CN205488207U - Emitting diode structure of integrated encapsulation of chip on board - Google Patents
Emitting diode structure of integrated encapsulation of chip on board Download PDFInfo
- Publication number
- CN205488207U CN205488207U CN201620244660.9U CN201620244660U CN205488207U CN 205488207 U CN205488207 U CN 205488207U CN 201620244660 U CN201620244660 U CN 201620244660U CN 205488207 U CN205488207 U CN 205488207U
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- chip
- led
- light
- emitting diode
- dustcoat
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Abstract
The utility model discloses an emitting diode structure of integrated encapsulation of chip on board, including base plate and LED chip, the base plate centre is equipped with chip slot, LED install the chip is on chip slot, chip slot is circular, and its edge connection has an anti - light cup, anti - light cup is the inverted circular truncated cone form, anti - light cup is connected with the epoxy dustcoat, the epoxy dustcoat is the hemisphere, be equipped with the phosphor powder area in the epoxy dustcoat, the utility model discloses with LED chip direct package on the base plate, do not need extra chip heat dissipation and electrode lead frame isotructure, simplify LED packaging technology, shorten LED and encapsulate the flow, more importantly can practice thrift the encapsulation cost, anti - light cup goes out the light reflex that the LED chip sent, epoxy dustcoat protection LED inner structure, light that simultaneously will the reflection of anti - light cup assemble the back outgoing, and the phosphor powder area is apart from LED chip position the farthest away, and increase luminance receives temperature little moreover.
Description
Technical field
This utility model relates to diode technologies field of giving out light, and is specifically related to the light emitting diode of a kind of chip on board integration packaging
Structure.
Background technology
Illumination application proposes the requirement of the most tens thousand of lumen of light flux to light source, and power type light-emitting diode is considered as
Most likely entering the new generation of green light source in general lighting field, improving the luminous efficiency of LED mainly has a following two approach:
(1) by expanding the light-emitting area of single LEDs wafer or some LEDs wafers being combined, LED core is improved
The luminous power of sheet self；(2) optimizing LED light structure, the light extraction efficiency of LED is had a significant impact by encapsulating structure, if
Count rational encapsulating structure, the beneficially outgoing of LED light line, the luminous external quantum efficiency of LED can be improved.
Along with improving constantly of LED luminance and luminous efficiency, the requirement to encapsulation is more and more higher, and on the one hand LED is necessary
Meet and there is sufficiently high efficiency of light extraction and luminous flux, make to send out while taking into account lighting angle, uniformity of luminance and the factor such as photochromic
Light loss is preferably minimized；On the other hand, encapsulation must is fulfilled for the cooling requirements of chip.Increasing along with great power LED operating current
Greatly, if heat dispersion is limited, not only makes LED luminance reduce, also can directly affect the service life of LED.
Summary of the invention
For problem above, this utility model provides the light emitting diode construction of a kind of chip on board integration packaging, by LED
Chip direct package is on substrate, it is not necessary to the structures such as extra chip cooling and contact conductor framework, simplifies LED packaging technology,
Shorten LED and encapsulate flow process, it is often more important that can save packaging cost, the luminous reflectance that LED chip is sent by reflector is gone out；
Epoxy resin outer housing protection LED internal structure, outgoing after simultaneously being converged by the light that reflector reflects, fluorescent material band is in distance LED
The position that chip is farthest, increases brightness, and temperature influence is little, can effectively solve the problem in background technology.
To achieve these goals, the technical solution adopted in the utility model is as follows: the luminescence of a kind of chip on board integration packaging
Diode structure, including substrate and LED chip, described substrate centre is provided with chip slot, and described LED chip is installed on core
On film trap, described chip slot is circular, and its edge connects that to have reflector, described reflector be reversed round bench shaped, described reflective
It is hemispherical that cup connection has epoxy resin outer housing, described epoxy resin outer housing, is provided with fluorescent material band in described epoxy resin outer housing.
As a kind of preferably technical scheme of this practical information, described chip slot uses electro-insulating rubber material.
As a kind of preferably technical scheme of this practical information, the bus of described reflector and substrate are 15 ° to 45 °.
As a kind of preferably technical scheme of this practical information, described fluorescent material band is inverted v-shaped.
The beneficial effects of the utility model:
LED chip is directly encapsulated on substrate by this utility model, it is not necessary to the structures such as extra chip cooling and contact conductor framework,
Simplify LED packaging technology, shorten LED and encapsulate flow process, it is often more important that can save packaging cost, reflector is by LED core
The luminous reflectance that sheet sends is gone out；Epoxy resin outer housing protection LED internal structure, outgoing after simultaneously the light that reflector reflects being converged,
Fluorescent material band, in the position farthest apart from LED chip, increases brightness, and temperature influence is little.
Accompanying drawing explanation
Fig. 1 is this utility model overall structure schematic diagram.
Figure is numbered: 1-substrate；2-LED chip；3-chip slot；4-reflector；5-epoxy resin outer housing；6-fluorescent material
Band.
Detailed description of the invention
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples,
This utility model is further elaborated.Should be appreciated that specific embodiment described herein is only in order to explain this reality
With novel, it is not used to limit this utility model.
Embodiment:
As it is shown in figure 1, the light emitting diode construction of a kind of chip on board integration packaging, including substrate 1 and LED chip 2, described base
Plate 1 centre is provided with chip slot 3, and described LED chip 2 is installed on chip slot 3, and described chip slot 3 is circular, and its
Edge connects reflector 4, and described reflector 4 is reversed round bench shaped, and described reflector 4 connects epoxy resin outer housing 5, institute
Stating epoxy resin outer housing 5 is hemispherical, is provided with fluorescent material band 6 in described epoxy resin outer housing 5.
On above-described embodiment preferably, described chip slot 3 uses electro-insulating rubber material.
On above-described embodiment preferably, the bus of described reflector 4 and substrate are 15 ° to 45 °.
On above-described embodiment preferably, described fluorescent material band 6 is inverted v-shaped.
Based on above-mentioned, LED chip is directly encapsulated on substrate by this utility model, it is not necessary to extra chip cooling and electrode
The structures such as lead frame, simplify LED packaging technology, shorten LED and encapsulate flow process, it is often more important that can save packaging cost,
The luminous reflectance that LED chip is sent by reflector is gone out；Epoxy resin outer housing protection LED internal structure, simultaneously that reflector is anti-
Outgoing after the light convergence penetrated, fluorescent material band, in the position farthest apart from LED chip, increases brightness, and temperature influence is little.
The foregoing is only preferred embodiment of the present utility model, not in order to limit this utility model, all in this practicality
Any amendment, equivalent and the improvement etc. made within novel spirit and principle, should be included in protection of the present utility model
Within the scope of.
Claims (4)
1. a light emitting diode construction for chip on board integration packaging, including substrate (1) and LED chip (2), described substrate (1)
Centre is provided with chip slot (3), and described LED chip (2) is installed on chip slot (3), it is characterised in that described chip
Groove (3) is circular, and its edge connects that to have reflector (4), described reflector (4) be reversed round bench shaped, described reflector
(4) connection has epoxy resin outer housing (5), and described epoxy resin outer housing (5) is hemispherical, described epoxy resin outer housing (5)
Inside it is provided with fluorescent material band (6).
The light emitting diode construction of a kind of chip on board integration packaging the most according to claim 1, it is characterised in that: described chip
Groove (3) uses electro-insulating rubber material.
The light emitting diode construction of a kind of chip on board integration packaging the most according to claim 1, it is characterised in that: described reflective
The bus of cup (4) and substrate are 15 ° to 45 °.
The light emitting diode construction of a kind of chip on board integration packaging the most according to claim 1, it is characterised in that: described fluorescence
Powder band (6) is inverted v-shaped.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620244660.9U CN205488207U (en) | 2016-03-25 | 2016-03-25 | Emitting diode structure of integrated encapsulation of chip on board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620244660.9U CN205488207U (en) | 2016-03-25 | 2016-03-25 | Emitting diode structure of integrated encapsulation of chip on board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205488207U true CN205488207U (en) | 2016-08-17 |
Family
ID=56648396
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620244660.9U Expired - Fee Related CN205488207U (en) | 2016-03-25 | 2016-03-25 | Emitting diode structure of integrated encapsulation of chip on board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205488207U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109346589A (en) * | 2018-10-23 | 2019-02-15 | 杭州倾诺光电科技有限公司 | A kind of package assembling and packaging technology of LED lamp bead |
-
2016
- 2016-03-25 CN CN201620244660.9U patent/CN205488207U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109346589A (en) * | 2018-10-23 | 2019-02-15 | 杭州倾诺光电科技有限公司 | A kind of package assembling and packaging technology of LED lamp bead |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160817 Termination date: 20190325 |