CN113380479B

CN113380479B - High-temperature-resistant waterproof chip type high-molecular NTC thermistor

Info

Publication number: CN113380479B
Application number: CN202110641987.5A
Authority: CN
Inventors: 董文进
Original assignee: Shenzhen Kemin Sensor Co ltd
Current assignee: Shenzhen Kemin Sensor Co ltd
Priority date: 2021-06-09
Filing date: 2021-06-09
Publication date: 2022-05-17
Anticipated expiration: 2041-06-09
Also published as: CN113380479A

Abstract

The invention discloses a high-temperature-resistant waterproof chip type high-molecular NTC thermistor, which comprises an upper substrate and a lower substrate, wherein a boss is arranged in the middle of the bottom of the upper substrate, a metal electrode groove is formed in the bottom of the boss, a silicon resin groove is formed in the outer side of the boss, a groove matched with the boss is formed in the middle of the top of the lower substrate for children, a chip matched with the metal electrode groove is arranged at the bottom of the groove, and a silicon resin wrapping layer matched with the silicon resin groove is formed in the outer side of the groove; according to the invention, the chip and the metal electrode groove are perfectly combined together through the corresponding clamping of the upper substrate and the lower substrate between the clamping layer and the clamping groove and the structural splicing of the boss and the groove, so that the assembling tightness of the thermistor is increased, the required size and volume of the resistor are reduced, the pins are more stably connected with the chip through the communication ports, and the practical use stability and the dislocation prevention function of the pins are increased.

Description

High-temperature-resistant waterproof chip type high-molecular NTC thermistor

Technical Field

The invention relates to the technical field of thermistors, in particular to a high-temperature-resistant waterproof chip type high-molecular NTC thermistor.

Background

The resistance value of the thermistor changes along with the temperature change, wherein the NTC thermistor is a negative temperature coefficient thermistor and is manufactured by adopting metal oxides of manganese, cobalt, nickel, copper and the like as main materials and adopting a ceramic process; at low temperatures, these oxide materials have a low number of carriers, so that their resistance values are high, and as the temperature increases, the number of carriers increases, so that their resistance values decrease, and mainly there are power-type, temperature-controlled, and temperature-compensated NTC thermistors.

When the current thermistor is used, an external heat source is absorbed, so that the aim of balancing the temperature and the resistance value is fulfilled, however, when the heat absorption of a chip in the thermistor is too high, the heat and the temperature are not easy to be uniformly absorbed and circulated, and are easy to transfer to pins, so that the welding positions of the pins are broken and damaged; the thermistor can generate a heat source with the rapid increase of the resistance when the heat source is absorbed by the resistor, the heat source is difficult to control and discharge, the actual temperature control effect of the thermistor is reduced, and the service life of the resistor is shortened.

Disclosure of Invention

The present invention is directed to a high temperature resistant and waterproof chip-type polymer NTC thermistor, so as to solve the above-mentioned problems in the background art.

In order to achieve the purpose, the invention provides the following technical scheme: including upper substrate and infrabasal plate, the intermediate position department of upper substrate bottom is equipped with the boss, the metal electrode groove has been seted up to the bottom of boss, the outside of boss is equipped with the silicone groove, the centre at infrabasal plate top is child to go out the recess that is equipped with the mutual adaptation of boss, the bottom of recess is equipped with the chip with the mutual adaptation of metal electrode groove, the outside of recess is equipped with the silicone parcel layer of laminating each other with the silicone groove, the intermediate position department of infrabasal plate one side has seted up the intercommunication mouth, the top and the bottom of chip one side are equipped with interconnect's pin, the inside both sides of recess are equipped with heat conduction chamber, the both sides of upper substrate bottom are equipped with prevention of seepage water heat-conducting component.

