CN204651303U - A kind of electronic element radiating cold drawing - Google Patents
A kind of electronic element radiating cold drawing Download PDFInfo
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- CN204651303U CN204651303U CN201520338345.8U CN201520338345U CN204651303U CN 204651303 U CN204651303 U CN 204651303U CN 201520338345 U CN201520338345 U CN 201520338345U CN 204651303 U CN204651303 U CN 204651303U
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Abstract
The utility model discloses a kind of electronic element radiating cold drawing, belong to electronic element radiating technical field.The technical solution of the utility model main points are: a kind of electronic element radiating cold drawing, be provided with upper cover plate, upper ledge strip of paper used for sealing, dividing plate, lower frame strip of paper used for sealing and lower cover that vacuum brazing is integrated from top to bottom successively, wherein the inside of upper ledge strip of paper used for sealing is provided with the fin consistent with upper ledge strip of paper used for sealing height, the inside of this fin is provided with coolant runner, upper ledge strip of paper used for sealing is provided with the liquid inlet joint and fluid joint that communicate with coolant runner, and the inside of lower frame strip of paper used for sealing is filled with phase-change material and is provided with fabrication hole on lower frame strip of paper used for sealing.The utility model heat exchanger effectiveness is high, and structure is simple, and cost is low, ensures the maximum permissible temperature of cold drawing surface temperature lower than electronic component, and protection electronic component prevents from being burned.
Description
Technical field
The utility model belongs to electronic element radiating technical field, is specifically related to a kind of electronic element radiating cold drawing.
Background technology
Along with electronic component integration degree is more and more higher, density of heat flow rate is increasing, and air cold plate can not meet cooling requirements under many circumstances, and electronics liquid cold plate has started generally to use.Current electronics liquid cold plate has edge tubular type, perforating type and inner fin type, wherein there is the large and shortcoming of heat transfer effect difference of Heavy Weight, thickness in the above two, and constantly increase along with electronic component integration degree, density of heat flow rate is increasing, cooling requirements for electronics liquid cold plate is also more and more higher, and current common inner fin type electronics liquid cold plate is not well positioned to meet the requirement of electronic element radiating.
Summary of the invention
The technical problem that the utility model solves there is provided that a kind of structure is simple, process implementing is good and the electronic element radiating cold drawing that heat exchange property is high.
The utility model adopts following technical scheme for solving the problems of the technologies described above, a kind of electronic element radiating cold drawing, it is characterized in that being provided with successively upper cover plate, upper ledge strip of paper used for sealing, dividing plate, lower frame strip of paper used for sealing and lower cover that vacuum brazing is integrated from top to bottom, wherein the inside of upper ledge strip of paper used for sealing is provided with the fin consistent with upper ledge strip of paper used for sealing height, the inside of this fin is provided with coolant runner, upper ledge strip of paper used for sealing is provided with the liquid inlet joint and fluid joint that communicate with coolant runner, and the inside of lower frame strip of paper used for sealing is filled with phase-change material and is provided with fabrication hole on lower frame strip of paper used for sealing.
Further restriction, described upper cover plate, upper ledge strip of paper used for sealing, dividing plate, lower frame strip of paper used for sealing and lower cover are aluminum alloy material or copper material.
Further restriction, the side that described dividing plate up and down frame strip of paper used for sealing is relative is provided with the integrated fin with dividing plate, and the height of this fin is consistent with the height of lower frame strip of paper used for sealing.
Further restriction, described phase-change material is paraffin.
Further restriction, is filled with heat-conducting medium in described phase-change material, and this heat-conducting medium is copper powder or silica flour.
The utility model heat exchanger effectiveness is high, and structure is simple, and cost is low.Specifically: (1) is lightweight, compact conformation, cost are low, processing is simple; (2) ensure the maximum permissible temperature of cold drawing surface temperature lower than electronic component, protection electronic component prevents from being burned; (3) relative to traditional cold drawing, heat transfer property is more excellent, and heat exchange efficiency is higher.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model, and Fig. 2 is end view of the present utility model.
Drawing illustrates: 1, upper cover plate, 2, upper ledge strip of paper used for sealing, 3, dividing plate, 4, lower frame strip of paper used for sealing, 5, lower cover, 6, fin, 7, coolant runner, 8, fin, 9, joint.
Embodiment
Describe particular content of the present utility model by reference to the accompanying drawings in detail.See attached Fig. 1 and 2, a kind of electronic element radiating cold drawing, be provided with the upper cover plate 1 that vacuum brazing is integrated from top to bottom successively, upper ledge strip of paper used for sealing 2, dividing plate 3, lower frame strip of paper used for sealing 4 and lower cover 5, wherein the inside of upper ledge strip of paper used for sealing 2 is provided with the fin 6 highly consistent with upper ledge strip of paper used for sealing 2, the inside of this fin 6 is provided with coolant runner 7, upper ledge strip of paper used for sealing 2 is provided with the liquid inlet joint 9 and fluid joint 9 that communicate with coolant runner 7, the inside of lower frame strip of paper used for sealing 4 is filled with phase-change material and is provided with fabrication hole on lower frame strip of paper used for sealing 4, described upper cover plate 1, upper ledge strip of paper used for sealing 2, dividing plate 3, lower frame strip of paper used for sealing 4 and lower cover 5 are aluminum alloy material or copper material, the side that dividing plate 3 up and down frame strip of paper used for sealing 4 is relative is provided with the integrated fin 8 with dividing plate 3, the height of this fin 8 is consistent with the height of lower frame strip of paper used for sealing 4, phase-change material is paraffin and in paraffin, is filled with heat-conducting medium copper powder or silica flour.
In the utility model installation process, each parts are processed according to drawing requirement size, machine rear cleaning assembling, during assembling, between every layer, lay solder foil, then use the welding of particular jig clamping, use vacuum brazing weldering as a whole, fill phase-change material paraffin by the fabrication hole on lower frame strip of paper used for sealing after having welded, paraffin is filled by liquid mode, after having filled, welding blanking cover shuts the fabrication hole on lower frame strip of paper used for sealing, finally carries out corresponding surface treatment as requested.
Operation principle of the present utility model is: electronic component is arranged at the side of upper cover plate, and during electronic component work, pass into coolant mainly through liquid in-out joint and take away the heat that electronic component sheds, fin can increase thermal transmission coefficient and the heat transfer area of cold drawing.When coolant cannot meet the cooling requirements of electronic component, the surface temperature of cold drawing starts to increase, when being increased to the phase transition temperature of phase-change material, phase-change material starts to produce phase transformation, a large amount of heats is absorbed by the latent heat that dissolves of phase transformation, reduce the surface temperature of cold drawing, thus ensure the normal work of electronic component.
More than show and describe general principle of the present utility model; principal character and advantage; under the prerequisite not departing from the utility model spirit and scope, the utility model also has various changes and modifications, and these changes and improvements all fall into claimed scope of the present utility model.
Claims (5)
1. an electronic element radiating cold drawing, it is characterized in that being provided with successively upper cover plate, upper ledge strip of paper used for sealing, dividing plate, lower frame strip of paper used for sealing and lower cover that vacuum brazing is integrated from top to bottom, wherein the inside of upper ledge strip of paper used for sealing is provided with the fin consistent with upper ledge strip of paper used for sealing height, the inside of this fin is provided with coolant runner, upper ledge strip of paper used for sealing is provided with the liquid inlet joint and fluid joint that communicate with coolant runner, and the inside of lower frame strip of paper used for sealing is filled with phase-change material and lower frame strip of paper used for sealing is provided with fabrication hole.
2. electronic element radiating cold drawing according to claim 1, is characterized in that: described upper cover plate, upper ledge strip of paper used for sealing, dividing plate, lower frame strip of paper used for sealing and lower cover are aluminum alloy material or copper material.
3. electronic element radiating cold drawing according to claim 1, is characterized in that: the side that described dividing plate up and down frame strip of paper used for sealing is relative is provided with the integrated fin with dividing plate, and the height of this fin is consistent with the height of lower frame strip of paper used for sealing.
4. electronic element radiating cold drawing according to claim 1, is characterized in that: described phase-change material is paraffin.
5. electronic element radiating cold drawing according to claim 1, is characterized in that: be filled with heat-conducting medium in described phase-change material, this heat-conducting medium is copper powder or silica flour.
Priority Applications (1)
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CN201520338345.8U CN204651303U (en) | 2015-05-25 | 2015-05-25 | A kind of electronic element radiating cold drawing |
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CN201520338345.8U CN204651303U (en) | 2015-05-25 | 2015-05-25 | A kind of electronic element radiating cold drawing |
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Cited By (12)
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CN105555105A (en) * | 2016-02-24 | 2016-05-04 | 新乡市特美特换热设备有限公司 | Evaporator temperature equalizing and cooling plate |
CN107732405A (en) * | 2017-09-19 | 2018-02-23 | 电子科技大学 | A kind of four layers of two-phase cold drawing in phased array antenna microchannel |
CN108099220A (en) * | 2017-11-24 | 2018-06-01 | 北京遥感设备研究所 | A kind of 3D printing cold plate phase-change material charging method |
CN108225072A (en) * | 2016-12-14 | 2018-06-29 | 新光电气工业株式会社 | Heat pipe and its manufacturing method |
CN108347860A (en) * | 2017-01-22 | 2018-07-31 | 中国科学院空间应用工程与技术中心 | Phase transformation cold plate and space heat elimination device based on phase-change material |
CN108520869A (en) * | 2018-06-25 | 2018-09-11 | 芜湖纯元光电设备技术有限公司 | A kind of microelectronic element plug-in type heat-exchanger rig |
CN108521745A (en) * | 2018-03-12 | 2018-09-11 | 上海卫星工程研究所 | The efficient phase-change energy storage for adapting to the big heat spreader of pulsed is heat sink |
CN108601288A (en) * | 2018-03-12 | 2018-09-28 | 上海卫星工程研究所 | A kind of high-power matrix fin enhanced heat exchange phase transition heat sink |
CN109037882A (en) * | 2018-07-26 | 2018-12-18 | 西南电子技术研究所(中国电子科技集团公司第十研究所) | Airborne phased array antenna phase-change thermal storage liquid-cooling heat radiation case |
CN109178346A (en) * | 2018-06-25 | 2019-01-11 | 上海卫星工程研究所 | A kind of integrated satellite capsule plate heat-storing device adapting to complicated hot-fluid environment |
CN111200923A (en) * | 2020-01-13 | 2020-05-26 | 贵州永红航空机械有限责任公司 | Miniature radiator structure for radiating large-scale electronic equipment |
CN111655007A (en) * | 2020-06-22 | 2020-09-11 | 云谷(固安)科技有限公司 | Display screen heat abstractor |
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2015
- 2015-05-25 CN CN201520338345.8U patent/CN204651303U/en active Active
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
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CN105555105B (en) * | 2016-02-24 | 2018-08-03 | 新乡市特美特热控技术股份有限公司 | A kind of evaporator samming cold plate |
CN105555105A (en) * | 2016-02-24 | 2016-05-04 | 新乡市特美特换热设备有限公司 | Evaporator temperature equalizing and cooling plate |
CN108225072A (en) * | 2016-12-14 | 2018-06-29 | 新光电气工业株式会社 | Heat pipe and its manufacturing method |
CN108225072B (en) * | 2016-12-14 | 2020-10-30 | 新光电气工业株式会社 | Heat pipe and method for manufacturing the same |
CN108347860A (en) * | 2017-01-22 | 2018-07-31 | 中国科学院空间应用工程与技术中心 | Phase transformation cold plate and space heat elimination device based on phase-change material |
CN107732405A (en) * | 2017-09-19 | 2018-02-23 | 电子科技大学 | A kind of four layers of two-phase cold drawing in phased array antenna microchannel |
CN108099220A (en) * | 2017-11-24 | 2018-06-01 | 北京遥感设备研究所 | A kind of 3D printing cold plate phase-change material charging method |
CN108601288B (en) * | 2018-03-12 | 2020-10-09 | 上海卫星工程研究所 | High-power matrix fin enhanced heat exchange phase change heat sink |
CN108521745A (en) * | 2018-03-12 | 2018-09-11 | 上海卫星工程研究所 | The efficient phase-change energy storage for adapting to the big heat spreader of pulsed is heat sink |
CN108601288A (en) * | 2018-03-12 | 2018-09-28 | 上海卫星工程研究所 | A kind of high-power matrix fin enhanced heat exchange phase transition heat sink |
CN108520869A (en) * | 2018-06-25 | 2018-09-11 | 芜湖纯元光电设备技术有限公司 | A kind of microelectronic element plug-in type heat-exchanger rig |
CN109178346A (en) * | 2018-06-25 | 2019-01-11 | 上海卫星工程研究所 | A kind of integrated satellite capsule plate heat-storing device adapting to complicated hot-fluid environment |
CN109037882A (en) * | 2018-07-26 | 2018-12-18 | 西南电子技术研究所(中国电子科技集团公司第十研究所) | Airborne phased array antenna phase-change thermal storage liquid-cooling heat radiation case |
CN111200923A (en) * | 2020-01-13 | 2020-05-26 | 贵州永红航空机械有限责任公司 | Miniature radiator structure for radiating large-scale electronic equipment |
CN111655007A (en) * | 2020-06-22 | 2020-09-11 | 云谷(固安)科技有限公司 | Display screen heat abstractor |
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Address after: 453003, 3 tower, experimental building, 1 Chuang Chuang Road, Xinxiang Development Zone, Henan. Patentee after: Xinxiang city tmetal thermal control technology Limited by Share Ltd Address before: 453000 IIC11-13, Chuang Road, Xinxiang Development Zone, Henan Patentee before: XINXIANG TEMEITE HEAT TRANSFER EQUIPMENT CO., LTD. |
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CP03 | Change of name, title or address |