CN204836151U - Radio communication device - Google Patents

Radio communication device Download PDF

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Publication number
CN204836151U
CN204836151U CN201520517718.8U CN201520517718U CN204836151U CN 204836151 U CN204836151 U CN 204836151U CN 201520517718 U CN201520517718 U CN 201520517718U CN 204836151 U CN204836151 U CN 204836151U
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China
Prior art keywords
wireless communication
communication device
radio communication
sim card
communication module
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CN201520517718.8U
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Chinese (zh)
Inventor
朱团
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Quectel Wireless Solutions Co Ltd
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Quectel Wireless Solutions Co Ltd
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Priority to CN201520517718.8U priority Critical patent/CN204836151U/en
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Abstract

The utility model provides a radio communication device, including a SIM cassette and a wireless communication module, its characterized in that, radio communication device includes a treater, a heating circuit and a temperature measurement circuit, temperature measurement circuit with the SIM cassette is located on the same PCB board, temperature measurement circuit is used for detecting the temperature of SIM cassette and with the temperature signal transmission that detects extremely wireless communication module, wireless communication module is used for converting received temperature signal into data signal and will digital signal transmission extremely the processo, the treater is used for the basis data signal passes through wireless communication module to heating circuit output high level or low level are in order to switch on or to turn -off heating circuit. The utility model discloses the SIM card that compensaties current radio communication device unusual defect appears easily under low temperature environment, can heat the SIM card.

