CN105338737A - Circuit board assembly and mobile phone camera module - Google Patents
Circuit board assembly and mobile phone camera module Download PDFInfo
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- CN105338737A CN105338737A CN201410344574.0A CN201410344574A CN105338737A CN 105338737 A CN105338737 A CN 105338737A CN 201410344574 A CN201410344574 A CN 201410344574A CN 105338737 A CN105338737 A CN 105338737A
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Abstract
The invention relates to a circuit board assembly and a mobile phone camera module. The circuit board assembly comprises a heat dissipation plate, a printed circuit board and a flexible circuit board, wherein heat dissipation plate possesses a heat dissipation surface and a bearing surface which are in an opposite arrangement; the printed circuit board is disposed on the bearing surface; the flexible circuit board is disposed on a surface of the printed circuit board and the surface is far away from the heat dissipation plate, and the flexible circuit board comprises an electronic element installation area disposed on the surface which is far away from the printed circuit board. The heat dissipation surface or the bearing surface is provided with heat dissipation grooves extended to two sides of the heat dissipation plate. An orthographic projection of each heat dissipation groove on a plane where the printed circuit board is located is on the printed circuit board. The above circuit board assembly has a good heat dissipation effect.
Description
Technical field
The present invention relates to technical field of electronic equipment, particularly relate to a kind of circuit board assemblies and mobile phone camera module.
Background technology
Traditional mobile phone camera module comprises circuit board assemblies and image sensor (Sensor).Wherein, circuit board assemblies comprise flexible PCB (FlexibleCircuitBoard, FPC), be pressed on the installing zone of FPC under printed circuit board (PCB) (PrintedCircuitBoard, PCB) and the reinforced sheet that is pasted on below PCB.Image sensor is pasted on the installing zone of FPC by chip on board (ChipOnBoard, COB) technique.PCB can increase intensity and the evenness of FPC installing zone, and can arrange more connecting circuit further, and reinforced sheet then can increase the intensity of FPC installing zone and PCB, prevents image sensor in COB technique from charging and attacking and causes FPC and PCB to damage on FPC.In addition, reinforced sheet is bondd by conducting resinl and PCB usually, can play electrostatic grounding effect when mobile phone camera module works and thermolysis.But during the work of mobile phone camera module, produce heat larger, existing mobile phone camera modular structure radiating effect is not ideal enough.
Summary of the invention
Based on this, be necessary to provide a kind of circuit board assemblies and the mobile phone camera module with better heat dispersion.
A kind of circuit board assemblies, comprising:
Heating panel, has relative heat-delivery surface and load-bearing surface, and described heat-delivery surface or described load-bearing surface offer the radiating groove extending to described heating panel both sides;
Printed circuit board (PCB), is located on described load-bearing surface, and described radiating groove described printed circuit board (PCB) orthographic projection be in the plane positioned on described printed circuit board (PCB); And
Flexible PCB, be located on the surface of described printed circuit board (PCB) away from described heating panel, described flexible PCB comprises the electronic component installing zone on the surface be located at away from described printed circuit board.
Wherein in an embodiment, described flexible PCB is mounting surface away from the surface of described printed circuit board (PCB), and described electronic component installing zone is a part for described mounting surface;
Described flexible PCB comprises the multiple weld pads be convexly equipped in described mounting surface, described multiple weld pad to be positioned at outside described electronic component installing zone and to arrange in two separate ranks, described two row weld pads lay respectively at the both sides of described electronic component installing zone, between adjacent two weld pads of same row, there is spacing.
Wherein in an embodiment, each row weld pad and a radiating groove are just to setting.
Wherein in an embodiment, the number of described radiating groove is many, and the number of described radiating groove is greater than two, and many described radiating grooves are arranged in parallel, and there is spacing between adjacent two radiating grooves.
Wherein in an embodiment, the spacing between adjacent two radiating grooves is identical, and the spacing between adjacent two weld pads of same row is identical.
Wherein in an embodiment, described printed circuit board (PCB) offers the ventilation slot extending to described printed circuit board (PCB) both sides on the surface of described heating panel, described ventilation slot is positioned in described mounting surface in the orthographic projection of described mounting surface, and between described two row weld pads.
Wherein in an embodiment, described printed circuit board (PCB) offers and runs through described printed circuit board (PCB) two surface and the ventilation hole extending to described printed circuit board (PCB) both sides, described ventilation hole is positioned in described mounting surface in the orthographic projection of described mounting surface, and between described two row weld pads.
Wherein in an embodiment, described load-bearing surface offers the radiating groove extending to described heating panel both sides, described printed circuit board (PCB) and the just right position of described radiating groove offer the docking groove extending to described printed circuit board (PCB) both sides, and described docking groove docks with described radiating groove and coordinates and forms louvre; Described radiating groove and described docking groove are positioned in described mounting surface in the orthographic projection of described mounting surface, and between described two row weld pads.
Wherein in an embodiment, described load-bearing surface offers the radiating groove extending to described heating panel both sides, described printed circuit board (PCB) and the just right position of described radiating groove offer runs through described printed circuit board (PCB) two surface and the butt hole extending to described printed circuit board (PCB) both sides, and described radiating groove docks with described butt hole and coordinates and forms louvre; Described radiating groove and described butt hole are positioned in described mounting surface in the orthographic projection of described mounting surface, and between described two row weld pads.
Wherein in an embodiment, described heat-delivery surface also offers the radiating groove extending to described heating panel both sides, the number of the described radiating groove be opened on heat-delivery surface is two, described in be opened in two radiating grooves on heat-delivery surface respectively with described two row weld pads just to setting.
Wherein in an embodiment, the cross sectional shape of described radiating groove is rectangle or V-shaped;
And/or described stiffener is steel disc;
And/or, be provided with conductive adhesive layer between described stiffener and described printed circuit board (PCB).
A kind of mobile phone camera module, comprising:
Above-mentioned circuit board assemblies; And
Image sensor, be located on described electronic component installing zone, and described image sensor is electrically connected with described flexible PCB.
When using foregoing circuit board component, the heat being located at the electronic component generation on electronic component installing zone conducts on flexible PCB, printed circuit board (PCB) and stiffener successively, then carries out heat exchange with air, thus realizes heat radiation.When heat-delivery surface offering the radiating groove running through the relative both sides of stiffener, radiating groove can increase the area of stiffener and air draught, thus accelerate the speed of stiffener and air heat exchange, and then foregoing circuit board component is made to have good heat dispersion.When load-bearing surface offering the radiating groove running through the relative both sides of stiffener, radiating groove coordinates with printed circuit board (PCB) and forms ventilation hole, thus the area of stiffener and printed circuit board (PCB) and air draught can be increased, thus accelerate the speed of stiffener and printed circuit board (PCB) and air heat exchange, and then foregoing circuit board component is made to have good heat dispersion.
Accompanying drawing explanation
Fig. 1 is the structural representation of the mobile phone camera module of an execution mode;
Fig. 2 is the exploded view of the mobile phone camera module in Fig. 1;
Fig. 3 is the structural representation of the mobile phone camera module in another execution mode;
Fig. 4 is the exploded view of the mobile phone camera module in Fig. 3;
Fig. 5 is the structural representation of the mobile phone camera module in another execution mode;
Fig. 6 is the structural representation of the mobile phone camera module in another execution mode.
Embodiment
Below in conjunction with drawings and the specific embodiments, circuit board assemblies and mobile phone camera module are further detailed.
As shown in Figures 1 and 2, the mobile phone camera module 10 of an execution mode, comprises circuit board assemblies 100, image sensor 200 and wire 300.
Circuit board assemblies 100 comprises heating panel 110, printed circuit board (PCB) 120 and flexible PCB 130.
