CN205069865U - Multilayer radiation appliance - Google Patents

Multilayer radiation appliance Download PDF

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Publication number
CN205069865U
CN205069865U CN201520854916.3U CN201520854916U CN205069865U CN 205069865 U CN205069865 U CN 205069865U CN 201520854916 U CN201520854916 U CN 201520854916U CN 205069865 U CN205069865 U CN 205069865U
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CN
China
Prior art keywords
radiation appliance
waveguide structure
circuit board
multilayer radiation
frequency circuit
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Active
Application number
CN201520854916.3U
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Chinese (zh)
Inventor
王昊
操宝林
黄勇
王啸
汪杰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Bohai Microsystem Co Ltd
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Suzhou Bohai Microsystem Co Ltd
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Priority to CN201520854916.3U priority Critical patent/CN205069865U/en
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Publication of CN205069865U publication Critical patent/CN205069865U/en
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Abstract

The utility model provides a multilayer radiation appliance, includes: a high frequency electric way board has an upper portion and a lower part, a microstrip irradiator, integrated top surface top layer at this high frequency electric way board, a stromatolite waveguide structure, integrated on the upper portion of this high frequency electric way board, it links to each other with this microstrip irradiator, a clearance waveguide structure, integrated in the lower part of this high frequency electric way board, it cascades with this stromatolite waveguide structure, and it has the air chamber of opening in the bottom surface of this high frequency electric way board, a metal sheet sets up the opening part at this clearance waveguide structure's air chamber, and an air waveguide, install the bottom side at this metal sheet. The utility model discloses it is higher to gain to the volume is less, and is easily integrated.

Description

Multilayer radiation appliance
Technical field
The utility model relates to high frequency signals equipment, particularly relevant with the transmission of radio frequency, millimeter-wave signal.
Background technology
The radiation of the existing millimeter wave signal of telecommunication is generally adopt metal waveguide horn antenna.This antenna, volume is comparatively large, and cost is higher.In addition, micro-strip paster antenna because volume is little, be easy to integrate extensive use.But traditional paster antenna is generally by the waveguide of LWG(lamination) power division network of structure carries out feed, and transmission line loss is comparatively large, causes the gain of antenna lower, and then the application of micro-strip paster antenna in millimeter wave transmission is obstructed.Visible, be necessary to improve the feeding classification of micro-strip paster antenna in fact.
Summary of the invention
The technical problems to be solved in the utility model is, for the above-mentioned defect of prior art, propose a kind of multilayer radiation appliance, gain is higher, and small volume, be easy to integrated.
The utility model solves the technical scheme that its technical problem adopts and comprises: provide a kind of multilayer radiation appliance, comprising: a high-frequency circuit board, have a top and a bottom; One micro-band radiant body, is integrated in the end face top layer of this high-frequency circuit board; One lamination waveguiding structure, is integrated in the top of this high-frequency circuit board, and it is connected with this micro-band radiant body; One gap waveguide structure, is integrated in the bottom of this high-frequency circuit board, itself and this lamination waveguiding structure cascade, and it has an air chamber of the bottom surface being opened on this high-frequency circuit board; One metallic plate, is arranged on the opening part of the air chamber of this gap waveguide structure; And an air waveguide, be installed in the bottom side of this metallic plate.
In certain embodiments, this high-frequency circuit board is low-temperature sintered ceramics material.
In certain embodiments, this metallic plate is welded by parallel seam welding with this high-frequency circuit board.
In certain embodiments, this air waveguide and this metallic plate pass through conductive adhesive.
In certain embodiments, this lamination waveguiding structure and this micro-band radiant body realize feed by the mode of probe coupling.
In certain embodiments, the mode that this gap waveguide structure and this lamination waveguiding structure are coupled by pyramidal structure realizes cascade.
In certain embodiments, this gap waveguide structure comprises metal bridge, and the implementation of this metal bridge is each layer type metal at this gap waveguide structure place and connects each layer metal by metallization via hole.
In certain embodiments, this gap waveguide structure comprises metal ferrule array, and this metal ferrule array is made up of the via hole that metallizes.
In certain embodiments, the air chamber one step chamber of this gap waveguide structure, this metallic plate is embedded in this step chamber.
In certain embodiments, this air waveguide and this gap waveguide structure realize Signal transmissions by slot-coupled.
Compared with prior art, multilayer radiation appliance of the present utility model, by integrated micro-band radiant body, lamination waveguiding structure and gap waveguide structure dexterously on high-frequency circuit board, and pass through the opening of the air chamber of this gap waveguide structure of metallic plate capping, again in the waveguide of the bottom side of this metallic plate installing air, gain is higher, and small volume, be easy to integrated.
Accompanying drawing explanation
Fig. 1 is that the facade of multilayer radiation appliance of the present utility model analyses and observe signal.
Fig. 2 be multilayer radiation appliance of the present utility model look up signal.
Wherein, description of reference numerals is as follows: 1 high-frequency circuit board 2 micro-band radiant body 3 lamination waveguiding structure 4 gap waveguide structure 5 metallic plate 6 air waveguide 41 air chamber.
Embodiment
In order to describe structure of the present utility model and feature place in detail, hereby lifting following preferred embodiment and coordinating accompanying drawing to be described as follows.
The facade being multilayer radiation appliance of the present utility model see Fig. 1 and Fig. 2, Fig. 1 analyses and observe signal.Fig. 2 be multilayer radiation appliance of the present utility model look up signal.The utility model proposes a kind of multilayer radiation appliance, comprising: a high-frequency circuit board 1, be integrated in micro-band radiant body 2, lamination waveguiding structure 3 and gap waveguide structure 4, metallic plate 5 and the air waveguide 6 on this high-frequency circuit board 1.
This high-frequency circuit board 1 is low-temperature sintered ceramics material.It is divided into a top and a bottom.Its end face top layer is integrated with this micro-band radiant body 2.Its top is integrated with this lamination waveguiding structure 3 that band radiant body 2 micro-with this is connected.Its underpart is integrated with this gap waveguide structure 4 with this lamination waveguiding structure 3 cascade.This gap waveguide structure 4 has an air chamber 41 of the bottom surface being opened on this high-frequency circuit board 1.
This lamination waveguiding structure 3 realizes feed with this micro-band radiant body 2 by the mode of probe coupling.The mode that this gap waveguide structure 4 is coupled by pyramidal structure with this lamination waveguiding structure 3 realizes cascade.
This gap waveguide structure 4 comprises metal bridge, and the implementation of this metal bridge is each layer type metal at this gap waveguide structure place and connects each layer metal by metallization via hole.This gap waveguide structure 4 comprises metal ferrule array, and this metal ferrule array is made up of the via hole that metallizes.The air chamber 41 of this gap waveguide structure 4 is a step chamber.
This metallic plate 5 is the encapsulation cover plate of the air chamber 41 of this gap waveguide structure 4.This metallic plate 5 is embedded in air chamber 41.This metallic plate 5 is welded by parallel seam welding with this high-frequency circuit board 1.
This air waveguide 6 is normal air waveguide, and it is installed in the bottom side of this metallic plate 5.This air waveguide 6 passes through conductive adhesive with this metallic plate 5.This air waveguide 6 realizes Signal transmissions with this gap waveguide structure 4 by slot-coupled.
Compared with prior art, multilayer radiation appliance of the present utility model, by integrated micro-band radiant body 2, lamination waveguiding structure 3 and gap waveguide structure 4 dexterously on high-frequency circuit board 1, and pass through the air chamber 41 of this gap waveguide structure 4 of metallic plate 5 capping, again in the bottom side of this metallic plate 5 installing air waveguide 6, gain is higher, and small volume, be easy to integrated.
Above, be only the preferred embodiment of the utility model, be intended to further illustrate the utility model, but not it is limited.All simple replacements carried out according to the content disclosed in above-mentioned word and accompanying drawing, all at the row of the rights protection scope of this patent.

Claims (10)

1. a multilayer radiation appliance, is characterized in that, comprising:
One high-frequency circuit board, has a top and a bottom;
One micro-band radiant body, is integrated in the end face top layer of this high-frequency circuit board;
One lamination waveguiding structure, is integrated in the top of this high-frequency circuit board, and it is connected with this micro-band radiant body;
One gap waveguide structure, is integrated in the bottom of this high-frequency circuit board, itself and this lamination waveguiding structure cascade, and it has an air chamber of the bottom surface being opened on this high-frequency circuit board;
One metallic plate, is arranged on the opening part of the air chamber of this gap waveguide structure; And
One air waveguide, is installed in the bottom side of this metallic plate.
2. multilayer radiation appliance according to claim 1, is characterized in that: this high-frequency circuit board is low-temperature sintered ceramics material.
3. multilayer radiation appliance according to claim 1, is characterized in that: this metallic plate is welded by parallel seam welding with this high-frequency circuit board.
4. multilayer radiation appliance according to claim 1, is characterized in that: this air waveguide and this metallic plate pass through conductive adhesive.
5. multilayer radiation appliance according to claim 1, is characterized in that: this lamination waveguiding structure and this micro-band radiant body realize feed by the mode of probe coupling.
6. multilayer radiation appliance according to claim 1, is characterized in that: the mode that this gap waveguide structure is coupled by pyramidal structure with this lamination waveguiding structure realizes cascade.
7. multilayer radiation appliance according to claim 1, is characterized in that: this gap waveguide structure comprises metal bridge, and the implementation of this metal bridge is each layer type metal at this gap waveguide structure place and connects each layer metal by metallization via hole.
8. multilayer radiation appliance according to claim 1, is characterized in that: this gap waveguide structure comprises metal ferrule array, and this metal ferrule array is made up of the via hole that metallizes.
9. multilayer radiation appliance according to claim 1, is characterized in that: the air chamber one step chamber of this gap waveguide structure, this metallic plate is embedded in this step chamber.
10. multilayer radiation appliance according to claim 1, is characterized in that: this air waveguide and this gap waveguide structure realize Signal transmissions by slot-coupled.
CN201520854916.3U 2015-10-29 2015-10-29 Multilayer radiation appliance Active CN205069865U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520854916.3U CN205069865U (en) 2015-10-29 2015-10-29 Multilayer radiation appliance

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520854916.3U CN205069865U (en) 2015-10-29 2015-10-29 Multilayer radiation appliance

Publications (1)

Publication Number Publication Date
CN205069865U true CN205069865U (en) 2016-03-02

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Application Number Title Priority Date Filing Date
CN201520854916.3U Active CN205069865U (en) 2015-10-29 2015-10-29 Multilayer radiation appliance

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CN (1) CN205069865U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106654543A (en) * 2015-10-29 2017-05-10 苏州博海创业微***有限公司 Multilayer radiation apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106654543A (en) * 2015-10-29 2017-05-10 苏州博海创业微***有限公司 Multilayer radiation apparatus

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