energy-saving LED streetlamp | |
| CN105813377A (en) | Printed circuit board | |
| CN105737037A (en) | LED (Light Emitting Diode) radiating street lamp | |
| CN105764246A (en) | Three-dimensional circuit board | |
| CN204704713U (en) | Ligthing paraphernalia | |
| CN214338203U (en) | Circuit structure and electric control device | |
| CN201599686U (en) | Retractable LED lamp | |
| CN204090294U (en) | Circuit board assemblies and mobile phone camera module | |
| CN209418494U (en) | Electronic equipment and display device | |
| CN204167350U (en) | Light-emitting diode (LED) module and lighting device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161019 Termination date: 20170509 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |