CN204994061U - Circuit board with shielding structure - Google Patents
Circuit board with shielding structure Download PDFInfo
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- CN204994061U CN204994061U CN201520641728.2U CN201520641728U CN204994061U CN 204994061 U CN204994061 U CN 204994061U CN 201520641728 U CN201520641728 U CN 201520641728U CN 204994061 U CN204994061 U CN 204994061U
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- layer
- wiring board
- line layer
- shielding
- insulating barrier
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Abstract
The utility model provides a circuit board with shielding structure, this circuit board include that first shielding layer, secondary shielding layer, a line layer setting between first shielding layer and secondary shielding layer, set up the first insulation layer between line layer and first shielding layer, set up the second insulating layer between line layer and secondary shielding layer, secondary shielding layer and second insulating layer set up on the line layer and the size on slightly be lighter than the line layer, when secondary shielding layer and the 2nd insulation cover were on the line layer, at least border part was exposed outside the secondary shielding layer on the line layer, set up a plurality of metal electrode of being connected with external circuit of being used for in that this exposed border is partial. Adopt the technical scheme of the utility model, all set up the shielding layer through the two sides at the line layer to need not to adopt the screening cover to shield the processing to the circuit, through being used for the line layer metal electrode who connects directly to expose in the insulating layer outside, avoided parasitic capacitance's production, promoted the anti -interference function of circuit board greatly.
Description
Technical field
The utility model relates to printed circuit board technology field, particularly relates to a kind of wiring board with shielding construction.
Background technology
In some special application fields of wiring board, the application scenarios such as such as remote sensing satellite, Aero-Space, radar communication, high frequency antenna, microwave antenna, to stability and the anti-interference requirement very harshness of wiring board, under the complex environments such as very high temperature, pole low temperature, wiring board all will keep stability; Any faint interference signal, all likely affects the normal work of wiring board, therefore, usually needs to carry out shielding processing to wiring board.Prior art to be typically employed on wiring board weld metal screening cover to promote the interference free performance of wiring board, metallic shield lid welds under needing high temperature, add one process, not only increase the complexity of processing technology, easily cause the softening of wiring board material when high-temperature soldering simultaneously, wiring board can produce certain distortion, and screening cover pyroconductivity and electronic circuit board comparing difference larger, screening cover heats up very fast, the leading warpage of screening cover will be caused like this, thus affect electronic circuit board contour structures and cause other device rosin joint.Such as, Chinese patent literature [201110199763.X] discloses the welding method of a kind of screening cover and electronic circuit board, solving wiring board produces warpage problem when crossing reflow ovens, effectively can reduce production cost.
Technique scheme, solve wiring board produces warpage problem when crossing reflow ovens, improvement of production process to a certain extent, but still need to use metallic shield lid, at high temperature weld metal screening cover can affect the performance of components and parts on wiring board to a certain extent.
Therefore, for the above-mentioned defect existed in currently available technology, be necessary to study in fact, to provide a kind of scheme, solve the defect existed in prior art.
Utility model content
In view of this, the purpose of this utility model is to provide a kind of wiring board with shielding construction, to solve the problem.
A kind of wiring board with shielding construction, this wiring board comprises the first screen, secondary shielding layer, a line layer are arranged between described first screen and described secondary shielding layer, first insulating barrier is set between described line layer and described first screen, the second insulating barrier is set between described line layer and described secondary shielding layer;
Described secondary shielding layer and described second insulating barrier to arrange on described line layer and size are slightly less than described line layer, when described secondary shielding layer and described second insulating barrier cover on described line layer, on described line layer, at least one edge portions is exposed outside described secondary shielding layer, arranges multiple metal electrode for being connected with external circuit at this exposed edge portions.
Preferably, the circumference of this wiring board is also provided with multiple exposed semicircle and connects via hole, and described connection via hole is for being communicated with described first screen and described secondary shielding layer.
Preferably, the material of described first insulating barrier is any one in ceramic base material, epoxy glass fiber cloth, glass honeycomb core plate, polyimide foam base material.
Preferably, the material of described second insulating barrier is elastic insulating material.
Preferably, described line layer is Copper Foil.
Preferably, described line layer is indium tin oxide films layer.
Preferably, the circuitous pattern of described line layer directly forms resistive element.
