CN204612556U - Heat-exchanger rig and there is the semiconductor refrigerating equipment of this heat-exchanger rig - Google Patents
Heat-exchanger rig and there is the semiconductor refrigerating equipment of this heat-exchanger rig Download PDFInfo
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- CN204612556U CN204612556U CN201520278452.6U CN201520278452U CN204612556U CN 204612556 U CN204612556 U CN 204612556U CN 201520278452 U CN201520278452 U CN 201520278452U CN 204612556 U CN204612556 U CN 204612556U
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Abstract
The utility model provides a kind of heat-exchanger rig and has the semiconductor refrigerating equipment of this heat-exchanger rig.Particularly, the utility model provides a kind of heat-exchanger rig, comprises at least one heat transfer substrate, at least one first heat pipe, at least one second heat pipe and multiple heat exchange fin.First heat pipe has the end section that with one of them heat transfer substrate hot linked centre portion and two are extended along the length direction of this heat transfer substrate by the two ends of centre portion respectively.The second end that second heat pipe has with one of them heat transfer substrate hot linked first end and extended along the length direction of this heat transfer substrate by first end.Multiple heat exchange fin is arranged on the end section of the first heat pipe and the second end of the second heat pipe, to distribute the heat transmitted from centre portion to end section.The utility model also provides a kind of semiconductor refrigerating equipment, comprises the casing, at least one semiconductor chilling plate and the heat-exchanger rig hot linked with the hot junction of semiconductor chilling plate that are limited with room between storing.
Description
Technical field
The utility model relates to heat transfer technology, particularly relates to a kind of heat-exchanger rig and has the semiconductor refrigerating equipment of this heat-exchanger rig.
Background technology
In recent years, semiconductor refrigerating equipment is widely used due to its superior performance, such as semiconductor freezer, semiconductor refrigerating refrigerator-freezer etc.Semiconductor refrigerating equipment utilizes the automatic pressure-transforming Variable flow control technology of semiconductor chilling plate to realize refrigeration, realizes heat radiation, without the need to refrigeration working medium and mechanical moving element by heat pipe and conduction technique simultaneously.Therefore, semiconductor refrigerating equipment does not have the series of problems of traditional mechanical refrigeration equipment such as Working medium pollution and mechanical oscillation in application in application process.
But while the cold junction generation cold of semiconductor chilling plate, its hot junction can produce a large amount of heats.In order to ensure that semiconductor chilling plate reliably carries out work constantly, need the heat distributing the generation of its hot junction in time.A kind of radiating mode of the prior art is arrange a heat-radiating substrate in the hot junction of semiconductor chilling plate to dispel the heat, and be embedded with multiple heat pipe with two condensation ends in heat-radiating substrate, the condensation end of multiple heat pipe is located in radiating fin.The plurality of heat pipe adopts the mode of Juxtaposition and Superimposition to arrange usually, be not easy to heat radiation, and heat pipe quantity is more.If multiple heat pipe staggered interting arranges, then easily interfere between heat pipe, arrange quite difficulty.
Utility model content
An object of the utility model first aspect is intended at least one defect overcoming existing heat-exchanger rig, provides a kind of heat-exchanger rig, and it, by reasonably selecting the type of heat pipe, improves the flexibility that heat pipe is arranged.
A further object of the utility model first aspect effectively will utilize heat transfer space, reduces heat pipe quantity, reduce costs.
Another further object of the utility model first aspect to improve the uniformity of heat-exchanger rig heat exchange.
An object of the utility model second aspect aims to provide a kind of semiconductor refrigerating equipment with heat-exchanger rig.
According to first aspect of the present utility model, the utility model provides a kind of heat-exchanger rig, comprising:
At least one heat transfer substrate, each described heat transfer substrate all has the hot linked heat-transfer surface with thermal source, to receive heat from corresponding thermal source;
At least one first heat pipe, described first heat pipe has the end section extended along the length direction of this heat transfer substrate by the two ends of described centre portion respectively with the hot linked centre portion of heat transfer substrate described in one of them and two;
At least one second heat pipe, described second heat pipe has and the hot linked first end of heat transfer substrate described in one of them and the second end of being extended along the length direction of this heat transfer substrate by described first end; And
Multiple radiating fin, is arranged on the end section of described first heat pipe and the second end of described second heat pipe, to distribute the heat of described end section and described second end simultaneously.
Alternatively, described at least one first heat pipe comprises many first heat pipes, and described at least one second heat pipe comprises many second heat pipes, and
Second end of the second heat pipe described in every root all at two described first heat pipes on the length direction of described radiating fin wherein between two adjacent end section.
Alternatively, described multiple radiating fin is distributed in the two ends of at least one heat transfer substrate described, to form two independently radiating fin modules.
Alternatively, at least one end section being arranged in every root first heat pipe in same radiating fin module on the length direction of described radiating fin between two of other at least one first heat pipe end section.
Alternatively, the end section of the first heat pipe extended with one end towards at least one heat transfer substrate described and the second end of the second heat pipe are configured to be arranged in same described radiating fin module along the length direction of described radiating fin with equidistant interval.
Alternatively, at least one heat transfer substrate described comprises arranged side by side between described two radiating fin modules and spaced two heat transfer substrates; Wherein
Be provided with at least two described first heat pipes and at least one described second heat pipe in each heat transfer substrate, and the end section of described at least two first heat pipes is interted in different radiating fin modules respectively.
Alternatively, at least one end section of the first heat pipe in a described heat transfer substrate wherein is embedded between at least two end section being embedded the first heat pipe in heat transfer substrate described in another.
Alternatively, be provided with the perforation that at least two run through its width in described heat transfer substrate, at least part of centre portion of described first heat pipe and the first end of described second heat pipe are embedded respectively in described at least two perforation.
Alternatively, described at least one first heat pipe comprises many first heat pipes, and described at least one second heat pipe comprises many second heat pipes, and
At least part of second end of described multiple second heat pipe is all arranged in the end of described heat exchange fin, between two end section of one of them end section first heat pipe described at least one at other of the first heat pipe described in every root.
According to second aspect of the present utility model, the utility model additionally provides a kind of semiconductor refrigerating equipment, comprising:
Casing, is limited with room between the storing for stored article in it;
At least one semiconductor chilling plate, between its cold junction and described storing, room is thermally coupled, thinks that between described storing, room provides cold; And
Arbitrary described heat-exchanger rig above, the heat-transfer surface of its at least one heat transfer substrate is thermally coupled with the hot junction of at least one semiconductor chilling plate described, to distribute the heat of described hot junction generation.
Because heat-exchanger rig of the present utility model comprises first heat pipe with two end section and the second heat pipe two kinds of heat pipes with second end, therefore, when heat transfer substrate is arranged heat pipe, layout first heat pipe and the second heat pipe can be replaced in interval, i.e. choice arrangement second heat pipe in the space being not enough to layout first heat pipe, thus take full advantage of heat pipe arrangement space, and the interference problem between the heat pipe produced when avoiding only adopting the first heat pipe to arrange, improve flexibility and the conveniency of heat pipe layout.
Further, owing to can unrestricted choice first heat pipe and/or the second heat pipe arrange in heat-exchanger rig of the present utility model, and at least one end section of the first heat pipe is between two end section of other at least one first heat pipe, second end of the second heat pipe at two the first heat pipes wherein between two adjacent end section, that is to say, first heat pipe and the second heat pipe staggered interting in heat transfer space is arranged, effectively to utilize the heat transfer space at heat pipe place, thus reach good heat transfer effect with less heat pipe quantity, reduce the cost of heat-exchanger rig.
Further, because the end section of the first heat pipe of heat-exchanger rig of the present utility model and the second end of the second heat pipe are located in two the radiating fin modules being arranged in heat transfer substrate two sections respectively, increase fin heat exchange area, improve heat exchange efficiency.
According to hereafter by reference to the accompanying drawings to the detailed description of the utility model specific embodiment, those skilled in the art will understand above-mentioned and other objects, advantage and feature of the present utility model more.
Accompanying drawing explanation
Hereinafter describe specific embodiments more of the present utility model with reference to the accompanying drawings by way of example, and not by way of limitation in detail.Reference numeral identical in accompanying drawing denotes same or similar parts or part.It should be appreciated by those skilled in the art that these accompanying drawings may not be drawn in proportion.In accompanying drawing:
Fig. 1 is the schematic diagram of the heat-exchanger rig according to the utility model embodiment;
Fig. 2 is the schematic diagram of the first heat pipe of heat-exchanger rig according to the utility model embodiment;
Fig. 3 is the schematic diagram of the heat-exchanger rig according to another embodiment of the utility model.
