CN204818423U - Cold system of processing of laser - Google Patents
Cold system of processing of laser Download PDFInfo
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- CN204818423U CN204818423U CN201520351595.5U CN201520351595U CN204818423U CN 204818423 U CN204818423 U CN 204818423U CN 201520351595 U CN201520351595 U CN 201520351595U CN 204818423 U CN204818423 U CN 204818423U
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Abstract
This application embodiment provides a cold system of processing of laser, and this system includes femto second laser ware subsystem for output femto second laser, free space or full fiber transmission system for direct femto second laser and predetermine the position, the optics focus set, be used for with the femto second laser of femto second laser ware subsystem output focuses on on the machined part. This system can improve the machining precision and carry out comparatively clean processing.
Description
Technical field
The utility model relates to a kind of technical field of laser processing, particularly relates to a kind of laser cold working system.
Background technology
In the processing of current industrial lasers, the basic mode of laser pulse and matter interaction piles up diffusion in the form of heat for the energy brought by laser, acts on material in pulse temporal.And in reality, the pulse width of existing laser is often than the length that thermal diffusion time comes, this is a kind of well phenomenon for laser weld and coating produced by laser cladding, but for most micro Process, such as laser engraving, laser boring, laser cutting, the thermal diffusion towards periphery on material can hurt processing quality.
Particularly, thermal diffusion can reduce micro-machined efficiency because thermal diffusion by energy band from processing stand, make to which reduce and originally should be used for the energy of removing materials completely.The coefficient of heat conduction of part material is higher, and this energy dissipation is larger.Thermal diffusion also can reduce the temperature of processing stand, causes processing temperature only a little more than material melting point.In addition, utilize laser to drop back finished surface contaminated samples to the microballon that workpiece carries out sputtering in process, and the residual temperature that thermal diffusion causes can make this microballon be attached on firmly on workpiece, make in cleaning very difficult, even cause the breakage of workpiece.And thermal diffusion also can reduce machining accuracy, part material remove the focus point size that splash zone is not limited to light beam itself, make melt region much larger than the size of Laser Focusing point.In addition, the heat energy ripple that thermal diffusion produces and the cooling ripple deriving and come will be propagated in heat affected area (instant heating is diffused in the panel region impacted near processing stand), cause mechanical stress, and may crack be produced, and along with the cooling of material, these defects will be frozen in the inside of workpiece, and in use afterwards, cause workpiece to lose efficacy ahead of time.Moreover, the relevance phenomenon produced because of thermal diffusion also has the formation of processing double teeming district around hole, the material that this double teeming district solidifies again has different greatly from the material of non-melting originally in physical characteristic and chemical characteristic, this makes the frame for movement in double teeming district comparatively fragile, all needs to be removed after processing.Sometimes thermal diffusion also can cause the type of surperficial seismic wave permanent, so cause the structure near workpiece processing district or multi-layer film material impaired.
As can be seen here, thermal diffusion can affect micro Process along with multiple physics or chemical phenomenon.
Summary of the invention
The utility model provides a kind of laser cold working system, can improve machining accuracy and carry out comparatively clean processing.
For achieving the above object, the utility model embodiment provides a kind of laser cold working system, comprising:
Femto-second laser subsystem, for exporting femtosecond laser;
Optical focusing device, focuses on workpiece for the femtosecond laser exported by described femto-second laser subsystem.
In a preferred embodiment, described femto-second laser subsystem is femtosecond solid state laser subsystem.
In a preferred embodiment, described femtosecond fixed laser subsystem comprises titanium-doped sapphire mode-locked laser.
In a preferred embodiment, also comprise polarized controller, the polarization state for the femtosecond laser exported described femtosecond solid state laser subsystem controls.
In a preferred embodiment, described polarized controller comprises half-wave plate and PBS optical splitter.
In a preferred embodiment, at least one fixed optical path direction control device is also comprised.
In a preferred embodiment, described fixed optical path direction control device is reflective mirror.
In a preferred embodiment, described femto-second laser subsystem comprises femto second optical fiber laser subsystem.
In a preferred embodiment, also comprise Transmission Fibers, transfer in described optical focusing device for the femtosecond laser that described femto second optical fiber laser subsystem is exported.
In a preferred embodiment, described optical focusing device is swingable optical focusing device.
By the utility model embodiment, can significantly promote machining accuracy and efficiency, and comparatively clean process is provided.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present application or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, the accompanying drawing that the following describes is only some embodiments recorded in the application, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the schematic diagram of the employing femtosecond solid state laser that provides of the utility model embodiment one as the laser cold working system of light source;
Fig. 2 is the embodiment of the employing femto second optical fiber laser that provides of the utility model embodiment two as the laser cold working system of light source.
Detailed description of the invention
Technical scheme in the application is understood better in order to make those skilled in the art person, below in conjunction with the accompanying drawing in the embodiment of the present application, technical scheme in the embodiment of the present application is clearly and completely described, obviously, described embodiment is only some embodiments of the present application, instead of whole embodiments.Based on the embodiment in the application, those of ordinary skill in the art are not making the every other embodiment obtained under creative work prerequisite, all should belong to the scope of the application's protection.
The utility model provides a kind of laser cold working system, and this system comprises femto-second laser subsystem and optical focusing device.Wherein femto-second laser subsystem is for exporting femtosecond laser, and optical focusing device focuses on workpiece for the femtosecond laser exported by femto-second laser subsystem.
Detailed realization of the present utility model is described in detail below with two specific embodiments.
Embodiment one
Fig. 1 shows the embodiment adopting femtosecond solid state laser as the laser cold working system of light source, and as shown in Figure 1, the laser cold working system in this embodiment comprises femtosecond solid state laser subsystem 10 and optical focusing device 13.Above-mentioned femtosecond solid state laser can mix titanium (Ti) sapphire mode-locked laser in practice.Polarized controller can be added in the output light path of femtosecond solid state laser subsystem 10, control with the polarization state of the laser exported femtosecond solid state laser subsystem, in FIG, half-wave plate (λ/2 wave plate) 11 and PBS (PolarizedBeamSplitter is comprised especially with polarized controller, polarization splitting prism) optical splitter 12 is example, wherein the position relationship of half-wave plate 11 and PBS optical splitter 12 is: be followed successively by half-wave plate 11 and PBS optical splitter 12 along direction of beam propagation.
In the present embodiment, femtosecond solid state laser subsystem 10 exports the direction of femtosecond laser can just to the input of optical focusing device 13, the consideration that also can take up space based on optimization system, femtosecond solid state laser subsystem 10 is placed on the position that the input of output femtosecond laser direction and optical focusing device 13 is in a certain angle, as in Fig. 1, the input in direction and optical focusing device 13 that femtosecond solid state laser subsystem 10 exports femtosecond laser is 90 degree of angles, now need in the light path between femtosecond solid state laser subsystem 10 and optical focusing device 13, to arrange at least one fixed optical path direction control device, to control the transmission direction of the femtosecond laser exported from femtosecond solid state laser subsystem 10, and finally guide to the input of optical focusing device 13.In FIG, this fixed optical path direction control device is reflective mirror 14, reflective mirror 15 and reflective mirror 16.Those skilled in the art should be understood that, according to the difference of light path design, can also select the reflective mirror of other quantity and place to go up in place.
The femtosecond laser that femtosecond solid state laser subsystem 10 exports focuses on the processing stand of workpiece 30 by optical focusing device 13.
Laser cold working system in the present embodiment utilizes femtosecond laser to process workpiece, femtosecond laser at a terrific speed by its whole energy injection on the very little zone of action of workpiece, the deposition of the high-energy-density produced in moment changes making the absorption of electronics and fortune merit mode, the impact of linear absorption, energy transfer and diffusion process can be avoided, fundamentally change the mechanism of high-order harmonics spectrum.Because femtosecond laser can within extremely short time and minimum spatial dimension, material is acted on high laser power density, in the very short time not having thermal diffusion, make electron temperature reach high, make material from the solid-state plasmoid becoming high temperature, high pressure instantaneously, promptly depart from processing matrix with spray pattern, and ambient substance is still in " cold state ", therefore compared with processing with Long Pulse LASER, femtosecond laser processing does not have thermal diffusion, and then processing neat in edge and precision is high, and significantly can promote the efficiency of processing.
Femtosecond laser can make the peak power of 10,000,000,000 watts of levels, the internal electric field of atom and molecule can be easily exceeded at the laser intensity of processing stand every square centimeter, with the pulse of femtosecond laser make material surface produce plasmarized after, the pressure that internal forces amount produces can form one volatile plume and outwards send forth, originally the cohesive force between material atom is the not enough ion bearing high concentration far away, electronics compared with ion come gently and comparatively there is kinetic energy, so electrons first sprays from material in the process fast, then the eruption of ion is only, because these are all with ion on schedule, so spray from material because of the strength of mutual exclusion.This process does not have droplet and is condensed in surrounding materials, and the surface near the material contamination not having the process of melting naturally yet just not splash.
Therefore, the machined surface of femto-second laser pulse is totally a lot, there is no melting residue, microcrack, the ripple that shakes, double teeming district or peel ply, not only can't see double teeming district, edge is comparatively straight, and the problem not having pollutant to adhere to, and also can not injure original micro-structural; Processing quality is more excellent.
It should be noted that, the light path of the laser cold working system in the present embodiment is fixing, and manufacturing cost is high, and maintenance difficulties is high, and long-time stability are poor.
Embodiment two
Fig. 2 shows the embodiment of femto second optical fiber laser as the laser cold working system of light source, as shown in Figure 2, laser cold working system in this embodiment comprises femto second optical fiber laser subsystem 21 and optical focusing device 22, between femto second optical fiber laser subsystem 21 and optical focusing device 22, arrange Transmission Fibers 21, the femtosecond laser that femto second optical fiber laser subsystem 21 exports transfers in optical focusing device 22 by this Transmission Fibers 21.The femtosecond laser that femto second optical fiber laser subsystem 21 exports focuses on the processing stand of workpiece 30 by optical focusing device 22.Because Transmission Fibers 21 has certain flexibility, so optical focusing device 22 can be set to swingable optical focusing device, thus the free all angles to workpiece 30 of femtosecond laser and each local positions can be utilized to process, thus further increase machining accuracy and repeatability.For the size of material, shape and physical characteristic not requirement, the cold working process of high accuracy, superelevation spatial resolution and superelevation popularity is made really to enter large-scale commercial Application.
Although depict the application by embodiment, those of ordinary skill in the art know, the application has many distortion and change and do not depart from the spirit of the application, and the claim appended by wishing comprises these distortion and change and do not depart from the spirit of the application.
Claims (10)
1. a laser cold working system, is characterized in that, comprising:
Femto-second laser subsystem, for exporting femtosecond laser;
Optical focusing device, focuses on workpiece for the femtosecond laser exported by described femto-second laser subsystem.
2. system according to claim 1, is characterized in that, described femto-second laser subsystem is femtosecond solid state laser subsystem.
3. system according to claim 2, is characterized in that, described femtosecond fixed laser subsystem comprises titanium-doped sapphire mode-locked laser.
4. system according to claim 2, is characterized in that, also comprises polarized controller, and the polarization state for the femtosecond laser exported described femtosecond solid state laser subsystem controls.
5. system according to claim 4, is characterized in that, described polarized controller comprises half-wave plate and PBS optical splitter.
6. system according to claim 2, is characterized in that, also comprises at least one fixed optical path direction control device.
7. system according to claim 6, is characterized in that, described fixed optical path direction control device is reflective mirror.
8. system according to claim 1, is characterized in that, described femto-second laser subsystem comprises femto second optical fiber laser subsystem.
9. system according to claim 8, is characterized in that, also comprises Transmission Fibers, transfers in described optical focusing device for the femtosecond laser exported by described femto second optical fiber laser subsystem.
10. system according to claim 9, is characterized in that, described optical focusing device is swingable optical focusing device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520351595.5U CN204818423U (en) | 2015-05-27 | 2015-05-27 | Cold system of processing of laser |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520351595.5U CN204818423U (en) | 2015-05-27 | 2015-05-27 | Cold system of processing of laser |
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| CN204818423U true CN204818423U (en) | 2015-12-02 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105033450A (en) * | 2015-05-27 | 2015-11-11 | 广东高聚激光有限公司 | Laser cold machining system |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105033450A (en) * | 2015-05-27 | 2015-11-11 | 广东高聚激光有限公司 | Laser cold machining system |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151202 Termination date: 20160527 |