Description

Radio communication device
Technical field
The utility model relates to Internet of Things wireless communication field, particularly a kind of radio communication device.
Background technology
Along with the use of Internet of Things radio communication device is more and more general, also more and more higher to the requirement of radio communication device, existing Internet of Things radio communication device must meet very harsh industrial standard.And in practical application, although Internet of Things radio communication device is all technical grade product,-45 degree can be adapted to accurate to the wide temperature scale of+85 degree, but the SIM card that radio communication device uses (client identification module) civil often, temperature range does not often reach the standard of radio communication device, particularly cryogenic property.That is, following problem may be there is when using radio communication device: under a low temperature environment, radio communication device itself can work, but the SIM card be installed in radio communication device is malfunctioning.Due to China's north-east, the temperature in the area such as Russian Siberia is often very low, is easy to occur above-mentioned problem, significantly limit popularization and the use of Internet of Things radio communication device.
Utility model content
The technical problems to be solved in the utility model is that the SIM card in order to overcome existing radio communication device easily occurs abnormal defect at low ambient temperatures, provides a kind of radio communication device that can heat SIM card.
The utility model solves above-mentioned technical problem by following technical proposals:
The utility model provides a kind of radio communication device, comprises a SIM card holder and a wireless communication module, is characterized in, described radio communication device also comprises a processor, a heater circuit and a temperature sensing circuit;
Described temperature sensing circuit and described SIM card holder are located on same PCB (printed circuit board) plate, described temperature sensing circuit is for detecting the temperature of described SIM card holder and the temperature signal detected being transferred to described wireless communication module, described wireless communication module is used for the temperature signal received to be converted to digital signal and by described digital data transmission to described processor, described processor to be used for according to described digital signal by described wireless communication module to described heater circuit output high level or low level, with conducting or turn off described heater circuit.
Wherein, it is to make described temperature sensing circuit near described SIM card holder that described temperature sensing circuit and described SIM card holder are located on same pcb board, is convenient to the temperature detecting SIM card holder, and then indirectly detects the temperature of SIM card.When the temperature of SIM card is lower, described heater circuit conducting, by the heat effect of described heater circuit, makes the temperature of SIM card holder increase, and then make the SIM card in SIM card holder also can reach temperature rise effect, prevent SIM card from occurring because ambient temperature is lower abnormal; When the temperature of SIM card is higher, described heater circuit turns off, and stops heating.
Preferably, described temperature sensing circuit comprises a thermistor, and described thermistor is connected with described wireless communication module.
The technical program is that the characteristic utilizing thermistor resistance to change along with the change of ambient temperature carrys out detected temperatures, and this detection mode structure is simple, the too many space that can not take pcb board.
Preferably, described heater circuit comprises at least one heating resistor and a switch, and the first end of described heating resistor is connected with described wireless communication module by described switch, and the second end of described heating resistor is connected with a power supply.Wherein, described switch carrys out conducting according to the low and high level receiving the output of described wireless communication module or turns off described heater circuit; Described heating resistor refers to the resistance that the heat utilizing resistance to produce when in energising heats, and when the quantity of described heating resistor is greater than 1, those heating resistors are in parallel.The quantity and the resistance that change heating resistor can change the heat discharged in the heater circuit unit interval, and then control the variations in temperature around SIM card holder.
Preferably, described switch is a NPN transistor, the base stage of described NPN transistor is connected with described wireless communication module, the grounded emitter of described NPN transistor, the collector electrode of described NPN transistor is connected with described first end, the conducting when described wireless communication module exports high level of described heater circuit, turns off when described wireless communication module output low level.
Preferably, a resistance is also in series with between the base stage of described NPN transistor and described wireless communication module.
Preferably, described heating resistor and described SIM card holder are positioned over the same face of described pcb board, and the region between described heating resistor and described SIM card holder in this face is covered with copper sheet.
Described copper sheet can accelerate heat transfer, makes the temperature of SIM card holder can fast lifting.
Preferably, the region be positioned at below described SIM card holder being positioned at region below described heating resistor and/or this face in this face is also covered with copper sheet respectively.
Preferably, described heating resistor and described SIM card holder are positioned over the not coplanar of described pcb board, and described pcb board is also formed with a through hole, and the heat that those heating resistors produce is passed to described SIM card holder by described through hole.
Preferably, the face at described heating resistor place and the face at described SIM card holder place are covered with copper sheet respectively.
Preferably, described wireless communication module is GSM (global system for mobile communications) module, 3G module (module of use G mobile communication) or 4G module (module of use forth generation mobile communication technology).
On the basis meeting this area general knowledge, above-mentioned each optimum condition, can combination in any, obtains each preferred embodiments of the utility model.
Positive progressive effect of the present utility model is: radio communication device of the present utility model can detect the temperature around SIM card holder, and then indirectly detect the temperature of SIM card, also by the heat effect of described heater circuit, the temperature of SIM card holder is increased, and then the SIM card in SIM card holder also can be heated up, prevent SIM card from occurring because ambient temperature is lower abnormal.In addition, radio communication device of the present utility model also has that structure is simple, take up room little advantage.
Accompanying drawing explanation
Fig. 1 is the circuit structure block diagram of the radio communication device of the utility model embodiment 1.
Fig. 2 is the circuit diagram of the temperature sensing circuit of the radio communication device of the utility model embodiment 1.
Fig. 3 is the circuit diagram of the heater circuit of the radio communication device of the utility model embodiment 1.
Fig. 4 is the schematic layout pattern of the pcb board of the radio communication device of the utility model embodiment 1.
Fig. 5 is the schematic layout pattern of the TOP layer of the pcb board of the radio communication device of the utility model embodiment 2.
Fig. 6 is the schematic layout pattern of the BOTTOM layer of the pcb board of the radio communication device of the utility model embodiment 2.
Embodiment
Lift preferred embodiment below, and come by reference to the accompanying drawings clearlyer intactly the utility model to be described.
Embodiment 1
See Fig. 1, a kind of radio communication device, comprises a wireless communication module U1, a processor U2, heater circuit 2 and a temperature sensing circuit 3.Wherein, described wireless communication module U1 can be gsm module, 3G module or 4G module.
Described radio communication device also comprises a SIM card holder.Described temperature sensing circuit 3 is for detecting the temperature of described SIM card holder and the temperature signal detected being transferred to described wireless communication module U1, described wireless communication module U1 is used for the temperature signal received to be converted to digital signal and by described digital data transmission to described processor U2, described processor U2 is used for exporting high level or low level by described wireless communication module U1 to described heater circuit 2 according to described digital signal, with conducting or turn off described heater circuit 2.
See Fig. 2, described temperature sensing circuit 3 comprises a thermistor NTC, and described thermistor NTC is connected with the ADC0 pin of described wireless communication module U1.The resistance of described thermistor NTC changes along with the change of temperature, and described wireless communication module U1 knows current temperature by obtaining the resistance of described thermistor.The TXD pin of described wireless communication module U1 and described processor U2 /RXD pin is connected, after the temperature signal received is converted to digital signal by described wireless communication module U1 by TXD pin transfer to described processor U2 /RXD pin.Described processor U2 /TXD pin is connected with the RXD pin of described wireless communication module U1, one feedback signal is returned to the RXD pin of described wireless communication module U1 by described processor U2 by/TXD pin, described wireless communication module U1 exports high level or low level to described heater circuit 2 according to described feedback signal.
Described heater circuit 2 comprises at least one heating resistor and a switch, and the first end of described heating resistor is connected with described wireless communication module U1 by described switch, and the second end of described heating resistor is connected with a power supply.
See Fig. 3, the heater circuit 2 of the present embodiment comprises 8 heating resistor R3-R10, and heating resistor R3-R10 is in parallel.Described switch is a NPN transistor Q1, and the base stage of described NPN transistor is connected with the PCTRL of described wireless communication module U1, the grounded emitter of described NPN transistor, and the collector electrode of described NPN transistor is connected with the first end of the heating resistor after parallel connection.The conducting when PCTRL exports high level of described heater circuit 2, turns off when PCTRL output low level.Resistance R1 is also in series with between the base stage of described NPN transistor and described PCTRL.
On the basis of common practise meeting this area, described switch can also choose other device, as diode, PNP transistor etc.Owing to adopting other device comparatively conventional as the circuit of switch, therefore do not repeat them here.
SIM card holder, described wireless communication module U1, described processor U2, described heater circuit 2 and described temperature sensing circuit 3 are all located on same pcb board.As shown in Figure 4, heating resistor and SIM card holder 1 are positioned over the same face of described pcb board, heating resistor is separately evenly placed, this face is covered with copper sheet 5, and the region of covering comprises region between heating resistor and described SIM card holder 1, is positioned at the region below heating resistor and is positioned at the region below described SIM card holder 1.In addition, when pcb board layout, try one's best by thermistor away from described heater circuit 2, in order to avoid affect the accuracy that thermistor detects the temperature of SIM card holder 1.
Embodiment 2
The radio communication device of the present embodiment is substantially identical with the radio communication device of embodiment 1, difference is, heating resistor in the present embodiment and described SIM card holder 1 are positioned over the not coplanar of described pcb board, described pcb board is also formed with a through hole, and the heat that those heating resistors produce is passed to described SIM card holder 1 by described through hole.Fig. 5 is the layout of the TOP layer (top layer) of pcb board, is placed with SIM card holder 1, TOP layer and is covered with copper sheet 6.Fig. 6 is the layout of the BOTTOM layer (bottom) of pcb board, is placed with heating resistor, and heating resistor is separately evenly placed, and BOTTOM layer is covered with copper sheet 7.
Although the foregoing describe embodiment of the present utility model, it will be understood by those of skill in the art that these only illustrate, protection range of the present utility model is defined by the appended claims.Those skilled in the art, under the prerequisite not deviating from principle of the present utility model and essence, can make various changes or modifications to these execution modes, but these change and amendment all falls into protection range of the present utility model.

