CN204991317U - Thermal resistance - Google Patents
Thermal resistance Download PDFInfo
- Publication number
- CN204991317U CN204991317U CN201520561906.0U CN201520561906U CN204991317U CN 204991317 U CN204991317 U CN 204991317U CN 201520561906 U CN201520561906 U CN 201520561906U CN 204991317 U CN204991317 U CN 204991317U
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- China
- Prior art keywords
- aluminum hull
- pin
- thermistor
- recess
- thermal resistance
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Abstract
The utility model relates to a thermal resistance, including thermal resistance chip, aluminum hull, pin A and pin B, the thermal resistance chip sets up in the aluminum hull, the aluminum hull is ring form casing, ring groove is seted up in the aluminum hull outside, sets up annular bulge in the aluminum hull, and both sides set up pin A and pin B respectively around the thermal resistance chip, set up on the aluminum hull with pin A and pin B matched with notch A and notch B, the packing ceramic solidification is physically between aluminum hull and the thermal resistance chip. The utility model has the advantages of 1, simple structure, the preparation is convenient, 2, annular bulge makes the ceramic solidification body and aluminum hull fixed more firm, increases area of contact, is favorable to the heat dissipation, 3, the ceramic solidification body, messenger thermal resistance chip can not receive the erosion of air or moisture content, has improved heat resistance, the thermal diffusivity of thermal resistance ware product, has better durability and stability, 4, ring groove increases heat radiating area and is favorable to the heat dissipation.
Description
Technical field
The utility model relates to a kind of electronic devices and components, particularly relates to a kind of thermistor.
Background technology
Thermistor is the electronic component utilizing the temperature variant characteristic of thermo-sensitive material resistivity and make, NTC themistor has been widely used in Inrush current restraining, temperature survey, control, temperature-compensating etc., PTC themistor is widely used in overcurrent protection, the startup of circuit and electronic component, and flow velocity, flow, the pertinent instruments of radionetric survey and application; NTC themistor/the PTC themistor of current existing encapsulation still has the problem of thermal endurance, thermal diffusivity deficiency, easily cause the aging of material, have impact on serviceability and the useful life of thermistor, along with all kinds of power supplys such as air-conditioning, refrigerator, microwave equipment and automobile and the stability requirement of circuit to thermistor more and more higher, be necessary that analysis and research have better thermal endurance, thermal diffusivity, thus improve the thermistor of product stability, to adapt to the needs of market requirements at the higher level and competition.
Utility model content
Technical problem to be solved in the utility model is: provide a kind of thermistor, and thermal endurance, thermal diffusivity are better, high its of performance has better durability and stability, uses under adapting to the environment of requirements at the higher level.
The technical scheme that the problem that the utility model is the above-mentioned proposition of solution adopts is:
A kind of thermistor, comprise thermistor chip 1, aluminum hull 2, pin A3 and pin B4, thermistor chip 1 is arranged in aluminum hull 2, described aluminum hull 2 is circular housing, offer annular recess 7 outside described aluminum hull 2, arrange annular projection 8 in aluminum hull 2, before and after thermistor chip 1, both sides arrange pin A3 and pin B4 respectively, aluminum hull 2 is offered the recess A5 and recess B6 that match with pin A3 and pin B4, between aluminum hull 2 and thermistor chip 1, fill of ceramic solidification body 9.
Described recess A5 and recess B6 is positioned at the both sides, front and back of aluminum hull 2, and what pin A3 and pin B4 was fixed is more firm.
The tangent plane of described annular projection 8 is trapezoidal, and shorter side, annular projection 8 tangent plane base is fixedly connected with aluminum hull 2, facilitates aluminum hull 2 and of ceramic solidification body 9 fixing more firm, and increases contact area.
Fill of ceramic solidification body 9 in described recess A5 and recess B6, pin A3 and pin B4 is separately fixed at recess A5 and recess B6.
Described pin A3 and pin B4 all arranges and locates turn of bilge 10, and location turn of bilge 10 is positioned at outside aluminum hull 2, locates more firm.
Wrapped resin protective layer 11 outside described thermistor chip 1.
Described thermistor chip 1 is NTC thermistor chip or PTC thermistor chip.
Operation principle of the present utility model: will the thermistor chip wrapped resin protective layer of pin be installed; of ceramic solidification body is utilized to be fixed in aluminum hull by thermistor chip landfill; pin A and pin B is fixed in recess A and recess B; annular projection makes of ceramic solidification body and aluminum hull fix more firm; and enlarge active surface, annular recess increases the area of dissipation of aluminum hull.
The beneficial effects of the utility model are: 1, structure is simple, easy to make; 2, annular projection makes of ceramic solidification body and aluminum hull fix more firmly, increases contact area, is conducive to heat radiation; 3, of ceramic solidification body, makes thermistor chip can not be subject to the erosion of air or moisture content, improves the thermal endurance of thermistor product, thermal diffusivity, has better to have better durability and stability; 4, annular recess increase area of dissipation is conducive to heat radiation.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model;
Fig. 2 is the cross section enlarged diagram of aluminum hull in Fig. 1.
Wherein, 1-thermistor chip, 2-aluminum hull, 3-pin A, 4-pin B, 5-recess A, 6-recess B, 7-annular recess, 8-annular projection, 9-of ceramic solidification body, 10-locates turn of bilge, 11-resin protective layer.
