CN205112572U - Coloured cover membrane of high frequency - Google Patents
Coloured cover membrane of high frequency Download PDFInfo
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- CN205112572U CN205112572U CN201520807203.1U CN201520807203U CN205112572U CN 205112572 U CN205112572 U CN 205112572U CN 201520807203 U CN201520807203 U CN 201520807203U CN 205112572 U CN205112572 U CN 205112572U
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Abstract
The utility model discloses a coloured cover membrane of high frequency, including the printing ink layer, adhere glue film, slim polyimide layer and from the type layer, the thickness on slim polyimide layer is the 5 -10 micron, slim polyimide layer formed at the printing ink layer with adhere between the glue film, have two -layerly and be respectively from the type layer with lower to the type layer from the type layer, last from the type level in the top on printing ink layer, down from the type level in adhere the below of glue film. The utility model discloses the coloured cover membrane of high frequency who has good electrical property under the high -frequency, this coloured cover membrane of high frequency can be made by straightforward procedure to have good power after that, can have the circuit and shield the function. Now for the 4G trade, under the condition that propagation velocity is faster, the signal loses also grow, the utility model discloses a coloured cover membrane of high frequency can reduce electronic material's dielectric loss, has reached high -speed, low -loss requirement in the industry.
Description
Technical field
The utility model belongs to cover membrane for printed circuit board technical field, and particularly a kind of have well electrical color covering film at high frequencies.
Background technology
Current electronic system, towards compact, high-fire resistance, multifunctionality, densification, high reliability and the future development of low cost, and functionally, then needs powerful and high-speed signal transmission.In high frequency field, radio infrastructure needs to provide enough low Insertion Loss, effectively could improve energy utilization rate.Along with 4G business is arrived, radio frequency products needs to provide wider bandwidth, and backward compatible 3G, 2G business.And in current high frequency cover layer, the material of cover layer is generally polyimides.Black covering film makes Dk/Df value bigger than normal owing to adding carbon dust in polyimides, be difficult to industrially apply.Identical, the cover layer of non-polyimides true qualities be applied, just must add the color change that the pigment of other color or extra additive make polyimide film in polyimide film, Dk/Df value will inevitably be made to increase.Which results in colored cover layer to be difficult to be applied in high frequency field because of the electrical requirements that cannot meet under high-frequency.
Utility model content
In order to solve the problems of the technologies described above, the utility model provides a kind ofly has well electrical high frequency color covering film at high frequencies, can be obtained, and have good adhesion by straightforward procedure, can have circuit shielding function simultaneously.
The utility model in order to the technical scheme solving its technical problem and adopt is:
A kind of high frequency color covering film, comprise ink layer, stick together glue-line, slim polyimide layer and release layer, the thickness of described slim polyimide layer is 5-10 micron, described slim polyimide layer is formed at described ink layer and describedly sticks together between glue-line, described release layer has two-layer and is respectively release layer and lower release layer, described upper release layer is positioned at the top of described ink layer, sticks together the below of glue-line described in described lower release layer is positioned at.
The utility model in order to the further technical scheme solving its technical problem and adopt is:
Say further, the thickness of described ink layer is 3-5 micron.
Say further, described in stick together glue-line thickness be 8-50 micron.
Say further, the thickness of every layer of described release layer is 25-100 micron.
The beneficial effects of the utility model are: high frequency color covering film of the present utility model have employed the slim polyimide layer that thickness is 5-10 micron, and be respectively equipped with ink layer in its both sides and stick together glue-line, the colouring of cover layer is realized by ink layer, and can by adding high frequency material and make it have high frequency characteristics sticking together in glue-line, can also by ink layer with stick together in glue-line and add low-dielectric powder and make it have low dielectric property.Cover layer of the present utility model is folded structure and is had well electrical high frequency color covering film at high frequencies, and this high frequency color covering film can be obtained by straightforward procedure, and has good adhesion, can have circuit shielding function simultaneously.
Accompanying drawing explanation
Fig. 1 is the structural representation of high frequency color covering film of the present utility model.
Detailed description of the invention
Below by way of specific instantiation, detailed description of the invention of the present utility model is described, those skilled in the art can understand advantage of the present utility model and effect easily by content disclosed in the present specification.The utility model also can be implemented in further, different ways, that is, under the category do not disclosed departing from the utility model, can give different modifications and change.
A kind of high frequency color covering film, as shown in Figure 1, by ink layer 10, stick together glue-line 20, slim polyimide layer 30 and release layer, the described glue-line 20 that sticks together is containing polyimide resin system resin, the thickness of described slim polyimide layer 30 is 5-10 micron, described slim polyimide layer 30 is formed at described ink layer 10 and describedly sticks together between glue-line 20, described release layer has two-layer and is respectively release layer 41 and lower release layer 42, described upper release layer 41 is positioned at the top of described ink layer 10, sticks together the below of glue-line 20 described in described lower release layer 42 is positioned at.
Wherein, the thickness of described ink layer is 3-5 micron, described in stick together glue-line thickness be 8-50 micron, the thickness of every layer of described release layer is 25-100 micron.
Under the support of said structure, the resin material of described ink layer can adopt high frequency resin, and adds colour solid to change the color of ink layer.Low-dielectric powder can also be added in ink layer.The surface of described ink layer can be greater than for glossiness the cloudy surface that 50 ° bright or glossiness be less than 20 °.Surface to ink layer is cloudy surface, then described ink layer comprises cloudy surface agent.
