CN204929386U - Thoughtlessly press HF link plate structure - Google Patents
Thoughtlessly press HF link plate structure Download PDFInfo
- Publication number
- CN204929386U CN204929386U CN201520678194.0U CN201520678194U CN204929386U CN 204929386 U CN204929386 U CN 204929386U CN 201520678194 U CN201520678194 U CN 201520678194U CN 204929386 U CN204929386 U CN 204929386U
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- layer
- circuit
- high frequency
- line layer
- board
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Abstract
The utility model discloses a thoughtlessly press HF link plate structure, including a high frequency board, the upper surface from bottom to top of high frequency board has set gradually first interior line layer, first outer line layer and the first solder paste china ink layer that hinders, the lower surface of high frequency board has set gradually the interior line layer of second, the outer line layer of second and second from top to bottom and has hindered solder paste china ink layer. The utility model discloses a two upper and lower surfaces at the two -sided high frequency board of polytetrafluoroethylene set up the interior line layer that forms the symmetry to the skin in proper order, prepreg and outer line layer, and arrange the plate voltage board through symmetrical structure, because it does not make as yet to adopt this structure outer circuit when the clamp plate, it carries out the pressfitting to belong to whole copper foil contact press steel sheet, consequently, the atress is comparatively even, can not make the copper foil produce because of pressure is too big damages, the circuit board was thoughtlessly pressed to the four layers manufacturing process and quality demand have effectively been improved to it, the pressfitting disability rate is produced with saving cost is reduced.
Description
Technical field:
The utility model relates to wiring board, and what be specifically related to is a kind of four sandwich circuit board structures by epoxy resin fiberglass and high frequency material mixed pressure.
Background technology:
Existing four floor heights frequently wiring board generally adopt mixed pressure structure, namely one piece of polytetrafluoroethylene double sided board having made first line layer, second layer line layer is adopted, make the epoxy resin fiberglass double sided board of tertiary circuit layer, the 4th sandwich circuit layer with one piece, then superposed the pressing of an epoxy resin prepreg between and form.But the wiring board of this mixed pressure structure due to outer-layer circuit ground floor, the 4th layer complete etching make, define line pattern, and the layers of copper of line pattern has certain thickness, certain height fall is had with central layer dielectric layer, directly contact with press steel plate in bonding processes, the pressure of about 50 ~ 200 tons that are produced by hydraulic system of press, the pressure that circuit can be caused to be subject to is uneven and the tiny circuit of part likely can be made to be damaged by pressure, cause wiring board article of manufacture Geological Problems, pressing scrappage is remained high.
Summary of the invention:
For this reason, the purpose of this utility model is to provide a kind of four sandwich circuit board structures by epoxy resin fiberglass and high frequency material mixed pressure, to solve the quality problem that existing mixed pressure wiring board causes because of structural design defect occurring in bonding processes.
For achieving the above object, the utility model mainly adopts following technical scheme:
A kind of mixed pressure HF link plate structure, comprise a high frequency plate, the upper surface of described high frequency plate is disposed with the first layer within the circuit, the first layer outside the circuit and the first solder mask layer from bottom to top; The lower surface of described high frequency plate is disposed with the second layer within the circuit, the second layer outside the circuit and the second solder mask layer from top to bottom.
Further, described high frequency plate is polytetrafluoroethylene double sided board.
Further, being also provided with a thickness between described first layer within the circuit and the first layer outside the circuit is 0.08MM ~ 0.18MM, and resin glue content is first prepreg of 35% ~ 63%.
Further, being also provided with a thickness between described second layer within the circuit and the second layer outside the circuit is 0.08MM ~ 0.18MM, and resin glue content is second prepreg of 35% ~ 63%.
The utility model is arranged by two surfaces up and down at the two-sided high frequency plate of polytetrafluoroethylene successively outer layers and forms symmetrical layer within the circuit, prepreg and layer outside the circuit, and by symmetrical structure row plate pressing plate, not yet make owing to adopting this structure outer-layer circuit when pressing plate, belong to whole Copper Foil kiss press steel plate and carry out pressing, therefore stressed comparatively even, Copper Foil will be produced because pressure is too large to damage, it effectively improves manufacturing process and the quality requirements of four layers of mixed pressure wiring board, reduces pressing scrappage and saves production cost.
Accompanying drawing illustrates:
Fig. 1 is the longitudinal profile structure cutaway view of the utility model mixed pressure HF link plate.
Identifier declaration in figure: the first solder mask layer 1, first layer outside the circuit 2, first prepreg 3, first layer within the circuit 4, high frequency plate 5, second layer within the circuit 6, second prepreg 7, second layer outside the circuit 8, second solder mask layer 9.
Embodiment:
For setting forth thought of the present utility model and object, below in conjunction with the drawings and specific embodiments, the utility model is described further.
As shown in Figure 1, Fig. 1 is the longitudinal profile structure cutaway view of the utility model mixed pressure HF link plate.The present embodiment provides a kind of four sandwich circuit board structures by epoxy resin fiberglass and high frequency material mixed pressure, and it causes the quality problem occurred in bonding processes because of structural design defect mainly for existing mixed pressure wiring board.
Mixed pressure HF link plate structure wherein described in the present embodiment includes one piece of upper and lower surface and has completed etching and the polytetrafluoroethylene high frequency double sided board forming the first layer within the circuit 4 and the second layer within the circuit 6, and described first layer within the circuit 4 and the second layer within the circuit 6 copper thickness are 0.5OZ ~ 3OZ.The upper surface of high frequency plate 5 is provided with the copper foil layer of one piece of etching formation first layer outside the circuit 2, and the copper foil layer of one piece of etching formation second layer outside the circuit 8 is provided with at the lower surface of high frequency plate 5, and the thickness of the first layer outside the circuit 2 and the second layer outside the circuit 8 is also 0.5OZ ~ 3OZ.
Stack between first layer within the circuit 4 and the first layer outside the circuit 2 between first prepreg 3, second layer within the circuit 6 and the second layer outside the circuit 8 and stacked the second prepreg 7.By pressing, the copper foil layer of formation first layer outside the circuit 2 is pressed together on the first layer within the circuit 4, the copper foil layer of formation second layer outside the circuit 8 is pressed together on the second layer within the circuit 6.Afterwards pad pasting, exposure, development, etch processes are carried out to above-mentioned copper foil layer, form outer-layer circuit, then in described outer-layer circuit, print the first solder mask layer 1, second solder mask layer 9 hide, described first solder mask layer 1, second solder mask layer 9 has insulating properties, can be green oil, also can be blue oil, chilli oil, white oil, butter, dirty oil etc.
Polytetrafluoroethylene high frequency double sided board in the present embodiment is a kind of high frequency material, is commonly called as Teflon, Teflon, King etc., has the advantages that insulating properties is good, dielectric constant is stablized, fissipation factor is lower; The line layer on its upper and lower surface is copper product composition.In the present embodiment, prepreg has good insulating properties, is the semi-solid preparation composite material that a kind of epoxy resin adds glass fabric formation, is commonly called as FR-4.And the thickness range of the present embodiment epoxy resin prepreg is: 0.08MM ~ 0.18MM, resin glue content is 35% ~ 63%.
The four sandwich circuit board structures by epoxy resin fiberglass and high frequency material mixed pressure described in the utility model, by first having made internal layer high frequency plate line layer, then symmetrical structure row plate pressing plate is carried out, because outer-layer circuit during pressing plate not yet makes, that whole Copper Foil kiss press steel plate carries out pressing, therefore uniform force, Copper Foil will be produced because pressure is too large to damage, improve calmly manufacturing process and the quality requirements of four layers of mixed pressure wiring board, reduce pressing scrappage and save production cost, can meet again PCB can meet dielectric constant stablize, transmission loss is little, the requirement of high-frequency high-speed Signal transmissions, be highly suitable for high-frequency microwave plate, radio-frequency antenna, coupler, network communication, the related application fields such as frequency converter.
More than that a kind of mixed pressure HF link plate structure provided by the utility model is described in detail, apply specific case herein to set forth structural principle of the present utility model and execution mode, above embodiment just understands method of the present utility model and core concept thereof for helping; Meanwhile, for one of ordinary skill in the art, according to thought of the present utility model, all will change in specific embodiments and applications, in sum, this description should not be construed as restriction of the present utility model.
Claims (4)
1. a mixed pressure HF link plate structure, is characterized in that, comprises a high frequency plate, and the upper surface of described high frequency plate is disposed with the first layer within the circuit, the first layer outside the circuit and the first solder mask layer from bottom to top; The lower surface of described high frequency plate is disposed with the second layer within the circuit, the second layer outside the circuit and the second solder mask layer from top to bottom.
2. mixed pressure HF link plate structure as claimed in claim 1, it is characterized in that, described high frequency plate is polytetrafluoroethylene double sided board.
3. mixed pressure HF link plate structure as claimed in claim 2, is characterized in that, be also provided with the first prepreg between described first layer within the circuit and the first layer outside the circuit.
4. mixed pressure HF link plate structure as claimed in claim 3, is characterized in that, be also provided with the second prepreg between described second layer within the circuit and the second layer outside the circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520678194.0U CN204929386U (en) | 2015-09-02 | 2015-09-02 | Thoughtlessly press HF link plate structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520678194.0U CN204929386U (en) | 2015-09-02 | 2015-09-02 | Thoughtlessly press HF link plate structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204929386U true CN204929386U (en) | 2015-12-30 |
Family
ID=54978478
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520678194.0U Expired - Fee Related CN204929386U (en) | 2015-09-02 | 2015-09-02 | Thoughtlessly press HF link plate structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204929386U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106852031A (en) * | 2017-03-22 | 2017-06-13 | 深圳市景旺电子股份有限公司 | A kind of mixed-compression board of three layers of HDI plates and aluminium base and preparation method thereof |
| CN107343354A (en) * | 2017-08-24 | 2017-11-10 | 湖南维胜科技电路板有限公司 | Soft or hard combination half-finished product plate and Rigid Flex |
| CN112208169A (en) * | 2020-09-30 | 2021-01-12 | 宁波甬强科技有限公司 | Copper-clad plate and manufacturing method thereof |
-
2015
- 2015-09-02 CN CN201520678194.0U patent/CN204929386U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106852031A (en) * | 2017-03-22 | 2017-06-13 | 深圳市景旺电子股份有限公司 | A kind of mixed-compression board of three layers of HDI plates and aluminium base and preparation method thereof |
| CN106852031B (en) * | 2017-03-22 | 2019-05-03 | 深圳市景旺电子股份有限公司 | A kind of three layers of HDI plate and the mixed-compression board of aluminum substrate and preparation method thereof |
| CN107343354A (en) * | 2017-08-24 | 2017-11-10 | 湖南维胜科技电路板有限公司 | Soft or hard combination half-finished product plate and Rigid Flex |
| CN107343354B (en) * | 2017-08-24 | 2023-10-20 | 湖南维胜科技电路板有限公司 | Soft and hard combined semi-finished board and soft and hard combined board |
| CN112208169A (en) * | 2020-09-30 | 2021-01-12 | 宁波甬强科技有限公司 | Copper-clad plate and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151230 Termination date: 20200902 |