CN204946888U - 倒装焊接芯片 - Google Patents
倒装焊接芯片 Download PDFInfo
- Publication number
- CN204946888U CN204946888U CN201520345046.7U CN201520345046U CN204946888U CN 204946888 U CN204946888 U CN 204946888U CN 201520345046 U CN201520345046 U CN 201520345046U CN 204946888 U CN204946888 U CN 204946888U
- Authority
- CN
- China
- Prior art keywords
- layer
- pad
- chip
- solder layer
- face
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 229910000679 solder Inorganic materials 0.000 claims abstract description 64
- 239000000758 substrate Substances 0.000 claims abstract description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical group [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 238000003466 welding Methods 0.000 abstract description 18
- 230000000694 effects Effects 0.000 abstract description 10
- 238000005476 soldering Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000000654 additive Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000010068 moulding (rubber) Methods 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000010309 melting process Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201520345046.7U CN204946888U (zh) | 2015-05-26 | 2015-05-26 | 倒装焊接芯片 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201520345046.7U CN204946888U (zh) | 2015-05-26 | 2015-05-26 | 倒装焊接芯片 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN204946888U true CN204946888U (zh) | 2016-01-06 |
Family
ID=55014290
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201520345046.7U Active CN204946888U (zh) | 2015-05-26 | 2015-05-26 | 倒装焊接芯片 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN204946888U (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109712899A (zh) * | 2018-12-27 | 2019-05-03 | 通富微电子股份有限公司 | 一种半导体封装方法及半导体封装器件 |
CN113113395A (zh) * | 2021-03-25 | 2021-07-13 | Tcl华星光电技术有限公司 | 基板以及发光基板的制备方法 |
WO2023240576A1 (zh) * | 2022-06-17 | 2023-12-21 | 厦门市芯颖显示科技有限公司 | 微型电子部件、绑定背板及绑定组件 |
-
2015
- 2015-05-26 CN CN201520345046.7U patent/CN204946888U/zh active Active
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109712899A (zh) * | 2018-12-27 | 2019-05-03 | 通富微电子股份有限公司 | 一种半导体封装方法及半导体封装器件 |
CN113113395A (zh) * | 2021-03-25 | 2021-07-13 | Tcl华星光电技术有限公司 | 基板以及发光基板的制备方法 |
WO2023240576A1 (zh) * | 2022-06-17 | 2023-12-21 | 厦门市芯颖显示科技有限公司 | 微型电子部件、绑定背板及绑定组件 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN100576476C (zh) | 芯片埋入半导体封装基板结构及其制法 | |
CN102646606B (zh) | Ic卡模块的封装方法 | |
CN103219299A (zh) | 集成电路封装组件及其形成方法 | |
CN108461459A (zh) | 一种负极对接双向整流二极管及其制造工艺 | |
CN103474406A (zh) | 一种aaqfn框架产品无铜扁平封装件及其制作工艺 | |
CN103794569A (zh) | 封装结构及其制法 | |
CN204946888U (zh) | 倒装焊接芯片 | |
CN104916592A (zh) | 半导体装置的制造方法及半导体装置 | |
CN103794587A (zh) | 一种高散热芯片嵌入式重布线封装结构及其制作方法 | |
CN104051443A (zh) | 新型高密度可堆叠封装结构及制作方法 | |
CN103295926A (zh) | 一种基于tsv芯片的互连封装方法 | |
CN107331627A (zh) | 一种芯片封装方法及芯片封装结构 | |
CN103887256A (zh) | 一种高散热芯片嵌入式电磁屏蔽封装结构及其制作方法 | |
CN203720871U (zh) | 一种智能卡 | |
CN202075772U (zh) | 接触式ic卡模块 | |
CN103762200B (zh) | 芯片封装件及其封装方法 | |
CN102208358A (zh) | 一种在基板上焊接倒装芯片的方法及封装器件 | |
CN102937663B (zh) | 智能电表核心模块的封装结构及封装方法 | |
CN103596358A (zh) | Smt加法高密度封装多层线路板结构及其制作方法 | |
CN203967124U (zh) | 一种倒装封装多面发光的led灯 | |
CN203608451U (zh) | Smt加法高密度封装多层线路板结构 | |
CN203787410U (zh) | 一种高散热芯片嵌入式电磁屏蔽封装结构 | |
CN107919333A (zh) | 一种三维pop封装结构及其封装方法 | |
CN208127189U (zh) | 一种负极对接双向整流二极管 | |
CN203367268U (zh) | 半导体芯片封装模组及其封装结构 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Flip-chip and welding method thereof Effective date of registration: 20170418 Granted publication date: 20160106 Pledgee: Guangdong Nanhai Rural Commercial Bank branch branch of Limited by Share Ltd. Pledgor: FOSHAN EVERCORE OPTOELECTRONIC TECHNOLOGY CO.,LTD. Registration number: 2017990000256 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20160106 Pledgee: Guangdong Nanhai Rural Commercial Bank branch branch of Limited by Share Ltd. Pledgor: FOSHAN EVERCORE OPTOELECTRONIC TECHNOLOGY CO.,LTD. Registration number: 2017990000256 |