CN204810690U - 内层带有镶嵌物的电路板压合结构 - Google Patents
内层带有镶嵌物的电路板压合结构 Download PDFInfo
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Cited By (1)
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CN105050338A (zh) * | 2015-07-07 | 2015-11-11 | 深圳市迅捷兴电路技术有限公司 | 内层带有镶嵌物的电路板压合结构及其制造方法 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN105050338A (zh) * | 2015-07-07 | 2015-11-11 | 深圳市迅捷兴电路技术有限公司 | 内层带有镶嵌物的电路板压合结构及其制造方法 |
CN105050338B (zh) * | 2015-07-07 | 2017-12-26 | 深圳市迅捷兴科技股份有限公司 | 内层带有镶嵌物的电路板压合结构及其制造方法 |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP03 | Change of name, title or address |
Address after: Baoan District manhole Street sand Shenzhen city 518000 four Guangdong province Dongbao Industrial Zone No. H building, the first floor of building G, Room 203, floor two floor Patentee after: Shenzhen City Xing Xing Polytron Technologies Inc Address before: Baoan District manhole Street sand Shenzhen city Guangdong province 518000 Industrial Zone No. four Dongbao building H Patentee before: Shenzhen Xunjiexing Circuit Tech Co., Ltd. |
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CP03 | Change of name, title or address | ||
AV01 | Patent right actively abandoned |
Granted publication date: 20151125 Effective date of abandoning: 20171226 |