Preferably, the two sides of the bottom of the anti-seepage heat-conducting component are provided with clamping layers, the two sides of the top of the lower substrate are provided with clamping grooves matched with the clamping layers in a clamping manner, the two groups of clamping grooves are provided with heat-conducting silicon layers at the ends far away from each other, the two groups of clamping layers are provided with heat-conducting silicon wafers attached to the heat-conducting silicon layers at the ends close to each other, the two groups of clamping layers and the clamping grooves are provided with channels communicated with each other, and the two sides of the top of the upper substrate and the two sides of the bottom of the lower substrate are provided with through holes communicated with the channels.

Preferably, the top of upper substrate and the bottom of infrabasal plate are triangle-shaped structure combination by two sets of inclined plate and form, the both ends of upper substrate are equipped with the butt joint lug, and the both ends of butt joint lug are equipped with the locating hole, the both ends of infrabasal plate are equipped with the butt joint groove, and the both ends in butt joint groove are equipped with the locating pin of mutually supporting with the locating hole.

Preferably, the edge of upper substrate bottom and the edge at infrabasal plate top all are equipped with the sealing tape, the bottom of upper substrate one side is equipped with the fixed station with boss interconnect, the top of infrabasal plate one side is equipped with the fixed slot with the mutual adaptation of fixed station.

Preferably, the top and the bottom of one side of the chip are provided with conductive colloids, the conductive colloids are connected with the two groups of pins, and the two groups of heat conducting cavities are communicated with the chip through the grooves and correspond to the chip.

Preferably, one side of the communicating opening is provided with two groups of positioning sleeves, the inner side of each positioning sleeve is provided with a sealing ring in a sleeved mode, the two groups of pins are matched with the positioning sleeves, and one ends, far away from one side of each pin, of the two groups of pins are provided with lantern rings.

Preferably, the plurality of groups of channels are in an inclined structure and are communicated with the through holes, and an anti-leakage sealing ring is arranged at the joint of the channel arranged at the bottom of each group of clamping layers and the channel arranged at the top of each clamping groove.

Compared with the prior art, the invention provides the high-temperature-resistant waterproof chip type high-molecular NTC thermistor which has the following beneficial effects:

1. according to the invention, the chip and the metal electrode groove are perfectly combined together through the corresponding clamping of the upper substrate and the lower substrate between the clamping layer and the clamping groove and the structural splicing of the boss and the groove, so that the assembling tightness of the thermistor is increased, the required size and volume of the resistor are reduced, the pins are more stably connected with the chip through the communication port, the stability of the practical use of the pins and the dislocation prevention function are increased, after the boss is tightly attached to the groove, the metal electrode groove and the periphery of the chip are promoted to form the silicone frame edge with high temperature resistance, waterproof performance and electric insulation effect by utilizing the corresponding contact of the silicone groove and the silicone wrapping layer, and the protective performance and the practical value of the practical use of the thermistor are increased.

2. The invention utilizes the mutual matching of the water seepage prevention heat conduction components, not only can utilize the structure clamping of the clamping groove and the clamping layer to quickly splice and position the upper substrate and the lower substrate, meanwhile, a plurality of groups of channels and through holes are mutually linked, and the heat conduction silicon wafer is mutually jointed with the heat conduction silicon layer to form a jointing layer with a heat conduction function, when the thermal shock in the upper substrate and the lower substrate is larger, the heat can be rapidly dissipated outwards through the communication and flow guide of the heat conduction cavity and the absorption of the laminating layer, the rapid heat dissipation effect of the device is enhanced, when the water liquid falls on the surface of the upper base plate or the lower base plate, the inclined plate with a triangular structure is used for guiding the water liquid to two sides to promote the water liquid to be discharged under the permeation of the through holes and the channels, so as to prevent water from accumulating on the surface of the upper substrate or the lower substrate for a long time to generate leakage, and increase the functionality and the water resistance of the resistor.

3. According to the invention, the thermistor shell which is tightly attached is formed by splicing the structures between the upper substrate and the lower substrate, and meanwhile, the upper substrate and the lower substrate which are spliced are further fixed under the matching of the positioning pins and the positioning holes by matching with the structure matching of the butt joint lug and the butt joint groove, so that the structure stitching strength of the upper substrate and the lower substrate is higher, the looseness is difficult to generate, and the attaching performance and the conductive effect of the chip in the metal electrode groove are improved.

Drawings

FIG. 1 is a perspective view of the present invention;

FIG. 2 is a perspective exploded view of the present invention;

FIG. 3 is a first perspective view of the upper substrate of the present invention;

FIG. 4 is a second perspective view of the upper substrate of the present invention;

FIG. 5 is a perspective view of a lower substrate according to the present invention;

FIG. 6 is a front cross-sectional view of the present invention;

FIG. 7 is an enlarged view taken at A of FIG. 5 according to the present invention.

In the figure: 1. an upper substrate; 2. a lower substrate; 3. a through hole; 301. a clamping layer; 302. a channel; 303. a heat-conducting silicon wafer; 304. a thermally conductive silicon layer; 305. a clamping groove; 4. a boss; 5. a silicone groove; 6. a metal electrode tank; 7. a silicone resin wrapping layer; 8. a chip; 9. a groove; 10. a communication port; 11. a pin; 12. a heat conducting cavity.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-7, the present invention provides a technical solution: high temperature resistant waterproof chip formula polymer NTC thermistor, including upper substrate 1 and infrabasal plate 2, the intermediate position department of 1 bottom of upper substrate is equipped with boss 4, metal electrode groove 6 has been seted up to boss 4's bottom, boss 4's the outside is equipped with silicone groove 5, the centre at 2 tops of infrabasal plate is for child's play be equipped with the recess 9 of the mutual adaptation of boss 4, the bottom of recess 9 is equipped with the chip 8 with the mutual adaptation of metal electrode groove 6, the outside of recess 9 is equipped with the silicone parcel layer 7 of laminating each other with silicone groove 5, intercommunication mouth 10 has been seted up to the intermediate position department of 2 one sides of infrabasal plate, the top and the bottom of chip 8 one side are equipped with interconnect's pin 11, the inside both sides of recess 9 are equipped with heat conduction chamber 12, the both sides of 1 bottom of upper substrate are equipped with prevention of seepage water heat-conducting component.

As a preferable embodiment of the present embodiment: both sides of prevention of seepage water heat conduction assembly bottom are equipped with clamping layer 301, the both sides at 2 tops of infrabasal plate are equipped with the block groove 305 with the block adaptation of clamping layer 301, the one end that two sets of block grooves 305 kept away from each other is equipped with heat conduction silicon layer 304, the one end that two sets of clamping layer 301 are close to each other is equipped with the heat conduction silicon chip 303 of laminating each other with heat conduction silicon layer 304, the passageway 302 of mutual intercommunication is evenly seted up with the inside of block groove 305 to two sets of clamping layer 301, the through-hole 3 that communicates each other with passageway 302 is evenly seted up to the both sides at 1 tops of upper substrate and the both sides of 2 bottoms of infrabasal plate.

As a preferable embodiment of the present embodiment: the top of the upper substrate 1 and the bottom of the lower substrate 2 are formed by combining two groups of inclined plates in a triangular structure, the two ends of the upper substrate 1 are provided with butt joint convex blocks, the two ends of each butt joint convex block are provided with positioning holes, the two ends of the lower substrate 2 are provided with butt joint grooves, the two ends of each butt joint groove are provided with positioning pins matched with the positioning holes, the auxiliary positioning effect of the side surfaces of the upper substrate 1 and the lower substrate 2 is increased, and the stability and the tightness of the thermistor structure assembly are improved.

As a preferable embodiment of the present embodiment: the edge of 1 bottom of upper substrate and the edge at 2 tops of infrabasal plate all are equipped with the sealing strip, increase the sealed effect after 2 concatenations of upper substrate 1 and infrabasal plate, the bottom of 1 one side of upper substrate is equipped with the fixed station with 4 interconnect of boss, the top of 2 one sides of infrabasal plate is equipped with the fixed slot with the mutual adaptation of fixed station, improve the location success and the structural strength of the 2 concatenations of upper substrate 1 and infrabasal plate.

As a preferable embodiment of the present embodiment: the top and the bottom of chip 8 one side are equipped with conductive adhesive, and conductive adhesive and two sets of pins 11 interconnect, and two sets of heat conduction chamber 12 communicate each other with chip 8 through recess 9 each other and correspond, increase the heat conduction and the radiating efficiency in two sets of heat conduction chamber 12.

As a preferable embodiment of the present embodiment: one side of intercommunication mouth 10 is equipped with two sets of position sleeves, and the inboard cover of position sleeve is equipped with the sealing washer, improves the leakproofness of position sleeve, makes opening 10 be difficult to the infiltration dust or water liquid, and two sets of pins 11 and the mutual adaptation of position sleeve, the one end of keeping away from each other in 11 one sides of two sets of pins are equipped with the lantern ring, the follow-up resistance detection work that carries on of operating personnel of being convenient for.

As a preferable embodiment of the present embodiment: the plurality of groups of channels 302 are in an inclined structure and are communicated with the through hole 3, and an anti-leakage sealing ring is arranged at the joint of the channel 302 arranged at the bottom of the two groups of clamping layers 301 and the channel 302 arranged at the top of the clamping groove 305, so that the sealing property of the communication part of the channel 302 is improved, and the water leakage is prevented.

In embodiment 1, as shown in fig. 1 to 6, during the splicing of the upper substrate 1 and the lower substrate 2, the two sets of abutting protrusions under the upper substrate 1 and the abutting grooves over the lower substrate 2 can be engaged and fitted to facilitate the side surfaces of the upper substrate 1 and the lower substrate 2 to obtain the auxiliary positioning effect, and at this time, the positioning pins and the positioning holes can be adapted to be locked and fixed, so as to facilitate the side surfaces of the upper substrate 1 and the lower substrate 2 to obtain an effective fixing structure, thereby increasing the tightness and structural strength of the splicing combination of the upper substrate 1 and the lower substrate 2.

Embodiment 2, as shown in fig. 1 to 6, after the two clamping layers 301 are clamped and fixed with the clamping grooves 305, the through hole 3 and the channel 302 are enabled to communicate with each other, so that the water penetrating into the surfaces of the upper substrate 1 and the lower substrate 2 is guided by the inclined plates having the triangular structures, so that the water is automatically discharged under the communication between the through hole 3 and the channel 302, the waterproof function of the resistor is increased, and when the exterior of the resistor is heated, the heat source is guided at the communication position between the through hole 3 and the channel 302 by the inclined plates, so that the heat source penetrates into the heat conducting silicon layer 304 and the heat conducting silicon wafer 303 through the communication between the channel 302 to be absorbed, and the heat source can be quickly guided into the cavities of the chip 8 and the metal electrode groove 6 from the heat conducting cavity 12 to increase the resistance, thereby increasing the operability and convenience of the temperature measurement of the resistor, and improving the protection performance of the device.

The working principle is as follows: this thermistor is when using, can alternate two sets of pins 11 under the location of intercommunication mouth 10 with chip 8 interconnect, at this moment drive clamping layer 301 and the correspondence of clamping groove 305 position and boss 4 and recess 9's structure cooperation splice respectively with upper substrate 1, make the perfect combination of upper substrate 1 and infrabasal plate 2 be in the same place, form sealed housing, and then let the chip 8 of the inboard laminating of infiltration metal electrode groove 6 obtain effectual sealed protection work, can carry out temperature balance with the absorptive heat source of pin 11 through chip 8 this moment, the laminating formation that utilizes silicon resin groove 5 and silicon resin parcel layer 7 prevents the safe edge, thermal-insulated effect has been increased, make the more temperature resistant stable temperature acquisition work that carries on of thermistor.

Finally, it should be noted that the above-mentioned contents are only used for illustrating the technical solutions of the present invention, and not for limiting the protection scope of the present invention, and that the simple modifications or equivalent substitutions of the technical solutions of the present invention by those of ordinary skill in the art can be made without departing from the spirit and scope of the technical solutions of the present invention.

Claims

1. High temperature resistant waterproof chip formula polymer NTC thermistor, including upper substrate (1) and infrabasal plate (2), its characterized in that: the heat-conducting waterproof heat-conducting plate is characterized in that a boss (4) is arranged at the middle position of the bottom of the upper base plate (1), a metal electrode groove (6) is formed in the bottom of the boss (4), a silicon resin groove (5) is formed in the outer side of the boss (4), a groove (9) matched with the boss (4) is formed in the middle of the top of the lower base plate (2) for children, a chip (8) matched with the metal electrode groove (6) is arranged at the bottom of the groove (9), a silicon resin wrapping layer (7) attached to the silicon resin groove (5) is arranged on the outer side of the groove (9), a communication port (10) is formed in the middle position of one side of the lower base plate (2), mutually connected pins (11) are arranged at the top and the bottom of one side of the chip (8), heat-conducting cavities (12) are formed in two sides of the inner portion of the groove (9), and anti-seepage heat-conducting assemblies are arranged on two sides of the bottom of the upper base plate (1),

wherein, the both sides of prevention of seepage water heat conduction assembly bottom are equipped with clamping layer (301), the both sides at infrabasal plate (2) top are equipped with block groove (305) with block layer (301) block adaptation, and are two sets of the one end that blocks groove (305) kept away from each other is equipped with heat conduction silicon layer (304), and is two sets of the one end that clamping layer (301) are close to each other is equipped with heat conduction silicon chip (303) of laminating each other with heat conduction silicon layer (304), and is two sets of passageway (302) that communicate each other are evenly seted up with the inside in block groove (305) in clamping layer (301), through-hole (3) that communicate each other with passageway (302) are evenly seted up to the both sides at upper substrate (1) top and the both sides of infrabasal plate (2) bottom.

2. The high temperature resistant waterproof chip-type polymer NTC thermistor according to claim 1, characterized in that: the top of upper substrate (1) and the bottom of infrabasal plate (2) are triangle-shaped structure combination by two sets of inclined plate and form, the both ends of upper substrate (1) are equipped with the butt joint lug, and the both ends of butt joint lug are equipped with the locating hole, the both ends of infrabasal plate (2) are equipped with the butt joint groove, and the both ends in butt joint groove are equipped with the locating pin of mutually supporting with the locating hole.

3. The high temperature resistant waterproof chip-type polymer NTC thermistor according to claim 1, characterized in that: the edge of upper substrate (1) bottom and the edge at infrabasal plate (2) top all are equipped with the sealing strip, the bottom of upper substrate (1) one side is equipped with the fixed station with boss (4) interconnect, the top of infrabasal plate (2) one side is equipped with the fixed slot with the mutual adaptation of fixed station.

4. The high temperature resistant waterproof chip-type polymer NTC thermistor according to claim 1, characterized in that: the top and the bottom of one side of the chip (8) are provided with conductive colloids, the conductive colloids are connected with the two groups of pins (11), and the two groups of heat conducting cavities (12) are communicated with the chip (8) through the grooves (9) to correspond to each other.

5. The high temperature resistant waterproof chip-type polymer NTC thermistor according to claim 1, characterized in that: two groups of positioning sleeves are arranged on one side of the communication port (10), sealing rings are sleeved on the inner sides of the positioning sleeves, the two groups of pins (11) are matched with the positioning sleeves, and a lantern ring is arranged at one end, far away from one side of each group of pins (11), of each group of pins.

6. The high temperature resistant waterproof chip-type polymer NTC thermistor according to claim 1, characterized in that: the channels (302) are in an inclined structure and are communicated with the through holes (3), and anti-leakage sealing rings are arranged at the joints of the channels (302) arranged at the bottoms of the clamping layers (301) and the channels (302) arranged at the tops of the clamping grooves (305).