CN205429128U - Intermodulation load is hanged down to high stability - Google Patents
Intermodulation load is hanged down to high stability Download PDFInfo
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- CN205429128U CN205429128U CN201620174834.9U CN201620174834U CN205429128U CN 205429128 U CN205429128 U CN 205429128U CN 201620174834 U CN201620174834 U CN 201620174834U CN 205429128 U CN205429128 U CN 205429128U
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- inner core
- load
- heat
- dissipating casing
- high stability
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Abstract
The utility model discloses an intermodulation load is hanged down to high stability, including fan -less housing, install load inner core in fan -less housing, 50 ohm of circuit boards and resistance card, and the connector, be provided with the inner core mounting hole in the fan -less housing, the load inner core set up in the inner core mounting hole and with inner core mounting hole interference fit, and fan -less housing fixed connection, the resistance card welds on the load inner core, and 50 ohm of circuit boards and resistance card pass through resistance card lead wire soldering tin and connect. Utility model's load inner core and fan -less housing adopt the interference fit structure, have guaranteed that connection structure between them is stable, and have increased area of contact between them, have increased the cooling surface of inner core promptly, have improved the whole radiating effect of device, the utility model discloses the structural stability of whole load, the ground state who connects the back loading is good, and the third order intermodulation index is stable.
Description
Technical field
This utility model relates to communication load field, specifically a kind of high stability low intermodulation load.
Background technology
Along with the development of short-wave communication tedhnology, broadband, the passive device demand of low intermodulation are increased day by day by people, and the lowest intermodulation load is applied widely due to it, and demand is the most urgent.Load is widely used in microwave system, is a single port Microwave Net, and replacement terminal, at a certain circuit output end mouth, receives power.The stock of existing composition frequency microwave power termination is resistor-type material.By certain technique resistance material is placed in the radio frequency structure of different-waveband the load being the formation of corresponding frequencies.The load of the resistance material of existing structure typically by adapter, resistor disc, 50 ohm of circuit plate circuit plates, loads inner core, and heat-dissipating casing forms.Load inner core and fin shell are by loose fit structure, adapter and load inner core are Split type structures, are also that screw is connected between wiring board, resistor disc and inner core, this non-immediate connection, the ground state of device will necessarily be affected, affect third order intermodulation index and the heat sinking function of device.
Utility model content
The technical problems to be solved in the utility model is to provide a kind of high stability low intermodulation load, and its attachment structure is stable, and radiating effect is more preferable, and third order intermodulation index is stable.
The technical solution of the utility model is:
A kind of high stability low intermodulation load, includes heat-dissipating casing, the load inner core being installed in heat-dissipating casing, 50 ohm of wiring boards and resistor disc, and adapter；It is characterized in that: in described heat-dissipating casing, be provided with inner core installing hole, described load inner core be arranged in inner core installing hole and with inner core installing hole interference fit fixing with heat-dissipating casing be connected；Described resistor disc is welded on load inner core, and 50 ohm of described wiring boards and resistor disc are connected by resistor disc lead-in wire scolding tin.
The outer conductor of described adapter is one-body molded with load inner core.
Multiple tapped through hole it is provided with on described heat-dissipating casing, being provided with multiple inner core screwed hole connected with tapped through hole on described load inner core, multiple fastening bolts sequentially pass through corresponding tapped through hole and inner core screwed hole and heat-dissipating casing and load inner core are fixed and connected.
The flange of described adapter is fixing with heat-dissipating casing patch merga pass connecting bolt to be connected.
Advantage of the present utility model:
Load inner core of the present utility model and heat-dissipating casing use over-surplus fit structure, it is ensured that both attachment structures are stable, and add both contacts area, i.e. add the radiating surface of inner core, improve the integral heat sink effect of device；The outer conductor of this utility model adapter is one-body molded with load inner core, resistor disc is welded on load inner core, 50 ohm of wiring boards and resistor disc are connected by resistor disc lead-in wire scolding tin, further increase the structural stability of overall load, the ground state connecting back loading is good, and third order intermodulation index is stable.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Detailed description of the invention
See Fig. 1, a kind of high stability low intermodulation load, include heat-dissipating casing 1,2,50 ohm of wiring boards 3 of the load inner core being installed in heat-dissipating casing 1 and resistor disc 4, and adapter；Inner core installing hole 5 it is provided with in heat-dissipating casing 1, in load inner core 2 is arranged at inner core installing hole 5 and with inner core installing hole 5 interference fit, multiple tapped through hole 6 it is provided with on heat-dissipating casing 1, being provided with multiple inner core screwed hole 7 connected with tapped through hole 6 on load inner core 2, multiple fastening bolts 8 sequentially pass through corresponding tapped through hole 6 and inner core screwed hole 7 and heat-dissipating casing 1 and load inner core 2 are fixed and connected；The flange 10 of adapter pastes with heat-dissipating casing 1 that merga pass connecting bolt is fixing to be connected；The outer conductor 9 of adapter is one-body molded with load inner core 2, and resistor disc 4 is welded on load inner core 2, and 50 ohm of wiring boards 3 and resistor disc 4 are connected by resistor disc lead-in wire scolding tin.
Claims (4)
1. a high stability low intermodulation load, it is characterised in that: include heat-dissipating casing, the load inner core being installed in heat-dissipating casing, 50 ohm of wiring boards and resistor disc, and adapter；It is characterized in that: in described heat-dissipating casing, be provided with inner core installing hole, described load inner core be arranged in inner core installing hole and with inner core installing hole interference fit fixing with heat-dissipating casing be connected；Described resistor disc is welded on load inner core, and 50 ohm of described wiring boards and resistor disc are connected by resistor disc lead-in wire scolding tin.
A kind of high stability low intermodulation load the most according to claim 1, it is characterised in that: the outer conductor of described adapter is one-body molded with load inner core.
A kind of high stability low intermodulation load the most according to claim 1, it is characterized in that: on described heat-dissipating casing, be provided with multiple tapped through hole, being provided with multiple inner core screwed hole connected with tapped through hole on described load inner core, multiple fastening bolts sequentially pass through corresponding tapped through hole and inner core screwed hole and heat-dissipating casing and load inner core are fixed and connected.
A kind of high stability low intermodulation load the most according to claim 1, it is characterised in that: the flange of described adapter is fixing with heat-dissipating casing patch merga pass connecting bolt to be connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620174834.9U CN205429128U (en) | 2016-03-08 | 2016-03-08 | Intermodulation load is hanged down to high stability |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620174834.9U CN205429128U (en) | 2016-03-08 | 2016-03-08 | Intermodulation load is hanged down to high stability |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205429128U true CN205429128U (en) | 2016-08-03 |
Family
ID=56534148
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620174834.9U Active CN205429128U (en) | 2016-03-08 | 2016-03-08 | Intermodulation load is hanged down to high stability |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205429128U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112087917A (en) * | 2020-07-27 | 2020-12-15 | 南京安尔泰通信科技有限公司 | High-power low-intermodulation load with good heat dissipation effect |
-
2016
- 2016-03-08 CN CN201620174834.9U patent/CN205429128U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112087917A (en) * | 2020-07-27 | 2020-12-15 | 南京安尔泰通信科技有限公司 | High-power low-intermodulation load with good heat dissipation effect |
| CN112087917B (en) * | 2020-07-27 | 2022-06-10 | 南京安尔泰通信科技有限公司 | High-power low-intermodulation load with good heat dissipation effect |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |