WO2017084340A1 - Heat dissipation structure for liquid crystal display device - Google Patents

Heat dissipation structure for liquid crystal display device Download PDF

Info

Publication number
WO2017084340A1
WO2017084340A1 PCT/CN2016/087072 CN2016087072W WO2017084340A1 WO 2017084340 A1 WO2017084340 A1 WO 2017084340A1 CN 2016087072 W CN2016087072 W CN 2016087072W WO 2017084340 A1 WO2017084340 A1 WO 2017084340A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat
heat dissipation
plate
substrate
liquid crystal
Prior art date
Application number
PCT/CN2016/087072
Other languages
French (fr)
Chinese (zh)
Inventor
贾智帅
Original Assignee
乐视控股（北京）有限公司
乐视致新电子科技（天津）有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 乐视控股（北京）有限公司, 乐视致新电子科技（天津）有限公司 filed Critical 乐视控股（北京）有限公司
Publication of WO2017084340A1 publication Critical patent/WO2017084340A1/en

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S8/00—Lighting devices intended for fixed installation
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the embodiments of the present application relate to the field of heat dissipation structure design, and in particular, to a heat dissipation structure for a liquid crystal display device.
  • the use of liquid crystal display devices has become more and more extensive.
  • the service life of the liquid crystal display device is closely related to the heat dissipation.
  • the heat dissipation structure of the liquid crystal display device commonly used in the market is generally directly adhered to the thermal conductive adhesive on the lower layer of the liquid crystal display device substrate, and the heat is transferred to the heat dissipation plate through the thermal conductive adhesive.
  • This structure is prone to heat concentration in the heat sink at the rear of the liquid crystal display device, and the heat is not easily transmitted to other places on the heat sink, and the heat dissipation effect is poor.
  • the embodiment of the present invention provides a heat dissipation structure for liquid crystal display, which solves the defects of heat concentration and poor heat dissipation effect of the heat dissipation structure of the display in the prior art, realizes the problem of improving heat concentration, and improves the heat dissipation efficiency of the display.
  • the embodiment of the present application provides a heat dissipation structure for a liquid crystal display device, including: a heat dissipation plate and a substrate for fixing a backlight source of the liquid crystal display device, wherein the substrate and the heat dissipation plate are connected by a first heat conduction layer a heat conducting plate is further disposed between the substrate and the heat dissipation plate;
  • One end of the heat conducting plate is in contact with the substrate, and the other end extends out of the substrate;
  • the heat conducting plate is provided with a heat insulating layer.
  • a heat dissipation structure for a liquid crystal display device provided by an embodiment of the present invention solves the problem of heat concentration of a heat dissipation structure of a conventional liquid crystal display device by transferring heat of a portion of the liquid crystal display device to other regions of the heat dissipation plate.
  • the heat dissipation efficiency and heat dissipation speed of the liquid crystal display device are known in the art.
  • FIG. 1 is a schematic structural diagram of a heat dissipation structure for a liquid crystal display device according to an embodiment of the present application.
  • the embodiment provides a heat dissipation structure for a liquid crystal display device.
  • the substrate 2 and the heat dissipation plate 4 for fixing the backlight source 1 of the liquid crystal display device are disposed between the substrate 2 and the heat dissipation plate 4 .
  • the thermal energy on the substrate 2 is quickly conducted to the heat sink 4 through the first heat conducting layer 3.
  • a heat conducting plate 6 is further disposed between the substrate 2 and the heat sink 4. One end of the heat conducting plate 6 is in contact with the substrate 2, and the other end extends out of the substrate 2.
  • the end of the heat conducting plate 6 in contact with the substrate 2 conducts thermal energy on the substrate 2 to the other end of the heat conducting plate 6, the first heat conducting layer 3 It is disposed side by side with one end of the heat conducting plate 6 between the substrate 2 and the heat radiating plate 4.
  • the upper and lower surfaces of the first heat conducting layer 3 are in the same layer as the substrate 2 and the heat sink 4, respectively, and may be in contact or have a gap.
  • the heat conducting plate 6 is provided with a heat insulating layer 5, and the heat insulating layer 5 may be disposed on a side of the heat conducting plate 6 in contact with the substrate 2.
  • the heat insulating layer 5 may also be disposed on a side where the back heat guiding plate 6 is in contact with the heat radiating plate 4.
  • the heat conducting plate 6 is disposed at an end away from the substrate 2 to be in contact with the heat sink 4 through a bare port, and the heat energy of the heat conducting plate 6 is transmitted to the heat sink 4 through the exposed port.
  • the first heat conduction layer 3 directly conducts part of the heat of the substrate 2 to the heat dissipation plate 4, and the heat conduction plate 6 and the heat insulation layer 5 transfer part of the heat of the substrate 2 to a region away from the heat dissipation plate 4 of the substrate 2, wherein the function of the heat insulation layer 5 Mainly to avoid heat loss in the area close to the substrate 2, and the problem of heat concentration cannot be solved.
  • a second heat conducting layer 7 is disposed at the exposed opening of the heat conducting plate 6, and the heat conducting plate 6 is disposed through the second heat conducting layer 7. It is in contact with the heat sink 4.
  • the heat conductive material used by the first heat conductive layer 3 and the second heat conductive layer 7 is a thermal conductive adhesive material, and the thermal conductivity of the thermal conductive adhesive after curing is between 1.1 W/m ⁇ K and 1.5 W/m ⁇ K. It has good thermal conductivity and good adhesion to most metal and non-metal materials.
  • the first heat conductive layer 3 can be directly adhered between the substrate 2 and the heat dissipation plate 4; the second heat conduction layer 7 is adhered to the upper layer of the heat dissipation plate 4 and connected to the lower surface of the heat conduction plate 6.
  • the first heat conductive layer 3 and the second heat conductive layer 7 may also use other heat conductive materials such as thermal grease, heat conductive adhesive, and the like. Depending on the specific application area or process, the first thermally conductive layer 3 and the second thermally conductive layer 7 may also use different thermally conductive materials.
  • the heat conducting plate 6 is made of a graphene material and has excellent thermal conductivity with a thermal conductivity of between 4000 W/m ⁇ K and 6600 W/m ⁇ K.
  • Graphene can be prepared by a mechanical peeling method, a redox method, an SiC epitaxial growth method, and a chemical vapor deposition method.
  • the heat conducting plate 6 can be attached to the heat sink 4 by an adhesive.
  • the material of the substrate 2 may be aluminum, copper, aluminum alloy, iron, ceramic, iron, natural graphite epoxy resin, etc., and has a thickness of 3.5 mm to 5 mm.
  • the heat dissipation plate 4 is matched with the shape of the heat conduction plate 6, the heat dissipation plate 4 is L-shaped, the heat conduction plate 6 is L-shaped, and the heat conduction plate 6 is disposed inside the heat dissipation plate 4.
  • the substrate 2, the backlight source 1 and the first heat conducting layer 3 are located on one side along the bent position of the L-shaped heat sink 4, and the second heat conducting layer 7 is located on the other side of the L-shaped heat sink 4.
  • the substrate 4 is connected to one end of the L-shaped heat conducting plate 6, and the other end of the L-shaped heat conducting plate 6 is connected to the heat sink 4 via a second heat conducting layer 7.
  • the heat sink 4 can be prepared by punching, stamping, or shaping.
  • the heat dissipation plate 4 of the embodiment of the present application adopts an aluminum alloy 6063-T5, and has a thermal conductivity of 180 W/m ⁇ K to 190 W/m ⁇ K, and has good heat dissipation performance, and the thickness thereof is between 8 mm and 10 mm. .
  • the backlight source 1 of the liquid crystal display device fixed on the substrate 2 is an LED (Light-Emitting Diode), and generally adopts an array structure, and the structure is prone to heat concentration and local temperature. Too high a problem.
  • This application is applicable to various use cases of LED display, and can solve the above heat dissipation problem.
  • the heat insulating layer 5 a heat insulating material such as polyethylene, polystyrene or silicate polyurethane can be used.
  • the heat insulating layer 5 of the embodiment of the present application is made of a polyurethane material having a density of 35 Kg/m 3 to 40 Kg/m 3 and a thermal conductivity of 0.018 W/m ⁇ K to 0.023 W/m ⁇ K, which has good heat insulation. performance.
  • the heat insulating layer 5 can be sprayed or glued to the heat conducting plate 6 and has a thickness of 1.5 mm to 2 mm.
  • the liquid crystal display device includes a liquid crystal display or a liquid crystal display television.