Preferably, described first screen and described secondary shielding layer are Copper Foil.
Preferably, described first screen is formed by the mode applying silver-bearing copper composite shielding coating on described first insulating barrier.
Preferably, described secondary shielding layer is formed by the mode applying silver-bearing copper composite shielding coating on described second insulating barrier.
Relative to prior art, the wiring board of the shielding construction that the utility model provides, by the two sides at line layer, all screen is set, thus without the need to adopting screening cover to carry out shielding processing to circuit, because screen and line layer are integrated, easy to process and the performance of components and parts on line layer can not be affected because increasing shielding process; Directly exposed outside insulating barrier by the metal electrode that line layer is used for connecting, thus without the need to process in wiring board via hole just connection metal electrode draw and receive PCB surface, avoid the generation of parasitic capacitance, greatly improve the anti-interference function of circuit board; Multiple exposed connection via hole is set in the circumference of wiring board simultaneously, makes upper and lower screen become equipotentiality body, promote the shielding properties of wiring board further.
Accompanying drawing explanation
The structured flowchart with the wiring board of shielding construction that Fig. 1 provides for the utility model.
Fig. 2 for the utility model embodiment 1 provide there is the wiring board of shielding construction face structured flowchart.
Fig. 3 for the utility model embodiment 2 provide there is the wiring board of shielding construction face structured flowchart.
In above-mentioned accompanying drawing, wherein, the first screen 1, first insulating barrier 2, line layer 3, the second insulating barrier 4, secondary shielding layer 5, line layer edge portions 6, metal electrode 7, connects via hole 8.
Embodiment
Be below specific embodiment of the utility model and by reference to the accompanying drawings, the technical solution of the utility model is further described, but the utility model be not limited to these embodiments.
Refer to Fig. 1 and Fig. 2, be depicted as the structured flowchart with the wiring board of shielding construction that the utility model provides, a kind of wiring board with shielding construction, comprise the first screen 1, secondary shielding layer 5, be arranged on line layer 3 between described first screen 1 and described secondary shielding layer 5, be arranged on the first insulating barrier 2 between described line layer 3 and described first screen 1, be arranged on the second insulating barrier 4 between described line layer 3 and described secondary shielding layer 5;
Described secondary shielding layer 5 and described second insulating barrier 4 to arrange on described line layer 3 and size are slightly less than described line layer 3, when described secondary shielding layer 5 and described second insulating barrier 4 cover on described line layer 3, on described line layer 3, at least one edge portions 6 is exposed outside described secondary shielding layer 5, arranges multiple metal electrode 7 for being connected with external circuit at this exposed edge portions 6.
Technical solutions of the utility model adopt three-decker, by all arranging screen on the two sides of line layer 3, thus without the need to adopting screening cover to carry out shielding processing to circuit, screen and line layer are integrated, easy to process and the performance of components and parts on line layer can not be affected because of increasing shielding process.
Wiring board of the prior art simultaneously, the line layer in intermediate layer will be connected with its levels circuit or outside line, is typically employed in the mode of processing metal via hole on wiring board, because metallic vias inside forms metal level, can produce parasitic capacitance like this.The existence of this parasitic capacitance, makes traditional circuit plate cannot meet application requirement in the application scenario of some high requests.Technical solutions of the utility model are directly exposed outside insulating barrier by the metal electrode 7 being used for connecting by line layer 3, thus without the need to process in wiring board via hole just connection metal electrode 7 draw and receive PCB surface, avoid the generation of parasitic capacitance, greatly improve the anti-interference function of circuit board.
In technique scheme, the material of described first insulating barrier 2 is any one in ceramic base material, epoxy glass fiber cloth, glass honeycomb core plate, polyimide foam base material; Epoxy glass fiber cloth and ceramic base material are the conventional board substrate of prior art, epoxy glass fiber cloth wiring board and ceramic base wiring board comparatively common in general circuit application.In the application scenario that some are special, the glass honeycomb core plate usually adopting performance more excellent and polyimide foam base material.Polyimide foams for a long time can the temperature of resistance to 250 DEG C ~ 300 DEG C, in short-term can resistance to 400 DEG C ~ 500 DEG C high temperature, and there is good mechanical performance (tensile strength is at more than 100MPa), its modulus of elasticity is generally 3GPa ~ 4GPa, can use as load-carrying member in hot environment, meet the demand of the industry such as Aeronautics and Astronautics and electronics.Polyimide foams has very high radiation-resistant property, after 5 × 109rad dose delivery, intensity still keeps about 80%, and there are good dielectric property, dielectric constant is about 3.4, Polyimide foams dielectric loss is 10-3, dielectric strength is 100kV/mm ~ 300kV/mm, specific insulation is the 1017 Ω cm orders of magnitude, these performances make polyimide foam be that copper-clad plate prepared by basic unit still can keep higher level in the temperature range and frequency range of broadness, make it at remote sensing satellite, Aero-Space, microstrip antenna, the particular application such as high frequency antenna, there is unrivaled performance advantage.Glass honeycomb core plate has glass honeycomb sandwich construction, has higher strength and stiffness and quality is lighter, compares with epoxy glass-fiber-fabric circuit board, weight saving 80%, have very high specific strength, specific stiffness, evenness is good, not yielding, structure is simple, easy for installation.In one preferably execution mode, the first insulating barrier 2 adopts glass honeycomb core plate or polyimide foam base material.
Due to line layer 3 being also provided with components and parts, the second insulating barrier 4 need cover the components and parts on line layer 3, and therefore the second insulating barrier 4 needs certain deformation space, selects elastic insulating material.Preferably, the second insulating barrier 4 adopts elastic insulated rubber.
See Fig. 3, be depicted as that the utility model embodiment 2 provides there is the wiring board of shielding construction face structured flowchart, the circumference of this wiring board is also provided with multiple exposed semicircle and connects via hole 8, described connection via hole 8 is for being communicated with described first screen 1 and described secondary shielding layer 5, make upper and lower screen become equipotentiality body, promote the shielding properties of wiring board further.Simultaneously outside exposed owing to connecting via hole 8, connecting via hole 8 without the need to being formed in wiring board, avoiding the generation of parasitic capacitance, improving the anti-interference function of circuit board further.
In a preferred embodiment, line layer 3 adopts Copper Foil, further, after Copper Foil forms circuitous pattern, then is bonded on the first insulating barrier 2.
In a preferred embodiment, line layer 3 is indium tin oxide films layer, and the similar Copper Foil of effect of indium tin oxide films layer, forms circuitous pattern thereon by photoresist mask etch technique.Indium tin oxide films layer has the characteristic of electricity conduction and good shielding properties simultaneously, is widely used in prior art as the conduction plated film of EMI shielding.In the utility model, directly apply indium tin oxide films layer and form circuitous pattern, promote the shielding properties of wiring board further.
Further, in some special dimensions, in order to ensure the stability of wiring board, the circuitous pattern of line layer 3 directly forms resistive element.Such as in microstrip circuit or high frequency antenna, the resistive element of employing is more, adopts the resistive element of prior art, and consistency and stability are difficult to ensure, its resistance of resistance welding procedures also minor variations can occur simultaneously.In the utility model embodiment, owing to adopting indium tin oxide material to form line layer 3, the resistivity of tin indium oxide much larger than metals such as copper, therefore when formation circuitous pattern, direct-on-line road floor 3 can arrange resistance.Actual resistance pattern can calculate according to the resistivity of indium tin oxide material.Namely in the resistive element position of line pattern, the size according to its resistance deposits the resistance pattern corresponding with its resistance in the preparation.
In a preferred embodiment, the first screen 1 and secondary shielding layer 5 adopt Copper Foil, and metal is natural shield, are wrapped in by line layer 3 in upper and lower copper foil layer, can play shield effectiveness.
But because these highly active copper atoms of copper foil surface are easily oxidised with air to Cu
2the film of O and CuO, the oxidization of copper powder speed that especially surface area is large is faster, greatly reduces shielding properties.In a preferred embodiment, adopt and form the first screen 1 and secondary shielding layer 5 in the mode of the first insulating barrier 2 and the second insulating barrier 4 surface spraying silver-bearing copper composite shielding coating.Silver is used as conductive filler the earliest in all metals, has the good (ρ of electric conductivity
v=1.62 × 10
-6Ω cm), strong, the steady performance of oxidation resistance, but silver is under direct current (DC) bias effect, or under wet heat condition, migration easily occurs and causes short circuit, greatly reduce the coefficient of safety of application.In addition, comparatively copper is much expensive for the price of silver, adopts silver cost will be made greatly to improve as screen.Be blended in resin after forming silver-coated copper powder in silver-bearing copper composite shielding coating, therefore copper powder does not directly contact with the external world, improves the antioxygenic property of copper powder, obtains the electric conductivity close to silver simultaneously, and similar with employing Copper Foil on cost.
