CN205498197U - Scattered heat recombination membrane of high -efficient thermal current direction - Google Patents
Scattered heat recombination membrane of high -efficient thermal current direction Download PDFInfo
- Publication number
- CN205498197U CN205498197U CN201620303466.3U CN201620303466U CN205498197U CN 205498197 U CN205498197 U CN 205498197U CN 201620303466 U CN201620303466 U CN 201620303466U CN 205498197 U CN205498197 U CN 205498197U
- Authority
- CN
- China
- Prior art keywords
- heat
- thermal
- insulation layer
- heat insulation
- conductivity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The utility model relates to a scattered heat recombination membrane of high -efficient thermal current direction belongs to the heat recombination material that looses, aim at providing the scattered heat recombination membrane that can guide heat transfer direction and control heat diffusion power. It includes the heat conduction stratum basale, pastes the heat insulation layer that applies on this heat conduction stratum basale surface, and the area of this heat insulation layer is less than the area of heat conduction stratum basale (3). The utility model discloses can present the direct radio according to the thermal conductance of heat transfer power and temperature difference and material and concern this characteristic, utilize the heat insulation layer temperature to rise the produced difference in temperature and drive the directional heat conduction stratum basale that channels into of heat to heat conduction stratum basale through the large tracts of land dispels the heat fast, thereby eliminates electron device's hot spot. The utility model discloses simple structure can effectively solve electronic product local overheat's phenomenon, guarantees electron device's high -power output, extension electron device's life, it can realize the scattered heat recombination material membrane of industrialization production to be one kind.
Description
Technical field
This utility model relates to a kind of heat radiation composite membrane, particularly relates to a kind of High Efficiency Thermal conductance to heat radiation composite membrane；Belong to heat dissipation composite material.
Background technology
Along with electronic product small and integrated, electronic component integration degree is more and more higher, and the heat radiation power of unit are increases the most therewith, and surface temperature can rise rapidly；Thus affect work efficiency and the life-span of electronic device.The most urgently research and develop a kind of high-performance heat sink material saving heat-dissipating space.
Graphite film, graphene film have excellent thermal diffusion performance and are constantly subjected to pay attention to, and are used widely in ultrathin portable electronic equipment.Graphite film and graphene film are the layer structures formed by carbon, and not only in face, thermal conductivity is high, density is little and thickness can control, below 50 microns, have flexibility；Thus eliminate heat spot in being applied to small space always.But along with thickness thinning of graphite film and graphene film, its cross-sectional area drastically reduces, and heat transfer efficiency is also with drastically declining.In electronic device, the heat of heat spot can not effectively spread apart, and temperature is the most too high.
Summary of the invention
In order to overcome defect present in prior art, this utility model aims to provide a kind of bootable heat direction of transfer with the High Efficiency Thermal conductance controlling heat diffusion power to heat radiation composite membrane, to effectively eliminate heat spot, reduction electronic device temperature, the work efficiency of raising electronic device and the service life in electronic device.
To achieve these goals, this utility model is by the following technical solutions: it includes thermal-conductivity substrate layer, sticks on the heat insulation layer on this thermal-conductivity substrate layer surface；The area of heat insulation layer is less than the area of thermal-conductivity substrate layer.
Thermal-conductivity substrate layer be in face laterally thermal conductivity be 100～2000 W/mk, longitudinal thermal conductivity be 10～500
W/mk, thickness is 0.1 μm～one of the Copper Foil of 500 μm, aluminium foil, native gold, native silver, lead foil, tinfoil paper, iron foil, magnesium paper tinsel, natural stone ink film, synthetic graphite film, graphene film.
Heat insulation layer be thermal conductivity be 0.01～0.1
W/mk, thickness are 0.1 μm～one of the glass fibre of 500 μm, asbestos, rock wool, silicate, pottery, ceramic fibre, Muscovitum, thin polymer film, aerogel blanket.
The surface of heat insulation layer is coated with surface heat-conducting layer, and the area of this surface heat-conducting layer is between heat insulation layer and thermal-conductivity substrate layer.
Surface heat-conducting layer be in face laterally thermal conductivity be 100～2000 W/mk, longitudinal thermal conductivity be 10～500
W/mk, thickness is 0.1 μm～one of the Copper Foil of 500 μm, aluminium foil, native gold, native silver, lead foil, tinfoil paper, iron foil, magnesium paper tinsel, natural stone ink film, synthetic graphite film, graphene film.
