CN202617578U - Low-temperature soldered electronic radiator - Google Patents
Low-temperature soldered electronic radiator Download PDFInfo
- Publication number
- CN202617578U CN202617578U CN 201220215542 CN201220215542U CN202617578U CN 202617578 U CN202617578 U CN 202617578U CN 201220215542 CN201220215542 CN 201220215542 CN 201220215542 U CN201220215542 U CN 201220215542U CN 202617578 U CN202617578 U CN 202617578U
- Authority
- CN
- China
- Prior art keywords
- radiating
- heat
- radiating fin
- substrate
- low temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a low-temperature soldered electronic radiator, which comprises a radiating substrate and radiating fins connected with the radiating substrate, wherein the radiating substrate is soldered and fixedly connected with the radiating fins. According to the low-temperature soldered electronic radiator, die opening is not required, and the quantity of the radiating fins can be designed according to the radiating requirement; and the radiator is uniform in internal heat conduction, high in heat conductivity, simple in structure, convenient to machine and manufacture and cost-saving.
Description
Technical field
The utility model relates to a kind of electronic radiation device, relates in particular to a kind of low temperature soldering formula electronic radiation device, belongs to technical field of electronic equipment.
Background technology
Development along with the electronic component high-frequency high-speed; The heat that electronic component produced is also more and more; The working temperature of electronic component constantly raises, and has had a strong impact on the useful life and the operation stability of electronic component, so must carry out radiating treatment to the electronic component in the work.No matter be the air cooling heat radiator of passive heat radiation, still need fan to force the auxiliary air-cooled radiator of water conservancy diversion, the responsibility of radiating fin all is through being gone out by the heat dissipation that the conduction of the hot end comes with contacting of surrounding environment (air).In order to make radiating fin obtain good heat dissipation, can absorb heat long range diffusion heat, big, little four requirements of the big windage of air volume of area of dissipation rapidly but must make it to satisfy.But existing integrated electronic radiation device can't satisfy above-mentioned condition, so cause its radiating effect can not reach optimum efficiency.
The utility model content
The technical problem that the utility model will solve provides a kind of low temperature soldering formula electronic radiation device, need not die sinking, can design the quantity of radiating fin by radiating requirements, and its inner heat conduction is even, thermal conductivity is high, simple in structure, processing and fabricating convenient, practice thrift cost.
For realizing above-mentioned purpose, the technical scheme that the utility model adopted is:
A kind of low temperature soldering formula electronic radiation device comprises heat-radiating substrate and the radiating fin that is connected with heat-radiating substrate, and said heat-radiating substrate and radiating fin soldering connect firmly.
As the improvement to the utility model, said heat-radiating substrate is provided with the groove identical with radiating fin quantity, and the bottom soldering of radiating fin is fixed in the groove.
As the further improvement to the utility model: said groove is parallel and spaced set on heat-radiating substrate.
As the further qualification to aforesaid way, the spacing between the adjacent radiating fin is 1.5mm.
As the further qualification to aforesaid way, each radiating fin height is 200mm.
Owing to adopted technique scheme, the utility model compared with prior art, the technological progress that is obtained is:
1, heat-radiating substrate and radiating fin two bodies are aluminium material; It is integrally welded that the face that is in contact with one another adopts the low temperature tin cream to fill, and this structure need not die sinking, and fin can conveniently be adjusted radiator length, height and the width by design requirement; The I of adjacent radiating fin spacing is accomplished 1.5mm; Highly accomplish 200mm, be particularly suitable for scientific research, the use in exploitation sample stage, and can reduce its cost of manufacture.
2, adopt that the weldering of low temperature tin cream solved that conventional high temperature weldering occurs be mingled with, defectives such as incomplete fusion, sand holes hole.
3, adopt the weldering of low temperature tin cream with heat-radiating substrate and radiating fin seamless link, make that radiator inside heat conduction is even, thermal conductivity is high.Compare with the radiator of same size, same material, same profile, its thermal resistance is minimum.
4, the structure of heat dissipation substrate of integral type can effectively distribute the bottom heat rapidly, through low temperature tin cream scolder in time, effectively heat is sent on the radiating fin, thereby improves integral heat sink usefulness.
5, the radiator of big relatively specification power both can have been practiced thrift high die sinking cost and also can practice thrift Production Time.
The utlity model has the characteristics that simple in structure, reasonable in design, processing and fabricating is convenient, cost of manufacture is low and need not die sinking, be applicable on the high-power heat dissipation element of natural cooling or air blast cooling.
Description of drawings
Below in conjunction with accompanying drawing and specific embodiment the utility model is done further to specify.
Fig. 1 is this practical new embodiment overall structure sketch map;
Among the figure: 1, heat-radiating substrate; 2, radiating fin.
Embodiment
Shown in Figure 1 is a kind of low temperature soldering formula electronic radiation device, comprises heat-radiating substrate 1 and the radiating fin 2 that is connected with heat-radiating substrate 1, and heat-radiating substrate 1 connects firmly with radiating fin 2 solderings.Adjacent radiating fin 2 spacings are 1.5mm, and the height of each radiating fin 2 is 200mm.
The material of heat-radiating substrate 1 and radiating fin 2 is aluminium section bar or aluminium sheet.Heat-radiating substrate 1 is provided with and the identical groove of radiating fin 2 quantity, and groove is parallel and spaced set on heat-radiating substrate 1.The bottom of radiating fin 2 adopts the welding of low temperature tin cream scolder to be fixed in the groove.
The filling scolder is solderability, fillibility, the good low temperature tin cream scolder of heat conductivity.Adopt the soldering mode that radiating fin 2 is fixed on the heat-radiating substrate 1, can design the quantity of radiating fin 2 and the spacing of adjacent two radiating fins 2 according to size of substrate, substrate shape, heat radiation power consumption.Heat-radiating substrate 1 can be according to heat spreader structures demand adjustment length and width with radiating fin 2.
Claims (5)
1. a low temperature soldering formula electronic radiation device comprises heat-radiating substrate (1) and the radiating fin (2) that is connected with heat-radiating substrate (1), it is characterized in that: said heat-radiating substrate (1) connects firmly with radiating fin (2) soldering.
2. low temperature soldering formula electronic radiation device according to claim 1 is characterized in that: said heat-radiating substrate (1) is provided with and the identical groove of radiating fin (2) quantity, and the bottom soldering of radiating fin (2) is fixed in the groove.
3. low temperature soldering formula electronic radiation device according to claim 2 is characterized in that: said groove is gone up parallel and spaced set in heat-radiating substrate (1).
4. low temperature soldering formula electronic radiation device according to claim 3, it is characterized in that: the spacing between the adjacent radiating fin (2) is 1.5mm.
5. low temperature soldering formula electronic radiation device according to claim 4 is characterized in that: each radiating fin (2) highly is 200mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220215542 CN202617578U (en) | 2012-05-15 | 2012-05-15 | Low-temperature soldered electronic radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220215542 CN202617578U (en) | 2012-05-15 | 2012-05-15 | Low-temperature soldered electronic radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202617578U true CN202617578U (en) | 2012-12-19 |
Family
ID=47351241
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220215542 Expired - Fee Related CN202617578U (en) | 2012-05-15 | 2012-05-15 | Low-temperature soldered electronic radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202617578U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104661497A (en) * | 2015-03-04 | 2015-05-27 | 山东超越数控电子有限公司 | Cooling fin provided with through holes |
| WO2021180038A1 (en) * | 2020-03-12 | 2021-09-16 | 中兴通讯股份有限公司 | Heat dissipation tooth piece and preparation method therefor, heat dissipation apparatus and electronic device |
-
2012
- 2012-05-15 CN CN 201220215542 patent/CN202617578U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104661497A (en) * | 2015-03-04 | 2015-05-27 | 山东超越数控电子有限公司 | Cooling fin provided with through holes |
| WO2021180038A1 (en) * | 2020-03-12 | 2021-09-16 | 中兴通讯股份有限公司 | Heat dissipation tooth piece and preparation method therefor, heat dissipation apparatus and electronic device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202816913U (en) | Microchannel liquid-cooled heat sink device | |
| CN105140194A (en) | Heat-superconducting radiator and manufacturing method thereof | |
| CN105101751A (en) | Thermal superconductive gilled radiator and manufacturing method therefor | |
| CN205071563U (en) | Superconductive gilled radiator of heat | |
| CN201396725Y (en) | Fin type radiator | |
| CN202083266U (en) | Heat transfer element with pipe integrated with corrugated fins | |
| CN203103278U (en) | Vacuum superconducting heat pipe radiator | |
| CN205104482U (en) | Superconductive radiator of heat | |
| CN202617578U (en) | Low-temperature soldered electronic radiator | |
| CN203423164U (en) | Temperature equalization superconductive heat radiator | |
| CN102394229A (en) | Plate radiator | |
| CN102163910A (en) | Power module and electronic apparatus using power module | |
| CN205161003U (en) | Efficient radiator | |
| CN109640581B (en) | Air-cooled cold plate with built-in heat pipe and processing method thereof | |
| CN201555083U (en) | Multi-chip high-power LED lamp and a radiator structure | |
| CN105957848A (en) | Base plate with integrated heat tubes and module device thereof | |
| CN203482570U (en) | Water-cooling substrate | |
| CN207149548U (en) | A kind of radiator structure of package substrate | |
| CN201064074Y (en) | Heat pipe radiator | |
| CN202304511U (en) | Panel heat radiator | |
| CN212936472U (en) | Novel chip heat dissipation device | |
| CN203194076U (en) | Monoblock corrugated radiating fin | |
| CN204005868U (en) | LED radiator | |
| CN202205731U (en) | Heat radiating module for IGBT (Insulated Gate Bipolar Transistor) module superconductive heat pipe | |
| CN208028050U (en) | A kind of spliced uniform-temperature plate heat dissipating device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Hebei Guantai Electronic Technology Co., Ltd. Assignor: Sanhe Yatai Electronic Technology Co., Ltd. Contract record no.: 2014990000062 Denomination of utility model: Low-temperature soldered electronic radiator Granted publication date: 20121219 License type: Exclusive License Record date: 20140208 |
|
| LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121219 Termination date: 20160515 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |