CN204834585U

CN204834585U - Be used for clean turnover case of silicon chip moving

Info

Publication number: CN204834585U
Application number: CN201520609184.1U
Authority: CN
Inventors: 苗立刚; 史舸; 陈卫群; 寇文辉; 魏海霞; 崔小换
Original assignee: MCL Electronic Materials Ltd
Current assignee: MCL Electronic Materials Ltd
Priority date: 2015-08-14
Filing date: 2015-08-14
Publication date: 2015-12-02
Anticipated expiration: 2025-08-14

Abstract

The utility model provides a be used for clean turnover case of silicon chip moving comprises laminar flow hood, filter, hinge, bolt, box and case lid. The air filters the back constantly in the getting into the through laminar flow hood, flows through the filter, has so not only kept the cleanliness factor of turnover incasement environment, what constantly flow simultaneously has gaseously further improved the cleanliness factor on silicon chip surface through the surface of silicon chip, has reduced silicon chip influence to the cleanliness factor of silicon chip through rank lower cleaning region at the operation in -process. The utility model discloses a turnover case need not the packing operation gone on because of the circulation between the process to the silicon chip, the cost is reduced, and simple structure, the operation, maintain convenient.

Description

A kind of clean Turnover Box for silicon chip running

Technical field

The utility model relates to monocrystalline silicon piece production field, specifically a kind of clean Turnover Box for silicon chip running.

Background technology

Along with the development of integrated circuit technique, the requirement of the monocrystalline silicon buffing sheet cleanliness factor of one of the base material of integrated circuit is just improved constantly.Improve clean room grade, improve the cleaning consciousness of personnel, improve automaticity, increase cleansing power etc. is all the cleanliness factor in order to improve silicon chip surface, reduces the impacts on silicon chip such as particle, metal, organic substance, to improve the quality of products.And operation is numerous in the production process of silicon chip, the control of the circulation between operation and operation is on one of key point that next procedure product quality affects, especially before the operation needing high temperature process.The circulation of current operation and inter process be mainly divided into do dry enter and wet out wet into, wet out wet into mode mainly through silicon chip and film magazine are placed on have pure water Turnover Box in transport.The dry mode entering to do is mainly used in the higher region of cleanliness factor and circulates in the post-production process of silicon chip, operating afterwards, which adds production cost once need through the relatively low region of cleanliness factor just needs first silicon chip first to be encapsulated.How adopting not only simple but also economic method to ensure the cleanliness factor of silicon chip in operation process, is the problem that all relevant enterprises need to be concerned about.

Utility model content

For problem high to purity requirements when silicon chip circulates in the region that cleanliness factor is high in solution prior art, the utility model provides a kind of clean Turnover Box for silicon chip running, operating by silicon chip being placed in this clean Turnover Box, effectively can reduce silicon chip surface in the dry introducing entering to do the impurity such as particle in operation process.

The utility model is the technical scheme solving the problems of the technologies described above employing: a kind of clean Turnover Box for silicon chip running, comprise the casing of a placement silicon chip, at a side of casing, hinge is provided with case lid, and case lid realizes opening-closing case body by latch, laminar flow hood and filter is respectively arranged with at the two ends that casing is corresponding, make air-flow enter in casing by laminar flow hood, the silicon chip surface flowing of placing in casing, and be filtered rear outflow.

The material of described casing and case lid is antistatic plastic, and the material of hinge and latch is stainless steel.

The utility model increases a laminar flow hood and filter on the Turnover Box of sealing, a laminar flow hood is increased in Turnover Box side, airflow direction is for blowing to Turnover Box inside, clean gas enters in Turnover Box through laminar flow hood, increases a filter, for the discharge of gas in the respective side of laminar flow hood, such gas forms a stable laminar flow, environment in continuous purification Turnover Box, the simultaneously flowing of gas on silicon chip, be also beneficial to the cleanliness factor improving silicon chip surface; Silicon chip is put into from normal top and taking-up changes into and carries out from the side putting into and taking out, and is beneficial to the maintenance of cleanliness factor in Turnover Box.

Beneficial effect: the utility model by increasing laminar flow hood on case, not only maintain the cleanliness factor of Turnover Box environment, the gas of constantly flowing is through the surface of silicon chip simultaneously, further increase the cleanliness factor of silicon chip surface, decrease silicon chip in operation process through the lower clean area of rank on the impact of the cleanliness factor of silicon chip.The Turnover Box that the utility model adopts, without the need to the package handling carried out silicon chip because of the circulation between operation, reduces cost, and structure is simple, operation, easy to maintenance.

Accompanying drawing explanation

Fig. 1 is structural representation of the present utility model;

Reference numeral: 1, laminar flow hood, 2, filter, 3, hinge, 4, latch, 5, casing, 6, case lid.

Embodiment

As shown in the figure, a kind of clean Turnover Box for silicon chip running, comprise the casing 5 of a placement silicon chip, at a side of casing 5, hinge 3 is provided with case lid 6, and case lid 6 realizes opening-closing case body 5 by latch 4, be respectively arranged with laminar flow hood 1 and filter 2 at the two ends of casing 5 correspondence, make air-flow enter in casing 5 by laminar flow hood 1, the silicon chip surface flowing of placing in casing 5, and flow out after filter 2 filters.

The material of described casing 5 and case lid 6 is antistatic plastic, and the material of hinge 3 and latch 4 is stainless steel.

Operationally Turnover Box is placed on small handcart, clean silicon wafer after cleaning puts into casing 5 in the clean area of higher level, and then the case lid 6 that closes, and plug latch 4, be transported to through the region that cleanliness class is relatively low that to open laminar flow hood 1 etc. behind the higher working region of the cleanliness factor of next procedure to be used, waiting constantly to enter laminar flow hood 1 at the gas of cleaning in process to be used and be blown in Turnover Box, then flow out through filter 2.Open case lid 6 when needed, take out silicon chip, silicon chip is placed on workbench and carries out processing operation.

Claims

1. the clean Turnover Box for silicon chip running, comprise the casing (5) of a placement silicon chip, at a side of casing (5), hinge (3) is provided with case lid (6), and case lid (6) realizes opening-closing case body (5) by latch (4), it is characterized in that: the two ends corresponding at casing (5) are respectively arranged with laminar flow hood (1) and filter (2), air-flow is made to enter in casing (5) by laminar flow hood (1), the silicon chip surface flowing of placing in casing (5), and flow out after filter (2) filters.

2. a kind of clean Turnover Box for silicon chip running according to claim 1, it is characterized in that: the material of described casing (5) and case lid (6) is antistatic plastic, the material of hinge (3) and latch (4) is stainless steel.