Claims (10)

1. a radio communication device, comprises a SIM card holder and a wireless communication module, it is characterized in that, described radio communication device also comprises a processor, a heater circuit and a temperature sensing circuit;
Described temperature sensing circuit and described SIM card holder are located on same pcb board, described temperature sensing circuit is for detecting the temperature of described SIM card holder and the temperature signal detected being transferred to described wireless communication module, described wireless communication module is used for the temperature signal received to be converted to digital signal and by described digital data transmission to described processor, described processor to be used for according to described digital signal by described wireless communication module to described heater circuit output high level or low level, with conducting or turn off described heater circuit.
2. radio communication device as claimed in claim 1, it is characterized in that, described temperature sensing circuit comprises a thermistor, and described thermistor is connected with described wireless communication module.
3. radio communication device as claimed in claim 1, it is characterized in that, described heater circuit comprises at least one heating resistor and a switch, and the first end of described heating resistor is connected with described wireless communication module by described switch, and the second end of described heating resistor is connected with a power supply.
4. radio communication device as claimed in claim 3, it is characterized in that, described switch is a NPN transistor, the base stage of described NPN transistor is connected with described wireless communication module, the grounded emitter of described NPN transistor, the collector electrode of described NPN transistor is connected with described first end, and the conducting when described wireless communication module exports high level of described heater circuit, turns off when described wireless communication module output low level.
5. radio communication device as claimed in claim 4, is characterized in that, be also in series with a resistance between the base stage of described NPN transistor and described wireless communication module.
6. radio communication device as claimed in claim 3, it is characterized in that, described heating resistor and described SIM card holder are positioned over the same face of described pcb board, and the region between described heating resistor and described SIM card holder in this face is covered with copper sheet.
7. radio communication device as claimed in claim 6, is characterized in that, the region be positioned at below described SIM card holder being positioned at region below described heating resistor and/or this face in this face is also covered with copper sheet respectively.
8. radio communication device as claimed in claim 3, it is characterized in that, described heating resistor and described SIM card holder are positioned over the not coplanar of described pcb board, and described pcb board is also formed with a through hole, and the heat that described heating resistor produces is passed to described SIM card holder by described through hole.
9. radio communication device as claimed in claim 8, it is characterized in that, the face at described heating resistor place and the face at described SIM card holder place are covered with copper sheet respectively.
10. radio communication device as claimed in claim 1, it is characterized in that, described wireless communication module is gsm module, 3G module or 4G module.
CN201520517718.8U 2015-07-16 2015-07-16 Radio communication device Active CN204836151U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201520517718.8U CN204836151U (en) 2015-07-16 2015-07-16 Radio communication device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201520517718.8U CN204836151U (en) 2015-07-16 2015-07-16 Radio communication device

Publications (1)

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CN204836151U true CN204836151U (en) 2015-12-02

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113674941A (en) * 2021-07-05 2021-11-19 珠海市华晶微电子有限公司 Thick film circuit PTC constant temperature tank building method and thick film circuit

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113674941A (en) * 2021-07-05 2021-11-19 珠海市华晶微电子有限公司 Thick film circuit PTC constant temperature tank building method and thick film circuit
CN113674941B (en) * 2021-07-05 2022-11-08 珠海市华晶微电子有限公司 Thick film circuit PTC constant temperature tank building method and thick film circuit

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CP03 Change of name, title or address
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Address after: 200233 room 701, No. 1801 B, Hongmei Road, Xuhui District, Shanghai

Patentee after: QUECTEL WIRELESS SOLUTIONS CO., LTD.

Address before: 200233 Shanghai city Xuhui District Tianzhou Road No. 99 building 13 Room 501

Patentee before: Shanghai Quectel Communication Technology Co.,Ltd.