CN205245106U - Integrative encapsulation thermal module of direct type - Google Patents
Integrative encapsulation thermal module of direct type Download PDFInfo
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- CN205245106U CN205245106U CN201521051280.5U CN201521051280U CN205245106U CN 205245106 U CN205245106 U CN 205245106U CN 201521051280 U CN201521051280 U CN 201521051280U CN 205245106 U CN205245106 U CN 205245106U
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- copper foil
- radiator
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Abstract
The utility model belongs to the technical field of the LED heat dissipation technology and specifically relates to an integrative encapsulation thermal module of direct type, include radiator, insulating layer, copper foil layer, hinder solder paste china ink layer, chip, encapsulated layer, its characterized in that: the encapsulated layer with insulating layer, copper foil layer, hinder solder paste china ink layer and chip package on the radiator surface, insulating layer, copper foil layer, hinder solder paste china ink layer and connect gradually, insulating layer, copper foil layer, hinder a solder paste china ink layer central authorities cooperation chip and be equipped with the fretwork district, chip embedding fretwork district, LED chip direct package is on the radiator, and the radiator directly conducts the heat of luminous body, does not pass through the transition layer for heat diffusion velocity, it is quicker to turn on light this process of whole radiator temperature constant temperature at lamps and lanterns, has reduced the ageing light decay and the increase of service life of chip.
Description
Technical field
The utility model relates to LED heat dissipation technology field, especially a kind of direct-type integral packaging radiating module.
Background technology
At present, on market, integrated light source is all to adopt to be encapsulated on an aluminium (copper) substrate, then the form that is coated with thermal grease and is fitted in radiator by the back side is carried out heat and conducted. At the heat energy that chip gives out of turning on light simultaneously, aluminium (copper) substrate is difficult to meet the temperature carrying of chip, and it is direct not that this process belongs to indirect conduction to hot transmission, causes chip to accelerate aging light decay, the techniques such as aluminium (copper) substrate and thermal grease have also increased cost, are necessary to improve.
Summary of the invention
For the deficiencies in the prior art, the utility model provides a kind of and directly LED chip is directly encapsulated in to the radiator module on radiator.
The technical solution of the utility model is:
A kind of direct-type integral packaging radiating module, comprise radiator, insulating barrier, copper foil layer, welding resistance ink layer, chip, encapsulated layer, it is characterized in that: described encapsulated layer by insulating barrier, copper foil layer, welding resistance ink layer and chip package on radiator surface, insulating barrier, copper foil layer, welding resistance ink layer connect successively, described insulating barrier, copper foil layer, welding resistance ink layer central authorities coordinate chip to be provided with vacancy section, and described chip embeds vacancy section; LED chip is directly encapsulated on radiator, radiator directly conducts the heat of illuminator, without transition zone, has accelerated heat diffusion speed, quicker in light fixture whole this process of radiator temperature constant temperature of turning on light, reduce the aging light decay of chip and increased the service life.
Further, described insulating barrier, copper foil layer, welding resistance ink layer both sides are equipped with region of elongation, and the cooperation of described region of elongation is provided with through hole, arranges and lock power line by through hole.
Further, the vacancy section that described in described radiator surface engagement, insulating barrier, copper foil layer, welding resistance ink layer central authorities are provided with is provided with a groove or sign, the location of all parts while being convenient to encapsulate.
Further, described radiator comprises at least one heat-conducting plate and is arranged on the radiating fin on heat-conducting plate, and described heat-conducting plate only one side is provided with radiating fin, and its effect is to be convenient to packaging LED chips.
Further, described insulating barrier adopts thermal conductive insulation glue or heat conductive silica gel, and its effect is to strengthen its heat-conductive characteristic when ensureing LED chip Electrical Safety, is convenient to heat radiation.
Further, described welding resistance ink layer adopts photocuring titanium dioxide welding resistance ink layer, and its effect is to make LED chip form white high reflective surface around, improves the LED efficiency of light energy utilization.