Detailed description of the invention
Fig. 1 is the schematic diagram of the heat-exchanger rig according to the utility model embodiment.As shown in Figure 1, heat-exchanger rig 100 comprises: at least one heat transfer substrate, at least one first heat pipe 21, at least one second heat pipe 22 and multiple heat exchange fin 30.Heat transfer substrate has the hot linked heat-transfer surface with thermal source, to accept heat from thermal source.First heat pipe 21 has the end section that the centre portion that is connected with one of them heat transfer substrate and two are extended along the length direction of this heat transfer substrate by the two ends of centre portion respectively.The second end that second heat pipe 22 has with one of them heat transfer substrate hot linked first end and extended along the length direction of this heat transfer substrate by first end.Multiple heat exchange fin 30 is arranged in the end section of heat pipe, to distribute the heat transmitted from centre portion to end section.
Because the heat-exchanger rig 100 in the utility model embodiment comprises first heat pipe 21 with two end section and the second heat pipe 22 two kinds of heat pipes with second end.Therefore, when heat transfer substrate is arranged heat pipe, can in the space being not enough to layout first heat pipe 21 choice arrangement second heat pipe 22, thus take full advantage of heat pipe arrangement space, and the interference problem between the heat pipe produced when avoiding only adopting the first heat pipe 21 to arrange, improve flexibility and the conveniency of heat pipe layout.
In embodiments more of the present utility model, as shown in Figure 1, at least one first heat pipe 21 comprises many first heat pipes 21, and at least one second heat pipe 22 comprises many second heat pipes 22.At least one end section of every root first heat pipe 21 on the length direction of radiating fin all between two end section of other at least one first heat pipe 21, the second end of every root second heat pipe 22 all at two the first heat pipes 21 on the length direction of radiating fin wherein between two adjacent end section.That is, arranging many first heat pipe 21 staggered interting of heat-exchanger rig 100 in the utility model embodiment, first heat pipe 21 and the second heat pipe 22 interval are alternately arranged, thus while avoiding heat pipe to arrange that generation is interfered, effectively make use of the heat transfer space at heat pipe place, thus reach good heat transfer effect with less heat pipe quantity, reduce the cost of heat-exchanger rig.
In embodiments more of the present utility model, multiple heat exchange fins 30 are distributed in the two ends of at least one heat transfer substrate, to form two independently heat exchange fin modules, thus increase the array area of heat exchange fin, ensure effective natural heat dissipation.Heat-exchanger rig 100 comprises at least two heat pipes, thus, is embedded the first heat pipe 21 at least one heat transfer substrate and the second heat pipe 22 can be divided into along the two groups of heat pipes extended towards at least one heat transfer substrate two ends respectively on heat transfer substrate length direction.Often organize the heat exchange fin module that the end section of heat pipe and/or the second end are all located in the respective end being arranged at least one heat transfer substrate, thus be convenient to layout and the installation of the first heat pipe 21 and the second heat pipe 22, also take full advantage of the heat transfer space between two heat exchange fin modules simultaneously.
Further, at least one end section being arranged in every root first heat pipe 21 in same radiating fin module on the length direction of radiating fin between two end section of other at least one first heat pipe 21, multiple first heat pipe 21 is formed arrange staggered interting, and make it be covered with this heat transfer space with irregular or regular form, thus effectively make use of this heat transfer space, improve heat transfer effect, decrease heat pipe quantity.
In embodiments more of the present utility model, the end section of the first heat pipe 21 extended with one end towards at least one heat transfer substrate and the second end of the second heat pipe 22 are configured to be arranged in same radiating fin module along the length direction of radiating fin with equidistant interval.That is, the end section that extends towards same direction of the first heat pipe 21 and the second end of the second heat pipe 22 of extending towards this direction are arranged in order along the length direction of heat exchange fin 30 with equidistant interval.In other words, heat exchange fin 30 is divided into isometric some parts, to be passed to heat exchange fin 30 with making the even heat of the first heat pipe 21 and the second heat pipe 22 by the end section that the first heat pipe 21 extends towards same direction and the second end of the second heat pipe 22 extended towards this direction along its length.The heat namely making heat exchange fin 30 receive is more even, is convenient to its heat exchange more equably, improves heat exchange efficiency.
