CN205535161U - Illuminating light source and illuminating device - Google Patents

Abstract

The utility model provides an illuminating light source and illuminating device who possesses the radiator that has the best heat radiation property. Illuminating light source and illuminating device possesses: LED module (10), be used for making LED module (10) luminous drive circuit (30) and surround radiator (40) of drive circuit (30), radiator (40) have the section of thick bamboo portion (41) of tube -shape and are set up platelike board (42) of just supporting LED module (10) in order to cover section of thick bamboo portion (41), the height of cylindrical section h of a section of thick bamboo (41) is for the cylinder diameter phi's of section of thick bamboo portion (41) ratio below 1.1.

Description

Illumination light source and lighting device

Technical field

The utility model relates to illumination light source and possesses the lighting device of this illumination light source.

Background technology

The semiconductor light-emitting elements such as light emitting diode (LED:Light Emitting Diode) have little Type and the feature of life-span length, it is therefore contemplated that as the light source of various goods.Wherein, have employed LED The most known lamp-bulb type fluorescent lamp of bulb-shaped lamp (LED bulb) or the illumination of incandescent lamp With light source by constantly exploitation (for example, referring to patent document 1).

LED bulb such as has: LED module (light emitting module), the enclosed globe shade (cover of covering LED module Parts), for loading the module board of LED module, making the luminous drive circuit of LED module, surround and drive Move the framework of circuit and accept the lamp holder being used for making the electric power of LED module luminescence from outside.

(prior art literature)

(patent document)

Patent document 1 Japanese Unexamined Patent Publication 2011-146241 publication

LED bulb is configured with radiator, dispels the heat for the heat that LED module is produced.But, It is not easy thing that making has the radiator of desired heat dissipation characteristics.Further, if will heat radiation Device is arranged in the position near framework, then can be because radiator is poor with the thermal expansion difference of framework or thermal contraction The problem causing deterioration.

Utility model content

First purpose of the present utility model is, it is provided that a kind of possess there is desired heat dissipation characteristics The illumination light source of radiator and lighting device.Further, second purpose is, it is provided that a kind of Can suppress to cause the illumination light source of the deterioration of radiator or framework because of thermal expansion difference or thermal contraction difference And lighting device.

In order to reach above-mentioned first purpose, a side of the illumination light source involved by the utility model Formula is, possesses light emitting module, for making the drive circuit of described light emitting module luminescence and surrounding institute Stating the radiator of drive circuit, described radiator has the cylinder portion of tubular and to cover cartridge Mode and the plate portion that is set, and this plate portion supports described light emitting module, the cylinder of cartridge is high relatively In the ratio of barrel dliameter of cartridge below 1.1.

Further, in order to reach above-mentioned second purpose, the illumination light source involved by the utility model One mode is, possesses light emitting module, for making the drive circuit of described light emitting module luminescence, surrounding The radiator of described drive circuit and framework, this framework has the tubular surrounding described drive circuit Inner casing portion and surround the outer part of tubular in described inner casing portion, described radiator has and is positioned at institute State the cylinder portion of the tubular between inner casing portion and described outer part and be set to cover cartridge And support the plate portion of the tabular of described light emitting module, the linear expansion coefficient of cartridge and described outer part Difference, is abutted by the interarea in described inner casing portion with described plate portion, thus described radiator is by described frame Body supports.

According to the utility model, it is possible to realize the photograph possessing the radiator with desired heat dissipation characteristics Bright light source and lighting device etc..And the deterioration of radiator or framework can be suppressed.

Accompanying drawing explanation

The top of Fig. 1 is bowing of the radiator in the LED bulb involved by embodiment 1 and framework View, the sectional view of this LED bulb at the IB-IB line on the Shi Tu1 top, bottom of Fig. 1.

Fig. 2 is the exploded perspective view of the LED bulb involved by embodiment 1.

The top of Fig. 3 be the LED bulb involved by embodiment 1 top view (except enclosed globe shade and State beyond light-emitting component), the middle part of Fig. 3 shows unloads LED mould from shown in the top of Fig. 3 State after block (substrate), the bottom of Fig. 3 shows unloads radiator from shown in the middle part of Fig. 3 The state of (only framework) afterwards.

Fig. 4 A to Fig. 4 C is for the heat radiation in the LED bulb involved by making embodiment 1 is described The figure of the method for device.

Fig. 5 A is the sectional view of the radiator in the LED bulb involved by embodiment 1.

Fig. 5 B is the shape illustrating the radiator in the LED bulb involved by embodiment 1 and thermal resistance The figure of relation.

Fig. 6 is the sectional view of the LED bulb in comparative example.

The top of Fig. 7 be the radiator in the LED bulb involved by the variation of embodiment 1 and The top view of framework, the bottom of Fig. 7 is this LED bulb at the VIIB-VIIB line on the top of Fig. 7 Sectional view.

Fig. 8 is the sectional view of the LED bulb involved by embodiment 2.

Fig. 9 is the exploded perspective view of the LED bulb involved by embodiment 2.

Figure 10 is the summary sectional view of the lighting device involved by embodiment 3.

Symbol description:

1,1A, 1B LED bulb (illumination light source)；10LED module (light emitting module)；11 bases Plate；11n, 42n through hole；12 light-emitting components；20 enclosed globe shades；21 opening portions；30 drive electricity Road；31 circuit substrates；40 radiators；41 portions；42 plate portions；50 frameworks；51 inner casing portions； 51n protuberance；52 outer parts

Detailed description of the invention

(embodiment)

Hereinafter embodiment of the present utility model is illustrated.Further, the enforcement that will be discussed below Mode is a preferred object lesson of the present utility model.Therefore, shown in following embodiment Numerical value, shape, material, inscape, the allocation position of inscape and connected mode, work Sequence and process sequence etc. are an example, are not the restrictions carrying out the utility model.Therefore, In the inscape of following embodiment, for illustrating the only of upper concept of the present utility model The inscape being silent in vertical claim illustrates as arbitrary inscape.

Further, each figure is ideograph, the most rigorous diagram.Further, in each figure, for Constituting of being substantially the same gives identical symbol, and omits repeat specification or carry out simplifying explanation.

In the following embodiments, as an example of illumination light source, to lamp-bulb type fluorescent lamp Or the LED (LED bulb) of the bulb-shaped of the substitute of incandescent lamp illustrates.

(embodiment 1)

[all compositions of LED bulb]

First, complete to the LED bulb 1 involved by embodiment 1 of Fig. 1, Fig. 2 and Fig. 3 is utilized Body composition illustrates.

The top of Fig. 1 is the radiator 40 in the LED bulb 1 involved by embodiment 1 and framework The top view of 50, the bottom of Fig. 1 is cutting of this LED bulb 1 at the IB-IB line on the top of Fig. 1 Face figure.Fig. 2 is the exploded perspective view of the LED bulb 1 involved by embodiment 1.The top of Fig. 3 It is that the top view of LED bulb 1 involved by embodiment is (except enclosed globe shade 20 and light-emitting component 12 State in addition), the middle part of Fig. 3 shows unloads LED module 10 (base from shown in the top of Fig. 3 Plate 11) after state, the bottom of Fig. 3 shows unloads radiator 40 from shown in the middle part of Fig. 3 After state (the only state of framework 50).Further, the middle part of Fig. 3 is identical with shown in the top of Fig. 1.

Further, in the bottom of Fig. 1, the chain-dotted line that the above-below direction along paper is drawn represents LED The central shaft J of bubble 1.In the present embodiment, central shaft J is the optical axis (lamp axle) of LED bulb 1, Consistent with the axle of enclosed globe shade 20 (enclosed globe shade axle).Further, central shaft J is LED bulb 1 to be pacified Install to become during the lamp socket of ligthing paraphernalia (not shown) axle of pivot, with the rotary shaft of lamp holder 60 Unanimously.Further, the drive circuit 30 shown in the bottom of Fig. 1 not represents the IB-IB on top of Fig. 1 Cutting plane at line.

As shown in the bottom of Fig. 1 and Fig. 2, LED bulb 1 possesses: LED module 10, cover LED The enclosed globe shade 20 of module 10, for making the drive circuit 30 of LED module 10 luminescence and surrounding drive The radiator 40 of dynamic circuit 30.LED bulb 1 is also equipped with: surround drive circuit 30 framework 50, Lamp holder 60, lead-in wire 71 to 74, screw 81 and 82.

In the present embodiment, LED bulb 1 is constituted periphery by enclosed globe shade 20, framework 50, lamp holder 60 Device.

Referring to Fig. 1 and Fig. 2, each component parts of LED bulb 1 is described in detail.

[LED module]

LED module 10 is the light-emitting device (light emitting module) of the light of the color (wavelength) releasing regulation. LED module 10 is such as configured to release white light.

LED module 10 is configured in the inside of enclosed globe shade 20, drive circuit 30 electric power supplied comes Luminous.

As shown in the bottom of Fig. 1, LED module 10 is fixed on radiator 40.Specifically, LED Module 10 is fixed on the plate portion 42 of radiator 40.LED module 10 has substrate 11 and is joined Put the light-emitting component 12 at substrate 11.

Substrate 11 is the installation base plate for installing light-emitting component 12.Substrate 11 is big when e.g. overlooking Cause as circular plate-like substrate.

As shown in the bottom of Fig. 1 and the middle part of Fig. 3, the central portion at substrate 11 is provided with through hole 11a, for making pair of lead wires 71 and 72 break-through derived from drive circuit 30.Further, through The position of hole 11a may not be the central portion of substrate 11.Further, can not also set at substrate 11 Put through hole 11a, and incised notch portion, pair of lead wires 71 and 72 are set at the edge part etc. of substrate 11 This incised notch portion of break-through and be connected with the pair of electrodes terminal of substrate 11.

Further, spiral shell radiator 40 being fixed for collecting it is provided with framework 50 at substrate 11 The through hole 11b of the head of screw of nail 81.In the present embodiment, due to radiator 40 and framework 50 Fixed by two screws 81, be therefore provided with two through hole 11b.Further, through hole 11b ratio Through hole 11c is big.

Further, substrate 11 is provided with the through hole 11c for making screw 82 break-through, this screw 82 For substrate 11 and radiator 40 are fixed.The plate portion 42 of substrate 11 and radiator 40 is logical Cross the screw hole 42c that break-through is screwed into radiator 40 in the screw 82 (with reference to Fig. 2) of through hole 11c And fixed.In the present embodiment, through hole 11c is provided with two, substrate 11 and plate portion 42 Fixed by two screws 82.Further, substrate 11 and the fixing means of radiator 40 are not by screw Fixing limited, it would however also be possible to employ other the fixing means such as sticker.

The gold obtained for example with the material based on the metals such as aluminium is coated with dielectric film as substrate 11 The ceramic substrate belonging to the ceramic sintered bodies such as basal substrate, aluminum oxide or the resin being made up of resin material Substrate etc..Further, the shape of substrate 11 is not limited by circle, it would however also be possible to employ rectangular-shaped substrate such as grade.

In surface configuration pair of electrodes terminal (not shown) of substrate 11, using as power supply.? Each of pair of electrodes terminal, connects and has the pair of lead wires 71 and 72 derived from drive circuit 30. Further, on the surface of substrate 11, for electrode terminal is electrically connected with multiple light-emitting components 12 Metal line (not shown) be formed the pattern of regulation shape.

Light-emitting component 12 has been mounted multiple on a face of substrate 11.In the present embodiment, Multiple light-emitting components 12 are configured on the circumference centered by central shaft J, in circular row.And And, it is mounted with multiple light-emitting component 12, but, light-emitting component 12 as an example in fig. 2 Installation number can also be one.

Light-emitting component 12 in present embodiment is that (SMD:Surface is installed on the surface of being respectively encapsulated Mount Device) LED element of type, as shown in the bottom of Fig. 1, possess: container (packaging body) 12a, it is installed to LED chip 12b in container 12a and to LED as installing for the first time The seal member 12c that chip 12b is packaged.The light-emitting component 12 of the LED element of SMD type, as Second time is installed and is installed to substrate 11.

Container 12a is the device for ceramic shaped products of resin forming product or the white being made up of white resin, has The recess (cavity) of rounding frustum shape.Recess is configured to medial surface, with will be from LED core The light of sheet 12b is reflected towards top.

LED chip 12b is installed in the bottom surface of the recess of container 12a.LED chip 12b is by specifying Direct current carry out an example of luminous semiconductor light-emitting elements, be the naked core sending monochromatic visible light Sheet.LED chip 12b e.g. sends the blue LED die of blue light when energising.

Seal member 12c is the insulative resin material that silicones etc. has light transmission.Present embodiment In seal member 12c contain fluorophor, this fluorophor is the ripple to the light from LED chip 12b The wavelength shifter of progress line translation.That is, seal member 12c is containing fluorescence in translucent resin Body containing fluorophor resin, by the wavelength (face that the optical wavelength conversion from LED chip 12b is regulation Discoloration is changed).Seal member 12c is filled into the recess of container 12a.

As seal member 12c, such as in the case of LED chip 12b is blue led, for terrible To white light, and use and the yellow fluorophor particle that YAG (yttrium-aluminium-garnet) is is distributed to silicones Containing fluorophor resin.Accordingly, yellow fluorophor particle is by the blue light excitation of blue LED die Release sodium yellow, thus, as the synthesis of energized sodium yellow Yu the blue light of blue LED die Light, and release white light from seal member 12c.Further, seal member 12c can also contain silica Deng photodiffusion material.

The multiple light-emitting components 12 constituted as above are such as connected in series, by passing through pair of lead wires 71 and 72 and from drive circuit 30 supply direct current come luminous.Further, multiple light-emitting components 12 Connected mode (be connected in series, be connected in parallel and be connected in series and be connected with the combination being connected in parallel Deng) there is no special restriction.

[enclosed globe shade]

As shown in the bottom of Fig. 1, enclosed globe shade 20 is the translucent cover parts covering LED module 10, It is configured to the light by LED module 10 is released extract outside lamp.That is, enclosed globe shade 20 is incided The light transmission enclosed globe shade 20 of LED module 10 of inner surface, and be extracted to the outside of enclosed globe shade 20.

Enclosed globe shade 20 is the hollow part with opening portion 21, and is and opening portion 21 opposite side Top seal the most spherical.As it is shown in figure 1, enclosed globe shade 20 e.g. using central shaft J as rotation The rotary body of the hollow of rotating shaft, it is shaped as opening portion 21 and reduces.

Enclosed globe shade 20 is fixed on the opening portion of the enclosed globe shade side of framework 50.In the present embodiment, Set on the end of the opening portion that the opening portion 21 of enclosed globe shade 20 is configured in the outer part 52 of framework 50 The recess (stage portion) put, by the stickers such as silicones, the opening portion 21 of enclosed globe shade 20 and framework The outer part 52 of 50 is fixed together.

Material as enclosed globe shade 20, it is possible to using visible ray is the glass materials such as transparent fused silica The light transmission of the composition such as material or the resin material such as acrylic resin (PMMA), polycarbonate (PC) Material.

Preferably, enclosed globe shade 20 is carried out at the diffusion that the light for making LED module 10 release spreads Reason.Such as, by forming optical diffusion film (light diffusion layer) at the inner surface of enclosed globe shade 20 or outer surface, So that enclosed globe shade 20 has light diffusion function.

Specifically, by by the resin containing the photodiffusion material such as silica or calcium carbonate or Chinese white Etc. the inner surface or the outer surface that fill enclosed globe shade 20 such that it is able to form milky optical diffusion film.Or Person, by forming multiple light diffusion point or small depression at enclosed globe shade 20, makes enclosed globe shade 20 have There is light diffusion function.So, by making enclosed globe shade 20 have light diffusion function such that it is able to make from LED Module 10 incides the light diffusion of enclosed globe shade 20, and realizes big light distribution angle.

Alternatively, it is also possible to do not make enclosed globe shade 20 have light diffusion function, and can use and can visually arrive The transparent enclosed globe shade 20 of internal LED module 10.Further, the shape of enclosed globe shade 20 can also be Ellipsoid of revolution or oblate spheroid, and, it is also possible to it is according to as general bulb-shaped A type lamp The shape of bubble.

[drive circuit]

Drive circuit 30 is for driving the power circuit of LED module 10 (power subsystem), will be used for Make the power supply of LED module 10 (light-emitting component 12) luminescence to LED module 10.Under Fig. 1 Shown in portion, the friendship that drive circuit 30 such as will supply from lamp holder 60 via pair of lead wires 73 and 74 Stream electricity is converted to direct current, and by pair of lead wires 71 and 72, this direct current is supplied to LED mould Block 10.By the direct current supplied from drive circuit 30 (lamp circuit), make LED module 10 ( Optical element 12) lighting or turn off the light.

Drive circuit 30 possesses circuit substrate 31 and is installed in multiple electricity of this circuit substrate 31 Subassembly (not shown).Drive circuit 30 is configured between LED module 10 and lamp holder 60.Tool For body, drive circuit 30 is incorporated in the inner casing portion 51 of framework 50, is fixed by screw, glues Or locking etc. and be fixed on inner casing portion 51.

Circuit substrate 31 is that the upper pattern in face (solder side) in side is formed with the metal lines such as Copper Foil Printed circuit board (PCB) (PCB).It is installed in multiple electronic units of circuit substrate 31 by being formed on electricity The metal line of base board 31 is electrically connected to each other.Circuit substrate 31 is such as with the master of this circuit substrate 31 State (longitudinal) that face is almost parallel with central shaft J and be configured.Further, circuit substrate 31 is not Limited by longitudinal, it is also possible to (horizontal with the state that the interarea of this circuit substrate 31 is substantially vertical with central shaft J Put) and be configured.Further, metal line may not be the side being made only in circuit substrate 31 On face (unilateral), but the two-sided of circuit substrate 31 can be formed at.That is, circuit substrate 31 is also It can be double-sided wiring board.

The electronic unit being installed in circuit substrate 31 is the multiple electricity for making LED module 10 lighting The resistive elements such as circuit component, the e.g. capacity cell such as electrolytic capacitor, ceramic capacitor, resistor, Convertor circuit element, coil part, choking-winding (choke transformer), noise filter, diode Or the semiconductor element etc. such as integrated circuit component.

The drive circuit 30 with this composition is incorporated in the framework 50 being made up of dielectric resin material Inner casing portion 51, to guarantee insulating properties.Further, drive circuit 30 can also combine light adjusting circuit Or booster circuit etc..

Drive circuit 30 is electrically connected by pair of lead wires 71 and 72 with LED module 10.Further, drive Dynamic circuit 30 is electrically connected by pair of lead wires 73 and 74 with lamp holder 60.These four lead-in wire 71～74 examples Alloyed copper lead-in wire in this way, is made up of the heart yearn of alloyed copper and the resin-coated of insulating properties being coated with this heart yearn.

Direct current is supplied to LED module 10 from drive circuit 30 by pair of lead wires 71 and 72 Electric wire.Such as, lead-in wire 71 is high-pressure side output sub-line, and lead-in wire 72 is low-pressure side output sub-line. Lead-in wire 71 and 72 break-through are arranged on the through hole of radiator 40 and are arranged on LED module 10 Through hole, be connected to the substrate 11 of LED module 10.Further, lead-in wire 71 and 72 and LED The connection of module 10 (substrate 11), lead-in wire 71 and 72 and drive circuit (circuit substrate 31) Connect, e.g. connector connection or welding etc..

Further, lead-in wire 73 and 74 is for alternating current is supplied to drive circuit 30 from lamp holder 60 Electric wire.Lead-in wire 73 is connected to the shell portion 61 of lamp holder 60.Lead-in wire 74 is connected to the contact of lamp holder 60 Portion 63.

[radiator]

The thermal component that the heat that LED module 10 is mainly produced by radiator 40 is dispelled the heat, with LED Module 10 thermocouple.Therefore, in order to the heat produced LED module 10 efficiently is dispelled the heat, Thus radiator 40 can be made up of the material that the pyroconductivity such as metal or high thermal conductive resin is high.This reality The radiator 40 executed in mode is made up of aluminium.Further, drive circuit 30 can also be produced by radiator 40 Raw heat is dispelled the heat.

Further, radiator 40 also serves as working for the supporting parts of support LED module 10. Specifically, as shown in the bottom of Fig. 1, LED module 10 is fixed on radiator 40.

Radiator 40 is configured in the way of surrounding drive circuit 30.Specifically, radiator 40 Drive circuit 30 is surrounded by the inner casing portion 51 of framework 50.Further, radiator 40 is at central shaft J Direction of principal axis on, be configured between LED module 10 and lamp holder 60.

Radiator 40 is slightly bottom tube-like parts, has the cylinder portion 41 of tubular and to cover a portion The mode of 41 and the plate portion (cap) 42 that is set, and this plate portion (cap) 42 supporting LED mould Block 10.

Cylinder portion 41 is the first heat-conducting plate of the cylinder constituting radiator 40.Cylinder portion 41 is configured to surround Drive circuit 30.In the present embodiment, cylinder portion 41 is configured to surround the inner casing portion 51 of framework 50, Drive circuit 30 is surrounded by the inner casing portion 51 of framework 50.That is, cylinder portion 41 is positioned at framework 50 Between inner casing portion 51 and outer part 52.The inner surface in cylinder portion 41 is relative with the outer surface in inner casing portion 51, The outer surface in cylinder portion 41 is relative with the inner surface of outer part 52.Cylinder portion 41 has and outer part 52 The corresponding shape of inner surface.