Further, described encapsulated layer comprises glue, silica gel and fluorescent material, and described fluorescent material sticks on silica gel, and described silica gel is contained on radiator by mucilage sealing.
A kind of direct-type integral packaging radiating module comprises the following steps implements encapsulation:
Step 1, is deposited in radiator surface by insulating barrier, copper foil layer, welding resistance ink layer;
Step 2, inserts chip the vacancy section of insulating barrier, copper foil layer, welding resistance ink layer;
Step 3, by encapsulated layer by insulating barrier, copper foil layer, welding resistance ink layer and chip package on radiator surface.
Further, described step 3 also comprises by through hole and arranges and lock power line.
The beneficial effects of the utility model are: the utility model by chip direct package on radiator, radiator directly conducts the heat of illuminator (chip), without transition zone, accelerate heat diffusion speed, quicker in light fixture whole this process of radiator temperature constant temperature of turning on light, reduce the aging light decay of chip and increased the service life.
Brief description of the drawings
Fig. 1 is exploded perspective view of the present utility model;
Fig. 2 is the exploded perspective view of insulating barrier in the utility model, copper foil layer, welding resistance ink layer, chip, encapsulated layer.
In figure, 1, radiator; 2, insulating barrier; 3, copper foil layer; 4, chip; 5, welding resistance ink layer; 6, encapsulated layer.
Detailed description of the invention
Below in conjunction with accompanying drawing, detailed description of the invention of the present utility model is described further:
For ease of explanation with install, what the present embodiment was selected is the radiator (Aluminium Radiator) that one side is provided with radiating fin, and is provided with Installation Mark at the one side middle part that radiator does not arrange radiating fin. In addition, chip conducts electricity by copper foil layer, and because this method of attachment is ripe prior art, the utility model does not repeat.
As shown in Figure 1, 2, a kind of direct-type integral packaging radiating module, comprise radiator 1, insulating barrier 2, copper foil layer 3, welding resistance ink layer 5, chip 4, encapsulated layer 6, it is characterized in that: insulating barrier 2, copper foil layer 3, welding resistance ink layer 5 and chip 4 are encapsulated in radiator 1 surface by described encapsulated layer, insulating barrier 2, copper foil layer 3, welding resistance ink layer 5 connect successively, described insulating barrier 2, copper foil layer 3, welding resistance ink layer 5 central authorities coordinate chip to be provided with vacancy section, and described chip 4 embeds vacancy section; LED chip is directly encapsulated on radiator, radiator directly conducts the heat of illuminator, without transition zone, has accelerated heat diffusion speed, quicker in light fixture whole this process of radiator temperature constant temperature of turning on light, reduce the aging light decay of chip and increased the service life.
Described insulating barrier 2, copper foil layer 3, welding resistance ink layer 5 both sides are equipped with region of elongation, and the cooperation of described region of elongation is provided with through hole, arranges and lock power line by through hole.
The vacancy section that described in described radiator 1 surface engagement, insulating barrier 2, copper foil layer 3, welding resistance ink layer 5 central authorities are provided with is provided with a groove or sign, the location of all parts while being convenient to encapsulate.
Described radiator 1 comprises at least one heat-conducting plate and is arranged on the radiating fin on heat-conducting plate, and described heat-conducting plate only one side is provided with radiating fin, and its effect is to be convenient to packaging LED chips.
Described insulating barrier 2 adopts thermal conductive insulation glue or heat conductive silica gel, and its effect is to strengthen its heat-conductive characteristic when ensureing LED chip Electrical Safety, is convenient to heat radiation.
Described welding resistance ink layer 5 adopts photocuring titanium dioxide welding resistance ink layer, and its effect is to make LED chip form white high reflective surface around, improves the LED efficiency of light energy utilization.
Described encapsulated layer 6 comprises glue, silica gel and fluorescent material, and described fluorescent material sticks on silica gel, and described silica gel is contained on radiator 1 by mucilage sealing.
