CN205319140U - Sheet separator for circuit substrate - Google Patents

Sheet separator for circuit substrate Download PDF

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Publication number
CN205319140U
CN205319140U CN201521089897.6U CN201521089897U CN205319140U CN 205319140 U CN205319140 U CN 205319140U CN 201521089897 U CN201521089897 U CN 201521089897U CN 205319140 U CN205319140 U CN 205319140U
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CN
China
Prior art keywords
circuit board
board use
use sheet
sheet material
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201521089897.6U
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Chinese (zh)
Inventor
福本孝
高桥秀明
新仓康夫
儿岛秀俊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ricoh Co Ltd
Original Assignee
Ricoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2015245718A external-priority patent/JP2016124707A/en
Application filed by Ricoh Co Ltd filed Critical Ricoh Co Ltd
Application granted granted Critical
Publication of CN205319140U publication Critical patent/CN205319140U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)

Abstract

The utility model provides a can be simply carry out the sheet separator for circuit substrate that separates to sheet for the circuit substrate. This sheet separator for circuit substrate includes: the portion of acceping for accept stromatolithic for circuit substrate sheet, jet -propelled unit spouts to the tip of sheet for the circuit substrate, make this for the circuit substrate sheet float, keep parts is set up the top at jet -propelled unit for keep the sheet for the circuit substrate of come -up and separate.

Description

Circuit board use sheet separation device
Technical field
The utility model relates to and circuit board use sheet separation method and circuit board use sheet separation device.
Background technology
Such as, always have the prepreg device that prepreg can be separated and carry and method (with reference to patent documentation 1).
Patent Document 1 discloses following prepreg feedway and prepreg supply method. Namely, according to the document, by utilizing the rotatable absorption layers such as cylinder, the end as adsorption section of the 1st prepreg in the prepreg of overlap is adsorbed and carries (top rotation), and by the absorption layer utilizing another cylinder to carry out moving up and down the end of the 2nd prepreg adsorbed and carry. Then, two absorption layers are moved horizontally simultaneously, such as, moves 50mm degree such that it is able to 2 prepregs that separately conveying needs.
But, according to the technology that patent documentation 1 is recorded, in order to make the 1st prepreg be separated with the 2nd prepreg, it is necessary to individually carry out absorption action and top spinning movement etc., and it is difficult to realize the separation of simple prepreg.
<prior art literature>
<patent documentation>
Patent documentation 1:(Japan) JP 2003-311769 publication
Summary of the invention
<problem to be solved in the utility model>
The utility model, in view of above problem, its object is to provide a kind of and is easily separated by circuit board use sheet material, and can't harm the circuit board use sheet separation method of the quality in circuit board use sheet material.
<solving the means of above-mentioned problem>
In order to reach above-mentioned purpose, circuit board use sheet separation method of the present utility model comprises: the 1st operation, and by carrying out jet by air injection unit to the circuit board use sheet material of lamination, and float in the end making this circuit board use sheet material; 2nd operation, after described 1st operation, keeps, by keeping parts, the described circuit board use sheet material floated and is separated.
<practical novel effect>
According to the utility model, it may be possible to provide easily carry out being separated and can't harm the circuit board use sheet separation method in circuit board use sheet quality.
Accompanying drawing explanation
Fig. 1 is the signal oblique drawing of the outward appearance representing the circuit board use sheet separation e Foerderanlage used in the circuit board use sheet separation carrying method of enforcement mode 1 of the present utility model.
Fig. 2 is the oblique drawing of the circuit board use sheet separation e Foerderanlage representing enforcement mode 1.
Fig. 3 is the schematic diagram of the separate stage of the circuit board use sheet material represented in the circuit board use sheet separation e Foerderanlage of enforcement mode 1.
Fig. 4 is the orthographic plan of the circuit board use sheet separation e Foerderanlage representing enforcement mode 1.
Fig. 5 is the schema representing the main operation performed by the circuit board use sheet separation e Foerderanlage of enforcement mode 1.
Fig. 6 A is the figure of the action passing state of the circuit board use sheet separation e Foerderanlage representing enforcement mode 1.
Fig. 6 B is the figure of the action passing state of the circuit board use sheet separation e Foerderanlage representing enforcement mode 1.
Fig. 6 C is the figure of the action passing state of the circuit board use sheet separation e Foerderanlage representing enforcement mode 1.
Fig. 7 A is the figure representing that shape is passed in the action of circuit board use sheet separation e Foerderanlage after Fig. 6 C.
Fig. 7 B is the figure representing that shape is passed in the action of circuit board use sheet separation e Foerderanlage after Fig. 6 C.
Fig. 8 be represent enforcement mode 2 be transferred in material separation carrying method use the signal oblique drawing being transferred material separate transfer.
Fig. 9 be for illustration of enforcement mode 2 floating keep e Foerderanlage to the schematic diagram of the absorption maintenance action being transferred material.
Figure 10 is the figure representing other concrete examples that the floating of enforcement mode 1 or enforcement mode 2 keeps e Foerderanlage etc.
Figure 11 be for illustration of enforcement mode 3 floating keep e Foerderanlage to the schematic diagram of the absorption maintenance action being transferred material.
Figure 12 be for illustration of enforcement mode 4 floating keep e Foerderanlage to the schematic diagram of the absorption maintenance action being transferred material.
Nomenclature
1 circuit board use sheet bundle, it is transferred material bundle
1A, 1B, 1C circuit board use sheet material, it is transferred material
130 circuit board use sheet separation e Foerderanlages (example of circuit board use sheet separation device)
130A is transferred material separate transfer (being transferred material tripping device)
136 loadings platform (resettlement section)
137 side rail
138 front end guide plates
139 afterbody railings
160 float keeps e Foerderanlage (keeping an example of parts)
160A, 160B, 160C (the 1st keeps parts-3 to keep an example of parts)
161 conveying belt (form and keep parts)
162 driving rods
163 driven rods
164 suction holes
300,300A, 300B air nozzle device (example of air injection unit, the 1st air ejection member)
310 negative pressure chambers
320 air chambers
322 floating nozzles (structure of air injection unit, the 1st air ejection member)
330 floating blower fans
370 sidepiece air nozzles (structure of air injection unit, the 2nd air ejection member)
380 sidepiece blower fans
390 attraction blower fans
Aa floating air
Ac sidepiece air
X throughput direction (example of the throughput direction of circuit board use sheet material, the throughput direction being transferred material)
Y width (example in the direction orthogonal with the stack direction of circuit board use sheet material relative to the throughput direction of circuit board use sheet material, the direction orthogonal with the stack direction being transferred material relative to the throughput direction being transferred material)
Z upper and lower is to (example of the stack direction of circuit board use sheet material, the stack direction being transferred material)
Embodiment
Hereinafter, with reference to accompanying drawing, enforcement mode of the present utility model is described in detail, wherein comprises embodiment. In each enforcement mode etc., if without the possibility confused, the textural element (parts or structural parts) etc. with identical function and shape is adopted identical symbol, illustrates and once omit repetition afterwards.
(implementing mode 1)
Circuit board use sheet separation method and circuit board use sheet material carrying method about enforcement mode 1 of the present utility model are described. What Fig. 1 represented is an enforcement mode of the device for the circuit board use sheet separation method and circuit board use sheet material carrying method implementing enforcement mode 1 of the present utility model. At this, as objective for implementation of the present utility model Fig. 1 shown in circuit board use sheet separation e Foerderanlage 130, be not limited to illustrated structure, using have arrange function, detection function etc. various devices as object.Circuit board use sheet separation e Foerderanlage 130 plays function as the circuit board use sheet separation device of circuit board use sheet material conveyor and forming circuit substrate sheet material conveyor.
As the circuit board use sheet material of separation conveying object of the present utility model, comprise the sheet material for well-known all circuit substrates. Such as comprise, the fibee reinforced material such as carbon fiber or woven fiber glass is flooded in the heat-curing resin being mixed with the additive such as solidifying agent, tinting material etc., then by heating or dry and obtain the reinforced plastic shaped material (prepreg) of the sheet of semi-cured state. In addition, prepreg or resin sheet etc. also comprise the material through the process such as Copper Foil or goldleaf.
About the width dimensions of circuit board use sheet material, such as, adopt the size of roughly 100mm-700mm degree. In addition, about thickness, such as, adopt the size of 0.02mm-0.2mm degree.
At this, the thickness of foregoing circuit substrate sheet material is only an example, naturally it is also possible to adopt the thickness beyond above-mentioned scope.
At this, throughput direction X is equivalent to the throughput direction of circuit board use sheet. Upper and lower is equivalent to the stack direction of circuit board use sheet material to Z. Width Y is equivalent to circuit board use sheet material
Referring to Fig. 1-Fig. 4, e Foerderanlage is kept to be described about the floating of circuit board use sheet separation e Foerderanlage and forming circuit substrate sheet separation e Foerderanlage. Fig. 1 is the signal oblique drawing representing circuit board use sheet separation e Foerderanlage, Fig. 2 is the oblique drawing representing circuit board use sheet separation e Foerderanlage, Fig. 3 is the schematic diagram of the separate stage of the circuit board use sheet material represented in circuit board use sheet separation e Foerderanlage, and Fig. 4 is the orthographic plan representing circuit board use sheet separation e Foerderanlage. The hollow arrow and the filled arrows that are suitable for sign in each figure represent that the air of each device passes in and out direction.
As shown in Figure 2, circuit board use sheet bundle 1 is made up of multiple circuit board use sheet materials of layer-by-layer state. In circuit board use sheet separation e Foerderanlage 130, circuit board use sheet bundle 1 is configured in as on the loading platform 136 of resettlement section using layer-by-layer state by collecting.
Load platform 136 and play function as preparatory unit, circuit board use sheet material is prepared to layer-by-layer state. Load platform 136 by driving the hoisting appliance of unit as circuit board use sheet material loading portion, it is possible to move to Z at upper and lower. In addition, circuit board use sheet separation e Foerderanlage 130 possesses detecting sensor 20 and circuit board use sheet locations control unit, this detecting sensor 20 is the circuit board use sheet detection unit of the upper position for detecting circuit board use sheet bundle 1, the driving of this circuit board use sheet locations control unit control hoisting appliance, thus the pilot circuit substrate upper position of sheet bundle 1. Thus, when reaching, above the circuit board use sheet bundle 1 loaded on platform 136, the desired height position detected out by detecting sensor 20, by action described later, the circuit board use sheet material 1A of upper is separated and carries.
Circuit board use sheet separation e Foerderanlage 130 is provided with one to as multiple guiding parts such as the side rail 137 of circuit board use sheet locations limiting part, front end guide plate 138, afterbody railings 139. Side rail 137 is configured in the both sides of circuit board use sheet width direction Y loading platform 136, the position of width Y of circuit board use sheet material of report to the leadship after accomplishing a task for the throughput direction X of the circuit board use sheet bundle 1 determined and configure (orthogonal).Front end guide plate 138 determines to be equivalent to the position of the length direction front end of the throughput direction X of circuit board use sheet bundle 1. Further, afterbody railing 139 determines the position of this length direction rear end. Above-mentioned multiple guiding parts can also be separated from one another and arrange
Being provided with the sidepiece air nozzle 370 as shown in chain double-dashed line at side rail 137 place (in figure left side depths) of Fig. 2, this sidepiece air nozzle 370 has as the function end, side of circuit board use sheet bundle 1 spray, being blown out the arrangement blowing unit of sidepiece air Ac (reference Fig. 4), the 2nd air ejection member of air injection unit. As shown in Figure 4, sidepiece air nozzle 370 is connected with sidepiece blower fan 380, and this sidepiece blower fan 380 has the function generating sidepiece air Ac.
The circuit board use sheet separation e Foerderanlage 130 of Fig. 2 keeps e Foerderanlage 160 with the floating of Fig. 3, possesses and drives rod 162, driven rod 163, conveying belt 161, negative pressure chamber 310. Driving rod 162 to be driven in rotation by drive shaft 162a, driven rod 163 rotates along with by the conveying belt 161 driving rod 162 to drive and rotate. Conveying belt 161 is the ring-shaped tape member being provided with the multiple suction holes being connected with negative pressure chamber 310. Negative pressure chamber 310 is connected to the attraction blower fan 390 shown in Fig. 4, because the air of the attraction blower fan 390 of outside attracts and keep negative pressure state, and by the suction hole of conveying belt 161, the circuit board use sheet material 1A of upper is attracted, is adsorbed. Blower fan 390 is attracted to have the function of the generation unit of the attraction air for generating attraction air.
As mentioned above, float and keep the conveying belt 161 of e Foerderanlage 160 to have adsorbing, as the negative pressure produced by air-breathing, the maintenance parts keeping the circuit board use sheet material carrying out floated to be separated, and the function as the supply unit that the circuit board use sheet material of maintenance is carried.
E Foerderanlage 160 is kept, according to the size of circuit board use sheet material, it is possible to strengthening floats keeps the size of e Foerderanlage 160, or multiple floating can be used to keep e Foerderanlage 160 as floating.
Can float keep e Foerderanlage 160 that circuit board use sheet material has carried out maintenance and separation after start to carry, it is also possible to keeping and just starting to carry before being separated.
In addition, the state being floated and keeping e Foerderanlage 160 to keep at least partially of the circuit board use sheet material of floating is kept referring to.
In the position relative with the front end of the circuit board use sheet bundle 1 being loaded, it is configured with the air nozzle device 300 as air injection unit. Being provided with air chamber 320 at air nozzle device 300, the air (being also referred to as below " gas ") as external pressurised gas is admitted to and is stored in this air chamber 320. In addition, as shown in Figure 3, Figure 4, air chamber 320 is provided with two floating nozzles 322.
As mentioned above, it is necessary, air nozzle device 300 plays function as floating unit, the circuit board use sheet material that loading platform 136 loads preparation is floated. In addition, air nozzle device 300 also as to the circuit board use sheet material being loaded jet and make it float air injection unit, and to the reverse direction of throughput direction X jet the 1st air ejection member play function.
The direction of injection air is the reverse direction of throughput direction X, and not necessarily is parallel direction, it is also possible to be tilted direction.
Air after also comprising eliminostatic as the air of gas, and other are for making circuit board use sheet material float and make it the gas etc. of 1 separation.Especially comprising the circuit board use sheet material of carbon fiber, the circuit board use sheet material of layer-by-layer state is close to not easily separated each other because of electrostatic interaction, and therefore, the air after the circuit board use sheet bundle 1 of layer-by-layer state is sprayed eliminostatic is comparatively effective.
As shown in Figure 3, Figure 4, floating nozzle 322 sprays floating air Aa to the end (following, to be also referred to as leading section) of the front side of circuit board use sheet bundle 1, so that circuit board use sheet material floats from circuit board use sheet bundle 1. In addition, such as, can also arranging the mechanism making sheet material off normal, floating nozzle 322, for the position being closer to central authorities than the leading section of circuit board use sheet bundle 1, makes the end of circuit board use sheet material float. At this, if the air of ejection is warm air, except the effect on moisture extraction to circuit board use sheet material, additionally it is possible to more effectively carry out being separated, arrange.
Fig. 5 is the figure representing the main operation performed by the circuit board use sheet separation device of present embodiment and circuit board use sheet material conveyor used in circuit board use sheet separation method of the present utility model and circuit board use sheet material carrying method. Fig. 6, Fig. 7 are the figure passed for illustration of the action of circuit board use sheet material conveyor.
First, with reference to Fig. 6 A, structure and action to foregoing circuit substrate sheet separation e Foerderanlage 130 carry out supplementing explanation. In circuit board use sheet separation e Foerderanlage 130 shown in Fig. 6 A, from air chamber 320 towards the front end face injection floating air Aa loading platform 136 the circuit board use sheet bundle 1 loaded, utilize this wind-force, make it to float up to the height of conveying belt 161 (circuit board use sheet material maintaining part).
Then, by attracting the start of blower fan 390, make 1 of the top of conveying belt 161 retaining circuit substrate sheet bundle 1. The circuit board use sheet material 1A of the upper that conveying belt 161 keeps and not necessarily is 1, also comprise the situation that circuit board use sheet material is kept with the state being close to each other. To this, spraying sidepiece air by the sidepiece air nozzle 370 as arrangement blowing unit being located on side rail 137,137, the circuit board use sheet material 1A kept by conveying belt 161 arranges, and makes it 1 separately. Arrangement refers to, by spraying air by sidepiece air nozzle, reduces the clinging force between circuit board use sheet material, thus auxiliary separating treatment.
Then, circuit board use sheet material 1A, by the conveying of conveying belt 161, is transported to the point of delivery as point of destination (such as, next operation), carries out necessary process thereafter.
Between air chamber 320 and the circuit board use sheet bundle 1 being loaded into topmost, it is configured with circuit board use sheet material cut-off parts 177, to prevent being carried by the circuit board use sheet material outside the circuit board use sheet material 1A of upper. In addition, the distance h between the uppermost position of the circuit board use sheet material reduced to make the supply along with circuit board use sheet material and conveying belt 161 remains fixing, is provided with the detecting sensor 20 of the height for detecting circuit board use sheet material. Detection sensing body 20 is the optical sensor of reflection-type. Signal according to detecting sensor 20, drives unit (hoisting appliance) by circuit board use sheet material loading portion, makes loading platform 136 increase and adjusts.
In order to make the circuit board use sheets of sizes on loading platform 136 coordinate, circuit board use sheet bundle 1 is alignd using its front end face as reference plane.In addition, in the downstream floating the throughput direction X keeping e Foerderanlage roller 160, being provided with the supply sensor 179 as detection portion, this supply sensor 179 is for detecting the arrival position of circuit board use sheet material.
Next, about action, the operation of circuit board use sheet separation e Foerderanlage 130, it is described in order.
(1) at the preparatory process (step S1) that circuit board use sheet material is prepared to layer-by-layer state, such as, following process is carried out. Specifically, by operator, circuit board use sheet bundle 1 is loaded on loading platform 136, now using its front end face as reference plane, aligns near front end guide plate 138 and arrange, so that circuit board use sheets of sizes coordinates. In addition, by operation side rail 137 and afterbody railing 139, make side end face and the aft end face alignment of circuit board use sheet bundle 1 respectively. In addition, in preparatory process, such as, the manual operation of operator be can also replace with robot or special purpose device, the loading action of circuit board use sheet bundle 1 as above or the alignment of circuit board use sheets of sizes carried out.
When receiving circuit board use feeding sheet materials instruction from the control portion of the circuit board use sheet separation e Foerderanlage 130 of Fig. 1, as shown in Figure 6B, the air chamber 320 of air nozzle device 300, the arrangement blowing unit that comprises sidepiece air nozzle 370 carry out start. Then, start to carry out the floating operation as the 1st operation, carry out jet (the step S2 of Fig. 5) to each end of circuit board use sheet material. By spraying floating air Aa by the floating nozzle 322 of air chamber 320, and spray sidepiece air Ac by sidepiece air nozzle 370, topmost circuit board use sheet material 1A, 1B, the 1C on ready loading platform 136 is floated. Consequently, it is possible to circuit board use sheet material 1A, 1B, 1C of change topmost contact area each other.
Meanwhile, start to carry out the maintenance operation as the 2nd operation, keep the circuit board use sheet material (the step S3 of Fig. 5) floated, and start to carry out air-breathing by conveying belt 161. Thus, the circuit board use sheet material 1A of upper floats, and as shown in Figure 6B, the circuit board use sheet material 1A of upper is transferred band 161 and adsorbs and keep.
In addition, in fig. 6b, with (AD) of bracket, the symbol of air chamber 320 and conveying belt 161 represents that air chamber 320 is in jet drive state, and conveying belt 161 is in attraction driving state. In addition, with (ST) of bracket, the symbol of conveying belt 161 represents that conveying belt 161 is in stopping state.
" finishing process " of the step S4 of Fig. 5 is the operation that the circuit board use sheet material kept by conveying belt 161 arranges, as mentioned above, it is necessary, undertaken by the arrangement blowing unit comprising sidepiece air nozzle 370.
(2) following, as shown in Figure 6 C, conveying belt 161 starts to drive, and carries out conveying operation, carries the circuit board use sheet material 1A (the step S5 of Fig. 5) kept by conveying belt 161.
In addition, in figure 6 c, in the symbol of conveying belt 161 with bracket (AD) represent be in rotate feed drive state.
(3) following, as shown in Figure 7 A, after circuit board use sheet material 1A arrives supply sensor 179, after the specified time, after circuit board use sheet material 1A departs from conveying belt 161, feed drive of stopping the rotation.
(4) circuit board use sheet material 1A mono-departs from the retaining zone of conveying belt 161, and as shown in Figure 7 B, next circuit board use sheet material 1A just by jet and float, is transferred band 161 maintenance.
(5) according to the circuit board use feeding sheet materials interval of setting, conveying belt 161 starts to drive again, carries out circuit board use sheet material 1A and supplies.
Then, (6) Fig. 6 B~Fig. 7 B is repeated, in order delivery circuit substrate sheet material.
In above-mentioned circuit board use feeding sheet materials action, record the air air quantity of air chamber 320, arrangement blowing unit, attraction blower fan 390. When air air quantity is fixed to certain value, the float-amount of circuit board use sheet material and collating condition, different according to the thickness of the circuit board use sheet material loaded, weight and size.
Such as, if the float-amount of circuit board use sheet material is little, causing cut-off (not feeding), on the contrary, when circuit board use sheet material excessively floats, circuit board use sheet material is close to mutually and is caused multiple supply. In addition, if attract blower fan 390 suction little, then cannot smooth delivery of power circuit board use sheet material, also can cause cut-off.
Therefore, in order to carry out suitable circuit board use feeding sheet materials, circuit board use sheet material according to loading predetermines air quantity, when have selected the circuit board use sheet material wanting to carry out circuit board use feeding sheet materials as user or operator, automatically provides corresponding air quantity. Further, this air quantity is adjusted by sky (duty) value that accounts for of blower fan.
Use the circuit substrate having the circuit board use sheet material of damage to make, the problem that electrical specification (resistance value) can be occurred bad. Therefore, problem when being separated by circuit board use sheet material is, it is necessary to prevent separated circuit board use sheet material generation electrical specification (resistance value) bad.
For the problems referred to above, following effect can be obtained by enforcement mode 1. Implementing in mode 1, circuit board use sheet separation method comprises: the preparatory process such as step S1 that circuit board use sheet bundle 1 circuit board use sheet material such as grade is prepared to layer-by-layer state; By carrying out jet by air injection unit, air ejection member such as air nozzle devices 300 to the circuit board use sheet material of lamination, and make the 1st operations (floating operation) such as step S2 that circuit board use sheet material floats; Parts are kept to keep the circuit board use sheet material floated and carry out the 2nd operations (maintenance operation) such as the step S3 that is separated by conveying belt 161 etc.
According to enforcement mode 1, its basic effect is, can provide a kind of and enough propose the separation easily carrying out circuit board use sheet material, and can't harm the circuit board use sheet separation method of the quality in circuit board use sheet material (circuit board use sheet material can not be damaged). Use the circuit substrate having the circuit board use sheet material of damage to make, the bad characteristic such as resistance value can occur. But, according to enforcement mode 1, a kind of separation that can easily carry out circuit board use sheet material can be provided, and can't harm the circuit board use sheet separation method of the quality in circuit board use sheet material (circuit board use sheet material can not be damaged), therefore, it is possible to prevent the bad problem of above-mentioned circuit substrate. This effect can solve the distinctive technical problem relevant to circuit board use sheet separation.
In the circuit board use sheet separation method implementing mode 1, as air injection unit, use the reverse direction of the throughput directions such as the throughput direction X to circuit board use sheet material to carry out jet air nozzle device 300 grade the 1st air ejection member, and carry out the 2nd air ejection member such as jet sidepiece air nozzle 370 to widths such as the width Y orthogonal with throughput direction.
In addition, in the circuit board use sheet separation method implementing mode 1, the 2nd operation comprises by the 2nd air ejection member arrangement steps such as the step S4 that circuit board use sheet material arranges.
In addition, in the circuit board use sheet separation method implementing mode 1, after the 2nd operation terminates, stop the jet of air ejection member.
In addition, implement mode 1 circuit board use sheet separation method in, conveying belt 161 grade keep parts, the negative pressure produced by air-breathing adsorb and keep float circuit board use sheet material.
In addition, in the circuit board use sheet separation method implementing mode 1, to for loading circuit substrate sheet material and the loading platform that can carry out lifting on the stack direction of circuit board use sheet material carries out elevating control so that the upper position of circuit board use sheet material loaded on this loading platform remains fixed position.
According to enforcement mode 1, its effect is to provide a kind of separation enough proposed easily and really carry out circuit board use sheet material, and can't harm the circuit board use sheet separation method of the quality in circuit board use sheet material (can not damage circuit board use sheet material).
In addition, enforcement mode 1 provides a kind of circuit board use sheet material carrying method using circuit board use sheet separation device, comprising conveying operations such as the step S5 for being carried by the circuit board use sheet material kept.
According to enforcement mode 1, its effect is, can provide a kind of circuit board use sheet material carrying method that can be really carried by separated circuit board use sheet material. Use the circuit substrate having the circuit board use sheet material of damage to make, the bad characteristic such as resistance value can occur. But, according to enforcement mode 1, a kind of separation that can easily carry out circuit board use sheet material can be provided, and can't harm the circuit board use sheet separation method of the quality in circuit board use sheet material (circuit board use sheet material can not be damaged), accordingly, it may be possible to prevent the bad problem of above-mentioned circuit substrate. This effect can solve the distinctive technical problem relevant to circuit board use sheet separation.
In addition, the technology structure of enforcement mode 1 relate to and a kind of there is the resettlement sections such as the loading platform 136 for the circuit board use sheet materials such as circuit board use sheet bundle 1 are prepared to layer-by-layer state, the circuit board use sheet separation device such as end to ready lamination circuit board use sheet material carries out jet and air injection unit such as air nozzle device 300 that this circuit board use sheet material is floated, the top that is arranged on air injection unit the conveying belt 161 etc. that is used for keeping the circuit board use sheet material floated keep parts circuit board use sheet separation e Foerderanlage 130. At this, " top " also comprises the meaning of oblique upper etc. directly over being not limited to.
According to enforcement mode 1, its effect is, can provide a kind of and enough propose the separation easily carrying out circuit board use sheet material, and can't harm the circuit board use sheet separation device of the quality in circuit board use sheet material. Use the circuit substrate having the circuit board use sheet material of damage to make, the bad characteristic such as resistance value can occur. But, according to enforcement mode 1, a kind of separation that can easily carry out circuit board use sheet material can be provided, and can't harm the circuit board use sheet separation device of the quality in circuit board use sheet material (circuit board use sheet material can not be damaged), therefore, it is possible to prevent the bad problem of above-mentioned circuit substrate. This effect can solve the distinctive technical problem relevant to circuit board use sheet separation.
(implementing mode 2)
Referring to Fig. 8, Fig. 9, the material separate transfer 130A that is transferred about enforcement mode 2 of the present utility model is described.Fig. 8 is the signal oblique drawing being transferred material separate transfer representing enforcement mode 2, and Fig. 9 is that to being transferred, material adsorbs and the schematic diagram of action that keeps for illustration of keeping e Foerderanlage by the floating of Fig. 8.
Enforcement mode 2 uses and is transferred material separate transfer 130A.
It is transferred material to comprise and can carry out being separated the electronic circuit board thin slices etc. such as the parts of the thin plate shape of conveying or thin slice shape, electronic circuit board material through the tinsels such as Copper Foil or coating process etc., paper, special film, plastic film, prepreg by the material separate transfer that is transferred of the present utility model. In addition, as being transferred material, can be undertaken being separated by the material separate transfer that is transferred of the present utility model, be not limited to thin plate shape or the parts of thin slice shape.
At this, it is described about the size (horizontal size × vertical size) being transferred material. Large size is roughly horizontal size 700mm × vertical size 700mm, and middle size is roughly horizontal size 420mm × vertical size 594mm, and little size is roughly horizontal size 210mm × vertical size 297mm.
Enforcement mode 2 be transferred material separate transfer 130A, as shown in Figure 8, it may also be useful to 2 air nozzle devices 300A, 300B being set up along width Y and 2 float and keep e Foerderanlage 160A, 160B. Float keep e Foerderanlage 160A, 160B be arranged on relative to be transferred material throughput direction X and as the different positions on the vertical direction of the height direction Z of the above-mentioned stack direction being transferred material and width Y, not must spread configuration. The buoyancy of the width Y being transferred material is increased by 2 air nozzle devices 300A, 300B, and the attractive holding force of the width Y keeping e Foerderanlage 160A, 160B increase to be transferred material that floated by 2.
2 air nozzle devices 300A, 300B have the internal structure identical with the single air nozzle device 300 of enforcement mode 1 respectively. By the floating blower fan of air nozzle device 300A, 300B is carried out ON/OFF control respectively, thus floated keep e Foerderanlage 160A, 160B to keep and after being separated, stop jet at the material that is transferred floated. In addition, illustrate the negative pressure produced by air-breathing in the present embodiment and carry out adsorbing the maintenance parts keeping and being separated, but be not limited to air-breathing, it is also possible to comprise electrostatic adhesion.
2 float maintenance e Foerderanlage 160A, 160B have the identical internal structure of the maintenance e Foerderanlage 160 of the floating with enforcement mode 1 respectively. Float and keep e Foerderanlage 160A as the 1st maintenance parts of the present utility model, float and keep e Foerderanlage 160B as the 2nd maintenance parts of the present utility model, play function respectively.
Float and keep e Foerderanlage 160A to keep e Foerderanlage 160B with floating, as shown in Figure 9, along width Y adjacent configuration each other. As shown in Figure 9, the material 1A that is transferred of floating is kept by the conveying belt 161 of the maintenance e Foerderanlage 160A that floated, and is then adsorbed by the conveying belt 161 of the maintenance e Foerderanlage 16B that floats and keeps. About the control method being transferred material 1A and being kept by floating e Foerderanlage 160A, the order keeping the respective conveying belt 161 of e Foerderanlage 160B to adsorb maintenance that floats, by respectively attraction blower fan 390 (with reference to Fig. 4) being carried out ON/OFF control, to realize order as above. The time no matter opened is similar and different, it is possible to keeps being transferred material 1A by this order and gets final product (control of enforcement mode 2-4 described later is also identical).In addition, the 1st maintenance parts keep the parts can also be separated from one another and arrange with the 2nd.
As mentioned above, it is necessary, according to enforcement mode 2, can provide and can easily be separated, and can't harm being transferred material separation method and being transferred material tripping device in the quality being transferred material. That floats is transferred material, is kept e Foerderanlage 160A to keep by floating, is then kept e Foerderanlage 160B to keep by the floating of adjacent configuration. Therefore, what kept e Foerderanlage 160A maintenance by floating is transferred material, it is possible to keep e Foerderanlage 160B to keep by floating without bending non-wrinkledly. Therefore, can easily be separated, and can't harm in the quality being transferred material.
At this, " maintenance parts " of the present utility model are defined. That is, " maintenance parts " refer to, carry out air-breathing and a unit of conveying belt driving.
Such as, as shown in Figure 10, float and keep in e Foerderanlage 160X, although 3 conveying belt 161a, 161b, 161c form holding unit 165, but when air-breathing and conveying belt drive by integrative control, using its entirety as 1 " maintenance parts ".
Such as, in Fig. 9, the floating shown in chain double-dashed line keeps e Foerderanlage 160A to have 3 conveying belt 161Aa, 161Ab, 161Ac, floats and keeps e Foerderanlage 160B to have 3 つ conveying belt 161Ba, 161Bb, 161Bc. In the case, air-breathing and conveying belt drive and keep to float e Foerderanlage 160A, floating to keep the unit of e Foerderanlage 160B to be controlled respectively, therefore float and keep e Foerderanlage 160A to keep e Foerderanlage 160B to be " maintenance parts " with floating.
It is controlled in the present embodiment, floating kept the floating blower fan of conveying belt 161Aa, 161Ab, 161Ac of e Foerderanlage 160A to become open state before this, and the floating blower fan of then float conveying belt 161Ba, 161Bb, 161Bc of keeping e Foerderanlage 160B becomes open state. But, in the present embodiment, keep e Foerderanlage 160A to keep being transferred material by floating after, keep e Foerderanlage 160B to keep being transferred material by floating. Therefore, such as, float keep e Foerderanlage 160A with float keep the magnetism of e Foerderanlage 160B to have a gap time, floating blower fan may become open state simultaneously.
As shown in Figure 10, float and keep in e Foerderanlage 160X, have 3 conveying belt 161a, 161b, 161c to form holding unit 165, carry out air-breathing by 1 attraction blower fan, and drive 3 conveying belt 161a, 161b, 161c by 1 drive-motor.
As shown in Figure 10,164 represent the suction hole running through conveying belt 161a, 161b, 161c and opening, the retaining zone of 166 expression circuit board use thin slices. Float and keep e Foerderanlage 160X to represent the different concrete example such as the floating maintenance e Foerderanlage 160 of enforcement mode 1 or floating maintenance e Foerderanlage 160A, 160B of enforcement mode 2.
(implementing mode 3)
Referring to Figure 11, being described about enforcement mode 3, emphasis illustrates and the difference implementing mode 2. Figure 11 keeps e Foerderanlage to the schematic diagram being transferred the absorption maintenance action that material carries out for illustration of by the floating of enforcement mode 3.
Enforcement mode 3 adopts 3 float and keep e Foerderanlage 160A, 160B, 160C. Usually, it is configured with and the air nozzle device that the 3rd is floated and keep e Foerderanlage 160C corresponding, but Figure 11 omits gas diagram. Implementing in mode 3, it is possible to utilize 3 to float and keep e Foerderanlage 160A, 160B, 160C etc., be separated being transferred material and carry.
3 float maintenance e Foerderanlage 160A, 160B, 160C have the single internal structure floating and keeping e Foerderanlage 160 identical with enforcement mode 1 respectively. In 3 air nozzle devices being omitted in figure, each floating blower fan is carried out ON/OFF control, to be floated keep e Foerderanlage 160A, 160B, 160C to keep and after being separated, stop jet at the material that is transferred floated.
Float and keep e Foerderanlage 160B as the 1st maintenance parts of the present utility model, float and keep e Foerderanlage 160C as the 2nd maintenance parts of the present utility model, float and keep e Foerderanlage 160A as the 3rd maintenance parts of the present utility model, play a role respectively.
Float and keep e Foerderanlage 160B to keep e Foerderanlage 160C with floating, as shown in figure 11, along the adjacent configuration of width Y. The maintenance e Foerderanlage 160B that floats is configured in float and keeps e Foerderanlage 160C and float keeping between e Foerderanlage 160A. In addition, the 1st maintenance parts, the 2nd maintenance parts keep the parts can be separated from one another and arrange with the 3rd.
As shown in figure 11, the material 1A that is transferred of floating is kept by the conveying belt 161 of the maintenance e Foerderanlage 160B that floats at first, is then adsorbed by the conveying belt 161 of float maintenance e Foerderanlage 160A and the maintenance e Foerderanlage 160C that floats and keeps.
As mentioned above, it is necessary, according to enforcement mode 3, can provide and can easily carry out being separated and can't harm being transferred material separation method and being transferred material tripping device in the quality being transferred material. By being arranged on, the floating keeping e Foerderanlage 160A and float between maintenance e Foerderanlage 160C that floats keeps e Foerderanlage 160B to keep to the material that is transferred floated, and is then kept e Foerderanlage 160A to keep by the floating of adjacent configuration. Therefore, what kept e Foerderanlage 160B maintenance by floating is transferred material, it is possible to keep e Foerderanlage 160A to keep by floating without bending non-wrinkledly, and then being floated keeps e Foerderanlage 160C to keep. Thus, it is possible to easily it is separated, and the quality being transferred material can not be damaged.
(implementing mode 4)
The utility model is not limited to the enforcement mode 3 shown in Figure 11, it is also possible to adopt the enforcement mode 4 shown in Figure 12. Figure 12 be for illustration of enforcement mode 4 floating keep e Foerderanlage to the schematic diagram being transferred the absorption maintenance action that material carries out.
In enforcement mode 4, comparing with enforcement mode 3, difference only is to change the conveying belt 161 by 3 float maintenance e Foerderanlage 160A, 160B, 160C, and to being transferred, material carries out adsorbing the order kept. Implementing in mode 4, float and keep e Foerderanlage 160A as the 1st maintenance parts of the present utility model, float and keep e Foerderanlage 160B as the 2nd maintenance parts of the present utility model, float and keep e Foerderanlage 160C as the 3rd maintenance parts of the present utility model, play function respectively.
Float and keep e Foerderanlage 160A to keep e Foerderanlage 160B with floating, as shown in figure 12, along the adjacent configuration of width Y. The maintenance e Foerderanlage 160B that floats is configured in float and keeps e Foerderanlage 160A and float keeping between e Foerderanlage 160C.
As shown in figure 12, the material 1A that is transferred of floating is kept by the conveying belt 161 of the maintenance e Foerderanlage 160A that floats at first, is then adsorbed by the conveying belt 161 of the maintenance e Foerderanlage 160B that floats and keeps.
As mentioned above, it is necessary, according to enforcement mode 4, can provide and can easily be separated, and can't harm being transferred material separation method and being transferred material tripping device in the quality being transferred material. Float be transferred material floated keep e Foerderanlage 160A keep, then by adjacent configuration floating keep e Foerderanlage 160B keep.Therefore, what kept e Foerderanlage 160A maintenance by floating is transferred material, it is possible to keep e Foerderanlage 160B to keep by floating without bending non-wrinkledly, and then being floated keeps e Foerderanlage 160C to keep. Accordingly, it may be possible to easily be separated, and the quality being transferred material can not be counted in.
It is illustrated about preferred implementation of the present utility model above, but the utility model is not limited to these specific enforcement modes, if it is special unrestricted in more than illustrating, it is possible within the scope of the interest purport of the present utility model described in Patent request scope, to carry out all distortion, change. Such as, it is possible to the technology item that above-mentioned enforcement mode or shape example etc. are recorded is carried out suitable combination.
In enforcement mode of the present utility model, the suitable effect recorded is only the example of the obtainable best effect of the utility model, the effect that effect of the present utility model is not limited in enforcement mode of the present utility model to record.

Claims (21)

1. a circuit board use sheet separation device, comprising:
Resettlement section, for accommodating the circuit board use sheet material of lamination;
Air injection unit, the end to described circuit board use sheet material carries out jet, and this circuit board use sheet material is floated; And
Keep parts, be arranged on the top of described air injection unit, for keep float described circuit board use sheet material and be separated.
2. circuit board use sheet separation device as claimed in claim 1, it is characterised in that,
Described maintenance parts comprise the 1st maintenance parts and the 2nd maintenance parts, and described 1st maintenance parts keep parts to be arranged on relative to carrying the different positions on direction that the stack direction of the throughput direction of described circuit board use sheet material and described circuit board use sheet material is vertical and adjoin each other with the described 2nd.
3. circuit board use sheet separation device as claimed in claim 2, it is characterised in that,
Described 1st maintenance parts and the described 2nd keep parts separated from one another and arrange.
4. circuit board use sheet separation device as claimed in claim 3, it is characterised in that,
Described circuit board use sheet separation device has the 1 couple guiding parts being oppositely arranged, the described circuit board use sheet material of lamination is led by this 1 couple guiding parts, and described 1st maintenance parts and described 2nd maintenance parts are arranged on described 1 between guiding parts.
5. circuit board use sheet separation device as claimed in claim 4, it is characterised in that,
Described 1st maintenance parts and described 2nd maintenance parts have 6 delivery section.
6. circuit board use sheet separation device as claimed in claim 5, it is characterised in that,
Described maintenance parts have adsorption section, and the described circuit board use sheet material floated is adsorbed by the negative pressure that this adsorption section is produced by air-breathing.
7. circuit board use sheet separation device as claimed in claim 1, it is characterised in that,
Described maintenance parts comprise the 1st maintenance parts, the 2nd maintenance parts and the 3rd maintenance parts, the different positions that described 1st maintenance parts, described 2nd maintenance parts and described 3rd maintenance parts are arranged on the direction vertical relative to the stack direction of the throughput direction of the described circuit board use sheet material of conveying and described circuit board use sheet material.
8. circuit board use sheet separation device as claimed in claim 7, it is characterised in that,
Described 1st maintenance parts, described 2nd maintenance parts and described 3rd maintenance parts are separated from one another and arrange.
9. circuit board use sheet separation device as claimed in claim 8, it is characterised in that,
Described circuit board use sheet separation device has the 1 couple guiding parts being oppositely arranged, the described circuit board use sheet material of lamination is led by this 1 couple guiding parts, and described 1st maintenance parts, described 2nd maintenance parts and described 3rd maintenance parts are arranged on described 1 between guiding parts.
10. circuit board use sheet separation device as claimed in claim 9, it is characterised in that,
Described 1st maintenance parts, described 2nd maintenance parts and described 3rd maintenance parts have 9 delivery section.
11. circuit board use sheet separation devices as claimed in claim 10, it is characterised in that,
Described maintenance parts have adsorption section, and the described circuit board use sheet material floated is adsorbed by this adsorption section by air-breathing.
12. circuit board use sheet separation devices as claimed in claim 1, it is characterised in that,
Described air injection unit comprises:
1st air ejection member, carries out jet to the leading section in the throughput direction downstream of described circuit board use sheet material; And
2nd air ejection member, carries out jet to the sidepiece of described circuit board use sheet material.
13. circuit board use sheet separation devices as claimed in claim 12, it is characterised in that,
Defeated 1st air ejection member of institute and described 2nd air ejection member are separated from one another and arrange.
14. circuit board use sheet separation devices as claimed in claim 13, it is characterised in that,
Different positions on the direction orthogonal relative to the stack direction of described throughput direction and described circuit board use sheet material, is provided with multiple described 1st air ejection member,
Different positions on described throughput direction, is provided with multiple described 2nd air ejection member.
15. circuit board use sheet separation devices as claimed in claim 14, it is characterised in that,
Multiple described 1st air ejection member is separated from one another and arranges.
16. circuit board use sheet separation devices as claimed in claim 15, it is characterised in that,
Described 2nd air ejection member is configured to be formed the mode of angle with the direction vertical relative to the stack direction of the throughput direction of the described circuit board use sheet material of conveying and described circuit board use sheet material.
17. circuit board use sheet separation devices as claimed in claim 1, it is characterised in that,
Rearward end in the throughput direction upstream of described circuit board use sheet material is provided with multiple guiding parts, and described multiple guiding parts are separated from one another and arrange.
18. circuit board use sheet separation devices as claimed in claim 1, it is characterised in that,
This circuit board use sheet separation device has:
Load platform, for loading described circuit board use sheet material; And
Guiding parts, are arranged on the leading section in the throughput direction downstream of described circuit board use sheet material,
Defeated loading portion of institute and described guiding parts are separated from one another and arrange.
19. circuit board use sheet separation devices as claimed in claim 1, it is characterised in that,
Also comprise detection portion, for detecting the position of the described circuit board use sheet material of lamination.
20. circuit board use sheet separation devices as claimed in claim 2, it is characterised in that,
Also comprise cut-off portion, for ending the circuit board use sheet material beyond the circuit board use sheet material by described maintenance component feed.
21. circuit board use sheet separation devices as claimed in claim 1, comprising:
Load platform, for loading described circuit board use sheet material, and lifting can be carried out on the loading direction of this circuit board use sheet material;
Load platform and drive unit, for driving described loading platform;
Detecting unit, detects on described loading platform the upper surface location of the circuit board use sheet material loaded; And
Control unit, according to the signal from described detecting unit, detects on described loading platform the upper surface location of the circuit board use sheet material loaded, and controls described loading platform and drive unit.
CN201521089897.6U 2014-12-26 2015-12-24 Sheet separator for circuit substrate Expired - Fee Related CN205319140U (en)

Applications Claiming Priority (4)

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JP2014266210 2014-12-26
JP2014-266210 2014-12-26
JP2015-245718 2015-12-16
JP2015245718A JP2016124707A (en) 2014-12-26 2015-12-16 Method and apparatus for separating sheet for circuit board

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CN106185266A (en) * 2016-08-31 2016-12-07 昆山富日精密机械有限公司 A kind of automatic arranging device of graphite flake
CN106276252A (en) * 2015-06-26 2017-01-04 株式会社理光 Prepreg carrying device

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JP3911405B2 (en) * 2001-11-15 2007-05-09 トヨタ自動車株式会社 Sheet take-out apparatus and sheet take-out method
WO2006085652A1 (en) * 2005-02-14 2006-08-17 Honda Motor Co., Ltd. Method of separating plate material
JP4777211B2 (en) * 2006-10-13 2011-09-21 キヤノン株式会社 Sheet feeding apparatus and image forming apparatus
JP2009170644A (en) * 2008-01-16 2009-07-30 Mitsubishi Materials Techno Corp Separation device and inspecting apparatus of substrate

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CN106276252A (en) * 2015-06-26 2017-01-04 株式会社理光 Prepreg carrying device
CN106044303A (en) * 2016-08-03 2016-10-26 中山联合光电科技股份有限公司 Masking paper separating device
CN106185266A (en) * 2016-08-31 2016-12-07 昆山富日精密机械有限公司 A kind of automatic arranging device of graphite flake

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