Cylinder portion 41 is as the cylindric metal parts of cylinder axle using central shaft J, as an example, Constituted by having certain thickness metallic plate.Specifically, cylinder portion 41 has diameter and fixes and at center The straight wall portion (the first cylindrical portion) of straight wall shape extended on the direction of axle J and relative to center Axle J and be inclined by the tapered portion (the second cylindrical portion) of cone-shaped constituted.

Plate portion 42 is second heat-conducting plate corresponding with the bottom of the radiator 40 having bottomless drum shape shape.Plate Portion 42 is the plate-shaped member that interarea is substantially orthogonal with central shaft J, e.g. using central shaft J as center Profile be circular discoideus.The metallic plate that plate portion 42 is e.g. circular.

In the present embodiment, plate portion 42 is the mounting portion of mounting LED module 10, plays module board Effect.LED module 10 is placed in the face (the first interarea) of enclosed globe shade 20 side in plate portion 42 On, and it is fixed on plate portion 42.

Further, the end of enclosed globe shade 20 side in the inner casing portion 51 of framework 50, it is connected to plate portion 42 Lamp holder 60 side face (the second interarea) on.That is, radiator 40 is connected to by inner casing portion 51 Second interarea in plate portion 42, and supported by framework 50.Specifically, radiator 40 is with LED module 10 states being fixed on this radiator 40, and supported by the inner casing portion 51 of framework 50.

In the present embodiment, radiator 40 and framework 50 only with the enclosed globe shade 20 in inner casing portion 51 The opening portion of side contacts with second interarea in plate portion 42, and the opening portion of lamp holder 60 side in cylinder portion 41 is with interior The bottom linking portion of shell portion 51 and outer part 52 does not contacts.That is, lamp holder 60 side in cylinder portion 41 Opening portion be open end.

As shown in the top of Fig. 1, the top of Fig. 2 and Fig. 3, plate portion 42 is provided with through hole 42a, For making pair of lead wires 71 and 72 break-through derived from drive circuit 30.Through hole 42a is set In the position relative with the through hole 11a of substrate 11.Therefore, in the present embodiment, through hole 42a It is arranged on the central portion in plate portion 42.Further, the position of through hole 42a may not be plate portion 42 Central portion.

Further, plate portion 42 is provided with the through hole for being fixed radiator 40 with framework 50 42b.Through hole 42b is arranged on the position relative with the screw hole 51b of framework 50, and screw 81 is worn Logical through hole 42b.That is, plate portion 42 and framework 50 is consolidated by the screw 81 of break-through through hole 42b Fixed.

Further, plate portion 42 is provided with the spiral shell for being fixed radiator 40 with LED module 10 Nail 42c.Screw hole 42c is arranged on the position corresponding with the through hole 11c of substrate 11, screw 82 (Fig. 2 references) are screwed into this screw hole 42c.That is, plate portion 42 passes through break-through in passing through with substrate 11 The screw 82 of through hole 11c is screwed into screw hole 42c and is fixed.Further, screw hole 42c also may be used To be the through hole of screw 82 break-through.

At radiator 40, the ratio of the high barrel dliameter relative to cylinder portion 41 of cylinder in cylinder portion 41 is below 1.1. In the present embodiment, the barrel dliameter in cylinder portion 41 is to load the portion that the plate portion 42 of LED module 10 is connected The barrel dliameter in the cylinder portion 41 (straight wall portion) in Fen, the cylinder in cylinder portion 41 is high is the plate portion 42 from cylinder portion 41 Length to the opening portion (end of lamp holder 60 side of tapered portion) in cylinder portion 41.

The radiator 40 of above-mentioned this composition is metal stamping product, such as by aluminium sheet etc. Metallic plate carries out punch process and shapes.That is, cylinder portion 41 is integrally formed with plate portion 42, by right Metallic plate carries out the punch process etc. such as processing that press, and forms the shape of regulation.Radiator 40 such as can Enough made by the method shown in Fig. 4 A to Fig. 4 C.Fig. 4 A to Fig. 4 C is for reality is described Execute the figure of the preparation method of radiator in the LED bulb 1 involved by mode 1.

First, as shown in the top of Fig. 4, prepare the flat metallic plate 40M such as aluminium sheet.Then, as Shown in the middle part of Fig. 4, by metallic plate 40M being carried out deep placement pressure processing, thus metallic plate 40M quilt It is processed into bottomless drum shape shape.Then, as shown in the bottom of Fig. 4, in order to make opening footpath diminish, and right Opening carries out pressure processing.At this point it is possible to as required, the redundance that pressure processing is generated Cut away.Hereby it is possible to making has the cylinder portion 41 of tubular and the radiator 40 in the plate portion 42 of tabular. Further, through hole 42a and 42b and screw hole 42c in plate portion 42 can also be in the top of Fig. 4 institute It is pre-formed during the state of the metallic plate shown, it is also possible in the manufacturing procedure shown in the bottom of Fig. 4 later Formed.

[framework]

As shown in the bottom of Fig. 1, framework 50, on the direction of central shaft J, is configured in enclosed globe shade 20 And between lamp holder 60.Framework 50 is double-wall structure, has tubular interior surrounding drive circuit 30 Shell portion (the first frame) 51 and surround the outer part (the second frame) of tubular in inner casing portion 51 52.Inner casing portion 51 and outer part 52 are connected to each other in the bottom of lamp holder 60.

Inner casing portion 51 is the cylinder (inner core) of the inboard portion constituting framework 50, directly surrounds driving electricity Road 30.Therefore, work as the circuit case of protection drive circuit 30 in inner casing portion 51.Further, The structure for the circuit substrate 31 of drive circuit 30 is fixed it is provided with in inner casing portion 51.That is, Inner casing portion 51 also functions to keep the effect of the maintaining part (retainer) of drive circuit 30.

The summary drum that inner casing portion 51 is e.g. extended on the direction of central shaft J and is formed. Inner casing portion 51 is configured to, across the cylinder portion of radiator 40 between this inner casing portion 51 and outer part 52 41.Therefore, the outer surface in inner casing portion 51 is relative with the inner surface in cylinder portion 41.Further, inner casing portion 51 And there is space (space) between cylinder portion 41.

Inner casing portion 51 is connected to second interarea in the plate portion 42 of radiator 40.Dissipating in inner casing portion 51 The opening portion of hot device 40 is the part that the second interarea with plate portion 42 abuts.Framework 50 is by inner casing portion 51 the second interareas being connected to plate portion 42, carry out supporting radiator 40.In the present embodiment, plate portion 42 are pressed from both sides by the end of the opening portion in the inner casing portion 51 in framework 50 and the plate portion 42 of radiator 40 Hold.

Inner casing portion 51 has the screw part 51a screwed togather with lamp holder 60.Lamp holder 60 is screwed into screw part 51a. Screw part 51a is formed on the part extended to lamp holder 60 side in inner casing portion 51.

As shown in the bottom of Fig. 1, the bottom of Fig. 2 and Fig. 3, it is provided with for making in inner casing portion 51 The screw hole 51b that screw 81 is screwed into, to carry out solid to this inner casing portion 51 with the plate portion 42 of radiator 40 Fixed.The screw 81 of the through hole 42b in break-through plate portion 42 is screwed into screw hole 51b.

Outer part 52 is the cylinder (urceolus) of the Outboard Sections constituting framework 50, such as the bottom institute of Fig. 1 Show, indirectly surround drive circuit 30.Specifically, outer part 52 is configured to, and is trapped among driving Circuit 30 carries out the cylinder portion 41 of the radiator 40 of corral around.Therefore, the interior table of outer part 52 Face is relative with the outer surface in cylinder portion 41.The inner surface configuration of outer part 52 is the surface shape with cylinder portion 41 The shape that shape is corresponding.

Outer part 52 is to expose the exposed division at outside (extraneous air), constitutes outside LED bulb 1 Enclose parts.Therefore, the outer surface of outer part 52 is exposed to outside.

The summary cylindrical shape that outer part 52 is e.g. extended on the direction of central shaft J and is formed Shape.Further, the inner peripheral surface of outer part 52 and outer peripheral face are taper surface (inclined plane), are configured to Tilt relative to central shaft J.

Between outer part 52 and cylinder portion 41, it is provided with gap, thus there is space (space).That is, The face that outer part 52 is configured to each other with cylinder portion 41 does not contacts.Accordingly, though radiator 40 (cylinder Portion 41) there is thermal expansion or thermal contraction, because of radiator 40 and framework with framework 50 (outer part 52) Stress produced by the linear expansion coefficient difference of 50 and the thermal expansion difference that causes or thermal contraction difference, it is also possible to by Space between outer part 52 and cylinder portion 41 absorbs.As an example, outer part 52 and cylinder portion Space between 41 is almost fixed.Further, outer part 52 can also contact with cylinder portion 41.

The framework 50 with this composition is one-body molded by resin.That is, inner casing portion 51 and outer part 52 is one-body molded, and framework 50 is the integrally formed product formed by resin.In such manner, it is possible to cheap Cost makes framework 50 simply.Framework 50 such as can be by polybutylene terephthalate (PBT) Constitute Deng insulative resin material.

[lamp holder]

Lamp holder 60 is for making luminous being subject to of LED module 10 (light-emitting component 12) from the outside acceptance of lamp Electricity portion.Lamp holder 60 for example, be mounted at the lamp socket of ligthing paraphernalia.Accordingly, lamp holder 60 makes LED When steeping 1 lighting, it is possible to accept electric power from the lamp socket of ligthing paraphernalia.

The alternating current from source power supply such as it is supplied with at lamp holder 60.Lamp holder in present embodiment 60 accept alternating current by two contacts, lamp holder 60 accept electric power by pair of lead wires 73 with And 74 and be imported into drive circuit 30.

Lamp holder 60 is metal to have bottomless drum shape shape, as shown in the bottom of Fig. 1, possesses outer peripheral face for outward The shell portion 61 of screw thread and be installed to the contact portion 63 in shell portion 61 by insulation division 62.Insulation division 62 are such as made up of cullet.

Outer peripheral face at lamp holder 60 is formed with the screw part for screwing togather with the lamp socket of ligthing paraphernalia.Further, Inner peripheral surface at lamp holder 60 is formed for screwing togather with the screw part 51a in the inner casing portion 51 of framework 50 Screw part.Lamp holder 60 is embedded into by being screwed into the screw part 51a in this inner casing portion 51, thus It is embedded in outward framework 50 (inner casing portion 51).

The kind of lamp holder 60 does not has special restriction, uses Edison of screw-in in the present embodiment The lamp holder of screw thread shape (E type).Such as, as lamp holder 60 can list E26 shape, E17 shape or E16 shape etc..Further, lamp holder 60 can also use plug-in type.

[effect etc.]

Then, the effect of the LED bulb 1 involved by present embodiment is illustrated.

First, utilize Fig. 5 A and Fig. 5 B to dissipating in the LED bulb 1 involved by present embodiment The effect of hot device 40 illustrates.Fig. 5 A is dissipating in the LED bulb 1 involved by embodiment 1 The sectional view of hot device 40, Fig. 5 B shows the shape of this radiator 40 and the relation of thermal resistance.Further, Thermal resistance (DEG C/W) is represented in figure 5b with relative value.

It is said that in general, the size of LED bulb or profile are determined the most, the therefore shape of radiator Or size etc. is restricted.Therefore, can not only easily carry out the heat dissipation design of radiator, and Can easily make the radiator with desired heat dissipation characteristics.

Therefore, invention personnel of the present utility model are to the shape of radiator 40 (diameter and height) and heat The relation of resistance is tested.Specifically, as shown in Figure 5A, by the cylinder portion 41 in radiator 40 Barrel dliameter (diameter of radiator 40) as φ, by high for the cylinder in cylinder portion 41 (height of radiator) As h, the thermal resistance (DEG C/W) of radiator 40 and the height h of radiator 40 are investigated relative to dissipating The relation of the ratio (h/ φ) of the diameter phi of hot device 40.Its result is as shown in Figure 5 B.Further, at figure 5B shows the situation that diameter phi is 45mm of radiator and the experimental result of the situation of 50mm.

According to this experimental result, knowable to shown in Fig. 5 B, the thermal resistance of radiator 40 (DEG C/W) interdependent In the height h of radiator 40 relative to the ratio (h/ φ) of the diameter phi of radiator 40.Specifically, The height h of radiator is the biggest relative to the ratio of the diameter phi of radiator 40 (h/ φ), and thermal resistance is more Little.

Such as, in the case of the diameter phi of radiator 40 is fixing, by making the height of radiator 40 H increases such that it is able to strengthen the height h ratio relative to the diameter phi of radiator 40 of radiator 40 (h/φ).In the radiator 40 of present embodiment, the height h of radiator 40 is being adjusted Time, such as can by the length of the straight wall portion in cylinder portion 41 (the first cylindrical portion) is adjusted, or The length of the tapered portion (the second cylindrical portion) in cylinder portion 41 be could be adjusted to realize by person.

And, knowable to shown in Fig. 5 B, and though the diameter phi of radiator 40 be the situation of 45mm also It is the situation of 50mm, when the height h of radiator is relative to the ratio (h/ φ) of the diameter phi of radiator 40 When reaching 1.1, thermal resistance almost keeps fixing.No matter it is to say, the diameter phi of radiator 40 Size how, when the height h of radiator 40 is relative to the ratio (h/ φ) of the diameter phi of radiator 40 During more than 1.1, the effect of the heat dispersion of radiator 40 also will not raise.

Therefore, for the radiator 40 being made up of cylinder portion 41 and plate portion 42, radiator 40 can be made Height h be set in less than 1.1 relative to the ratio (h/ φ) of the diameter phi of radiator 40.

Such as, by making the height h of radiator 40 reduce or make the diameter phi of radiator 40 increase, It is thus possible to easily make the height h ratio relative to the diameter phi of radiator 40 of radiator 40 (h/ φ) becomes less than 1.1.

Further, the barrel dliameter (diameter of radiator 40) in cylinder portion 41 becomes the maximum outside diameter in a portion 41. Such as, cylinder portion 41 is then for diameter in the case of cylinder, in the case of cylinder portion 41 is for angle cylinder is then Maximum outside diameter, is then cornerwise length in the case of quadrangular barrel.Further, in the plate portion of radiator 40 In the case of the outer peripheral portion of 42 forms step, the barrel dliameter in cylinder portion 41 then becomes external diameter.Further, exist In the case of difference occurs in the height local of radiator 40, the height h of radiator 40 is then mean height Degree.

Then, utilize Fig. 6 to during thermal expansion in the LED bulb 1 involved by present embodiment or heat Effect during contraction illustrates.Fig. 6 is the sectional view of the LED bulb 100 in comparative example.

As shown in Figure 6, in the LED bulb 100 of comparative example, be equivalent to the heat radiation having bottomless drum shape shape The plate portion (cap) 420 of the bottom of device 400, by being pressed from both sides with peripheral framework 520 by circuit case 510 Hold, fix radiator 40.Radiator 400 is made up of metals such as aluminium.Further, circuit case 510 And periphery framework 520 is made up of resins such as PBT.

When LED bulb 100 lighting, because of LED module produce heat, and can cause radiator 400, Circuit case 500 and peripheral framework 520 expanded by heating (volumetric expansion).Now, resin and metal Compare, owing to the thermal coefficient of expansion (linear expansion coefficient) of resin is higher several times than metal, therefore, tree The circuit case 500 (peripheral framework 520) of fat is bigger than the coefficient of thermal expansion of metal radiator 400. So, due to resinous circuit case 500 (peripheral framework 520) and metal radiator 400 Coefficient of thermal expansion different, there is thermal expansion rate variance the most between the two.

In this case, as shown in Figure 6, if the plate portion 420 of radiator 400 is by circuit case 510 Clamp with peripheral framework 520, then because of this thermal expansion rate variance, resinous circuit case 500 (external surrounding frame Body 520) on be there is stress deformation, then by the extruding when thermal expansion of the metal radiator 400 Have the situation producing crack.Specifically, due to the central shaft (lamp axle) of LED bulb 100 The extruding of the thermal expansion on direction of principal axis, thus produce on circuit case 500 and peripheral framework 520 Crack etc..On the contrary, when LED bulb 100 cools down, because of radiator 400 and circuit case 510 The thermal contraction of (peripheral framework 520) is poor, also has generation at circuit case 510 (peripheral framework 520) The situations such as crack.When occurring when crack at circuit case 500 and peripheral framework 520, meeting Reduce insulating properties.

It addition, as shown in the bottom of Fig. 1, in the LED bulb 1 of present embodiment, pass through inner casing Portion 51 is connected to second interarea in plate portion 42, thus radiator 40 is supported by framework 50.Concrete and Speech, the contact portion of radiator 40 and framework 50 is only the enclosed globe shade 20 in plate portion 42 and inner casing portion 51 The part that the opening portion of side abuts, radiator 40 with the state propped up by inner casing portion 51 by framework 50 Supporting.That is, the opening portion of lamp holder 60 side in the cylinder portion 41 of radiator 40 and inner casing portion 51 and The part that the bottom of outer part 52 is connected to each other does not contacts, and is formed with space.

Accordingly, when linear expansion coefficient radiator different from each other 40 and framework 50 expand, due to inner casing Portion 51 is the structure extended on the direction of principal axis of central shaft J, and therefore, inner casing portion 51 is so that dispelling the heat The mode of device 40 movement above the paper of Fig. 1 and extend on this direction of principal axis.In this case, About radiator 40 and framework 50, the opening portion of enclosed globe shade 20 side in inner casing portion 51 is connected to plate portion Second interarea of 42.That is, radiator 40 only abuts with framework 50 on the direction of principal axis of central shaft J.

Therefore, even if radiator 40 and framework 50 thermal expansion, also will not occur because of metal in framework 50 The extruding that produces when thermal expansion of radiator 40 of system and the stress deformation that causes such that it is able to suppression exists Crack etc. is produced in framework 50.Equally, even if in radiator 40 and framework 50 thermal contraction, it is also possible to Suppress in framework 50, to produce crack etc. because of the thermal contraction of radiator 40 and framework 50 difference.

Further, in the LED bulb 100 of the structure shown in Fig. 6, in order to avoid because of linear expansion coefficient Differ from and produce the problems such as crack, also to consider the thermal expansion of peripheral framework 520 and radiator 40.Further, In LED bulb 1 in the present embodiment, due to lamp holder 60 side in the cylinder portion 41 of radiator 40 Opening portion part connected to each other with the bottom in inner casing portion 51 and outer part 52 do not contact, therefore, Need not consider that radiator 40 is poor with the linear expansion coefficient of framework 50.I.e., it is possible to realize not expanded by heating And thermal contraction impact radiator 40 and the structure of framework 50.

Further, in the present embodiment, the linear expansion coefficient of radiator 40 expands with the line of framework 50 Coefficient is different.That is, the linear expansion coefficient in cylinder portion 41 and plate portion 42 and inner casing portion 51 and outer part The linear expansion coefficient of 52 is different.

[summary]

By the LED bulb 1 involved by above-described present embodiment, it is possible to make radiator 40 Highly h is relative to the ratio (h/ φ) of the diameter phi of the radiator 40 being made up of cylinder portion 41 and plate portion 42 Below 1.1.

Accordingly, owing to the ratio of the diameter phi with radiator 40 and the height h of radiator 40 can be obtained (h/ φ) corresponding thermal resistance, therefore, it is possible to realize possessing the radiator with desired heat dissipation characteristics LED bulb.

Further, in the present embodiment, radiator 40 is the punch process product of metallic plate.

Accordingly, due to can be by making, therefore cylinder portion 41 is integrally formed with plate portion 42 Can inexpensively and simply realize radiator 40.Therefore, it is possible to expect that cost reduces significantly.

Further, in the present embodiment, be also equipped with surrounding the tubular of drive circuit 30 inner casing portion 51, And there is the framework 50 of the outer part 52 of the tubular surrounding inner casing portion 51, the cylinder portion of radiator 40 41 are configured between the inner casing portion 51 of framework 50 and outer part 52.

Accordingly, i.e. it is capable of good heat dissipation characteristics and is capable of again good insulating properties.

Further, in the present embodiment, the outer part 52 of the cylinder portion 41 of radiator 40 and framework 50 Linear expansion coefficient different, the shape in cylinder portion 41 is corresponding to the shape of the inner surface of outer part 52.And And, abutted by second interarea in the inner casing portion 51 of framework 50 with the plate portion 42 of radiator 40, from And radiator 40 is supported by framework 50.

Accordingly, the thermal expansion difference that produces because radiator 40 and the linear expansion coefficient difference of framework 50 and The stress that one side of thermal contraction difference and the radiator 40 that causes and framework 50 applies to the opposing party obtains Suppression.Therefore, it is possible to suppression radiator 40 and the deterioration of framework 50.Especially can suppress Resinous framework 50 produces crack etc..