Compared with the prior art, this utility model is owing to have employed technique scheme, by heat insulation layer local complexity on thermal-conductivity substrate layer；Therefore heat insulation layer can effectively stop heat from heat source to transmit along longitudinal, thus reduces the surface temperature of electric-device housing.Further, since heat insulation layer temperature raises, under the driving of the temperature difference, heat can be effectively directed importing thermal-conductivity substrate layer, and by large-area thermal-conductivity substrate layer quick heat radiating, thus eliminate the heat spot of electronic device.This utility model simple in construction, can realize industrialization and produce, it is possible to the phenomenon effectively solving electronic product hot-spot, the high-power output ensureing electronic device, the service life of prolongation electronic device.
Accompanying drawing explanation
Fig. 1 is the structural representation of this utility model embodiment 1.
In figure: surface heat-conducting layer 1, heat insulation layer 2, thermal-conductivity substrate layer 3.
Detailed description of the invention
The utility model is described in further detail with specific embodiment below in conjunction with the accompanying drawings:
Embodiment 1
As shown in Figure 1: powdered ceramic material is placed in water and processes with high-energy ultrasonic instrument, obtain ceramic solution；One piece of mask plate (not shown) with certain window area is placed on thermal-conductivity substrate layer 3 surface that material is Copper Foil, this ceramic solution is sprayed on the thermal-conductivity substrate layer 3 of preheating, removes mask plate after drying, local can be obtained on the surface of thermal-conductivity substrate layer 3 and paste ceramic-coated heat insulation layer 2.
Embodiment 2
Kynoar (PVDF) is joined 100g
In N-Methyl pyrrolidone (NMP), add ceramic powders, use the mode localised application of roll shaft coating in thermal-conductivity substrate layer 3 surface that material is graphite paper in the slurry being stirred, local can be obtained after drying on this thermal-conductivity substrate layer surface and paste ceramic-coated heat insulation layer 2.
Embodiment 3
With PET film be heat insulation layer 2, with synthetic graphite paper for thermal-conductivity substrate layer 3 and surface heat-conducting layer 1, in heat insulation layer 2 surface brush thin layer of adhesive, use film coating process that heat insulation layer 2 is pasted on the surface of thermal-conductivity substrate layer 3, then surface heat-conducting layer 1 is pasted onto heat insulation layer 2 surface by recycling film coating process, forms interlayer composite radiating thin film.The area of heat insulation layer 2 is less than the area of thermal-conductivity substrate layer 3, and the area of surface heat-conducting layer 1 is between heat insulation layer 2 and thermal-conductivity substrate layer 3.
Claims (5)
1. High Efficiency Thermal conductance is to a heat radiation composite membrane, including thermal-conductivity substrate layer, the heat insulation layer that sticks on this thermal-conductivity substrate layer surface；It is characterized in that: the area of heat insulation layer (2) is less than the area of thermal-conductivity substrate layer (3).
High Efficiency Thermal conductance the most according to claim 1 is to heat radiation composite membrane, it is characterized in that: thermal-conductivity substrate layer (3) be in face laterally thermal conductivity be 100～2000 W/mk, longitudinal thermal conductivity be 10～500 W/mk, thickness is 0.1 μm～one of the Copper Foil of 500 μm, aluminium foil, native gold, native silver, lead foil, tinfoil paper, iron foil, magnesium paper tinsel, natural stone ink film, synthetic graphite film, graphene film.
High Efficiency Thermal conductance the most according to claim 1 to heat radiation composite membrane, it is characterised in that: heat insulation layer (2) be thermal conductivity be 0.01～0.1 W/mk, thickness be 0.1 μm～one of the glass fibre of 500 μm, asbestos, rock wool, silicate, pottery, ceramic fibre, Muscovitum, thin polymer film, aerogel blanket.
High Efficiency Thermal conductance the most as claimed in any of claims 1 to 3 is to heat radiation composite membrane, it is characterized in that: the surface of heat insulation layer (2) is coated with surface heat-conducting layer (1), the area of this surface heat-conducting layer is between heat insulation layer (2) and thermal-conductivity substrate layer (3).