Heating panel 110 has relative heat-delivery surface 112 and load-bearing surface 114.Heat-delivery surface 112 or load-bearing surface 114 offer the radiating groove 116 extending to heating panel 110 both sides.In the present embodiment, load-bearing surface 114 offers the radiating groove 116 extending to heating panel 110 both sides.As shown in Figure 3, in other embodiments, heat-delivery surface 112 offers the radiating groove 116 extending to heating panel 110 both sides.
Further, in the present embodiment, the cross sectional shape of radiating groove 116 is rectangle.Be appreciated that in other embodiments, the cross sectional shape of radiating groove 116 also can be V-shaped or other shapes.
Heating panel 110 needs to have certain rigidity to increase the intensity of printed circuit board (PCB) 120 and flexible PCB 130.In the present embodiment, heating panel 110 for having certain rigidity and having the steel disc of better heat dispersion, thus is more conducive to foregoing circuit board component 100 and dispels the heat.
Printed circuit board (PCB) 120 is located on load-bearing surface 114, and radiating groove 116 is positioned on printed circuit board (PCB) 120 in the orthographic projection of printed circuit board (PCB) 120.Printed circuit board (PCB) 120 for increasing the intensity of flexible PCB 130 and evenness, and can arrange more connecting circuit further.In the present embodiment, conductive adhesive layer (not shown) is provided with between printed circuit board (PCB) 120 and heating panel 110.Conductive adhesive layer plays the effect connecting printed circuit board (PCB) 120 and heating panel 110, and when mobile phone camera module 10 works, conductive adhesive layer can also play electrostatic grounding effect and thermolysis.
Flexible PCB 130 is located on the surface of printed circuit board (PCB) 120 away from heating panel 110.Flexible PCB 130 comprises is located at the electronic component installing zone 1322 of flexible PCB 130 away from the surface of printed circuit board 120.
In the present embodiment, circuit board assemblies 100 is applied in mobile phone camera module 10, and electronic component installing zone 1322 is for installing image sensor 200.Be appreciated that in other embodiments, when circuit board assemblies 100 is applied to LED technology field, electronic component installing zone 1322 may be used for installing LED chip.
When using foregoing circuit board component 100, the heat being located at the electronic component generation on electronic component installing zone 1322 conducts on flexible PCB 130, printed circuit board (PCB) 120 and heating panel 110 successively, then carries out heat exchange with air, thus realizes heat radiation.
When heat-delivery surface 112 offering the radiating groove 116 extending to heating panel 110 both sides, radiating groove 116 can increase the area of heating panel 110 and air draught, thus accelerate the speed of heating panel 110 and air heat exchange, and then foregoing circuit board component 100 is made to have good heat dispersion.
When load-bearing surface 114 offering the radiating groove 116 extending to heating panel 110 both sides, radiating groove 116 coordinates with printed circuit board (PCB) 120 and forms ventilation hole, thus the area of heating panel 110 and printed circuit board (PCB) 120 and air draught can be increased, thus accelerate the speed of heating panel 110 and printed circuit board (PCB) 120 and air heat exchange, and then foregoing circuit board component 100 is made to have good heat dispersion.
In the present embodiment, flexible PCB 130 is mounting surface 132 away from the surface of printed circuit board (PCB) 120.Electronic component installing zone 1322 is a part for mounting surface 132.Flexible PCB 130 comprises the multiple weld pads 134 be convexly equipped in mounting surface 132, multiple weld pad 134 to be positioned at outside electronic component installing zone 1322 and to arrange in two separate ranks, two row weld pads 134 lay respectively at the both sides of electronic component installing zone 1322, between adjacent two weld pads 134 of same row, there is spacing.Thus can the space of Appropriate application flexible PCB 130.
Further, in the present embodiment, each row weld pad 134 and a radiating groove 116 are just to setting.Because weld pad 134 needs to be electrically connected with electronic component, weld pad 134 place easily gathers more heat, ventilation hole 116 and weld pad 134 is just more conducive to circuit board assemblies 100 to setting and dispels the heat.