And, constituted by this, it may not be necessary to consider the linear expansion coefficient of radiator 40 and framework 50 Difference, the height and position of radiator 40 can be by the length on the direction of principal axis of the central shaft J in inner casing portion 51 Degree is adjusted.Accordingly, owing to the height h of radiator 40 can be easily adjusted, therefore, it is possible to Easily make the height h of radiator 40 ratio (h/ φ) relative to the diameter phi of radiator 40 1.1 Below.Therefore, it is possible to easily make the radiator with desired heat dissipation characteristics.

Further, in the present embodiment, the second interarea with the plate portion 42 in inner casing portion 51 abuts Part is opening portion.

Hereby it is possible to come stably supporting radiator 40 by inner casing portion 51.

Further, in the present embodiment, framework 50 is integrally formed by resin, and radiator 40 is metal System.

Hereby it is possible to make radiator 40 and framework 50 simply with low cost.

Further, in the present embodiment, LED module 10 is fixed on the plate portion 42 of radiator 40.

Accordingly, owing to being required for the metallic plate for loading LED module 10, therefore, it is possible to reduce Use number of components, thus realize the LED bulb of low cost.It is additionally, since and makes LED module 10 straight Contact radiator 40, therefore, it is possible to be thermally conducted to radiator by what LED module 10 produced efficiently 40, thus realize the higher LED bulb of heat dissipation characteristics.

Further, in the present embodiment, although radiator 40 is fixed by screw 81 with framework 50, But, not it is limited by this.Such as, LED bulb 1A shown in the top of Fig. 7 and bottom, also Screw can not be used, and radiator 40 is fixed with framework 50.Specifically, Ke Yiru Shown in the bottom of Fig. 7, by arranging the same of stop hole 41a in the side in the cylinder portion 41 of radiator 40 Time, the outer part 52 in framework 50 arranges engagement pawl 52a protruded from inner surface, thus engagement pawl 52a is stuck in stop hole 41a, is fixed radiator 40 with framework 50.Such as, stop hole 41a and engagement pawl 52a, with central shaft J as axle, are equally spaced three in the circumferential.

(embodiment 2)

Then, utilize Fig. 8 and Fig. 9 that LED bulb 1B involved by embodiment 2 is illustrated. Fig. 8 is the sectional view of LED bulb 1B involved by embodiment 2.Fig. 9 is involved by embodiment 2 And the exploded perspective view of LED bulb 1B.

As shown in FIG. 8 and 9, LED bulb 1B involved by embodiment 2 and embodiment 1 Involved LED bulb 1 is identical, possesses: LED module 10, enclosed globe shade 20, radiator 40, frame Body 50 and lamp holder 60.Further, LED bulb 1B is also equipped with screw 83.

Further, although Fig. 8 and Fig. 9 is shown without drive circuit and lead-in wire, present embodiment In LED bulb 1B as embodiment 1, possess drive circuit 30 and lead-in wire 71～74.

Hereinafter, to illustrate centered by the difference of embodiment 1.

LED module 10, as embodiment 1, possesses substrate 11 and light-emitting component 12, in this reality Execute in mode, be formed with a through hole 11a, two through hole 11m and two at substrate 11 Through hole 11n.

Radiator 40 is identical with embodiment 1, has a portion 41 and plate portion 42, in present embodiment In, straight wall portion (the first cylindrical portion) it is not provided with in cylinder portion 41, cylinder portion 41 is only by tapered portion (second Cylindrical portion) constitute.That is, cylinder portion 41 is all cylinders for cone-shaped (circular cone shape).Further, A through hole 42a, two through hole 42m and two through hole 42n it are formed with in plate portion 42. Further, the peripheral end in plate portion 42 is provided with stage portion.

Framework 50 is identical with embodiment 1, has inner casing portion 51 and outer part 52, this embodiment party In formula, it is provided with two screw hole 51m and two protuberance 51n in inner casing portion 51.Each protuberance 51n from the end of the opening in inner casing portion 51 along the direction of central shaft J with bar-shaped protrusion.Protrude Portion 51n is inserted into the through hole 42n of the radiator 40 and through hole 11n of LED module 10.That is, Protuberance 51n plays the function of position determination section, to framework 50, radiator 40, LED module 10 Between relative position relation determine, two protuberance 51n are inserted into through hole 42n and pass through Through hole 11n, thus to framework 50, radiator 40, LED module 10 at transverse direction (with central shaft J Vertical direction) on movement limit, and also rotation is limited.

The through hole 11m of LED module 10 (substrate 11), the through hole of radiator 40 (plate portion 42) 42m, the screw hole 51m of framework 50 (inner casing portion 51) are arranged on the position of overlap when overlooking. Further, the through hole 11n of LED module 10 (substrate 11), radiator 40 (plate portion 42) through Hole 42n, the protuberance 51n of framework 50 (inner casing portion 51) are arranged on the position of overlap when overlooking.

LED module 10, radiator 40, framework 50 are fixed together by three screws 83.

Specifically, the substrate 11 of LED module 10, the plate portion 42 of radiator 40, framework 50 interior Shell portion 51, is screwed in the state in inner casing portion 51 and quilt with substrate 11 and plate portion 42 by two screws 83 It is fixed together.Screw 83 can be such as tapping screw, but is not limited by this.

In the case of LED module 10, radiator 40, framework 50 are combined, first, will Each of two protuberance 51n of framework 50 (inner casing portion 51) is inserted into radiator 40 (plate portion 42) each and two through holes of LED module 10 (substrate 11) of two through hole 42n Each of 11n.Then, two screws 83 are inserted respectively into the two of LED module 10 (substrate 11) Two through hole 42m's of each and the radiator 40 (plate portion 42) of individual through hole 11m is every One, each of two screws 83 is screwed into two screw holes of framework 50 (inner casing portion 51) Each of 51m.In such manner, it is possible to by LED module 10, radiator 40, framework 50 are carried out group Incompatible fixing.

Accordingly, about the method that LED module 10, radiator 40, framework 50 are fixed, In embodiment 1, two screws 81 radiator 40 is fixed with framework 50, and, by LED module 10 is fixed by two screws 82 with radiator 40, and in the present embodiment, by LED module 10, radiator 40, framework 50 are tightened fixing by two screws 83 together.

In LED bulb 1B of above-mentioned this composition as embodiment 1, make radiator 40 Highly h is relative to the ratio (h/ φ) of the diameter phi of the radiator 40 being made up of cylinder portion 41 and plate portion 42 It is less than 1.1.

Hereby it is possible to obtain the effect as embodiment 1.That is, owing to can obtain and heat radiation The thermal resistance that the ratio (h/ φ) of the diameter phi of device 40 and the height h of radiator 40 is corresponding, therefore can Enough LED bulb realizing possessing the radiator with desired heat dissipation characteristics.

Further, present embodiment is also as embodiment 1, and radiator 40 is that the punching press of metallic plate adds Work product.

Accordingly, due to can by making cylinder portion 41 is integrally formed with plate portion 42, accordingly, it is capable to Enough inexpensively and simply realize radiator 40.

Further, present embodiment is also as embodiment 1, and the cylinder portion 41 of radiator 40 is positioned at frame Between inner casing portion 51 and the outer part 52 of body 50.

Accordingly, can either expect that excellent heat dissipation characteristics can expect again excellent insulating properties.

Further, present embodiment, also as embodiment 1, is supported by the inner casing portion 51 of framework 50 It is connected to second interarea in the plate portion 42 of radiator 40, thus radiator 40 is supported by framework 50.

Hereby it is possible to the thermal expansion that suppression produces because of the linear expansion coefficient difference of radiator 40 with framework 50 Radiator 40 and a side of framework 50 that difference and thermal contraction difference are caused apply stress to the opposing party. Therefore, it is possible to suppression radiator 40 and the deterioration of framework 50.Enable in particular to suppression resinous Crack etc. is produced in framework 50.And it is possible to need not consider that radiator 40 expands with the line of framework 50 Coefficient difference, by being adjusted the inner casing portion 51 length on the direction of principal axis of central shaft J, it becomes possible to The height and position of radiator 40 is adjusted.

Further, different from embodiment 1 in the present embodiment, be provided with in inner casing portion 51 two convex Going out portion 51n, each break-through of the two protuberance 51n is in two through hole 11n of substrate 11 Each of two through hole 42n in each and plate portion 42.

Hereby it is possible to determine LED module 10, radiator 40, the position of framework 50 simply.And And, protuberance 51n, through hole 11n and through hole 42n may not be two, and can be three More than individual.And, although rotation can not be limited, but protuberance 51n, through hole 11n And through hole 42n can also be respectively one, in such manner, it is possible to limit LED module 10, radiator 40 and framework 50 movement in the transverse direction.Further, through hole 11m, through hole 42m and Screw 83 may not be respectively two.Further, in order to LED module, radiator 40, The structure (protuberance 51n, through hole 11n, through hole 42n) that the position of framework 50 carries out determining Configuration and LED module, radiator 40, framework are fixed structure (through hole 11m, Through hole 42m, screw 83) configuration, it is also possible to suitably change.

(embodiment 3)

[lighting device]

Figure 10 is the summary sectional view of the lighting device 2 involved by embodiment 3.

As shown in Figure 10, the lighting device 2 involved by present embodiment is such as installed to the sky of indoor Card uses.Lighting device 2 possess the above-mentioned LED bulb 1 involved by embodiment 1 and Ligthing paraphernalia 3.

Ligthing paraphernalia 3 makes LED bulb 1 turn off the light and lighting, possesses the utensil being installed in ceiling Main body 4 and the lampshade part 5 of covering LED bulb 1.

Appliance body 4 has the lamp socket 4a of the lamp holder 60 of mounted LED lamp bubble 1, and to LED bulb 1 It is powered.The lamp holder 60 of LED bulb 1 is screwed into lamp socket 4a, is supplied by lamp socket 4a electric power It is given to LED bulb 1.Further, light-passing board can also be set in the opening portion of lampshade part 5.

By the lighting device 2 involved by above-described present embodiment, have owing to being mounted with to possess The LED bulb 1 of the radiator 40 of desired heat dissipation characteristics, therefore, it is possible to realization has excellent The lighting device of luminance.And, it is also possible to replace LED bulb 1 and use embodiment 2 institute LED bulb 1A related to.

(other variation etc.)

Above according to embodiment and variation to the illumination light source involved by the utility model and Lighting device is illustrated, but the utility model not by above-mentioned embodiment and each become Shape example is limited.

Such as, in the above-described embodiment, although framework 50 is double-wall structure, but is not subject to This is limited.Such as, framework 50 can not also possess outer part 52, also may be used in the cylinder portion 41 of radiator 40 It is exposed to outside to be configured to the outer part of LED bulb.

Further, in the above-described embodiment, although light-emitting component 12 is SMD type LED element, no Cross and be not limited by this.For example, it is also possible to use bare chip to be directly mounted on substrate (for the first time Install) the LED module of COB (ChipOnBoard: chip on board) type.I.e., it would however also be possible to employ LED chip itself is come as light-emitting component 12.In this case, as seal member, can be right Multiple LED chip seal in the lump, it is also possible to seal respectively.Can also be containing above-mentioned in seal member Yellow fluorophor equiwavelength's coversion material.

Further, in the above-described embodiment, although light-emitting component 12 use by blue led core Sheet and yellow fluorophor and release the White LED element of the B-Y type of white light, but be not limited by this. Such as can also use containing red-emitting phosphors and green-emitting phosphor containing fluorophor resin, and pass through It is combined with blue LED die and releases the composition of white light.Further, in order to improve color rendering, also Yellow fluorophor can be added, or red-emitting phosphors and green-emitting phosphor can also be mixed into.Further, The LED chip of the light sending the color beyond blueness can also be used, such as, can use and compare blue led The UV LED chip of the ultraviolet light that the wavelength of blue light that chip is released is short, mainly by uv light induction, Thus from sending the blue emitting phophor of blue light, red light and green light, green-emitting phosphor and red Look fluorophor releases white light.

Further, in above-mentioned embodiment and each variation, exemplified as light-emitting component LED, but can use the semiconductor light-emitting elements such as semiconductor laser, organic EL (Electro Luminescence: electroluminescent) or the light-emitting component such as inorganic EL or other solid luminescence unit Part.

Further, perform for above-mentioned embodiment those skilled in the art it is conceivable that various The mode that obtains of deformation or without departing from the range of purport of the present utility model to above-mentioned enforcement The mode that inscape in mode and function at random combine and obtain is all contained in this practicality In novel.

Claims (9)

1. an illumination light source, it is characterised in that

This illumination light source possesses:

Light emitting module；

For making the drive circuit of described light emitting module luminescence；And

Surround the radiator of described drive circuit,

Cylinder portion that described radiator has tubular and the plate being set in the way of covering cartridge Portion, and the described light emitting module of this plate portion supporting,

The ratio of the high barrel dliameter relative to cartridge of cylinder of cartridge is below 1.1.

2. illumination light source as claimed in claim 1, it is characterised in that

Described radiator is the punch process product of metallic plate.

3. illumination light source as claimed in claim 1 or 2, it is characterised in that

This illumination light source is also equipped with framework, and this framework has tubular interior surrounding described drive circuit Shell portion and surround the outer part of tubular in described inner casing portion,

Cartridge is between described inner casing portion and described outer part.

4. illumination light source as claimed in claim 3, it is characterised in that

Cartridge is different from the linear expansion coefficient of described outer part, and, cartridge has and institute State the corresponding shape of inner surface of outer part,

Abutted by the interarea in described inner casing portion with described plate portion, thus described radiator is by described framework Supporting.

5. illumination light source as claimed in claim 4, it is characterised in that

The part that in described inner casing portion, interarea with described plate portion abuts is opening portion.

6. illumination light source as claimed in claim 4, it is characterised in that

Described framework is integrally formed by resin,

Described radiator is metal system.

7. illumination light source as claimed in claim 3, it is characterised in that

Described light emitting module possesses and is provided with the substrate of multiple through hole and is configured in described substrate On light-emitting component,

Described plate portion is provided with multiple through hole,

Described inner casing portion is provided with multiple protuberance,

Each of the plurality of protuberance, break-through is in the plurality of through hole each of described substrate Each of the plurality of through hole in individual and described plate portion.

8. illumination light source as claimed in claim 1, it is characterised in that

Described light emitting module is fixed on described plate portion.

9. a lighting device, it is characterised in that

This lighting device possesses the illumination light source described in any one of claim 1 to 8.