CN205542887U - 一种防水及散热型led封装基板 - Google Patents
一种防水及散热型led封装基板 Download PDFInfo
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- CN205542887U CN205542887U CN201620242503.4U CN201620242503U CN205542887U CN 205542887 U CN205542887 U CN 205542887U CN 201620242503 U CN201620242503 U CN 201620242503U CN 205542887 U CN205542887 U CN 205542887U
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CN201620242503.4U CN205542887U (zh) | 2016-03-28 | 2016-03-28 | 一种防水及散热型led封装基板 |
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Cited By (1)
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CN117038818A (zh) * | 2023-10-08 | 2023-11-10 | 盐城鸿石智能科技有限公司 | 一种高反射MicroLED及其制备方法 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN117038818A (zh) * | 2023-10-08 | 2023-11-10 | 盐城鸿石智能科技有限公司 | 一种高反射MicroLED及其制备方法 |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CB03 | Change of inventor or designer information |
Inventor after: Bai Yunfeng Inventor before: Li Chao |
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CB03 | Change of inventor or designer information | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170314 Address after: 523039 Guangdong province Dongguan City Wanjiang Jintai community Zhou Wu Ji Bihai four floor Room 401 Patentee after: Guangdong Jian Technology Co., Ltd. Address before: 441500 Xiangfan County, Hubei, Nanzhang County Road No. 2 Patentee before: Li Chao |
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TR01 | Transfer of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160831 Termination date: 20200328 |
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CF01 | Termination of patent right due to non-payment of annual fee |