CN204810724U - Reflow soldering carrier is crossed to flexible line way board - Google Patents
Reflow soldering carrier is crossed to flexible line way board Download PDFInfo
- Publication number
- CN204810724U CN204810724U CN201520609849.9U CN201520609849U CN204810724U CN 204810724 U CN204810724 U CN 204810724U CN 201520609849 U CN201520609849 U CN 201520609849U CN 204810724 U CN204810724 U CN 204810724U
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- CN
- China
- Prior art keywords
- carrier
- reflow soldering
- flexible line
- place
- line way
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- 238000005476 soldering Methods 0.000 title claims abstract description 22
- 230000007797 corrosion Effects 0.000 claims abstract description 7
- 238000005260 corrosion Methods 0.000 claims abstract description 7
- 239000003292 glue Substances 0.000 claims description 7
- 238000003466 welding Methods 0.000 abstract description 8
- 239000012530 fluid Substances 0.000 abstract description 4
- 239000002390 adhesive tape Substances 0.000 abstract 3
- 230000005540 biological transmission Effects 0.000 abstract 1
- 239000000969 carrier Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 description 6
- 230000004075 alteration Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 239000012876 carrier material Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
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- Structure Of Printed Boards (AREA)
Abstract
The utility model discloses a reflow soldering carrier is crossed to flexible line way board, the corrosion resistant plate who adopts thickness to be 0.2 -0.3mm makes, is suitable for on it to place the regional a large amount of through -hole that evenly is provided with of placing of flexible line way board, and this carrier two sides bonds and has the high temperature adhesive tape layer, the high temperature adhesive tape layer covers at least completely place the region. The utility model provides a carrier adopts the thin just good corrosion resistant plate of conductivity of heat of thickness to make, carrier weight has been alleviateed like this, can place it when crossing the fluid welding and convey on the guipure, can place a plurality of carriers on the guipure when the reflow soldering, the operation efficiency is improved, simultaneously the carrier place flexible line way board place a large amount of through -holes of regional setting, and placing regional setting high temperature adhesive tape, the setting transmission that can make warm area heat energy furthest under the reflow soldering equipment is to the board of flexible line way like this, and make flexible line way board be heated evenly, avoid producing the colour difference because of flexible line way board is heated the inequality, product qualities are guaranteed.
Description
Technical field
The utility model relates to a kind of flexible circuit board and crosses Reflow Soldering carrier.
Background technology
Current industry carried out the normally special carrier of furnace carrier excessively used in reflow process at FPC, its thickness is thicker, Heavy Weight, when Reflow Soldering, the track that the carrier carrying flexible circuit board can only be placed on Reflow Soldering transmits, and the guipure that can not be placed on Reflow Soldering transmits, and track can only put a carrier in the horizontal plane, thus have impact on Reflow Soldering production capacity; In addition, due to carrier material reason, it can affect the temperature of Reflow Soldering, thus affect the welding quality of product, during as welded, carrier can absorb a large amount of heats, this can affect the change of the actual temperature of product, thus affect the welding quality (temperature is the essential condition of FPC welding) of product, cross the difference of furnace carrier quantity in addition, also can affect the variations in temperature of whole meeting fluid welding, if do carrier by nonmetallic materials, it has again the shortcoming do not readily not conducted heat, cause two faces of FPC product to be heated uneven, thus have impact on the welding quality of product.
Utility model content
To this, the utility model aims to provide a kind of rational in infrastructure, can ensure product quality, and the flexible circuit board that can improve production capacity crosses Reflow Soldering carrier.
The technical scheme realizing the utility model object is:
A kind of flexible circuit board crosses Reflow Soldering carrier, employing thickness is that the corrosion resistant plate of 0.2-0.3mm is made, the put area it being suitable for place flexible circuit board is evenly provided with a large amount of through holes, this carrier two sides is bonded with high-temp glue belt, and described high-temp glue belt covers described put area at least completely.
In technique scheme, the edge of described put area and the distance of carrier edge are greater than 30mm.
In technique scheme, the aperture of described through hole is 2mm, and the spacing between adjacent through-holes is 4mm.
In technique scheme, the edges and corners of described carrier are provided with fillet.
The utility model has positive effect:
(1) carrier in the utility model adopts thinner thickness and the corrosion resistant plate of good thermal conduction is made, alleviate carrier weight like this, can place it on guipure when crossing fluid welding and transmit, when Reflow Soldering, guipure can place multiple carrier, increase work efficiency, a large amount of through hole is set at the put area of the placement flexible circuit board of carrier simultaneously, and at put area, high temperature gummed tape is set, under such setting can make solder reflow device, warm area heat energy is delivered in flexible circuit board to greatest extent, and flexible circuit board is heated evenly, avoid being heated inequality and produce aberration because of flexible circuit board, ensure product quality.(2) in the utility model, the distance that the edge of described put area and carrier are convenient to is greater than 30mm, thus avoids employee in the process of operation, encounter the product being placed on put area.
Accompanying drawing explanation
Fig. 1 is the positive direction view that in embodiment 1, flexible circuit board crosses Reflow Soldering carrier;
Fig. 2 is the partial enlarged view at A place in Fig. 1.
Reference numeral shown in figure is: 1-put area; 2-through hole; 3-carrier.
Embodiment
Do to illustrate to the concrete structure that flexible circuit board in the utility model crosses Reflow Soldering carrier below in conjunction with Figure of description:
A kind of flexible circuit board crosses Reflow Soldering carrier, as depicted in figs. 1 and 2, employing thickness is that the corrosion resistant plate of 0.2-0.3mm is made, the put area 1 it being suitable for place flexible circuit board is evenly provided with a large amount of through holes 2, this carrier two sides is bonded with high-temp glue belt (not shown), and described high-temp glue belt covers described put area 1 at least completely.Carrier in the present embodiment adopts thinner thickness and the corrosion resistant plate of good thermal conduction is made, alleviate carrier weight like this, can place it on guipure when crossing fluid welding and transmit, guipure can be placed multiple carrier 3 when Reflow Soldering, increase work efficiency, a large amount of through hole 2 is set at the put area 1 of the placement flexible circuit board of carrier simultaneously, and at put area 1, high temperature gummed tape is set, under such setting can make solder reflow device, warm area heat energy is delivered in flexible circuit board to greatest extent, and flexible circuit board is heated evenly, avoid being heated inequality and produce aberration because of flexible circuit board, ensure product quality.Described high-temp glue belt can be only cover put area 1, also can be cover carrier comprehensively.
In the present embodiment, the edge of described put area 1 and the distance at carrier 3 edge are greater than 30mm, thus avoid employee in the process of operation, encounter the product being placed on put area 1.
In the present embodiment, the aperture of described through hole 2 is 2mm, and the spacing between adjacent through-holes 2 is 4mm.
The edges and corners of described carrier 3 are provided with fillet, thus avoid corner angle to human body injury in morning.
Obviously, above-described embodiment of the present utility model is only for the utility model example is clearly described, and is not the restriction to execution mode of the present utility model.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here exhaustive without the need to also giving all execution modes.And these belong to connotation of the present utility model the apparent change of extending out or variation still belong to protection range of the present utility model.
Claims (4)
1. a flexible circuit board crosses Reflow Soldering carrier, it is characterized in that, employing thickness is that the corrosion resistant plate of 0.2-0.3mm is made, the put area (1) it being suitable for place flexible circuit board is evenly provided with a large amount of through holes (2), this carrier two sides is bonded with high-temp glue belt, and described high-temp glue belt covers described put area (1) at least completely.
2. flexible circuit board according to claim 1 crosses Reflow Soldering carrier, it is characterized in that, the edge of described put area (1) and the distance at carrier (3) edge are greater than 30mm.
3. flexible circuit board according to claim 1 crosses Reflow Soldering carrier, it is characterized in that, the aperture of described through hole (2) is 2mm, and the spacing between adjacent through-holes (2) is 4mm.
4. flexible circuit board according to claim 1 crosses Reflow Soldering carrier, it is characterized in that, the edges and corners of described carrier are provided with fillet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520609849.9U CN204810724U (en) | 2015-08-13 | 2015-08-13 | Reflow soldering carrier is crossed to flexible line way board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520609849.9U CN204810724U (en) | 2015-08-13 | 2015-08-13 | Reflow soldering carrier is crossed to flexible line way board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204810724U true CN204810724U (en) | 2015-11-25 |
Family
ID=54595466
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520609849.9U Active CN204810724U (en) | 2015-08-13 | 2015-08-13 | Reflow soldering carrier is crossed to flexible line way board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204810724U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112299365A (en) * | 2020-11-11 | 2021-02-02 | 无锡红光微电子股份有限公司 | Carrier for MEMS chip process machining |
-
2015
- 2015-08-13 CN CN201520609849.9U patent/CN204810724U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112299365A (en) * | 2020-11-11 | 2021-02-02 | 无锡红光微电子股份有限公司 | Carrier for MEMS chip process machining |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP03 | Change of name, title or address |
Address after: 325600 No. five, No. 187, weft Road, Yueqing Economic Development Zone, Zhejiang, China Patentee after: JD LONGWAYFLEX CO.,LTD. Address before: 325600, No. seventeen, No. 238, weft Road, Yueqing Economic Development Zone, Wenzhou, Zhejiang Patentee before: LONGWEI ELECTRONICS Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210511 Address after: No. 187, Weiwu Road, Yueqing Economic Development Zone, Yueqing City, Wenzhou City, Zhejiang Province 325600 Patentee after: Zhejiang Qiaolong Electronic Technology Co.,Ltd. Address before: No. 187, Weiwu Road, Yueqing Economic Development Zone, Zhejiang 325600 Patentee before: JD LONGWAYFLEX Co.,Ltd. |
|
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: No. 187, Weiwu Road, Yueqing Economic Development Zone, Yueqing City, Wenzhou City, Zhejiang Province 325600 Patentee after: Zhejiang Yilian Electronics Co.,Ltd. Country or region after: China Address before: No. 187, Weiwu Road, Yueqing Economic Development Zone, Yueqing City, Wenzhou City, Zhejiang Province 325600 Patentee before: Zhejiang Qiaolong Electronic Technology Co.,Ltd. Country or region before: China |