CN205254332U - Wafer vertical cut machine - Google Patents
Wafer vertical cut machine Download PDFInfo
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- CN205254332U CN205254332U CN201520895447.XU CN201520895447U CN205254332U CN 205254332 U CN205254332 U CN 205254332U CN 201520895447 U CN201520895447 U CN 201520895447U CN 205254332 U CN205254332 U CN 205254332U
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- glass microscope
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Abstract
Wafer vertical cut machine relates to the laser scribing field. The utility model provides a present wafer scriber since CCD image identification system and the same side -mounting of laser need to increase the back of the body and carve the process for processing cycle is longer, and efficiency is not high, use cost and the higher problem of fragmentation rate. Wafer vertical cut machine, it includes board base, base, stand, optics bottom plate, laser instrument, light path seal box, cavity X -Y two dimension platform, cavity DD rotary actuator, glass microscope carrier, CCD and CCD adjusting device. The utility model discloses a hollow design for it is in service, can not collide CCD, CCD can follow down and upwards discern the object, and detects on it firmly absorbent object profile through the glass microscope carrier, and adopts three -dimensional regulative mode to CCD, makes CCD influence center and the laser center to coincide, thereby has improved cutting accuracy, simultaneously, reduce use cost, reduce manufacturing procedure, shortened the processing time limit for a project, increase the benefit.
Description
Technical field
The utility model relates to laser scribing field, particularly relates to a kind of wafer straight cutting machine.
Background technology
Wafer Dicing machine is in the market divided into break bar machine and laser scribing means, laser scribing in the marketSheet machine CCD image recognition system is contained in above microscope carrier, follows laser as coaxial or homonymy. Blade or laser are allFrom back side scribing or cutting, and crystal grain and cutting groove be all in front, and the back side does not have groove, in the time of scribing, needsIncrease back side contraposition etching wire casing, thereby increase several procedures, make the process-cycle longer, efficiency is not high,Use cost and fragmentation rate increase.
Utility model content
The utility model provides a kind of reduction of erection time, reduces fragmentation rate, the wafer straight cutting machine of increasing the benefit.
The utility model solves the technical scheme that its technical problem adopts: wafer straight cutting machine, it comprises machinePlatform base, be positioned at board base top pedestal, be fixed on column on pedestal, be positioned at the optics on columnBase plate, be positioned at laser instrument on optical backplane, be positioned at light path seal box under optical backplane, be arranged on pedestalOn hollow X-Y two-dimensional stage, be arranged on the hollow DD rotation of the hollow position of hollow X-Y two-dimensional stageMotor, be arranged on the top of the hollow of hollow DD rotation motor glass microscope carrier, to be arranged on X-Y two dimension flatThe CCD of the bottom of the hollow of platform and be positioned at the CCD that can carry out to CCD three-dimensional regulation under CCDAdjusting device; Described light path seal box is positioned at the top of glass microscope carrier.
Described hollow X-Y two-dimensional stage comprises grating ruler reading head, linear electric motors and guide rail.
Described CCD sees through on hollow X-Y two-dimensional stage and hollow DD rotation motor identification glass microscope carrier and producesProduct.
On described glass microscope carrier, be provided with vacuum suction hole by vacuum suction and fixed product.
The beneficial effects of the utility model: wafer straight cutting machine of the present utility model, by the design of hollow, makesIn running, can not collide CCD, CCD is recognition object from bottom to top, and by glass microscope carrierDetect the contour of object firmly adsorbing on it, and CCD is adopted to three-dimensional regulation mode, make CCD impactCenter and laser center overlap, thereby have improved cutting accuracy; Meanwhile, wafer straight cutting machine of the present utility modelReduce use cost, reduced manufacturing procedure, shortened the processing duration, increased the benefit.
Brief description of the drawings
Fig. 1 is the schematic diagram of the wafer straight cutting machine of embodiment;
Fig. 2 is the part schematic diagram of the wafer straight cutting machine of embodiment;
Fig. 3 is the schematic diagram of another angle of Fig. 2;
Fig. 4 is the schematic diagram of the hollow X-Y two-dimensional stage of the wafer straight cutting machine of embodiment;
Fig. 5 is the hollow DD rotation motor of wafer straight cutting machine and the schematic diagram of glass microscope carrier of embodiment;
Wherein, 1-board base, 2-pedestal, 3-column, 4-optical backplane, 5-laser instrument, the sealing of 6-light pathCase, 7-hollow DD rotation motor, 8-hollow X-Y two-dimensional stage, 9-glass microscope carrier, 10-CCD, 11-CCDAdjusting device, 81-grating ruler reading head, 82-linear electric motors, 83-guide rail.
Detailed description of the invention
In order to deepen, to understanding of the present utility model, below in conjunction with drawings and Examples, the utility model to be doneDescribe in further detail, this embodiment is only for explaining the utility model, not to protection of the present utility modelScope forms restriction.