Embodiment
Embodiment of the present utility model is further illustrated below in conjunction with accompanying drawing.
With reference to Fig. 1-2, a kind of thermistor described in this embodiment, comprise thermistor chip 1, aluminum hull 2, pin A3 and pin B4, thermistor chip 1 is arranged in aluminum hull 2, described aluminum hull 2 is circular housing, annular recess 7 is offered outside described aluminum hull 2, annular projection 8 is set in aluminum hull 2, before and after thermistor chip 1, both sides arrange pin A3 and pin B4 respectively, aluminum hull 2 is offered the recess A5 and recess B6 that match with pin A3 and pin B4, between aluminum hull 2 and thermistor chip 1, fill of ceramic solidification body 9.
Described recess A5 and recess B6 is positioned at the both sides, front and back of aluminum hull 2, and what pin A3 and pin B4 was fixed is more firm.
The tangent plane of described annular projection 8 is trapezoidal, and shorter side, annular projection 8 tangent plane base is fixedly connected with aluminum hull 2, facilitates aluminum hull 2 and of ceramic solidification body 9 fixing more firm, and increases contact area.
Fill of ceramic solidification body 9 in described recess A5 and recess B6, pin A3 and pin B4 is separately fixed at recess A5 and recess B6.
Described pin A3 and pin B4 all arranges and locates turn of bilge 10, and location turn of bilge 10 is positioned at outside aluminum hull 2, locates more firm.
Wrapped resin protective layer 11 outside described thermistor chip 1.
Described thermistor chip 1 is NTC thermistor chip or PTC thermistor chip.
The operation principle of this embodiment: will the thermistor chip wrapped resin protective layer of pin be installed; of ceramic solidification body is utilized to be fixed in aluminum hull by thermistor chip landfill; pin A and pin B is fixed in recess A and recess B; annular projection makes of ceramic solidification body and aluminum hull fix more firm; and enlarge active surface, annular recess increases the area of dissipation of aluminum hull.
The beneficial effect of this embodiment is: 1, structure is simple, easy to make; 2, annular projection makes of ceramic solidification body and aluminum hull fix more firmly, increases contact area, is conducive to heat radiation; 3, of ceramic solidification body, makes thermistor chip can not be subject to the erosion of air or moisture content, improves the thermal endurance of thermistor product, thermal diffusivity, has better to have better durability and stability; 4, annular recess increase area of dissipation is conducive to heat radiation.
Specific embodiment of the utility model does not form restriction of the present utility model, and every employing analog structure of the present utility model and change, all in protection range of the present utility model.
Claims (6)
1. a thermistor, it is characterized in that: comprise thermistor chip (1), aluminum hull (2), pin A(3) and pin B(4), thermistor chip (1) is arranged in aluminum hull (2), described aluminum hull (2) is circular housing, annular projection (8) is set in described aluminum hull (2), annular recess (7) is offered in aluminum hull (2) outside, before and after thermistor chip (1), both sides arrange pin A(3 respectively) and pin B(4), aluminum hull (2) is offered and pin A(3) and pin B(4) the recess A(5 that matches) and recess B(6), of ceramic solidification body (9) is filled between aluminum hull (2) and thermistor chip (1).
2. a kind of thermistor as claimed in claim 1, is characterized in that: described recess A(5) and recess B(6) be positioned at the both sides, front and back of aluminum hull (2).
3. a kind of thermistor as claimed in claim 1, is characterized in that: the tangent plane of described annular projection (8) is trapezoidal, and shorter side, annular projection (8) tangent plane base is fixedly connected with aluminum hull (2).
4. a kind of thermistor as claimed in claim 1, is characterized in that: described recess A(5) and recess B(6) interior filling of ceramic solidification body (9).
5. a kind of thermistor as claimed in claim 1, is characterized in that: described pin A(3) and pin B(4) all arrange and locate turn of bilge (10), location turn of bilge (10) is positioned at aluminum hull (2) outside.
6. a kind of thermistor as claimed in claim 1, is characterized in that: described thermistor chip (1) outside wrapped resin protective layer (11).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201520561906.0U CN204991317U (en) | 2015-07-30 | 2015-07-30 | Thermal resistance |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201520561906.0U CN204991317U (en) | 2015-07-30 | 2015-07-30 | Thermal resistance |
Publications (1)
Publication Number | Publication Date |
---|---|
CN204991317U true CN204991317U (en) | 2016-01-20 |
Family
ID=55125660
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201520561906.0U Expired - Fee Related CN204991317U (en) | 2015-07-30 | 2015-07-30 | Thermal resistance |
Country Status (1)
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CN (1) | CN204991317U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113380479A (en) * | 2021-06-09 | 2021-09-10 | 深圳市科敏传感器有限公司 | High-temperature-resistant waterproof chip type high-molecular NTC thermistor |
-
2015
- 2015-07-30 CN CN201520561906.0U patent/CN204991317U/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113380479A (en) * | 2021-06-09 | 2021-09-10 | 深圳市科敏传感器有限公司 | High-temperature-resistant waterproof chip type high-molecular NTC thermistor |
CN113380479B (en) * | 2021-06-09 | 2022-05-17 | 深圳市科敏传感器有限公司 | High-temperature-resistant waterproof chip type high-molecular NTC thermistor |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160120 Termination date: 20200730 |