In embodiments more of the present utility model, at least one heat transfer substrate comprises arranged side by side between two radiating fin modules and spaced two heat transfer substrates, be specially the first heat transfer substrate 11 and the second heat transfer substrate 12, first heat transfer substrate 11 has the first heat-transfer surface 111, second heat transfer substrate and has the second heat-transfer surface 121.Be provided with at least two first heat pipes 21 and at least one second heat pipe 22 in each heat transfer substrate, and the end section of at least two first heat pipes 21 is interted in different radiating fin modules respectively.First heat transfer substrate 11 and the second heat transfer substrate 12 between two heat exchange fin modules side by side and interval arrange, to make the length direction of two heat transfer substrates and width all consistent, the first heat transfer substrate 11 and the second heat transfer substrate 12 are along its width side by side and the setting that keeps at a certain distance away.Further, at least one end section being embedded the first heat pipe 21 in the first heat transfer substrate 11 is being embedded between at least two end section of the first heat pipe 21 of the second heat transfer substrate 12, to make the first heat pipe 21 staggered interting of two heat transfer substrates arrange, provide radiating effect.
Further, in the utility model embodiment, first heat pipe 21 can roughly take the shape of the letter U, to make two end section of every root first heat pipe 21 be extended in parallel by the two ends of its centre portion in the same direction, and then two end section of every root first heat pipe 21 are all located in same heat exchange fin module.Particularly, the end section 212 of the first heat pipe 21 and another end section 213 are extended towards same one end (right-hand member of state shown in Fig. 1) of heat transfer substrate 11 along the length direction of heat transfer substrate 11 by the two ends of its centre portion 211, thus end section 212 and another end section 213 are all located in the heat exchange fin module being arranged in this end.Second heat pipe 22 can be substantially L-shaped, extended by its first end 221 to make the second end 222 of every root second heat pipe 22 along the length direction of heat transfer substrate 11 towards any one end of heat transfer substrate 11.
Fig. 2 is the schematic diagram of the first heat pipe 21 of heat-exchanger rig 100 according to the utility model embodiment.Composition graphs 1 and Fig. 2, the centre portion 211 of the first heat pipe 21 has the first linear pattern sub-segments 2111, the second linear pattern sub-segments 2112 and the 3rd linear pattern sub-segments 2113 that the width along heat transfer substrate 11 connects successively.First linear pattern sub-segments 2111, second linear pattern sub-segments 2112 and the 3rd linear pattern sub-segments 2113 can be located on the same line, also can lay respectively on different straight lines, can also have on two straight lines of certain angle for adjacent two sub-segments are positioned at.The length of the first linear pattern sub-segments 2111, second linear pattern sub-segments 2112 and the 3rd linear pattern sub-segments 2113 can be isometric, also can Length discrepancy.Two adjacent the first heat pipes 21 are embedded in heat transfer substrate 11 with its different linear pattern sub-segments respectively, arrange to make at least two the first heat pipe 21 staggered interting.
In embodiments more of the present utility model, be equipped with the perforation that at least two run through its width in each heat transfer substrate, at least part of centre portion of the first heat pipe 21 and the first end 221 of the second heat pipe 22 are embedded in this perforation.Preferably, bore a hole to be equidistantly spaced, heat transfer substrate to be divided into along its length three isometric parts, to be passed to the first heat pipe 21 and the second heat pipe 22 with making the even heat in heat transfer substrate for these at least two.The large I of perforation and the external diameter of the first heat pipe 21 and the second heat pipe 22 match respectively, to be embedded after in perforation at the first heat pipe 21 and the second heat pipe 22, make its outer surface and the heat transfer substrate close contact being positioned at perforation, thus make the effective transmission realizing heat.
It will be understood by those skilled in the art that in other embodiment of the utility model, also can offer the card holding trough running through heat transfer substrate width on the heat-transfer surface of heat transfer substrate, be embedded at wherein for the first heat pipe 21 and the second heat pipe 22.The dimensional configurations of card holding trough becomes to make the first heat pipe 21 and the second heat pipe 22 can clamp embedding under external force wherein, and keeps this first heat pipe 21 and the second heat pipe 22, avoids it to automatically disengage card holding trough.
In embodiments more of the present utility model, at least one heat transfer substrate also can be provided with blower fan, flow towards multiple heat exchange fin 30 to order about air-flow, thus make air and multiple heat exchange fin 30 that forced-convection heat transfer occur, improve heat exchange efficiency.
