CN208490042U - PCB release film - Google Patents
PCB release film Download PDFInfo
- Publication number
- CN208490042U CN208490042U CN201821116034.7U CN201821116034U CN208490042U CN 208490042 U CN208490042 U CN 208490042U CN 201821116034 U CN201821116034 U CN 201821116034U CN 208490042 U CN208490042 U CN 208490042U
- Authority
- CN
- China
- Prior art keywords
- pcb
- base material
- layer
- pet base
- release layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000463 material Substances 0.000 claims abstract description 37
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 28
- 239000010703 silicon Substances 0.000 claims abstract description 28
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 18
- 230000003746 surface roughness Effects 0.000 claims description 6
- 229920002545 silicone oil Polymers 0.000 abstract description 8
- 238000003825 pressing Methods 0.000 abstract description 7
- 229920000139 polyethylene terephthalate Polymers 0.000 description 21
- 239000010408 film Substances 0.000 description 13
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 5
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 5
- 239000004810 polytetrafluoroethylene Substances 0.000 description 5
- 239000004812 Fluorinated ethylene propylene Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229920009441 perflouroethylene propylene Polymers 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 239000003431 cross linking reagent Substances 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 229920002799 BoPET Polymers 0.000 description 2
- -1 Polytetrafluoroethylene Polymers 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 241000282320 Panthera leo Species 0.000 description 1
- 229920002600 TPX™ Polymers 0.000 description 1
- OBNDGIHQAIXEAO-UHFFFAOYSA-N [O].[Si] Chemical compound [O].[Si] OBNDGIHQAIXEAO-UHFFFAOYSA-N 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 230000003796 beauty Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000013039 cover film Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 239000004447 silicone coating Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Abstract
The utility model relates to a kind of PCB release film, including organosilicon release layer, use made of PET material on one side as PET base material layer and non-silicon release layer that smooth surface and another side are mute face；The silicone release layer is arranged in the smooth surface of the PET base material layer, and the non-silicon release layer is arranged on the mute face of the PET base material layer.It is high to have many advantages, such as that surface dynes value is high, silicone oil shifts low, at low cost and discrimination after the utility model PCB release film and PCB pressing.
Description
[technical field]
The utility model relates to laminar products, more particularly to the laminar product being actually made of synthetic resin, especially
Release membrane structure used when being related to pressing for printed circuit board.
[background technique]
With the high speed development of electronics and information industry, the electronic products such as mobile phone, digital equipment, 3C class update day crescent
Basic material different, that printed circuit board is interconnected as the important carrier and electronics of electronic equipment, it is small-sized at present just towards lighting
Change and multifunction develops.
Printed circuit board (Printed Circuit Board, abbreviation PCB) is to be formed on general substrate by predetermined design
The printing plate of connection and printing assembly between point.The major function of PCB product makes various electronic components form predetermining circuit
Connection, plays the role of relay transmission.
The substrate and crucial interconnected parts, the manufacture quality of printed circuit board loaded as electronic component not only directly affects electricity
The reliability of sub- product, and system product whole competitiveness is influenced, therefore be referred to as " mother of electronic system product ".Printing electricity
The development level of road plate industry reflects the development speed and technical standard of a country electronic industry to a certain extent.
In PCB production process, pressing (such as cover film, PI film, pure glue steel disc etc.) operation would generally be used to release
Film, for protecting and being isolated.But currently available technology common are machine silicon release film, after high-temperature laminating, can generate difference
The silicone oil of degree shifts, and shows that plate face has remaining silicone oil or mist, and then it is strong to cause the coating surface of rear process to be removed
Degree reduce so that it is not up to standard.
Non-silicon separated type material is mainly TPX, PTFE and FEP etc. at present, but itself such low polarity separated type material price mistake
Height is not suitable for high volume applications in bonding operation.TPX is the abbreviation of English Transparent Polymer X, and Chinese is meant
4- methylpentene -1；PTFE is the abbreviation of English Polytetrafluoroethylene, and Chinese means polytetrafluoroethylene (PTFE)；FEP
It is the abbreviation of English Fluorinated ethylene propylene, Chinese means fluorinated ethylene propylene copolymer (perfluor
Ethylene propylene copolymer).
Therefore, in order to solve silicone oil branch problem, and use cost is effectively reduced, develops a new PCB release film
Have far-reaching significance.
[utility model content]
A kind of PCB is provided the technical problem to be solved by the present invention is to avoid above-mentioned the deficiencies in the prior art place
With release film, it is high to have many advantages, such as that surface dynes value is high, silicone oil shifts low, at low cost and discrimination after pressing with PCB.
