CN202487557U - Power diode mounting structure - Google Patents
Power diode mounting structure Download PDFInfo
- Publication number
- CN202487557U CN202487557U CN2012200703268U CN201220070326U CN202487557U CN 202487557 U CN202487557 U CN 202487557U CN 2012200703268 U CN2012200703268 U CN 2012200703268U CN 201220070326 U CN201220070326 U CN 201220070326U CN 202487557 U CN202487557 U CN 202487557U
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- CN
- China
- Prior art keywords
- power diode
- insulating
- mounting structure
- radiator
- screw
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to the field of power electronics, and discloses a power diode mounting structure. The structure comprises a radiator and a screw component. The structure is characterized in that an insulating heat conduction pad is arranged between the radiator and a power diode; the screw component comprises a metal screw and an insulating component for the metal screw; the insulating heat conduction pad is insulating heat conduction silica gel cloth; and the insulating component comprises an insulating gasket and an insulating sleeve. According to the power diode mounting structure, the thorough isolation (electric ground) between the power diode and the radiator is realized, and the voltage endurance between the power diode and the electric ground is improved. The structure disclosed by the utility model has a simple structure and low cost, and is safe and reliable, and convenient to mount and maintain.
Description
Technical field
The utility model relates to field of power electronics, particularly a kind of mounting structure of power diode.
Background technology
At present, the mounting means of power diode, the basic employing is directly installed on the plane of radiator or heat abstractor.Like this, easy for installation, good heat dissipation effect, but existing problems are the electric insulation intensity that influence product integral body, its reason is that the withstand voltage level of power diode is lower, is difficult to satisfy the requirement of the electric insulation intensity of product.
Summary of the invention
The purpose of the utility model is to provide a kind of mounting structure of power diode safe and reliable, simple in structure, convenient for installation and maintenance, with low cost.
In order to achieve the above object, the utility model adopts following technical scheme to be achieved.
A kind of mounting structure of power diode comprises radiator and screw assembly, it is characterized in that, is provided with the insulating heat-conductive pad between said radiator and the power diode, and said screw assembly comprises metallic screw and the insulation assembly that is used for metallic screw.
The characteristics of the utility model are with further improving:
Said insulating heat-conductive pad is an insulating heat-conductive silica gel cloth.
Said insulation assembly comprises insulation spacer and insulating case.
The mounting structure of the power diode of the utility model; Be provided with the insulating heat-conductive pad between its radiator and the power diode; Its screw assembly comprises metallic screw and the insulation assembly that is used for metallic screw; Realize that power diode and radiator thoroughly isolate (electrically), the raising power diode and electrically between voltage endurance capability.The utility model is safe and reliable, simple in structure, convenient for installation and maintenance, with low cost.
Description of drawings
Below in conjunction with accompanying drawing and embodiment the utility model is done further explain.
Fig. 1 is the mounting structure sketch map of a kind of power diode of the utility model;
Fig. 2 is the enlarged diagram of screw assembly part among Fig. 1;
Among the figure: 1, screw assembly; 101, metallic screw; 102, insulation spacer; 103, insulating case; 2, power diode; 3, insulating heat-conductive pad; 4, radiator.
Embodiment
With reference to Fig. 1, Fig. 2, the mounting structure for a kind of power diode of the utility model wherein, is provided with insulating heat-conductive pad 3 between radiator 4 and the power diode 2, and insulating heat-conductive pad 3 is an insulating heat-conductive silica gel cloth; Screw assembly 1 comprises metallic screw 101 and the insulation assembly that is used for metallic screw 101, and insulation assembly comprises insulation spacer 102 and insulating case 103.Insulating case 103 is used for the bar portion of insulated metal screw 101, and insulation spacer 102 is used for the head of insulated metal screw 101.In the present embodiment, the bottom of insulating case 103 has the insulation spacer of the one of being shaped to, and has further guaranteed dielectric strength between power diode 2 and metallic screw 101, the radiator 4, thereby has improved the whole dielectric voltage withstand level of product.
Although more than combine accompanying drawing that embodiment of the present invention are described, the present invention is not limited to above-mentioned specific embodiments and applications field, and above-mentioned specific embodiments only is schematic, guiding, rather than restrictive.Those of ordinary skill in the art under the situation that does not break away from the scope that claim of the present invention protects, can also make a variety of forms under the enlightenment of this specification, these all belong to the row of the present invention's protection.
Claims (3)
1. the mounting structure of a power diode comprises radiator and screw assembly, it is characterized in that, is provided with the insulating heat-conductive pad between said radiator and the power diode, and said screw assembly comprises metallic screw and the insulation assembly that is used for metallic screw.
2. the mounting structure of power diode according to claim 1 is characterized in that, said insulating heat-conductive pad is an insulating heat-conductive silica gel cloth.
3. the mounting structure of power diode according to claim 1 is characterized in that, said insulation assembly comprises insulation spacer and insulating case.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200703268U CN202487557U (en) | 2012-02-29 | 2012-02-29 | Power diode mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200703268U CN202487557U (en) | 2012-02-29 | 2012-02-29 | Power diode mounting structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202487557U true CN202487557U (en) | 2012-10-10 |
Family
ID=46961957
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012200703268U Expired - Fee Related CN202487557U (en) | 2012-02-29 | 2012-02-29 | Power diode mounting structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202487557U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110379783A (en) * | 2018-07-09 | 2019-10-25 | 株洲中车奇宏散热技术有限公司 | Promote the method and structure of the insulation of semiconductor devices opposite heat sink and heat dissipation performance |
| CN112420636A (en) * | 2020-11-19 | 2021-02-26 | 四川长虹空调有限公司 | Chip heat radiation structure |
-
2012
- 2012-02-29 CN CN2012200703268U patent/CN202487557U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110379783A (en) * | 2018-07-09 | 2019-10-25 | 株洲中车奇宏散热技术有限公司 | Promote the method and structure of the insulation of semiconductor devices opposite heat sink and heat dissipation performance |
| CN110379783B (en) * | 2018-07-09 | 2021-12-14 | 株洲中车奇宏散热技术有限公司 | Method and structure for improving insulation and heat dissipation performance of semiconductor device relative to radiator |
| CN112420636A (en) * | 2020-11-19 | 2021-02-26 | 四川长虹空调有限公司 | Chip heat radiation structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121010 Termination date: 20150229 |
|
| EXPY | Termination of patent right or utility model |