Abstract

Disclosed is a heat dissipation structure for a liquid crystal display device, comprising a heat dissipation plate (4) and a substrate (2) for fixing a backlight power source (1) of the liquid crystal display device, wherein the substrate (2) and the heat dissipation plate (4) are connected via a first thermal conductive layer (3), and a thermal conductive plate (6) is further provided between the substrate (2) and the heat dissipation plate (4); one end of the thermal conductive plate (6) is in contact with the substrate (2), and the other end thereof extends beyond the substrate (2); and a thermal insulation layer (5) is provided on the thermal conductive plate (6) and the heat dissipation plate (4). The heat dissipation structure for a liquid crystal display device can solve the problem that the heat is concentrated on the existing heat dissipation plate of a liquid crystal display device, causing the local temperature to be too high.

Description

一种用于液晶显示设备的散热结构Heat dissipation structure for liquid crystal display device 技术领域Technical field
本申请实施例涉及散热结构设计领域，尤其涉及一种用于液晶显示设备的散热结构。The embodiments of the present application relate to the field of heat dissipation structure design, and in particular, to a heat dissipation structure for a liquid crystal display device.
背景技术Background technique
随着电子产品产业的发展，液晶显示设备器的使用范围也越来越广泛。液晶显示设备器的使用寿命与散热关系密切，目前市场上常用的液晶显示设备散热结构，一般是在液晶显示设备基板的下层直接黏贴导热胶，通过导热胶将热量传递到散热板上后释放，这种结构容易出现热量集中于热量集中于液晶显示设备后的散热板处，热量不易传递至散热板其他处，散热效果差的问题。With the development of the electronic product industry, the use of liquid crystal display devices has become more and more extensive. The service life of the liquid crystal display device is closely related to the heat dissipation. Currently, the heat dissipation structure of the liquid crystal display device commonly used in the market is generally directly adhered to the thermal conductive adhesive on the lower layer of the liquid crystal display device substrate, and the heat is transferred to the heat dissipation plate through the thermal conductive adhesive. This structure is prone to heat concentration in the heat sink at the rear of the liquid crystal display device, and the heat is not easily transmitted to other places on the heat sink, and the heat dissipation effect is poor.
实用新型内容Utility model content
本申请实施例提供一种用于液晶显示的散热结构，用以解决现有技术中显示器散热结构热量集中，散热效果差的缺陷，实现了改进热量集中问题，提高了显示器散热效率。The embodiment of the present invention provides a heat dissipation structure for liquid crystal display, which solves the defects of heat concentration and poor heat dissipation effect of the heat dissipation structure of the display in the prior art, realizes the problem of improving heat concentration, and improves the heat dissipation efficiency of the display.
本申请实施例提供了一种用于液晶显示设备的散热结构，包括：散热板和用于固定液晶显示设备的背光光源的基板，所述基板与所述散热板之间通过第一导热层连接，所述基板与所述散热板之间还设置有导热板；The embodiment of the present application provides a heat dissipation structure for a liquid crystal display device, including: a heat dissipation plate and a substrate for fixing a backlight source of the liquid crystal display device, wherein the substrate and the heat dissipation plate are connected by a first heat conduction layer a heat conducting plate is further disposed between the substrate and the heat dissipation plate;
所述导热板一端与所述基板相接触，另一端延伸出至所述基板之外；One end of the heat conducting plate is in contact with the substrate, and the other end extends out of the substrate;
所述导热板上设置有绝热层。The heat conducting plate is provided with a heat insulating layer.
本申请实施例提供的一种用于液晶显示设备的散热结构，通过将部分液晶显示设备的热量通过导热板传递至散热板其他区域，解决了现有液晶显示设备散热结构热量集中的问题，提高液晶显示设备的散热效率及散热速度。A heat dissipation structure for a liquid crystal display device provided by an embodiment of the present invention solves the problem of heat concentration of a heat dissipation structure of a conventional liquid crystal display device by transferring heat of a portion of the liquid crystal display device to other regions of the heat dissipation plate. The heat dissipation efficiency and heat dissipation speed of the liquid crystal display device.
附图说明 DRAWINGS
为了更清楚地说明本申请实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作一简单地介绍，显而易见地，下面描述中的附图是本申请的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, a brief description of the drawings used in the embodiments or the prior art description will be briefly described below. Obviously, the drawings in the following description It is a certain embodiment of the present application, and other drawings can be obtained according to the drawings without any creative work for those skilled in the art.
图1为本申请实施例中的一种用于液晶显示设备的散热结构的结构示意图。FIG. 1 is a schematic structural diagram of a heat dissipation structure for a liquid crystal display device according to an embodiment of the present application.
具体实施方式detailed description
为使本申请实施例的目的、技术方案和优点更加清楚，下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。The technical solutions in the embodiments of the present application are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present application. It is a part of the embodiments of the present application, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present application without departing from the inventive scope are the scope of the present application.
本实施例提供了一种用于液晶显示设备的散热结构，参见图1，包括：用于固定液晶显示设备的背光光源1的基板2和散热板4，其中，基板2与散热板4之间通过第一导热层3连接，基板2上的热能通过第一导热层3快速传导至散热板4上。基板2与散热板4之间还设置有导热板6。该导热板6一端与基板2相接触，另一端延伸出至基板2之外，导热板6与基板2相接触的一端将基板2上的热能传导至导热板6另一端，第一导热层3与导热板6的一端并排设置在基板2与散热板4之间。第一导热层3的上下表面分别与基板2和散热板4二者在同一层，可以相接触或存在间隙。导热板6上设置有绝热层5，绝热层5可以设置在导热板6与基板2相接触的一侧面，绝热层5还可以设置在背向导热板6与散热板4相接触的一侧。导热板6在远离基板2的一端设置一裸露口与散热板4相接触，通过该裸露口将导热板6的热能传导至散热板4。The embodiment provides a heat dissipation structure for a liquid crystal display device. Referring to FIG. 1 , the substrate 2 and the heat dissipation plate 4 for fixing the backlight source 1 of the liquid crystal display device are disposed between the substrate 2 and the heat dissipation plate 4 . Through the connection of the first heat conducting layer 3, the thermal energy on the substrate 2 is quickly conducted to the heat sink 4 through the first heat conducting layer 3. A heat conducting plate 6 is further disposed between the substrate 2 and the heat sink 4. One end of the heat conducting plate 6 is in contact with the substrate 2, and the other end extends out of the substrate 2. The end of the heat conducting plate 6 in contact with the substrate 2 conducts thermal energy on the substrate 2 to the other end of the heat conducting plate 6, the first heat conducting layer 3 It is disposed side by side with one end of the heat conducting plate 6 between the substrate 2 and the heat radiating plate 4. The upper and lower surfaces of the first heat conducting layer 3 are in the same layer as the substrate 2 and the heat sink 4, respectively, and may be in contact or have a gap. The heat conducting plate 6 is provided with a heat insulating layer 5, and the heat insulating layer 5 may be disposed on a side of the heat conducting plate 6 in contact with the substrate 2. The heat insulating layer 5 may also be disposed on a side where the back heat guiding plate 6 is in contact with the heat radiating plate 4. The heat conducting plate 6 is disposed at an end away from the substrate 2 to be in contact with the heat sink 4 through a bare port, and the heat energy of the heat conducting plate 6 is transmitted to the heat sink 4 through the exposed port.
第一导热层3将基板2的部分热量直接传导至散热板4，导热板6和绝热层5将基板2的部分热量传递至远离基板2的散热板4的区域，其中，绝热层5的作用主要是避免热量在靠近基板2的区域散失，而导致热量集中问题无法解决。The first heat conduction layer 3 directly conducts part of the heat of the substrate 2 to the heat dissipation plate 4, and the heat conduction plate 6 and the heat insulation layer 5 transfer part of the heat of the substrate 2 to a region away from the heat dissipation plate 4 of the substrate 2, wherein the function of the heat insulation layer 5 Mainly to avoid heat loss in the area close to the substrate 2, and the problem of heat concentration cannot be solved.
在导热板6的裸露口处设置第二导热层7，通过第二导热层7将导热板6 与散热板4相接触。A second heat conducting layer 7 is disposed at the exposed opening of the heat conducting plate 6, and the heat conducting plate 6 is disposed through the second heat conducting layer 7. It is in contact with the heat sink 4.
可选地，所述第一导热层3和第二导热层7采用的导热材料为导热胶材料，导热胶固化后的导热系数在1.1W/m·K～1.5W/m·K之间，具有较好的导热性能，且与大多数金属和非金属材料具有良好的粘结性。第一导热层3可直接黏贴在基板2与散热板4之间；第二导热层7黏贴于散热板4上层，并与导热板6的下表面相连接。第一导热层3和第二导热层7还可以使用导热硅脂、导热粘结剂等其他导热材料。根据具体应用区域或工艺情况，第一导热层3和第二导热层7也可使用不同的导热材料。Optionally, the heat conductive material used by the first heat conductive layer 3 and the second heat conductive layer 7 is a thermal conductive adhesive material, and the thermal conductivity of the thermal conductive adhesive after curing is between 1.1 W/m·K and 1.5 W/m·K. It has good thermal conductivity and good adhesion to most metal and non-metal materials. The first heat conductive layer 3 can be directly adhered between the substrate 2 and the heat dissipation plate 4; the second heat conduction layer 7 is adhered to the upper layer of the heat dissipation plate 4 and connected to the lower surface of the heat conduction plate 6. The first heat conductive layer 3 and the second heat conductive layer 7 may also use other heat conductive materials such as thermal grease, heat conductive adhesive, and the like. Depending on the specific application area or process, the first thermally conductive layer 3 and the second thermally conductive layer 7 may also use different thermally conductive materials.
可选地，导热板6由石墨烯材料制成，具有优异的导热性能，其导热系数在4000W/m·K～6600W/m·K之间。石墨烯，可通过机械剥离法、氧化还原法、SiC外延生长法和化学气相沉积法等方法制备。导热板6可以通过粘合剂连接于散热板4上。Alternatively, the heat conducting plate 6 is made of a graphene material and has excellent thermal conductivity with a thermal conductivity of between 4000 W/m·K and 6600 W/m·K. Graphene can be prepared by a mechanical peeling method, a redox method, an SiC epitaxial growth method, and a chemical vapor deposition method. The heat conducting plate 6 can be attached to the heat sink 4 by an adhesive.
基板2的材料可以为铝，也可以是铜、铝合金、铁、陶瓷、铁、天然石墨环氧树脂等，其厚度为3.5mm～5mm。The material of the substrate 2 may be aluminum, copper, aluminum alloy, iron, ceramic, iron, natural graphite epoxy resin, etc., and has a thickness of 3.5 mm to 5 mm.
可选地，散热板4与导热板6的形状相匹配，散热板4为L型，导热板6为L型，所述导热板6设置在所述散热板4的内侧。基板2、背光光源1和第一导热层3沿L型的散热板4的弯折位置，位于一侧；第二导热层7，位于L型散热板4的另一侧。Optionally, the heat dissipation plate 4 is matched with the shape of the heat conduction plate 6, the heat dissipation plate 4 is L-shaped, the heat conduction plate 6 is L-shaped, and the heat conduction plate 6 is disposed inside the heat dissipation plate 4. The substrate 2, the backlight source 1 and the first heat conducting layer 3 are located on one side along the bent position of the L-shaped heat sink 4, and the second heat conducting layer 7 is located on the other side of the L-shaped heat sink 4.
所述基板4连接在所述L型导热板6的一端，所述L型导热板6的另一端通过第二导热层7与所述散热板4连接。The substrate 4 is connected to one end of the L-shaped heat conducting plate 6, and the other end of the L-shaped heat conducting plate 6 is connected to the heat sink 4 via a second heat conducting layer 7.
散热板4，可通过冲裁、冲压、整形加工等方式制备。可选地，本申请实施例的散热板4采用铝合金6063-T5，其导热系数为180W/m·K～190W/m·K，具有较好的散热性能，其厚度为8mm～10mm之间。The heat sink 4 can be prepared by punching, stamping, or shaping. Optionally, the heat dissipation plate 4 of the embodiment of the present application adopts an aluminum alloy 6063-T5, and has a thermal conductivity of 180 W/m·K to 190 W/m·K, and has good heat dissipation performance, and the thickness thereof is between 8 mm and 10 mm. .
可选地，本实用新型实施例，基板2上固定的液晶显示设备的背光光源1为LED(Light-Emitting Diode，发光二极管)，一般采用阵列式结构，这种结构容易出现热量集中、局部温度过高的问题。本申请适用于LED显示的各种使用场合，能够解决上述散热问题。Optionally, in the embodiment of the present invention, the backlight source 1 of the liquid crystal display device fixed on the substrate 2 is an LED (Light-Emitting Diode), and generally adopts an array structure, and the structure is prone to heat concentration and local temperature. Too high a problem. This application is applicable to various use cases of LED display, and can solve the above heat dissipation problem.
绝热层5，可采用聚乙烯、聚苯乙烯、硅酸盐聚氨酯等绝热材料。优选地，本申请实施例的绝热层5，采用聚氨酯材料，其密度为35Kg/m3～40Kg/m3， 导热系数为0.018W/m·K～0.023W/m·K，具有良好的绝热性能。绝热层5，可以喷涂或胶黏在导热板6上，其厚度为1.5mm～2mm。As the heat insulating layer 5, a heat insulating material such as polyethylene, polystyrene or silicate polyurethane can be used. Preferably, the heat insulating layer 5 of the embodiment of the present application is made of a polyurethane material having a density of 35 Kg/m 3 to 40 Kg/m 3 and a thermal conductivity of 0.018 W/m·K to 0.023 W/m·K, which has good heat insulation. performance. The heat insulating layer 5 can be sprayed or glued to the heat conducting plate 6 and has a thickness of 1.5 mm to 2 mm.
本申请实施例中，所述液晶显示设备包括液晶显示器或液晶显示电视机。通过以上的实施方式的描述，本领域的技术人员可以清楚地了解到各实施方式的散热结构，具有良好的散热性能，能够解决液晶显示设备热量集中、局部温度过高的问题，延长了液晶显示设备的使用寿命。In the embodiment of the present application, the liquid crystal display device includes a liquid crystal display or a liquid crystal display television. Through the description of the above embodiments, those skilled in the art can clearly understand the heat dissipation structure of each embodiment, have good heat dissipation performance, can solve the problem of heat concentration and local temperature of the liquid crystal display device, and prolong the liquid crystal display. The service life of the equipment.
最后应说明的是：以上实施例仅用以说明本申请的技术方案，而非对其限制；尽管参照前述实施例对本申请进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例技术方案的精神和范围。 Finally, it should be noted that the above embodiments are only used to explain the technical solutions of the present application, and are not limited thereto; although the present application is described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still The technical solutions described in the foregoing embodiments are modified, or the equivalents of the technical features are replaced by the equivalents. The modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims (10)