A kind of direct-type integral packaging radiating module comprises the following steps implements encapsulation:
Step 1, is deposited in radiator 1 surface by insulating barrier 2, copper foil layer 3, welding resistance ink layer 5;
Step 2, inserts chip 4 vacancy section of insulating barrier 2, copper foil layer 3, welding resistance ink layer 5;
Step 3, is encapsulated in radiator 1 surface by encapsulated layer 6 by insulating barrier 2, copper foil layer 3, welding resistance ink layer 5 and chip 4.
Described step 3 also comprises by through hole and arranges and lock power line.
That in above-described embodiment and description, describes just illustrates principle of the present utility model and most preferred embodiment; do not departing under the prerequisite of the utility model spirit and scope; the utility model also has various changes and modifications, and these changes and improvements all fall within the scope of claimed the utility model.
Claims (7)
1. a direct-type integral packaging radiating module, comprise radiator, insulating barrier, copper foil layer, welding resistance ink layer, chip, encapsulated layer, it is characterized in that: described encapsulated layer by insulating barrier, copper foil layer, welding resistance ink layer and chip package on radiator surface, insulating barrier, copper foil layer, welding resistance ink layer connect successively, described insulating barrier, copper foil layer, welding resistance ink layer central authorities coordinate chip to be provided with vacancy section, and described chip embeds vacancy section.
2. direct-type integral packaging radiating module according to claim 1, is characterized in that: described insulating barrier, copper foil layer, welding resistance ink layer both sides are equipped with region of elongation, and the cooperation of described region of elongation is provided with through hole, arranges and lock power line by through hole.
3. direct-type integral packaging radiating module according to claim 2, is characterized in that: the vacancy section that described in described radiator surface engagement, insulating barrier, copper foil layer, welding resistance ink layer central authorities are provided with is provided with a groove or sign.
4. direct-type integral packaging radiating module according to claim 3, is characterized in that: described radiator comprises at least one heat-conducting plate and be arranged on the radiating fin on heat-conducting plate, and described heat-conducting plate only one side is provided with radiating fin.
5. direct-type integral packaging radiating module according to claim 4, is characterized in that: described insulating barrier adopts thermal conductive insulation glue or heat conductive silica gel.
6. direct-type integral packaging radiating module according to claim 5, is characterized in that: described welding resistance ink layer adopts photocuring titanium dioxide welding resistance ink layer.
7. direct-type integral packaging radiating module according to claim 6, is characterized in that: described encapsulated layer comprises glue, silica gel and fluorescent material, and described fluorescent material sticks on silica gel, and described silica gel is contained on radiator by mucilage sealing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521051280.5U CN205245106U (en) | 2015-12-16 | 2015-12-16 | Integrative encapsulation thermal module of direct type |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521051280.5U CN205245106U (en) | 2015-12-16 | 2015-12-16 | Integrative encapsulation thermal module of direct type |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205245106U true CN205245106U (en) | 2016-05-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521051280.5U Expired - Fee Related CN205245106U (en) | 2015-12-16 | 2015-12-16 | Integrative encapsulation thermal module of direct type |
Country Status (1)
| Country | Link |
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| CN (1) | CN205245106U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105371252A (en) * | 2015-12-16 | 2016-03-02 | 东莞市星曜光电照明科技有限公司 | Direct type integrally-encapsulated heat dissipation module |
| CN112820814A (en) * | 2021-02-26 | 2021-05-18 | 上海鼎晖科技股份有限公司 | Dam-free COB LED substrate and preparation method and application thereof |
-
2015
- 2015-12-16 CN CN201521051280.5U patent/CN205245106U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105371252A (en) * | 2015-12-16 | 2016-03-02 | 东莞市星曜光电照明科技有限公司 | Direct type integrally-encapsulated heat dissipation module |
| CN112820814A (en) * | 2021-02-26 | 2021-05-18 | 上海鼎晖科技股份有限公司 | Dam-free COB LED substrate and preparation method and application thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160518 Termination date: 20171216 |
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| CF01 | Termination of patent right due to non-payment of annual fee |