Embodiment
As shown in Figures 1 to 5, wafer straight cutting machine, it comprises board base 1, is positioned at board base 1 topPedestal 2, be fixed on column 3 on pedestal 2, be positioned at optical backplane 4 on column 3, be positioned at optics at the bottom ofLaser instrument 5 on plate 4, be positioned at light path seal box 6 under optical backplane 4, be arranged on the hollow on pedestal 2X-Y two-dimensional stage 8, be arranged on the hollow position of hollow X-Y two-dimensional stage 8 hollow DD rotation motor 7,Be arranged on the top of the hollow of hollow DD rotation motor 7 glass microscope carrier 9, be arranged on X-Y two-dimensional stage 8Hollow bottom CCD10 and be positioned at and can carry out three-dimensional regulation to CCD10 under CCD10CCD adjusting device 11; Described light path seal box 6 is positioned at the top of glass microscope carrier 9; Described hollow X-YTwo-dimensional stage 8 comprises grating ruler reading head 81, linear electric motors 82 and guide rail 83; During described CCD10 sees throughEmpty X-Y two-dimensional stage 8 and hollow DD rotation motor 7 are identified product on glass microscope carrier 9; Described glass carriesOn platform 9, be provided with vacuum suction hole by vacuum suction and fixed product.
The hollow X-Y two-dimensional stage 8 of the present embodiment adopts the form of hollow, in hollow X-Y two-dimensional stage 8CCD10 is installed under hollow position, and hollow X-Y two-dimensional stage 8 is in operation and can not collides CCD10,Also reached recognition object object from bottom to top; Hollow DD rotation motor 7 adopts the big-and-middle footpath motor of eating dishes without rice or wine,Above motor, adopt glass microscope carrier 9, CCD10 sees through the contour of object that glass microscope carrier 9 detects on it, therebySend instructions to laser instrument, and glass microscope carrier 9 adopts the design in vacuum suction hole, also reached firmly and inhaledThe effect of by-product; CCD adopts CCD adjusting device 11 to carry out three-dimensional regulation, makes in CCD impactThereby the heart and laser center overlap and improve cutting accuracy.
Pedestal 2, column 3 and the optical backplane 4 of the present embodiment all adopt marble, have improved machine operationPrecision.
The wafer straight cutting machine of the present embodiment, by the design of hollow, makes in running, can not collideCCD, CCD is recognition object from bottom to top, and detects by glass microscope carrier the object wheel firmly adsorbing on itExterior feature, and CCD is adopted to three-dimensional regulation mode, make CCD affect center and laser center coincidence, therebyImprove cutting accuracy; Meanwhile, wafer straight cutting machine of the present utility model has reduced use cost, has reduced and has addedWork operation, has shortened the processing duration, increases the benefit.
Above-described embodiment should not limit the utility model by any way, and all employings are equal to replaces or equivalence conversionThe technical scheme that obtains of mode all drop in protection domain of the present utility model.
Claims (3)
1. wafer straight cutting machine, it is characterized in that: it comprises board base, be positioned at the pedestal of board base top, be fixed on the column on pedestal, be positioned at the optical backplane on column, be positioned at the laser instrument on optical backplane, be positioned at the light path seal box under optical backplane, be arranged on the hollow X-Y two-dimensional stage on pedestal, be arranged on the hollow DD rotation motor of the hollow position of hollow X-Y two-dimensional stage, be arranged on the glass microscope carrier at the top of the hollow of hollow DD rotation motor, be arranged on the hollow of X-Y two-dimensional stage bottom CCD and be positioned at the CCD adjusting device that can carry out to CCD three-dimensional regulation under CCD, described light path seal box is positioned at the top of glass microscope carrier.
2. wafer straight cutting machine according to claim 1, is characterized in that: described hollow X-Y two-dimensional stage comprises grating ruler reading head, linear electric motors and guide rail.
3. wafer straight cutting machine according to claim 1, is characterized in that: on described glass microscope carrier, be provided with vacuum suction hole by vacuum suction and fixed product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520895447.XU CN205254332U (en) | 2015-11-11 | 2015-11-11 | Wafer vertical cut machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520895447.XU CN205254332U (en) | 2015-11-11 | 2015-11-11 | Wafer vertical cut machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205254332U true CN205254332U (en) | 2016-05-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520895447.XU Active CN205254332U (en) | 2015-11-11 | 2015-11-11 | Wafer vertical cut machine |
Country Status (1)
| Country | Link |
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| CN (1) | CN205254332U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105215545A (en) * | 2015-11-11 | 2016-01-06 | 苏州天弘激光股份有限公司 | Wafer straight cutting machine |
| CN106077959A (en) * | 2016-07-06 | 2016-11-09 | 中国电子科技集团公司第四十五研究所 | Laser scribing method for GPP wafer bottom alignment |
-
2015
- 2015-11-11 CN CN201520895447.XU patent/CN205254332U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105215545A (en) * | 2015-11-11 | 2016-01-06 | 苏州天弘激光股份有限公司 | Wafer straight cutting machine |
| CN106077959A (en) * | 2016-07-06 | 2016-11-09 | 中国电子科技集团公司第四十五研究所 | Laser scribing method for GPP wafer bottom alignment |
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|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |