CN204615796U - A kind of Large Copacity Small-Sized Pulsed switching device - Google Patents
A kind of Large Copacity Small-Sized Pulsed switching device Download PDFInfo
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- CN204615796U CN204615796U CN201520354961.2U CN201520354961U CN204615796U CN 204615796 U CN204615796 U CN 204615796U CN 201520354961 U CN201520354961 U CN 201520354961U CN 204615796 U CN204615796 U CN 204615796U
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- switching device
- press
- large copacity
- unit
- lower platen
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- 239000004065 semiconductor Substances 0.000 claims abstract description 30
- 238000010521 absorption reaction Methods 0.000 claims abstract description 17
- 238000009413 insulation Methods 0.000 claims description 13
- 229910000838 Al alloy Inorganic materials 0.000 claims description 6
- 229920002430 Fibre-reinforced plastic Polymers 0.000 claims description 5
- 239000011151 fibre-reinforced plastic Substances 0.000 claims description 5
- 239000010935 stainless steel Substances 0.000 claims description 5
- 229910001220 stainless steel Inorganic materials 0.000 claims description 5
- 239000011810 insulating material Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 2
- 238000009434 installation Methods 0.000 description 5
- 238000002955 isolation Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
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Abstract
The utility model discloses a kind of Large Copacity Small-Sized Pulsed switching device, comprise semiconductor pressing component, described semiconductor pressing component comprises and press-fits housing and press-fit in press-fiting the semiconductor subassembly in housing, also comprise grading resistor unit, piezo-resistance unit, RC absorption circuit unit and trigger control unit, described grading resistor unit, piezo-resistance unit, RC absorption circuit unit and trigger control unit be installed on the side that press-fits housing and by more than one installed part with press-fit housing and be connected.The utility model is simple and compact for structure, and volume is little, lightweight, good heat dissipation effect.
Description
Technical field
The utility model is mainly concerned with large power semiconductor device pulse switch apparatus field, is specifically related to a kind of Large Copacity Small-Sized Pulsed switching device.
Background technology
Along with the development of Pulse Power Techniques, the application of high-voltage large-capacity semiconductor pulse switching device is more and more wider, and impulse power electrical source system is more and more stricter to the technical indicator of volume weight, needs while practical function, make full use of space, reduce equipment volume and weight.
High-voltage large-capacity semiconductor pulse switching device is realized by the connection in series-parallel of multiple thyristor, diode, grading resistor, RC absorption circuit, and thyristor, diode are operationally, a large amount of heats can be produced, must ensure that the contact-making surface of device has certain thrust, to reduce the contact heat resistance of contact-making surface, the heat that semiconductor is produced distributes rapidly, otherwise the temperature of tube core can meet or exceed permission joint temperature, and damages device.The pressing component that usual multiple thyristor, the connection in series-parallel lower platen of diode, radiator add the compositions such as components and parts, metal pull bar, insulating part and disc spring realizes.
At present, there is following technical problem in above-mentioned high-voltage large-capacity semiconductor pulse switching device:
(1) vibrational power flow is unreasonable, and grading resistor unit, RC absorption circuit unit are all independent installations, causes that the volume of switching device is large, Heavy Weight, does not meet the environment applying to aviation, naval vessel etc. high to power density requirements and uses.
(2) nut collar of the double threaded screw of pressing component is at the two ends of pressing component, and take up room volume; And press-loading apparatus and upper and lower semiconductor are connected the place of touching and all be have employed lower insulators, cause that the height of press-loading apparatus is high, volume is large, Heavy Weight.
(3) the steel plate materials Heavy Weight in pressing component, hot tolerance is poor, causes the radiating effect of switching device not good.
Utility model content
The technical problem that the utility model solves is: for prior art Problems existing, provide a kind of simple and compact for structure, volume is little, a kind of Large Copacity Small-Sized Pulsed switching device of lightweight, good heat dissipation effect.
For solving the problems of the technologies described above, the utility model by the following technical solutions:
A kind of Large Copacity Small-Sized Pulsed switching device, comprise semiconductor pressing component, described semiconductor pressing component comprises and press-fits housing and press-fit in press-fiting the semiconductor subassembly in housing, also comprise grading resistor unit, piezo-resistance unit, RC absorption circuit unit and trigger control unit, described grading resistor unit, piezo-resistance unit, RC absorption circuit unit and trigger control unit be installed on the side that press-fits housing and by more than one installed part with press-fit housing and be connected.
As further improvement of the utility model, describedly press-fit housing and comprise top board, lower platen and be connected to some pull bars between top board and lower platen, described grading resistor unit, piezo-resistance unit, RC absorption circuit unit, trigger control unit are connected with top board and/or lower platen by installed part.
In the present embodiment, described installed part is insulating mount.
As further improvement of the utility model, the periphery place of described top board and/or lower platen offers more than one for installing the nick shaped Baltimore groove of installed part.
As further improvement of the utility model, the horizontal cross-section of described Baltimore groove is trapezoidal, described installed part is provided with the trapezoidal end that cooperatively interacts for being arranged in described Baltimore groove, and described installed part is provided with installing hole for being fixedly connected with top board and/or lower platen.
As further improvement of the utility model, in described lower platen, be embedded with several swivel nuts for cylinder lever connecting rod.
As further improvement of the utility model, described top board and lower platen are made by aluminium alloy.
As further improvement of the utility model, described pull bar is made up of insulating material.
As further improvement of the utility model, described pull bar is fiber reinforced plastics insulation blanket stud.
As further improvement of the utility model, described swivel nut is stainless steel swivel nut.
Compared with prior art, the utility model has the advantage of:
(1) Large Copacity Small-Sized Pulsed switching device of the present utility model, grading resistor unit, piezo-resistance unit, RC absorption circuit unit, trigger control unit are installed on semiconductor pressing component side, make installation as far as possible near semiconductor pressing component body, by opening Baltimore groove in the relevant position of upper lower platen, and adopt insulating mount to carry out insulation isolation, such that switching device structure is compact, volume is little.
(2) Large Copacity Small-Sized Pulsed switching device of the present utility model, adopt the insulation blanket stud of high strength to link the upper lower platen press-fiting housing, and on lower platen, inlay stainless steel swivel nut, reduce the height of traditional switch device, switching device volume is little.Go up lower platen simultaneously and adopt aluminium alloy, can make that switching device is lightweight, thermal capacity is large, damage because temperature is too high when avoiding semiconductor to work.
Accompanying drawing explanation
Fig. 1 is the stereochemical structure principle schematic of the utility model Large Copacity Small-Sized Pulsed switching device.
Fig. 2 is Facad structure principle schematic of the present utility model.
Fig. 3 is the utility model A-A sectional structure principle schematic in fig. 2.
Fig. 4 of the present utility modelly looks up structural principle schematic diagram.
Marginal data:
1, housing is press-fited; 11, top board; 12, lower platen; 121, swivel nut; 13, pull bar; 2, grading resistor unit; 3, piezo-resistance unit; 4, RC absorption circuit unit; 5, trigger control unit; 6, installed part; 7, rectifying tube; 8, conductive copper plate; 9, water-filled radiator; 10, thyristor; 14, lead; 15, disc spring; 16, nut.
Embodiment
Below in conjunction with specific embodiments and the drawings, the utility model is described in further detail.
As shown in Figures 1 to 4, the utility model provides a kind of Large Copacity Small-Sized Pulsed switching device, comprise semiconductor pressing component, described semiconductor pressing component comprises and press-fiting housing 1, press-fiting in press-fiting the semiconductor subassembly in housing 1, also comprise grading resistor unit 2, piezo-resistance unit 3, RC absorption circuit unit 4 and trigger control unit 5, it is characterized in that, described grading resistor unit 2, piezo-resistance unit 3, RC absorption circuit unit 4 and trigger control unit 5 be installed on the side that press-fits housing 1 and by more than one installed part 6 with press-fit housing 1 and be connected.
In the present embodiment, semiconductor pressing component comprises top board 11, lower platen 12 and four pull bars 13 be connected between top board 11 and lower platen 12 and rectifying tube 7, conductive copper plate 8, water-filled radiator 9, thyristor 10, lead 14, disc spring 15, nut 16, semiconductor pressing component is placed on pressing machine, pressing machine is utilized to apply certain pressure on top board 11, utilize the bounce of disc spring 15, make to compress between each semiconductor element string of semiconductor pressing component, make the pressure assembling force reaching regulation between each semiconductor element, to reduce the contact heat resistance of semiconductor element, the heat that semiconductor is operationally produced without part distributes rapidly, semiconductor element can normally be worked and unlikely damage.Utilize installed part 6 that grading resistor unit 2, piezo-resistance unit 3, RC absorption circuit unit 4, trigger control unit 5 are installed in the side press-fiting housing 1 simultaneously.In the present embodiment, installed part 6 is the structure of three pieces of tabulars, be installed on three sides of top board 11 and/or lower platen 12 respectively, wherein the plate two sides of one piece of installed part 6 respectively on grading resistor unit 2 and piezo-resistance unit 3 are installed, two outer two pieces of installed parts 6 are separately installed with RC absorption circuit unit 4 and trigger control unit 5, the structure of being installed by side and mode, make strile pulse switch device volume miniaturized.
In the present embodiment, installed part 6 is insulating mount, the periphery place of top board 11 and/or lower platen 12 offers more than one for installing the nick shaped Baltimore groove of installed part 6, the horizontal cross-section of Baltimore groove is trapezoidal, installed part 6 is provided with the trapezoidal end that cooperatively interacts for being arranged in Baltimore groove, and installed part 6 is provided with installing hole for being fixedly connected with top board 11 and/or lower platen 12.
Filled type installation is carried out by adopting nick shaped Baltimore groove, and adopt the installed part 6 of insulation to carry out insulation isolation, make top board 11 and/or lower platen 12 and grading resistor unit 2, piezo-resistance unit 3, components and parts mutually insulated between RC absorption circuit unit 4 and the different potentials of trigger control unit 5, each cellular installation can be made again in the inside press-fiting housing 1 profile simultaneously, strile pulse switch device is accomplished, and volume is miniaturized, and assembly overall dimension is effectively controlled; And the mutual insulation isolation that can also meet in high-voltage great-current situation between different potentials components and parts, achieve the insulation isolation of high electronegative potential.Coordinate by adopting dovetail groove, trapezoidal end and snap in installation, make each unit and press-fit housing 1 to install more fastening, while guarantee insulation level, mechanical strength is guaranteed.
In the present embodiment, top board 11 and lower platen 12 are made by aluminium alloy, and be embedded with four swivel nuts 121 for cylinder lever connecting rod 13 in lower platen 12, pull bar 13 is made up of insulating material, are fiber reinforced plastics insulation blanket stud.Fastening in swivel nut in a screw-in lower platen 12 of pull bar 13 121, the double threaded screw solving existing pressing component takes up room the problem of volume, makes strile pulse switch device height reduction, realizes miniaturized.
By adopting the top board 11 that is made of aluminium alloy and lower platen 12, can make that strile pulse switch device is lightweight, thermal capacity large, when switching device work, the heat of generation is transmitted to rapidly on lower platen, damages when avoiding semiconductor to work because temperature is too high.The screw thread of the fiber reinforced plastics insulation blanket stud of high strength can improve creepage distance simultaneously, insulation in guarantee between lower platen, between the components and parts of different potentials, simultaneously fiber reinforced plastics insulation blanket stud external diameter can with the outer diameter contact of thyristor 10, rectifying tube 7, thus avoid being short-circuited due to energising between different potentials components and parts, thus the area of the top board 11 and lower platen 12 press-fiting housing 1 can be made to effectively reduce, thus the volume realizing strile pulse switch device is further miniaturized, lightweight.
In the present embodiment, swivel nut 121 is stainless steel swivel nut.Stainless steel is higher than intensity of aluminum alloy, can strengthen the threaded connection intensity of pull bar 13 and lower platen 12.
Below be only preferred implementation of the present utility model, protection range of the present utility model be not only confined to above-described embodiment, all technical schemes belonged under the utility model thinking all belong to protection range of the present utility model.It should be pointed out that for those skilled in the art, not departing from the some improvements and modifications under the utility model principle prerequisite, protection range of the present utility model should be considered as.
Claims (10)
1. a Large Copacity Small-Sized Pulsed switching device, comprise semiconductor pressing component, described semiconductor pressing component comprises and press-fits housing (1), press-fit in press-fiting the semiconductor subassembly in housing (1), also comprise grading resistor unit (2), piezo-resistance unit (3), RC absorption circuit unit (4) and trigger control unit (5), it is characterized in that, described grading resistor unit (2), piezo-resistance unit (3), RC absorption circuit unit (4) and trigger control unit (5) be installed on the side that press-fits housing (1) and by more than one installed part (6) with press-fit housing (1) and be connected.
2. Large Copacity Small-Sized Pulsed switching device according to claim 1, it is characterized in that, the described some pull bars (13) press-fiting housing (1) and comprise top board (11), lower platen (12) and be connected between top board (11) and lower platen (12), described grading resistor unit (2), piezo-resistance unit (3), RC absorption circuit unit (4), trigger control unit (5) are connected with top board (11) and/or lower platen (12) by installed part (6).
3. Large Copacity Small-Sized Pulsed switching device according to claim 2, is characterized in that, described installed part (6) is insulating mount.
4. Large Copacity Small-Sized Pulsed switching device according to claim 3, is characterized in that, the periphery place of described top board (11) and/or lower platen (12) offers more than one for installing the nick shaped Baltimore groove of installed part (6).
5. Large Copacity Small-Sized Pulsed switching device according to claim 4, it is characterized in that, the horizontal cross-section of described Baltimore groove is trapezoidal, described installed part (6) is provided with the trapezoidal end that cooperatively interacts for being arranged in described Baltimore groove, and described installed part (6) is provided with installing hole for being fixedly connected with top board (11) and/or lower platen (12).
6. according to the Large Copacity Small-Sized Pulsed switching device in claim 2 ~ 5 described in any one, it is characterized in that, in described lower platen (12), be embedded with several swivel nuts for cylinder lever connecting rod (13) (121).
7. according to the Large Copacity Small-Sized Pulsed switching device in claim 2 ~ 5 described in any one, it is characterized in that, described top board (11) and lower platen (12) are made by aluminium alloy.
8. according to the Large Copacity Small-Sized Pulsed switching device in claim 2 ~ 5 described in any one, it is characterized in that, described pull bar (13) is made up of insulating material.
9. Large Copacity Small-Sized Pulsed switching device according to claim 8, is characterized in that, described pull bar (13) is fiber reinforced plastics insulation blanket stud.
10. Large Copacity Small-Sized Pulsed switching device according to claim 6, is characterized in that, described swivel nut (121) is stainless steel swivel nut.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520354961.2U CN204615796U (en) | 2015-05-28 | 2015-05-28 | A kind of Large Copacity Small-Sized Pulsed switching device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520354961.2U CN204615796U (en) | 2015-05-28 | 2015-05-28 | A kind of Large Copacity Small-Sized Pulsed switching device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204615796U true CN204615796U (en) | 2015-09-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520354961.2U Expired - Fee Related CN204615796U (en) | 2015-05-28 | 2015-05-28 | A kind of Large Copacity Small-Sized Pulsed switching device |
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| Country | Link |
|---|---|
| CN (1) | CN204615796U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107818951A (en) * | 2017-10-12 | 2018-03-20 | 南京拓扑瞬电电气科技有限公司 | Band heat management high-voltage pulse thyristor switch device |
| CN112152424A (en) * | 2020-08-10 | 2020-12-29 | 常州博瑞电力自动化设备有限公司 | Compact air-cooled static frequency converter power cabinet |
-
2015
- 2015-05-28 CN CN201520354961.2U patent/CN204615796U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107818951A (en) * | 2017-10-12 | 2018-03-20 | 南京拓扑瞬电电气科技有限公司 | Band heat management high-voltage pulse thyristor switch device |
| CN107818951B (en) * | 2017-10-12 | 2019-08-09 | 南京帕尔斯电气科技有限公司 | Band heat management high-voltage pulse thyristor switch device |
| CN112152424A (en) * | 2020-08-10 | 2020-12-29 | 常州博瑞电力自动化设备有限公司 | Compact air-cooled static frequency converter power cabinet |
| CN112152424B (en) * | 2020-08-10 | 2022-02-08 | 常州博瑞电力自动化设备有限公司 | Compact air-cooled static frequency converter power cabinet |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150902 |