Under the support of said structure, described in stick together glue-line and can also add high frequency powder and low-dielectric powder.
Embodiment 1 and 2: slim polyimide layer 30 is first provided, at this slim polyimide layer 30 coated thereon ink layer 10, and dried, pressing.Then release layer 41 in pressing on ink layer 10, and glue-line 20 is sticked together in coating below slim polyimide layer 30, and dried, pressing.Afterwards again in sticking together below glue-line 20 release layer 42 under pressing, namely form High frequency color cover layer of the present utility model.In embodiment 1 and 2, the thickness of slim polyimide layer 30 is 5 μm, and ink film thickness is 3 μm, and adhesion glue layer thickness is 25 μm.
For the ease of carrying out performance test with prior art, the ink layer of the cover layer of embodiment 1 and embodiment 2 is black.
Embodiment 1 and the difference of embodiment 2 are only that the interpolation ratio of the low-dielectric powder sticked together in glue-line is different.In embodiment 1, the interpolation ratio sticking together the low-dielectric powder in glue-line is 20%; In example 2, the interpolation ratio sticking together the low-dielectric powder in glue-line is 50%.
Comparative example 1: for reaching black polyamide cover layer advanced in years, is made up of a layer thickness to be the black polyamide film of 12 microns and a layer thickness be glue-line of 25 microns and mould release membrance.
Comparative example 2: be Du Pont's black polyamide cover layer, is made up of a layer thickness to be the black polyamide film of 12 microns and a layer thickness be glue-line of 25 microns and mould release membrance.
Comparative example 3: be a kind of true qualities polyimides cover layer, is made up of a layer thickness to be the polyimide film of 12 microns and a layer thickness be glue-line of 25 microns and mould release membrance.
Comparative example 1,2,3 and embodiment 1,2 are all done dielectric property to test and adhesion is tested, result is as table 1:
Table 1:
As shown in Table 1, embodiment 1 and 2, compared to comparative example 1,2 and 3, can increase substantially electrical performance really, and has good adhesion simultaneously.
Above-mentioned description and embodiment are only exemplary illustration principle of the present utility model and effect thereof, are not to restriction of the present utility model.Any creation fallen in the utility model right all belongs to the scope that the utility model is protected.
Claims (4)
1. a high frequency color covering film, is characterized in that: comprising:
Ink layer (10);
Stick together glue-line (20);
Slim polyimide layer (30), the thickness of described slim polyimide layer is 5-10 micron, and described slim polyimide layer is formed at described ink layer and describedly sticks together between glue-line;
Release layer, described release layer has two-layer and is respectively release layer (41) and lower release layer (42), and described upper release layer is positioned at the top of described ink layer, sticks together the below of glue-line described in described lower release layer is positioned at.
2. high frequency color covering film as claimed in claim 1, is characterized in that: the thickness of described ink layer is 3-5 micron.
3. high frequency color covering film as claimed in claim 1, is characterized in that: described in stick together glue-line thickness be 8-50 micron.
4. high frequency color covering film as claimed in claim 1, is characterized in that: the thickness of every layer of described release layer is 25-100 micron.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520807203.1U CN205112572U (en) | 2015-10-19 | 2015-10-19 | Coloured cover membrane of high frequency |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520807203.1U CN205112572U (en) | 2015-10-19 | 2015-10-19 | Coloured cover membrane of high frequency |
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| Publication Number | Publication Date |
|---|---|
| CN205112572U true CN205112572U (en) | 2016-03-30 |
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| CN201520807203.1U Active CN205112572U (en) | 2015-10-19 | 2015-10-19 | Coloured cover membrane of high frequency |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018214366A1 (en) * | 2017-05-23 | 2018-11-29 | 昆山雅森电子材料科技有限公司 | Ultra-matte colored ultra-thin coverlay for high-frequency applications, and manufacturing method |
| CN109825204A (en) * | 2017-11-23 | 2019-05-31 | 昆山雅森电子材料科技有限公司 | A kind of coloured ultra-thin cover film of high shielding and preparation method |
| TWI671204B (en) * | 2017-02-24 | 2019-09-11 | 亞洲電材股份有限公司 | Membrane thin color film and the manufacture thereof |
| CN110626036A (en) * | 2018-06-25 | 2019-12-31 | 昆山雅森电子材料科技有限公司 | High-transparency composite PI film and preparation method thereof |
-
2015
- 2015-10-19 CN CN201520807203.1U patent/CN205112572U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI671204B (en) * | 2017-02-24 | 2019-09-11 | 亞洲電材股份有限公司 | Membrane thin color film and the manufacture thereof |
| WO2018214366A1 (en) * | 2017-05-23 | 2018-11-29 | 昆山雅森电子材料科技有限公司 | Ultra-matte colored ultra-thin coverlay for high-frequency applications, and manufacturing method |
| CN109825204A (en) * | 2017-11-23 | 2019-05-31 | 昆山雅森电子材料科技有限公司 | A kind of coloured ultra-thin cover film of high shielding and preparation method |
| CN110626036A (en) * | 2018-06-25 | 2019-12-31 | 昆山雅森电子材料科技有限公司 | High-transparency composite PI film and preparation method thereof |
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