High Efficiency Thermal conductance the most according to claim 4 is to heat radiation composite membrane, it is characterized in that: surface heat-conducting layer (1) be in face laterally thermal conductivity be 100～2000 W/mk, longitudinal thermal conductivity be 10～500 W/mk, thickness is 0.1 μm～one of the Copper Foil of 500 μm, aluminium foil, native gold, native silver, lead foil, tinfoil paper, iron foil, magnesium paper tinsel, natural stone ink film, synthetic graphite film, graphene film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620303466.3U CN205498197U (en) | 2016-04-13 | 2016-04-13 | Scattered heat recombination membrane of high -efficient thermal current direction |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620303466.3U CN205498197U (en) | 2016-04-13 | 2016-04-13 | Scattered heat recombination membrane of high -efficient thermal current direction |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205498197U true CN205498197U (en) | 2016-08-24 |
Family
ID=56712723
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620303466.3U Active CN205498197U (en) | 2016-04-13 | 2016-04-13 | Scattered heat recombination membrane of high -efficient thermal current direction |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205498197U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI607881B (en) * | 2016-12-14 | 2017-12-11 | 國家中山科學研究院 | Composite material for LED heat-dissipating substrate and manufacturing method thereof |
| CN107458062A (en) * | 2017-08-22 | 2017-12-12 | 江苏泛亚微透科技股份有限公司 | Carbon thermally conductive sheet and expanded PTFE heat insulating coat film and preparation method thereof |
| CN110603147A (en) * | 2017-02-23 | 2019-12-20 | 格拉芬康普西斯有限公司 | Composite structure and method of manufacture |
-
2016
- 2016-04-13 CN CN201620303466.3U patent/CN205498197U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI607881B (en) * | 2016-12-14 | 2017-12-11 | 國家中山科學研究院 | Composite material for LED heat-dissipating substrate and manufacturing method thereof |
| CN110603147A (en) * | 2017-02-23 | 2019-12-20 | 格拉芬康普西斯有限公司 | Composite structure and method of manufacture |
| CN107458062A (en) * | 2017-08-22 | 2017-12-12 | 江苏泛亚微透科技股份有限公司 | Carbon thermally conductive sheet and expanded PTFE heat insulating coat film and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203353019U (en) | Graphene metal cooling fin and electronic product cooling structure | |
| CN205498197U (en) | Scattered heat recombination membrane of high -efficient thermal current direction | |
| CN106082186B (en) | A kind of heat conduction film and preparation method thereof of graphene-nanometer carbon/carbon-copper composite material | |
| CN104495795B (en) | A kind of graphite flake and preparation method thereof | |
| CN106433508A (en) | Preparation method of graphene heat conduction double-sided adhesive tape | |
| CN106847767A (en) | A kind of graphite Copper Foil heat sink compound | |
| CN107140619A (en) | A kind of graphene thick film of high heat conduction and preparation method thereof | |
| TW201528927A (en) | New heat spreading packaging design | |
| CN103533682A (en) | Unidirectional heating device | |
| CN104475316A (en) | Preparing method of graphene coating | |
| WO2017084340A1 (en) | Heat dissipation structure for liquid crystal display device | |
| CN202750393U (en) | Heat conductive layer sheet | |
| CN107901524A (en) | Unmanned plane circuit control panel and its manufacture method with class graphene composite radiating film | |
| CN109181654A (en) | A kind of graphene-based composite heat conduction film and preparation method thereof and its application | |
| CN203855543U (en) | Thermally conductive graphite composite film | |
| CN108486568B (en) | Large-scale graphene/metal heterojunction composite film for heat conduction and preparation method thereof | |
| CN209561585U (en) | A kind of composite heat-conducting structure, cell apparatus and electronic equipment | |
| CN204733502U (en) | Graphite guide warmware | |
| CN106888548A (en) | A kind of aluminium-based copper-clad laminate and its painting method with graphene/carbon nano-tube composite radiating coating | |
| CN208402321U (en) | A kind of compound graphite radiating chip architecture | |
| CN203884121U (en) | Radiating fin | |
| CN207185037U (en) | A kind of high power device heat dissipation film | |
| CN106179923B (en) | The preparation method of graphene metallic composite | |
| CN201774738U (en) | PCB board capable of implementing radiant type heat dissipation | |
| CN209420183U (en) | A kind of heat loss through radiation piece |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| PP01 | Preservation of patent right |
Effective date of registration: 20200611 Granted publication date: 20160824 |
|
| PP01 | Preservation of patent right |