In the present embodiment, the number of radiating groove 116 is many, and the number of radiating groove 116 is greater than two, and many radiating grooves 116 are arranged in parallel, and there is spacing between adjacent two radiating grooves 116.Although set up the heat radiation that many radiating grooves 116 are conducive to improving circuit board assemblies 100, the rigidity of heating panel 110 can be affected.In the present embodiment, after considering the heat radiation of circuit board assemblies 100 and these two factors of rigidity of heating panel 110, five radiating grooves 116 are set.As shown in Figures 4 and 5, be appreciated that in other embodiments, the number of radiating groove 116 also can be two.
Further, in the present embodiment, the spacing between adjacent two row radiating grooves 116 is identical, thus is more conducive to Homogeneouslly-radiating and is more conducive to make heating panel 110.
Further, in embodiments, the spacing between adjacent two weld pads 134 of same row is identical, thus is more conducive to make flexible PCB 130, is more conducive to radiating groove 116 Homogeneouslly-radiating simultaneously.
In other embodiments, heating panel 110 is constant with the design of flexible PCB 130.Printed circuit board (PCB) 120 offers the ventilation slot extending to printed circuit board (PCB) 120 both sides on the surface of heating panel 110, and ventilation slot is positioned in mounting surface 132 in the orthographic projection of mounting surface 132, and between two row weld pads 134.Ventilation slot and radiating groove 116 can dispel the heat, thus make circuit board assemblies 100 have better heat dispersion.
Be appreciated that in other embodiments, heating panel 110 is constant with the design of flexible PCB 130.Printed circuit board (PCB) 120 also can offer and run through printed circuit board (PCB) 120 liang of surfaces and the ventilation hole extending to printed circuit board (PCB) 120 both sides, ventilation hole is positioned in mounting surface 132 in the orthographic projection of mounting surface 132, and between two row weld pads 134.Ventilation hole and radiating groove 116 can dispel the heat, thus make circuit board assemblies 100 have better heat dispersion.
As shown in Figure 6, in other embodiments, the design of flexible PCB 130 is constant.Load-bearing surface 114 offers the radiating groove 116 extending to heating panel 110 both sides.And printed circuit board (PCB) 120 position just right with radiating groove 116 also can offer and run through printed circuit board (PCB) 120 liang of surfaces and the butt hole 122 extending to printed circuit board (PCB) 120 both sides.Radiating groove 116 docks with butt hole 122 and coordinates and forms louvre.Radiating groove 116 and butt hole 122 are positioned in mounting surface 132 in the orthographic projection of mounting surface 132, and between two row weld pads 134 (also i.e. radiating groove 116 and docking groove 122 above weld pad 134 is not set).Thus the area of heating panel 110, printed circuit board (PCB) 120 and flexible PCB 130 and air draught can be increased, accelerate the speed of heating panel 110, printed circuit board (PCB) 120 and flexible PCB 130 and air heat exchange, and then make foregoing circuit board component 100 have better heat dispersion.Because printed circuit board (PCB) 120 can increase intensity and the evenness of flexible PCB 130, in order to avoid docking groove 122 affects the evenness of flexible PCB 130, docking groove 122 can not be positioned at immediately below weld pad 134.
Just right position also can offer the docking groove extending to printed circuit board (PCB) 120 both sides to be appreciated that printed circuit board (PCB) 120 and radiating groove 116.Docking groove docks with radiating groove 116 and coordinates and forms louvre.Radiating groove 116 and docking groove are positioned in mounting surface 132 in the orthographic projection of mounting surface 132, and between two row weld pads 134.The louvre that docking groove and radiating groove 116 are formed, coordinate the ventilation hole formed larger relative to the radiating groove 116 in Fig. 1 with printed circuit board (PCB) 120, also namely docking groove is set up, the area of heating panel 110 and printed circuit board (PCB) 120 and air draught can be increased, thus accelerate the speed of heating panel 110 and printed circuit board (PCB) 120 and air heat exchange, and then foregoing circuit board component is made to have good heat dispersion.