  1. 一种用于液晶显示设备的散热结构，包括：散热板和用于固定液晶显示设备的背光光源的基板，所述基板与所述散热板之间通过第一导热层连接，其特征在于，A heat dissipation structure for a liquid crystal display device, comprising: a heat dissipation plate and a substrate for fixing a backlight source of the liquid crystal display device, wherein the substrate and the heat dissipation plate are connected by a first heat conduction layer, wherein
    所述基板与所述散热板之间还设置有导热板；A heat conducting plate is further disposed between the substrate and the heat dissipation plate;
    所述导热板一端与所述基板相接触，另一端延伸出至所述基板之外；One end of the heat conducting plate is in contact with the substrate, and the other end extends out of the substrate;
    所述导热板上设置有绝热层。The heat conducting plate is provided with a heat insulating layer.
  2. 根据权利要求1所述的散热结构，其特征在于，所述绝热层设置在所述导热板与所述基板相接触的一侧面，所述导热板在远离基板的一端设置一裸露口与所述散热板相接触。The heat dissipation structure according to claim 1, wherein the heat insulating layer is disposed on a side of the heat conducting plate that is in contact with the substrate, and the heat conducting plate is disposed at an end away from the substrate with a bare port and the The heat sink is in contact.
  3. 根据权利要求2所述的散热结构，其特征在于，在所述导热板的裸露口处设置第二导热层，通过所述第二导热层将所述导热板与所述散热板相接触。The heat dissipation structure according to claim 2, wherein a second heat conduction layer is disposed at the exposed opening of the heat conduction plate, and the heat conduction plate is in contact with the heat dissipation plate through the second heat conduction layer.
  4. 根据权利要求2或3所述的散热结构，其特征在于，所述绝热层设置在背向所述导热板与所述散热板相接触的一侧。The heat dissipation structure according to claim 2 or 3, wherein the heat insulation layer is disposed on a side facing away from the heat conduction plate and the heat dissipation plate.
  5. 根据权利要求4所述的散热结构，其特征在于，所述第一导热层、第二导热层采用的材料为导热胶。The heat dissipation structure according to claim 4, wherein the first heat conductive layer and the second heat conductive layer are made of a thermal conductive adhesive.
  6. 根据权利要求1所述的散热结构，其特征在于，所述导热板由石墨烯材料制成。The heat dissipation structure according to claim 1, wherein the heat conductive plate is made of a graphene material.
  7. 根据权利要求1所述的散热结构，其特征在于，所述绝热层为由绝热材料喷涂在所述导热板上而成。The heat dissipation structure according to claim 1, wherein the heat insulation layer is formed by spraying a heat insulating material on the heat conduction plate.
  8. 根据权利要求7所述的散热结构，其特征在于，所述导热板通过粘合剂连接于所述散热板上。The heat dissipation structure according to claim 7, wherein the heat conducting plate is connected to the heat dissipation plate by an adhesive.
  9. 根据权利要求1所述的散热结构，其特征在于，所述导热板与所述散热板的形状相匹配，所述散热板为L型，所述导热板为L型，所述导热板设置在所述散热板的内侧。The heat dissipation structure according to claim 1, wherein the heat conduction plate is matched with the shape of the heat dissipation plate, the heat dissipation plate is L-shaped, the heat conduction plate is L-shaped, and the heat conduction plate is disposed at The inside of the heat sink.
  10. 根据权利要求1所述的散热结构，其特征在于，所述基板上固定的液晶显示设备的背光光源为LED，所述液晶显示设备包括液晶显示器或液晶显示电视机。 The heat dissipation structure according to claim 1, wherein the backlight source of the liquid crystal display device fixed on the substrate is an LED, and the liquid crystal display device comprises a liquid crystal display or a liquid crystal display television.
PCT/CN2016/087072 2015-11-18 2016-06-24 Heat dissipation structure for liquid crystal display device WO2017084340A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201520921995.5U CN205213232U (en) 2015-11-18 2015-11-18 A heat radiation structure for liquid crystal display equipment
CN201520921995.5 2015-11-18

