CN107343354B - Soft and hard combined semi-finished board and soft and hard combined board - Google Patents
Soft and hard combined semi-finished board and soft and hard combined board Download PDFInfo
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- CN107343354B CN107343354B CN201710732685.2A CN201710732685A CN107343354B CN 107343354 B CN107343354 B CN 107343354B CN 201710732685 A CN201710732685 A CN 201710732685A CN 107343354 B CN107343354 B CN 107343354B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a soft and hard combined semi-finished product plate and a soft and hard combined plate, wherein the soft and hard combined semi-finished product plate comprises a first hard plate layer, a first hard plate film layer, a first covering film layer, a first soft plate film layer, a second soft plate film layer, a third soft plate layer, a second covering film layer, a second hard plate film layer and a second hard plate layer which are sequentially pressed from bottom to top, the second soft plate layer consists of a high-frequency signal transmission area and a common signal transmission area, the high-frequency signal transmission area is made of a double-sided copper-covered teflon material, and the area, opposite to the high-frequency signal transmission area, on the third soft plate layer is made of a single-sided copper-covered teflon material; the active circuit area of the second flexible board layer is located within the high frequency signal transmission area. The invention meets the high-frequency transmission requirement, has low cost and smooth surface, is not easy to generate interlayer offset, has good reliability and strong processability, and is suitable for the production of rigid-flex boards.
Description
Technical Field
The invention belongs to the technical field of printed circuit boards, and particularly relates to a soft and hard combined semi-finished product board and a soft and hard combined board.
Background
Along with the rapid development of information technology, 5G waves roll, the speed of information transmission is faster and faster, the frequency is higher and higher, and higher requirements are also put forward on electronic products. At present, a polyimide copper-clad plate is used as a soft board layer of the soft and hard combined board, an epoxy resin copper-clad plate is used as a hard board layer, the soft board layer and the hard board layer are pressed together through prepregs or pure glue, and then finished products are manufactured through working procedures such as drilling, electroplating and etching. Because the dielectric constants of the two materials are above 3.0 and the dielectric loss is about 0.02, the requirements of high-frequency transmission cannot be met.
Teflon (Teflon, or polytetrafluoroethylene, with a dielectric constant of typically 2.3-2.8 and a loss of 0.0015-0.0020) materials are commonly used in the industry to replace traditional polyimide or epoxy materials to reduce the dielectric constant and loss. However, the teflon material is expensive, only single-layer local mixed pressure and multi-layer local mixed pressure aiming at the PCB are adopted in the prior art, and the teflon material is only suitable for manufacturing a pure hard board (PCB) with small deformation coefficient and no uncovering process, and is not suitable for manufacturing a soft and hard combined board with multi-layer mixed pressure and higher steps.
Because the soft and hard combined plate has the specificity, the part of the inner soft plate which needs to bear the bending function is exposed after the soft plate is uncovered, so that the hard plate films on the upper layer and the lower layer adjacent to the exposed area of the soft plate need to be windowed (so as to ensure that the soft plate layer and the hard plate layer in the uncovered area are not bonded through the films, otherwise, the soft part and the hard part cannot be separated), and the support of the hard plate film is not provided, and the soft plate embedded in the exposed area of the soft plate is suspended, thereby influencing the product manufacturing process and even being unable to finish the manufacture. The gaps on the periphery of the exposed area of the soft board need more glue to be filled, the thickness of the area after lamination cannot meet the requirement, the dents at the gaps can be displayed on the outermost layer, the uneven surface can make the film not tight, open a circuit is caused, the manufacture of an outer layer circuit is affected, in addition, the size deformation difference between the soft board and the hard board of the soft board is large, the control is difficult, and the interlayer deviation problem is easy to occur.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a soft and hard combined semi-finished product plate and a soft and hard combined plate, which meet the high-frequency transmission requirement, have low cost and smooth surface and are not easy to generate interlayer offset.
In order to solve the technical problems, the invention adopts the following technical scheme:
the soft and hard combined semi-finished product plate comprises a first hard plate layer, a first hard plate film layer, a first covering film layer, a first soft plate film layer, a second soft plate film layer, a third soft plate layer, a second covering film layer, a second hard plate film layer and a second hard plate layer which are sequentially pressed from bottom to top, wherein the first hard plate film layer is provided with a first open window opposite to a bending region of the first soft plate layer, the second hard plate film layer is provided with a second open window opposite to the bending region of the third soft plate layer, the first hard plate layer is provided with a third open window opposite to the first open window, the second hard plate layer is provided with a fourth open window opposite to the second open window, the first open window, the second open window, the third open window and the fourth open window are all opposite to an effective circuit region of the second soft plate layer, the second soft plate layer consists of a high-frequency signal transmission region and a common signal transmission region, and the structure is characterized in that the high-frequency signal transmission region is formed by manufacturing a high-frequency copper-fluorine-coated soft iron-copper-coated material; the effective circuit area of the second soft board layer is positioned in the high-frequency signal transmission area, and the sizes of the first windowing and the second windowing are the same as the size of the effective circuit area of the second soft board layer.
By adopting the structure, the high-frequency signal transmission area is made of the double-sided copper-clad teflon material with low dielectric constant and low loss, and the area, opposite to the high-frequency signal transmission area, on the third soft board layer is made of the single-sided copper-clad teflon material (one copper is etched on the double-sided copper-clad plate). The high-frequency signal transmission area is larger than the effective circuit area, but not just has the same size with the window, so that the edge extends to be buried below the soft board film, the condition that other layers are corresponding to the circuit at the interface can be avoided, on one hand, the effective supporting effect can be provided for the teflon material of the high-frequency signal transmission area, the problem of material deformation is improved to a certain extent, and on the other hand, the problem of bad circuit manufacturing process can be avoided because the sunken area is in the non-circuit area.
Further, the edge of the high-frequency signal transmission area is provided with a first positioning hole for positioning the first soft board layer and the third soft board layer.
The first positioning hole is arranged on the edge of the buried high-frequency signal transmission area, so that the pin can be used for preventing the high-frequency signal transmission area from shifting.
Further, the edge of the second soft board layer is provided with a second positioning hole for positioning the first soft board layer and the third soft board layer.
As a preferable mode, the common signal transmission area is made of polyimide double-sided copper-clad material, and the cost can be reduced on the premise of meeting the high-frequency signal transmission requirement.
As a preferable mode, the area, opposite to the common signal transmission area, of the third soft board layer is made of polyimide single-sided copper-clad material, and the cost can be reduced on the premise of meeting the high-frequency signal transmission requirement.
As a preferred mode, the first soft board layer is made of polyimide single-sided copper-clad material.
Because the high-frequency signal is transmitted on the adjacent circuit of the third soft board layer, the third soft board layer affects the high-frequency signal transmission, and the first soft board layer does not affect the high-frequency signal transmission, so that the area, opposite to the high-frequency signal transmission area, of the third soft board layer is made of a single-sided copper-coated teflon material, the first soft board layer is made of a polyimide single-sided copper-coated material, and the cost can be reduced on the premise of meeting the high-frequency signal transmission requirement. If the lines adjacent to the first flexible board layer transmit high-frequency signals, the area of the first flexible board layer corresponding to the high-frequency signal transmission area is also made of teflon materials.
Preferably, the first hard plate layer is made of an epoxy resin copper-clad material or a pure copper foil.
Preferably, the second hard plate layer is made of an epoxy resin copper-clad material or a pure copper foil.
Based on the same inventive concept, the invention also provides a soft and hard combined plate which is structurally characterized by comprising the soft and hard combined semi-finished product plate.
Compared with the prior art, the invention meets the high-frequency transmission requirement, has low cost, flat surface, difficult interlayer offset, good reliability and strong processability, and is suitable for the production of rigid-flex boards.
Drawings
Fig. 1 is a schematic diagram of a soft and hard combined semi-finished product plate structure.
Fig. 2 is a schematic view of a second flexible printed circuit board layer structure.
Fig. 3 is a schematic view of the soft board portion structure of the soft and hard combined semi-finished board.
Fig. 4 is a schematic view of the structure of the first and second hard plates when they are not windowed.
Wherein 1 is a first hard plate layer, 2 is a first hard plate film layer, 3 is a first covering film layer, 4 is a first soft plate layer, 5 is a first soft plate film layer, 6 is a second soft plate layer, 7 is a second soft plate film layer, 8 is a third soft plate layer, 9 is a second covering film layer, 10 is a second hard plate film layer, 11 is a second hard plate layer, 12 is a first window, 13 is a second window, 14 is a third window, 15 is a fourth window, 16 is an effective circuit area, 17 is a high-frequency signal transmission area, 18 is a common signal transmission area, 19 is a first positioning hole, and 20 is a second positioning hole.