The explanation of above embodiment just understands method of the present utility model and core concept thereof for helping.Should be understood that; for those skilled in the art; under the prerequisite not departing from the utility model principle, can also carry out some improvement and modification to the utility model, these improve and modify and also fall in the protection range of the utility model claim.Be apparent for those skilled in the art to the multiple amendment of these embodiments, General Principle as defined herein can realize in other embodiments when not departing from spirit or scope of the present utility model.Therefore, the utility model can not be restricted to these embodiments shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (10)
1. one kind has the wiring board of shielding construction, it is characterized in that, this wiring board comprises the first screen (1), secondary shielding layer (5), a line layer (3) are arranged between described first screen (1) and described secondary shielding layer (5), first insulating barrier (2) is set between described line layer (3) and described first screen (1), the second insulating barrier (4) is set between described line layer (3) and described secondary shielding layer (5);
Described secondary shielding layer (5) and described second insulating barrier (4) arrange described line layer (3) and go up and size be slightly less than described line layer (3), when described secondary shielding layer (5) and described second insulating barrier (4) cover on described line layer (3), the upper at least one edge portions (6) of described line layer (3) is exposed described secondary shielding layer (5) outward, arranges multiple metal electrode (7) for being connected with external circuit at this exposed edge portions (6).
2. the wiring board with shielding construction according to claim 1, it is characterized in that, the circumference of this wiring board is also provided with multiple exposed semicircle and connects via hole (8), and described connection via hole (8) is for being communicated with described first screen (1) and described secondary shielding layer (5).
3. the wiring board with shielding construction according to claim 1 and 2, is characterized in that, the material of described first insulating barrier (2) is any one in ceramic base material, epoxy glass fiber cloth, glass honeycomb core plate, polyimide foam base material.
4. the wiring board with shielding construction according to claim 1 and 2, is characterized in that, the material of described second insulating barrier (4) is elastic insulating material.
5. the wiring board with shielding construction according to claim 1 and 2, is characterized in that, described line layer (3) is Copper Foil.
6. the wiring board with shielding construction according to claim 1 and 2, is characterized in that, described line layer (3) is indium tin oxide films layer.
7. the wiring board with shielding construction according to claim 6, is characterized in that, the circuitous pattern of described line layer (3) directly forms resistive element.
8. the wiring board with shielding construction according to claim 1 and 2, is characterized in that, described first screen (1) and described secondary shielding layer (5) are Copper Foil.
9. the wiring board with shielding construction according to claim 1 and 2, is characterized in that, described first screen (1) is by being formed in the mode of described first insulating barrier (2) upper coating silver-bearing copper composite shielding coating.
10. the wiring board with shielding construction according to claim 1 and 2, is characterized in that, described secondary shielding layer (5) is by being formed in the mode of described second insulating barrier (4) upper coating silver-bearing copper composite shielding coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520641728.2U CN204994061U (en) | 2015-08-24 | 2015-08-24 | Circuit board with shielding structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520641728.2U CN204994061U (en) | 2015-08-24 | 2015-08-24 | Circuit board with shielding structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204994061U true CN204994061U (en) | 2016-01-20 |
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ID=55128376
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520641728.2U Active CN204994061U (en) | 2015-08-24 | 2015-08-24 | Circuit board with shielding structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204994061U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112566356A (en) * | 2020-11-20 | 2021-03-26 | 深圳市金晟达电子技术有限公司 | Millimeter wave radar printed circuit board |
-
2015
- 2015-08-24 CN CN201520641728.2U patent/CN204994061U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112566356A (en) * | 2020-11-20 | 2021-03-26 | 深圳市金晟达电子技术有限公司 | Millimeter wave radar printed circuit board |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |