CN202905935U - Small high-performance chip antenna - Google Patents

Small high-performance chip antenna Download PDF

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Publication number
CN202905935U
CN202905935U CN 201220604376 CN201220604376U CN202905935U CN 202905935 U CN202905935 U CN 202905935U CN 201220604376 CN201220604376 CN 201220604376 CN 201220604376 U CN201220604376 U CN 201220604376U CN 202905935 U CN202905935 U CN 202905935U
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CN
China
Prior art keywords
antenna
chip antenna
layered chip
pcb board
metal level
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 201220604376
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Chinese (zh)
Inventor
郑轶
金龙
胡季岗
***
***
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chengdu Electronic & Information Technology Engineering Co Ltd
Original Assignee
Chengdu Electronic & Information Technology Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by Chengdu Electronic & Information Technology Engineering Co Ltd filed Critical Chengdu Electronic & Information Technology Engineering Co Ltd
Priority to CN 201220604376 priority Critical patent/CN202905935U/en
Application granted granted Critical
Publication of CN202905935U publication Critical patent/CN202905935U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to a small high-performance chip antenna, which comprises a multi-layered chip antenna and an antenna PCB (Printed Circuit Board), wherein the antenna PCB is formed by three layers of a front-side feed matching metal layer, a dielectric layer and a back-side floor metal layer. The small high-performance chip antenna is characterized in that the multi-layered chip antenna is located at the edge of the front-side feed matching metal layer of the antenna PCB; the front-side feed matching metal layer of the antenna PCB comprises a short-circuited microstrip line and a 50 ohm feeder; the short-circuited microstrip line and the 50 ohm feeder are connected with the multi-layered chip antenna via connection points; a front-side non-metal area and a back-side non-metal area are respectively arranged at the edges of the front-side feed matching metal layer and the back-side floor metal layer of the antenna PCB; and a large number of grounding through holes are arranged around the multi-layered chip antenna on the antenna PCB. The small high-performance chip antenna has the beneficial effects that small and high-performance characteristics are provided, the omnidirectional radiation property is provided, and batch and low-cost production can be realized.

Description

A kind of high performance chips antenna of miniaturization
Technical field
The utility model relates to the portable radio antenna technical field, particularly a kind of high performance chips antenna of miniaturization.
Background technology
Antenna is one of vitals of wireless communication system.In recent years, the fast development of modern radio system, to the small and exquisite property of wireless device, portable proposition strict requirement, many miniaturizations active, passive electronic that are applied in the circuit have obtained huge progress, yet antenna but often becomes parts the heaviest in the system and reveals, and becomes one of bottleneck of restriction wireless device miniaturization.
The miniaturization of antenna must be accompanied by the sacrifice of some aspect performance index, especially adopts the antenna of conventional planar structure, and the reducing of size brings the sacrifice of index even more serious simultaneously.If but can realize the structure that some are novel, take full advantage of the space that antenna takies, such as the stacked antenna of three-dimensional, just can be good at realizing the balance of sacrificing with index of reducing of size.
There is power reflection for the miniature antenna particular importance in impedance matching online because antenna mismatch means in transmission, causes standing wave greater than 1 or much larger than 1.If standing wave is very high, power will be along reflection before and after the transmission line, and this past interflection is for lossy transmission line, and its energy loss is very large.
In addition, need the interconnected through hole of interlayer even the interconnected through hole of interlayer a lot of in some multi-layered chip antenna, be unfavorable in enormous quantities, the low-cost production of antenna.
Given this, be necessary to provide a kind of high performance chips antenna of miniaturization to address the above problem.
The utility model content
The purpose of this utility model is in order to provide a kind of volume little, simple in structure and can satisfy a kind of high performance chips antenna of miniaturization of the application of the multiple portable communications such as GSM, GPS bluetooth.
The technical solution of the utility model is: a kind of high performance chips antenna of miniaturization, comprise multi-layered chip antenna and front feed coupling metal level, the antenna pcb board of dielectric layer and three layers of formation of floor, back side metal level, it is characterized in that, described multi-layered chip antenna is positioned at the edge of the front feed coupling metal level of antenna pcb board, the front feed coupling metal level of antenna pcb board comprises short circuit microstrip line and 50 ohm of feeder lines, described short circuit microstrip line, 50 ohm of feeder lines are connected by tie point with multi-layered chip antenna, the front that the front feed coupling metal level of antenna pcb board and the edge of floor, back side metal level arrange respectively without metallic region and the back side without metallic region, on the described antenna pcb board multi-layered chip antenna around be provided with a large amount of grounding through hole.
Described multi-layered chip antenna comprises the top to bottom, left and right, front and rear metal covering that is formed by end-blocking, the double layer capacity structure, because the existence of metal covering, the formation of double layer capacity structure does not just need extra through hole, the feeder line tie point of antenna is positioned at the lower-left side, and the lower right side of antenna is the grounding through hole tie point.
The beneficial effects of the utility model are: the utility model antenna has miniaturization, high performance characteristics, and has the omnidirectional radiation characteristic, can produce cheaply in enormous quantities, the various wireless communication that is fit to very much present stage is used, and therefore has higher practicality.
Description of drawings
Fig. 1 is the threedimensional model structure chart of the utility model antenna.
Fig. 2 is pcb board Facad structure figure of the present utility model.
Fig. 3 is pcb board structure figure of the present utility model.
Fig. 4 is the pcb board side-looking structure chart of the utility model antenna.
Fig. 5 is input impedance figure after the self-resonance of the utility model antenna.
Fig. 6 is the return loss resolution chart of the utility model antenna.
Embodiment
Below in conjunction with the drawings and specific embodiments the utility model is described further.
As shown in Figure 4, a kind of high performance chips antenna of miniaturization comprises that multi-layered chip antenna 10 and front feed mate the antenna pcb board of metal level 20, dielectric layer 30 and 40 3 layers of formation of floor, back side metal level; Shown in Fig. 2 and 3, described multi-layered chip antenna 10 is positioned at the edge of the front feed coupling metal level 20 of antenna pcb board, the front feed coupling metal level 20 of antenna pcb board comprises short circuit microstrip line 21 and 50 ohm of feeder lines 22, described short circuit microstrip line 21,50 ohm of feeder lines 22 are connected by tie point 23 with antenna component 10, the front that the front feed coupling metal level 20 of antenna pcb board and the edge of floor, back side metal level 40 arrange respectively without metallic region 31 and the back side without metallic region 32, on the described antenna pcb board antenna component 10 around be provided with a large amount of grounding through hole 33A.
As shown in Figure 1, described multi-layered chip antenna 10 comprise by end-blocking form about, about and front and back metal covering 101,102, double layer capacity structure 103,104, because metal covering 101,102 existence, double layer capacity structure 103,104 formation just do not need extra through hole.The feeder line tie point 105 of antenna is positioned at the lower-left side, and the lower right side of antenna is grounding through hole tie point 106.
Described multi-layered chip antenna 10 utilizes the double layer capacity structure 103,104 can self-resonance in very little volume, the input impedance behind the resonance as shown in Figure 5, this novel antenna component resonance is at 2.45GHz as can be known.
After described multi-layered chip antenna 10 is installed on pcb board, one end feeder line tie point 105 is connected in tie point 23, short circuit microstrip line 21 and 50 ohm of feeder lines 22 of pcb board, the other end 106 connects grounding through hole 33A, the front of pcb board effectively raises the radiance of antenna without metallic region 32 without metallic region 31 and the back side, grounding through hole 33A around the multi-layered chip antenna 10 has guaranteed the Electro Magnetic Compatibility of antenna simultaneously, make antenna can not disturb the work of other circuit devcie, it only is 3 * 1.5 * 0.9mm in size that whole system makes antenna 3Very small size under realized that high-performance has realized high-performance.
In the present embodiment, pcb board is of a size of 80mm * 40mm, and thickness is 1mm, and dielectric material is FR4, and dielectric constant is 4.4, is 4mm * 4mm without the metallic region size, and the short circuit microstrip line is 0.2mm * 1mm.It is the LTCC material of 0.1mm that antenna component adopts 9 bed thickness altogether, and its dielectric constant is 14, and the double layer capacity structure lays respectively at the 4th layer, five layers.After design is finished, make this antenna by our LTCC production line, the test of the return loss of antenna as shown in Figure 6, frequency from 2.4GHz to the 2.48GHz scope in return loss less than-8dB.The gain test of antenna is 2dBi at 2.45GHz, and has preferably omni-directional.
Those of ordinary skill in the art will appreciate that embodiment described here is in order to help the principle of reader understanding's utility model, should to be understood to that protection range of the present utility model is not limited to such special statement and embodiment.Those of ordinary skill in the art can make various other various concrete distortion and combinations that do not break away from the utility model essence according to disclosed these technology enlightenments of the utility model, and these distortion and combination are still in protection range of the present utility model.

Claims (2)

1. the high performance chips antenna of a miniaturization, comprise multi-layered chip antenna (10) and front feed coupling metal level (20), the antenna pcb board of dielectric layer (30) and (40) three layers of formation of floor, back side metal level, it is characterized in that, described multi-layered chip antenna (10) is positioned at the edge of the front feed coupling metal level (20) of antenna pcb board, the front feed coupling metal level (20) of antenna pcb board comprises short circuit microstrip line (21) and 50 ohm of feeder lines (22), described short circuit microstrip line (21), 50 ohm of feeder lines (22) are connected by tie point (23) with multi-layered chip antenna (10), without metallic region (32), multi-layered chip antenna (10) is provided with a large amount of grounding through hole (33A) on every side on the described antenna pcb board without metallic region (31) and the back side in the front that the front feed coupling metal level (20) of antenna pcb board and the edge of floor, back side metal level (40) arrange respectively.
2. the high performance chips antenna of a kind of miniaturization according to claim 1, it is characterized in that, described multi-layered chip antenna (10) comprises the top to bottom, left and right, front and rear metal covering (101,102) that is formed by end-blocking, double layer capacity structure (103,104), because the existence of metal covering (101,102), the formation of double layer capacity structure (103,104) does not just need extra through hole, the feeder line tie point (105) of antenna is positioned at the lower-left side, and the lower right side of antenna is grounding through hole tie point (106).
CN 201220604376 2012-11-16 2012-11-16 Small high-performance chip antenna Expired - Fee Related CN202905935U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201220604376 CN202905935U (en) 2012-11-16 2012-11-16 Small high-performance chip antenna

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201220604376 CN202905935U (en) 2012-11-16 2012-11-16 Small high-performance chip antenna

Publications (1)

Publication Number Publication Date
CN202905935U true CN202905935U (en) 2013-04-24

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201220604376 Expired - Fee Related CN202905935U (en) 2012-11-16 2012-11-16 Small high-performance chip antenna

Country Status (1)

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CN (1) CN202905935U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103474732A (en) * 2013-09-26 2013-12-25 安徽蓝麦通信科技有限公司 Double-grounding-conductor signal transmission board
CN105680170A (en) * 2016-02-01 2016-06-15 广东风华高新科技股份有限公司 Ltcc antenna
CN109962334A (en) * 2017-12-14 2019-07-02 三星电机株式会社 Anneta module and electronic equipment including the Anneta module

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103474732A (en) * 2013-09-26 2013-12-25 安徽蓝麦通信科技有限公司 Double-grounding-conductor signal transmission board
CN105680170A (en) * 2016-02-01 2016-06-15 广东风华高新科技股份有限公司 Ltcc antenna
CN109962334A (en) * 2017-12-14 2019-07-02 三星电机株式会社 Anneta module and electronic equipment including the Anneta module
US11637362B2 (en) 2017-12-14 2023-04-25 Samsung Electro-Mechanics Co., Ltd. Antenna module

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130424

Termination date: 20151116

EXPY Termination of patent right or utility model