Detailed Description
The soft and hard combined plate comprises a soft and hard combined semi-finished plate with a structure shown in the figure. As shown in fig. 1, the soft and hard combined semi-finished product board comprises a first hard board layer 1, a first hard board film layer 2, a first covering film layer 3, a first soft board layer 4, a first soft board film layer 5, a second soft board layer 6, a second soft board film layer 7, a third soft board layer 8, a second covering film layer 9, a second hard board film layer 10 and a second hard board layer 11 which are sequentially pressed from bottom to top, wherein the first hard board film layer 2 is provided with a first open window 12 opposite to a bending area of the first soft board layer 4, the second hard board film layer 10 is provided with a second open window 13 opposite to the bending area of the third soft board layer 8, the first hard board layer 1 is provided with a third open window 14 opposite to the first open window 12, the second hard board layer 11 is provided with a fourth open window 15 opposite to the second open window 13, the first open window 12, the second open window 13, the third open window 14 and the fourth open window 15 are all opposite to an effective area 16 of the second soft board layer 6, the second hard board film layer 10 is provided with a high-frequency soft board layer 6, the second open window 6 is made of a high-frequency soft board layer 17 is made of a high-frequency copper signal transmission area, and a high-frequency soft board 17 is made of a high-frequency copper signal transmission area is formed by a high-frequency soft board layer 17, and a high frequency signal transmission area is made of a high frequency copper alloy material, and a high frequency signal transmission area is formed by a soft-frequency copper signal area 17. The effective line area 16 of the second flexible sheet layer 6 is located within the high frequency signal transmission area 17, and the first and second windows 12, 13 are the same size as the effective line area 16 of the second flexible sheet layer 6.
The first soft board film and the second soft board film are flexible films and are used for pressing the inside of the soft board, and after solidification, the flexible films can be bent at will. The first hard plate film and the second hard plate film are not bendable after being solidified.
The edge of the high frequency signal transmission region 17 is provided with first positioning holes 19 for positioning with the first and third flexible sheet layers 4 and 8.
The edge of the second lamina layer 6 is provided with second positioning holes 20 for positioning with the first lamina layer 4 and the third lamina layer 8.
The common signal transmission region 18 is made of polyimide double-sided copper-clad material.
The area of the third flexible board layer 8 opposite to the normal signal transmission area 18 is made of polyimide single-sided copper-clad material.
The first flexible board layer 4 is made of polyimide single-sided copper-clad material.
The first hard plate layer 1 is made of an epoxy resin copper-clad material or a pure copper foil.
The second hard plate layer 11 is made of an epoxy resin coated copper material or a pure copper foil.
The manufacturing process of the soft and hard combined semi-finished product plate is as follows:
after the conventional polyimide double-sided copper-clad material of the second flexible board layer 6 is etched, openings required by the high-frequency signal transmission area 17 and the first positioning holes 19 required by the lamination are punched, and the edges of the openings are larger than the effective circuit area 16, so that the indentation caused by lamination at the edge interface and the added first positioning holes 19 cannot influence the effective circuit area, as shown in fig. 2.
The openings are filled with high-frequency material double-sided copper-clad teflon material which is etched and punched with first positioning holes 19, the film and the soft board layer are sequentially stacked, the film and the soft board layer are respectively provided with corresponding positioning holes, the upper layer and the lower layer are positioned through the positioning holes, and the layers are pressed into the multilayer circuit board through a vacuum press. After the first flexible board layer 4 and the third flexible board layer 8 are etched, the first cover film layer 3 and the second cover film layer 9 are respectively pressed to cover the whole upper board surface and the whole lower board surface, and the upper board surface and the lower board surface are used as soft board parts of the soft and hard combined semi-finished board, as shown in fig. 3. The flexible board layer is not limited to a 3-layer structure, and the number of layers can be increased by lamination.
The outer layer is a hard board layer and hard board film layer, after being integrally pressed with the inner soft board layer, the integral construction of the soft and hard combined semi-finished board is formed, as shown in fig. 4, the number of layers is not limited by the outer layer, the number of outer layer layers can be increased by adding copper-clad plates or pure copper foil and hard board film layers, the position, adjacent to the soft board layer, of the hard board film layer corresponding to the effective circuit area 16 is windowed (after forming, the effective circuit area 16 is finally exposed and not covered by the hard board layer), the edge of the high-frequency material filled locally should extend below the windowed film, and the local part is also provided with positioning holes penetrating through all layers.
And the pressed semi-finished product structure is electrically connected with each layer inside through mechanical through holes and blind holes, copper deposition and electroplating. Meanwhile, in order to improve the signal transmission efficiency, reduce the useless transmission path of the signal or avoid unnecessary loss, adopt the back drilling technology, cut the redundant path, because the signal is connected with soft board layer by hard board layer through the metallized through hole, the metallized hole is usually the through hole (when the depth is too large, the blind hole of layer-to-layer can't be realized, the blind hole of overlapping makes the process is complicated, the difficulty is big, the cost is high), the signal only needs to be transmitted into the inner layer from the top layer, then part of the signal reaches the bottom layer through the metallized hole, this will influence the transmission speed and the integrality of the signal, therefore, cut this part of metal hole of inner layer to bottom layer through the back drilling, be favorable to the transmission of the signal. Finally, forming an outer layer circuit, printing solder resist ink, printing characters, uncovering, performing surface antioxidation treatment, forming an appearance, checking the quality of a finished product, and finishing the manufacture of the whole finished product.
The embodiments of the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and many forms may be made by those having ordinary skill in the art without departing from the spirit of the present invention and the scope of the claims, which are all within the scope of the present invention.
Claims (6)
1. The soft and hard combined semi-finished board comprises a first hard board layer (1), a first hard board film layer (2), a first cover film layer (3), a first soft board layer (4), a first soft board film layer (5), a second soft board layer (6), a second soft board film layer (7), a third soft board layer (8), a second cover film layer (9), a second hard board film layer (10) and a second hard board layer (11) which are sequentially pressed from bottom to top, wherein the first hard board film layer (2) is provided with a first open window (12) opposite to a bending region of the first soft board layer (4), the second hard board film layer (10) is provided with a second open window (13) opposite to a bending region of the third soft board layer (8), the first hard board layer (1) is provided with a third open window (14) opposite to the first open window (12), the second hard board layer (11) is provided with a fourth open window (15) opposite to the second open window (13), the first open window (12), the second open window (13) and the second hard board film layer (10) are provided with a high-frequency signal transmission region (17) opposite to the second soft board layer (6), the second open window (13) and the fourth open window (16) are formed by a high-frequency signal transmission region (17) and a common soft board layer, the area, opposite to the high-frequency signal transmission area (17), of the third soft board layer (8) is made of a single-sided copper-coated teflon material; the effective circuit area (16) of the second flexible board layer (6) is positioned in the high-frequency signal transmission area (17), and the sizes of the first window (12) and the second window (13) are the same as the size of the effective circuit area (16) of the second flexible board layer (6);
the edge of the high-frequency signal transmission area (17) is provided with a first positioning hole (19) for positioning the first soft board layer (4) and the third soft board layer (8);
the edge of the second soft board layer (6) is provided with a second positioning hole (20) for positioning the first soft board layer (4) and the third soft board layer (8);
the common signal transmission area (18) is made of polyimide double-sided copper-clad material.
2. Soft and hard combined semi-finished board according to claim 1, characterized in that the area of the third soft board layer (8) opposite to the normal signal transmission area (18) is made of polyimide single-sided copper-clad material.
3. Soft and hard combined semi-finished board according to claim 1, characterized in that the first soft board layer (4) is made of polyimide single-sided copper-coated material.
4. Soft and hard bonded semifinished sheet according to claim 1, wherein the first hard sheet layer (1) is made of an epoxy resin copper-clad material or a pure copper foil.
5. A soft and hard bonded semifinished sheet according to claim 1, wherein the second hard sheet layer (11) is made of an epoxy resin coated copper material or a pure copper foil.
6. A rigid-flex board comprising the rigid-flex board of any one of claims 1 to 5.
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| CN201710732685.2A CN107343354B (en) | 2017-08-24 | 2017-08-24 | Soft and hard combined semi-finished board and soft and hard combined board |
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| CN201710732685.2A CN107343354B (en) | 2017-08-24 | 2017-08-24 | Soft and hard combined semi-finished board and soft and hard combined board |
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| CN107343354A CN107343354A (en) | 2017-11-10 |
| CN107343354B true CN107343354B (en) | 2023-10-20 |
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|---|---|---|---|---|
| TWI701982B (en) | 2019-05-14 | 2020-08-11 | 欣興電子股份有限公司 | Circuit board structure and manufacturing method thereof |
| CN111954366B (en) * | 2019-05-17 | 2022-04-01 | 欣兴电子股份有限公司 | Circuit board structure and manufacturing method thereof |
| CN110418520A (en) * | 2019-06-12 | 2019-11-05 | 惠州市特创电子科技有限公司 | A kind of partial hybrid substrate of 5G high frequency circuit board and preparation method thereof |
| CN110248502A (en) * | 2019-07-02 | 2019-09-17 | 高德（无锡）电子有限公司 | A kind of processing technology of the Rigid Flex of multilayer soft board |
| CN112911834B (en) * | 2020-12-15 | 2022-12-13 | 惠州美锐电子科技有限公司 | Production method of soft-hard combined PCB |
| CN116504771B (en) * | 2023-06-27 | 2023-12-08 | 长春希达电子技术有限公司 | Micro-LED driving panel and preparation method thereof |
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