Further, the number of radiating groove 116 is many, and the number of radiating groove 116 is greater than two, and many radiating grooves 116 are arranged in parallel, and there is spacing between adjacent two radiating grooves 116.Further, the spacing between adjacent two radiating grooves 116 is equal.
Further, heat-delivery surface 112 offers the radiating groove (not showing in Fig. 6) extending to heating panel 110 both sides.The number being opened in the radiating groove on heat-delivery surface 112 is two, be opened in two radiating grooves on heat-delivery surface 112 respectively with two row weld pads 134 just to setting, thus make circuit board assemblies 100 have better heat dispersion.
As shown in Figures 1 and 2, image sensor 200 is located at electronic component installing zone 1322, and image sensor 200 is electrically connected with flexible PCB 130.In the present embodiment, the surface of image sensor 200 away from flexible PCB 130 there is pad 210.
Wire 300 one end is electrically connected with weld pad 134, and the other end is electrically connected with pad 210, thus realizes image sensor 200 and be electrically connected with flexible PCB 130.
Because foregoing circuit board component 100 has good radiating effect, therefore, the mobile phone camera module 10 of foregoing circuit board component 100 is adopted to have good radiating effect.
The above embodiment only have expressed several execution mode of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.
Claims (12)
1. a circuit board assemblies, is characterized in that, comprising:
Heating panel, has relative heat-delivery surface and load-bearing surface, and described heat-delivery surface or described load-bearing surface offer the radiating groove extending to described heating panel both sides;
Printed circuit board (PCB), is located on described load-bearing surface, and described radiating groove described printed circuit board (PCB) orthographic projection be in the plane positioned on described printed circuit board (PCB); And
Flexible PCB, be located on the surface of described printed circuit board (PCB) away from described heating panel, described flexible PCB comprises the electronic component installing zone on the surface be located at away from described printed circuit board.
2. circuit board assemblies according to claim 1, is characterized in that, described flexible PCB is mounting surface away from the surface of described printed circuit board (PCB), and described electronic component installing zone is a part for described mounting surface;
Described flexible PCB comprises the multiple weld pads be convexly equipped in described mounting surface, described multiple weld pad to be positioned at outside described electronic component installing zone and to arrange in two separate ranks, described two row weld pads lay respectively at the both sides of described electronic component installing zone, between adjacent two weld pads of same row, there is spacing.
3. circuit board assemblies according to claim 2, is characterized in that, each row weld pad and a radiating groove are just to setting.
4. circuit board assemblies according to claim 3, is characterized in that, the number of described radiating groove is many, and the number of described radiating groove is greater than two, and many described radiating grooves are arranged in parallel, and there is spacing between adjacent two radiating grooves.
5. circuit board assemblies according to claim 4, is characterized in that, the spacing between adjacent two radiating grooves is identical, and the spacing between adjacent two weld pads of same row is identical.
6. the circuit board assemblies according to any one of claim 3 ~ 5, it is characterized in that, described printed circuit board (PCB) offers the ventilation slot extending to described printed circuit board (PCB) both sides on the surface of described heating panel, described ventilation slot is positioned in described mounting surface in the orthographic projection of described mounting surface, and between described two row weld pads.
7. the circuit board assemblies according to any one of claim 3 ~ 5, it is characterized in that, described printed circuit board (PCB) offers and runs through described printed circuit board (PCB) two surface and the ventilation hole extending to described printed circuit board (PCB) both sides, described ventilation hole is positioned in described mounting surface in the orthographic projection of described mounting surface, and between described two row weld pads.
8. circuit board assemblies according to claim 2, it is characterized in that, described load-bearing surface offers the radiating groove extending to described heating panel both sides, described printed circuit board (PCB) and the just right position of described radiating groove offer the docking groove extending to described printed circuit board (PCB) both sides, and described docking groove docks with described radiating groove and coordinates and forms louvre; Described radiating groove and described docking groove are positioned in described mounting surface in the orthographic projection of described mounting surface, and between described two row weld pads.
9. circuit board assemblies according to claim 2, it is characterized in that, described load-bearing surface offers the radiating groove extending to described heating panel both sides, described printed circuit board (PCB) and the just right position of described radiating groove offer runs through described printed circuit board (PCB) two surface and the butt hole extending to described printed circuit board (PCB) both sides, and described radiating groove docks with described butt hole and coordinates and forms louvre; Described radiating groove and described butt hole are positioned in described mounting surface in the orthographic projection of described mounting surface, and between described two row weld pads.
10. circuit board assemblies according to claim 8 or claim 9, it is characterized in that, described heat-delivery surface also offers the radiating groove extending to described heating panel both sides, the number of the described radiating groove be opened on heat-delivery surface is two, described in be opened in two radiating grooves on heat-delivery surface respectively with described two row weld pads just to setting.
11. circuit board assemblies according to claim 1, is characterized in that, the cross sectional shape of described radiating groove is rectangle or V-shaped;
And/or described stiffener is steel disc;
And/or, be provided with conductive adhesive layer between described stiffener and described printed circuit board (PCB).
12. 1 kinds of mobile phone camera modules, is characterized in that, comprising:
Circuit board assemblies according to any one of claim 1 ~ 11; And
Image sensor, be located on described electronic component installing zone, and described image sensor is electrically connected with described flexible PCB.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410344574.0A CN105338737B (en) | 2014-07-18 | 2014-07-18 | Circuit board assemblies and mobile phone camera mould group |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410344574.0A CN105338737B (en) | 2014-07-18 | 2014-07-18 | Circuit board assemblies and mobile phone camera mould group |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105338737A true CN105338737A (en) | 2016-02-17 |
| CN105338737B CN105338737B (en) | 2019-02-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410344574.0A Expired - Fee Related CN105338737B (en) | 2014-07-18 | 2014-07-18 | Circuit board assemblies and mobile phone camera mould group |
Country Status (1)
| Country | Link |
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| CN (1) | CN105338737B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106163234A (en) * | 2016-07-28 | 2016-11-23 | 广东欧珀移动通信有限公司 | Mobile device |
| CN110602360A (en) * | 2019-09-03 | 2019-12-20 | Oppo广东移动通信有限公司 | Camera module, camera device and electronic equipment |
| CN110794640A (en) * | 2018-08-01 | 2020-02-14 | 三赢科技（深圳）有限公司 | 3D projector |
| CN115126768A (en) * | 2021-03-26 | 2022-09-30 | Oppo广东移动通信有限公司 | Rotating shaft mechanism and electronic equipment |
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| CN201774736U (en) * | 2010-07-28 | 2011-03-23 | 嘉联益科技股份有限公司 | Flexible circuit board with heat dissipation structure |
| CN203661415U (en) * | 2013-12-26 | 2014-06-18 | 南昌欧菲光电技术有限公司 | Soft circuit board and hard circuit board combination device and mobile phone camera module |
| CN204090294U (en) * | 2014-07-18 | 2015-01-07 | 南昌欧菲光电技术有限公司 | Circuit board assemblies and mobile phone camera module |
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| JP2008258495A (en) * | 2007-04-06 | 2008-10-23 | Stanley Electric Co Ltd | Heat dissipation structure of electronic component mounting circuit board |
| CN101226976A (en) * | 2007-10-09 | 2008-07-23 | 番禺得意精密电子工业有限公司 | LED device and locating structure thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106163234A (en) * | 2016-07-28 | 2016-11-23 | 广东欧珀移动通信有限公司 | Mobile device |
| CN110794640A (en) * | 2018-08-01 | 2020-02-14 | 三赢科技（深圳）有限公司 | 3D projector |
| CN110602360A (en) * | 2019-09-03 | 2019-12-20 | Oppo广东移动通信有限公司 | Camera module, camera device and electronic equipment |
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| CN115126768A (en) * | 2021-03-26 | 2022-09-30 | Oppo广东移动通信有限公司 | Rotating shaft mechanism and electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105338737B (en) | 2019-02-12 |
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