Publications (1)

Publication Number Publication Date
WO2017084340A1 true WO2017084340A1 (en) 2017-05-26

Family

ID=55850914

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2016/087072 WO2017084340A1 (en) 2015-11-18 2016-06-24 Heat dissipation structure for liquid crystal display device

Country Status (2)

Country Link
CN (1) CN205213232U (en)
WO (1) WO2017084340A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113140160A (en) * 2021-04-26 2021-07-20 武汉华星光电半导体显示技术有限公司 Display module

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN205213232U (en) * 2015-11-18 2016-05-04 乐视致新电子科技（天津）有限公司 A heat radiation structure for liquid crystal display equipment
CN106125861A (en) * 2016-06-21 2016-11-16 太仓鸿鑫精密压铸有限公司 Fin for computer radiator
US10502889B2 (en) 2017-06-30 2019-12-10 Wuhan China Star Optoelectronics Technology Co., Ltd. Backlight unit
CN107290898B (en) * 2017-06-30 2020-12-25 武汉华星光电技术有限公司 Backlight assembly
CN108319050A (en) * 2017-07-28 2018-07-24 合肥市惠科精密模具有限公司 A kind of outdoor large TFT-LCD display screen heat-sink fixing devices
CN113097374B (en) * 2021-04-01 2023-09-05 厦门天马微电子有限公司 Display panel and display device

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2239720B (en) * 1989-11-30 1993-09-29 Nippon Graphite Ind Ltd Method of producing longitudinally fine striped type heat seal connector member
JP2008306084A (en) * 2007-06-11 2008-12-18 Sharp Corp Cooling system
CN202546677U (en) * 2012-02-17 2012-11-21 青岛海信电器股份有限公司 Heat dissipation structure of LED lamp and liquid crystal module
CN102943981A (en) * 2012-11-22 2013-02-27 深圳市华星光电技术有限公司 Backlight module and liquid crystal display device
CN203731199U (en) * 2013-11-25 2014-07-23 深圳Tcl新技术有限公司 Backlight module and display
CN205213232U (en) * 2015-11-18 2016-05-04 乐视致新电子科技（天津）有限公司 A heat radiation structure for liquid crystal display equipment

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2239720B (en) * 1989-11-30 1993-09-29 Nippon Graphite Ind Ltd Method of producing longitudinally fine striped type heat seal connector member
JP2008306084A (en) * 2007-06-11 2008-12-18 Sharp Corp Cooling system
CN202546677U (en) * 2012-02-17 2012-11-21 青岛海信电器股份有限公司 Heat dissipation structure of LED lamp and liquid crystal module
CN102943981A (en) * 2012-11-22 2013-02-27 深圳市华星光电技术有限公司 Backlight module and liquid crystal display device
CN203731199U (en) * 2013-11-25 2014-07-23 深圳Tcl新技术有限公司 Backlight module and display
CN205213232U (en) * 2015-11-18 2016-05-04 乐视致新电子科技（天津）有限公司 A heat radiation structure for liquid crystal display equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113140160A (en) * 2021-04-26 2021-07-20 武汉华星光电半导体显示技术有限公司 Display module

Also Published As

Publication number Publication date
CN205213232U (en) 2016-05-04

Similar Documents

Publication Publication Date Title
WO2017084340A1 (en) Heat dissipation structure for liquid crystal display device
CN105517423B (en) A kind of high heat conduction graphene heat radiating metal foil
CN204466141U (en) A kind of Graphene composite radiating film
JP2006303240A (en) Heat dissipating sheet, heat dissipating body, manufacturing method for the sheet, and heat transfer method
CN101321428A (en) High cooling circuit board and preparation thereof
TW201528927A (en) New heat spreading packaging design
CN205161023U (en) Liquid metal base heat conduction membrane composite construction
TW201251148A (en) Manufacturing method of LED heat conduction device
TW201810560A (en) Power module and manufacturing method thereof
CN204168701U (en) Graphite heat conducting foam liner
CN205510635U (en) High heat conduction graphite alkene heat dissipation metal forming
CN209729888U (en) High reliablity heat radiation module
WO2016131296A1 (en) Thermal conductor and electronic terminal
CN208191005U (en) A kind of graphene reinforced heat conduction metal pcb board of array LED encapsulation
CN103648253B (en) A kind of Novel heat-conducting insulation system
CN107946264A (en) graphene composite radiating structure
CN207811649U (en) A kind of novel heat-conducting piece
CN204407364U (en) LED chip radiator structure
CN210560217U (en) Graphene heat conduction and dissipation film
CN208315541U (en) Heat conductive insulating plate and converter plant
CN207596775U (en) A kind of heat conduction and heat radiation insulated compound adhesive tape with jog
CN203466182U (en) Ceramic cooling fin having advantages of good heat conduction performance and light weight
CN207733169U (en) A kind of structure improved thermally conductive sheet
CN207657295U (en) Unmanned plane circuit control panel with class graphene composite radiating film
CN206493657U (en) Nanometer fin

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 16865520

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 16865520

Country of ref document: EP

Kind code of ref document: A1