The utility model solve the technical problem the technical solution adopted is that:
A kind of PCB release film, including organosilicon release layer are provided, used made of PET material on one side as smooth surface and another
It is on one side the PET base material layer and non-silicon release layer in mute face；The light of the PET base material layer is arranged in the silicone release layer
On face, the non-silicon release layer is arranged on the mute face of the PET base material layer.
The surface roughness Ra value of the smooth surface of the PET base material layer at 0.01~0.2 micron, the mute face of PET base material layer it
Surface roughness Ra value is at 0.3~0.6 micron.The PET base material layer with a thickness of 5~150 microns.
The silicone release layer with a thickness of 0.1~0.5 micron.
The non-silicon release layer with a thickness of 0.1~0.5 micron.
Compared with the existing technology compared with the beneficial effect of the utility model PCB release film is:
One, the utility model PCB release film does substrate layer using the PET film with high identification, and mute face is for being coated with
Non-silicon release layer, smooth surface, since the two sides of PET base material layer is apparently different, can be used to area for being coated with organosilicon release layer
It is non-silicon release layer which kind of, which divides, which kind of is silicone release layer, is avoided with mistake；
Two, non-silicon release layer is applied to contact with the plate face of PCB, silicone release layer be applied to steel plate face contact,
It is coated with non-using face using the lower silicone release agent of price, reduces production cost to the maximum extent；
Three, non-silicon mould release can effectively avoid silicone oil transfer, and the plate face dyne of PCB is worth higher, rear process material after pressing
With the plate face good bonding strength of PCB.
In conclusion the utility model PCB release film and PCB have after pressing, surface dynes value is high, silicone oil transfer is low,
The advantages that at low cost and discrimination is high.
[Detailed description of the invention]
Fig. 1 is the orthographic projection main cross-sectional schematic diagram of the utility model PCB release film.
[specific embodiment]
The utility model is described in further detail below with reference to each attached drawing.
Referring to Fig. 1, a kind of PCB release film, including organosilicon release layer 20, it uses made of PET material on one side for light
Face and another side are the PET base material layer 10 and non-silicon release layer 30 in mute face；The silicone release layer 20 is arranged described
In the smooth surface of PET base material layer 10, the non-silicon release layer 30 is arranged on the mute face of the PET base material layer 10.
Referring to Fig. 1, the surface roughness Ra value of the smooth surface of the PET base material layer 10 is at 0.01~0.2 micron, PET base material
The surface roughness Ra value in the mute face of layer 10 is at 0.3~0.6 micron.The PET base material layer 10 with a thickness of 5~150 microns.
Referring to Fig. 1, the actually described silicone release layer 20 and non-silicon release layer 30 are coated on using silicone release agent
In the smooth surface of the PET base material layer 10, coating process includes: to take a certain amount of siloxane polymer, retarder thinner, crosslinking
Agent, adhesive promoter and catalyst, are gradually added in sequence, are coated in the smooth surface of the PET base material layer 10 and are passed through
At silicone release layer 20 after baking-curing.The specific formula of silicone release agent is blended as follows: according to mass fraction, taking silicon oxygen
100 parts of alkane polymer (such as DOW CORNING 7458) first adds 1000~2000 parts of retarder thinner (such as toluene), is sufficiently mixed straight
To being completely dispersed；0.1~0.8 part of crosslinking agent (such as DOW CORNING 7672) is added again, is sufficiently mixed to guarantee that crosslinking agent divides completely
It dissipates；Then 0.1~0.3 part of adhesive promoter (such as DOW CORNING 297) is added, be sufficiently mixed to guarantee adhesive promoter point
It clears complete；0.4~0.7 part of catalyst (such as DOW CORNING 4000) finally is added, is sufficiently mixed to guarantee that catalyst is completely dispersed；
The above mixed liquor, that is, silicone release agent is coated in the smooth surface of the PET base material layer 10 by coating machine, and in temperature 140
It is toasted 40 seconds~120 seconds at~160 DEG C, final curing is at silicone release layer 20；The silicone release layer 20 with a thickness of
0.1~0.5 micron.DOW CORNING 7458, DOW CORNING 7672, DOW CORNING 297 and DOW CORNING 4000 of the utility model etc. are all beauty
Dow Corning Corporation of state product produced.
Referring to Fig. 1, the actually described non-silicon release layer 30 is coated on the mute of the PET base material layer 10 using non-silicon mould release
On face, coating process includes: to take a certain amount of non-silicon mould release such as alkane copolymer, solvent, is gradually added in sequence,
Be coated on the mute face of the PET base material layer 10 and by after baking-curing at non-silicon release layer 30.Non-silicon mould release it is specific
Formula is blended as follows: according to mass fraction, taking 100 parts of alkane copolymer (such as Japanese lion king PEELOIL 1010), adds dilute
5000~20000 parts of solvent (such as toluene) is released, be sufficiently mixed and is heated to 60 DEG C until being completely dispersed；It is by the above mixed liquor
Non-silicon mould release is coated on the mute face of the PET base material layer 10 by special non-silicone coating machine, and in temperature 140~160
It is toasted 40 seconds~120 seconds at DEG C, final curing is at non-silicon release layer 30；The non-silicon release layer 30 it is micro- with a thickness of 0.1~0.5
Rice.
The utility model PCB release film does substrate using the PET film with high identification, and mute face is for being coated with non-silicon
Release layer 30, smooth surface can be played and be avoided with wrong effect for being coated with organosilicon release layer 20；Non-silicon release layer 30 is applied to
Contacted with the plate face of PCB, silicone release layer 20 be applied to steel plate face contact, use the lower silicone release agent of price to apply
The non-using face of cloth, reduces production cost to the maximum extent；Non-silicon mould release can effectively avoid silicone oil transfer, PCB after pressing
Plate face dyne is worth higher, the plate face good bonding strength of rear process material and PCB.
Preferred embodiments of the present invention above described embodiment only expresses, the description thereof is more specific and detailed,
But it should not be understood as limiting the scope of the patent of the utility model;It should be appreciated that for the common of this field
For technical staff, without departing from the concept of the premise utility, various modifications and improvements can be made, these all belong to
In the protection scope of the utility model;Therefore, all equivalents and modification done with the utility model claims range,
It should belong to the covering scope of the utility model claims.
Claims (5)
1. a kind of PCB release film, it is characterised in that:
Including organosilicon release layer (20),
It uses on one side for the PET base material layer (10) that smooth surface and another side are mute face made of PET material, and
Non-silicon release layer (30)；
The silicone release layer (20) is arranged in the smooth surface of the PET base material layer (10), and the non-silicon release layer (30) sets
It sets on the mute face of the PET base material layer (10).
2. PCB release film according to claim 1, it is characterised in that:
The surface roughness Ra value of the smooth surface of the PET base material layer (10) at 0.01~0.2 micron, PET base material layer (10) it is mute
The surface roughness Ra value in face is at 0.3~0.6 micron.
3. PCB release film according to claim 1 or 2, it is characterised in that:
The PET base material layer (10) with a thickness of 5~150 microns.
4. PCB release film according to claim 1 or 2, it is characterised in that:
The silicone release layer (20) with a thickness of 0.1~0.5 micron.
5. PCB release film according to claim 1 or 2, it is characterised in that:
The non-silicon release layer (30) with a thickness of 0.1~0.5 micron.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821116034.7U CN208490042U (en) | 2018-07-16 | 2018-07-16 | PCB release film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821116034.7U CN208490042U (en) | 2018-07-16 | 2018-07-16 | PCB release film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208490042U true CN208490042U (en) | 2019-02-12 |
Family
ID=65247138
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821116034.7U Expired - Fee Related CN208490042U (en) | 2018-07-16 | 2018-07-16 | PCB release film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208490042U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110576628A (en) * | 2019-09-27 | 2019-12-17 | 中山国安火炬科技发展有限公司 | Non-silicon matte double-sided release film and preparation process thereof |
| CN113473734A (en) * | 2021-08-04 | 2021-10-01 | 苏州城邦达益材料科技有限公司 | Photosensitive cover film for FPC |
| CN113607892A (en) * | 2021-08-18 | 2021-11-05 | 深圳市高仁电子新材料有限公司 | Method for detecting whether silicone oil of PET (polyethylene terephthalate) protective film can transfer or not |
-
2018
- 2018-07-16 CN CN201821116034.7U patent/CN208490042U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110576628A (en) * | 2019-09-27 | 2019-12-17 | 中山国安火炬科技发展有限公司 | Non-silicon matte double-sided release film and preparation process thereof |
| CN113473734A (en) * | 2021-08-04 | 2021-10-01 | 苏州城邦达益材料科技有限公司 | Photosensitive cover film for FPC |
| CN113607892A (en) * | 2021-08-18 | 2021-11-05 | 深圳市高仁电子新材料有限公司 | Method for detecting whether silicone oil of PET (polyethylene terephthalate) protective film can transfer or not |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200922 Address after: 7 Fushan 8th Road, Qianwu Town, Doumen District, Zhuhai City, Guangdong Province (workshop 4) Patentee after: Zhuhai Yixin Material Technology Co.,Ltd. Address before: 518054 Hengyu Center B Block 308, Dengliang Road, Nanshan District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Yixin Electronics Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190212 |