Further, in the lamellar body of each heat exchange fin 30, be all formed with air vent 31, and the air vent forward of adjacent two heat exchange fins 30 is relative.Can be formed with multiple air vent 31 in each heat exchange fin 30, the air vent forward being positioned at same position of adjacent two heat exchange fins 30 is relative.That is, the air vent being positioned at same position of multiple heat exchange fin 30 is located along the same line, so that air is circulated by the air vent of multiple heat exchange fin 30, strengthens the exchange capability of heat of heat exchange fin 30, thus improves the heat exchange efficiency of heat-exchanger rig 100.
Further, heat exchange fin 30 can extend along the width of at least one heat transfer substrate, and its place plane is vertical in the heat-transfer surface of heat transfer substrate, thus make the air vent in multiple heat exchange fin 30 be positioned at along on heat transfer substrate length direction and on the straight line parallel with heat-transfer surface, so that the blower fan be arranged on heat transfer substrate is along air vent 31 to heat exchange fin 30 blow flow, improve the flow velocity of air-flow, be convenient to carry out forced-convection heat transfer between air and heat exchange fin 30.
In embodiments more of the present utility model, the spacing between adjacent two heat exchange fins in multiple heat exchange fin is greater than a predetermined minimum spacing threshold value.That is, adjacent two heat exchange fins in multiple heat exchange fin 30 keep at a certain distance away setting, to form predetermined gap between adjacent two heat exchange fins.This predetermined minimum spacing threshold value is preferably 10 ~ 20mm.
Fig. 3 is the schematic diagram of the heat-exchanger rig according to another embodiment of the utility model.As shown in Figure 3, in other embodiments of the present utility model, at least one first heat pipe 21 comprises many first heat pipes 21, and at least one second heat pipe 22 comprises many second heat pipes 22.At least part of second end of multiple second heat pipe 22 is all arranged in the end of heat exchange fin, and at least part of end section of many first heat pipes 21 is between the second end of many second heat pipes 22, so that layout the first heat pipe 21 and the second heat pipe 22.Between two end section of one of them end section at least one first heat pipe 21 at other of every root first heat pipe 21.In the utility model embodiment, heat-exchanger rig 100 comprises first heat transfer substrate 11 with the first heat-transfer surface 111 and second heat transfer substrate 12 with the second heat-transfer surface 121, is all embedded with two second heat pipes 22 and two first heat pipes 21 in each heat transfer substrate.Second end of second heat pipe wherein in each heat transfer substrate to be arranged in one of them heat exchange fin module and to be positioned at the end of heat exchange fin 30, and the second end of another the second heat pipe to be arranged in another heat exchange fin module and to be embedded between adjacent two end section of two the first heat pipes of two heat transfer substrates.Particularly, the second end 222 of second heat pipe 22 in heat transfer substrate 11 to be arranged in one of them heat exchange fin module and to be positioned at the end of heat exchange fin 30, and the first end 221 of the second heat pipe 22 is embedded in heat transfer substrate 11.The end section 212 of the first heat pipe 21 and another end section 213 are located in same radiating fin module respectively, and its centre portion 211 is embedded in heat transfer substrate 11.
In other embodiments of the present utility model, each heat exchange fin module is divided into upper and lower two parts, is located in the first heat pipe 21 end section in each part and the second heat pipe 22 second end and is configured to length direction along heat exchange fin 30 to be equidistantly spaced.That is, each part in each heat exchange fin module can be divided into isometric some parts by the first heat pipe 21 end section and the second heat pipe 22 second end along its length, to be passed to heat exchange fin with making the even heat of the first heat pipe 21 end section and the second heat pipe 22 second end.The heat namely making heat exchange fin receive is more even, is convenient to its heat exchange more equably, improves heat exchange efficiency.Particularly, the upper part heat exchange fin of two heat exchange fin modules is positioned at the two ends, left and right of heat transfer substrate 11, and the lower part heat exchange fin of two heat exchange fin modules is positioned at the two ends, left and right of other heat transfer substrates 12, with the heat of two heat transfer substrates that dispel the heat equably.
The utility model also provides a kind of semiconductor refrigerating equipment, comprises casing, at least one semiconductor chilling plate and heat-exchanger rig 100.Room between the storing for stored article is limited with in casing.Between the cold junction of semiconductor chilling plate and storing, room is thermally coupled, thinks that between this storing, room provides cold.The heat-transfer surface of at least one heat transfer substrate of heat-exchanger rig 100 and the hot junction of at least one semiconductor chilling plate thermally coupled, with distribute this hot junction produce heat.
In embodiments more of the present utility model, the cold junction of semiconductor chilling plate can be close to inwall or the outer wall of room between storing, and the heat-transfer surface of heat transfer substrate can be close in the hot junction of semiconductor chilling plate.Each heat transfer substrate is provided with screw fixing hole towards the side of heat-transfer surface, for the hot junction of fixing semiconductor chilling plate, ensures the reliably thermally coupled of this hot junction and heat-exchanger rig 100.In the utility model embodiment, heat-exchanger rig 100 can be heat abstractor, and in other embodiment of the utility model, heat-exchanger rig 100 also can be cold scattering device.
It will be understood by those skilled in the art that the semiconductor refrigerating equipment that relates in the utility model embodiment can for refrigerator, refrigerator-freezer, freezing and refrigeration tank or other utilize semiconductor chilling plate to carry out the equipment freezed.
Those skilled in the art will also be understood that, in case of no particular description, alleged by the utility model " on ", D score, "left", "right", " front " and " afterwards " are all normal operating conditions of the heat-exchanger rig 100 be arranged in semiconductor refrigerating equipment be benchmark.
So far, those skilled in the art will recognize that, although multiple exemplary embodiment of the present utility model is illustrate and described herein detailed, but, when not departing from the utility model spirit and scope, still can directly determine or derive other modification many or amendment of meeting the utility model principle according to content disclosed in the utility model.Therefore, scope of the present utility model should be understood and regard as and cover all these other modification or amendments.
Claims (10)
1. a heat-exchanger rig, is characterized in that, comprising: at least one heat transfer substrate, and each described heat transfer substrate all has the hot linked heat-transfer surface with thermal source, to receive heat from corresponding thermal source;
At least one first heat pipe, described first heat pipe has the end section extended along the length direction of this heat transfer substrate by the two ends of described centre portion respectively with the hot linked centre portion of heat transfer substrate described in one of them and two;
At least one second heat pipe, described second heat pipe has and the hot linked first end of heat transfer substrate described in one of them and the second end of being extended along the length direction of this heat transfer substrate by described first end; And
Multiple radiating fin, is arranged on the end section of described first heat pipe and the second end of described second heat pipe, to distribute the heat of described end section and described second end simultaneously.
2. heat-exchanger rig according to claim 1, is characterized in that, described at least one first heat pipe comprises many first heat pipes, and described at least one second heat pipe comprises many second heat pipes, and
Second end of the second heat pipe described in every root all at two described first heat pipes on the length direction of described radiating fin wherein between two adjacent end section.
3. heat-exchanger rig according to claim 2, is characterized in that, described multiple radiating fin is distributed in the two ends of at least one heat transfer substrate described, to form two independently radiating fin modules.
4. heat-exchanger rig according to claim 3, it is characterized in that, at least one end section being arranged in every root first heat pipe in same radiating fin module on the length direction of described radiating fin between two of other at least one first heat pipe end section.
5. heat-exchanger rig according to claim 4, it is characterized in that, the end section of the first heat pipe extended with one end towards at least one heat transfer substrate described and the second end of the second heat pipe are configured to be arranged in same described radiating fin module along the length direction of described radiating fin with equidistant interval.
6. heat-exchanger rig according to claim 3, is characterized in that, at least one heat transfer substrate described comprises arranged side by side between described two radiating fin modules and spaced two heat transfer substrates; Wherein
Be provided with at least two described first heat pipes and at least one described second heat pipe in each heat transfer substrate, and the end section of described at least two first heat pipes is interted in different radiating fin modules respectively.
7. heat-exchanger rig according to claim 6, it is characterized in that, be embedded at least one end section of the first heat pipe in a described heat transfer substrate wherein between at least two end section being embedded the first heat pipe in heat transfer substrate described in another.
8. heat-exchanger rig according to claim 1, it is characterized in that, be provided with the perforation that at least two run through its width in described heat transfer substrate, at least part of centre portion of described first heat pipe and the first end of described second heat pipe are embedded respectively in described at least two perforation.
9. heat-exchanger rig according to claim 1, is characterized in that, described at least one first heat pipe comprises many first heat pipes, and described at least one second heat pipe comprises many second heat pipes, and
At least part of second end of described multiple second heat pipe is all arranged in the end of described heat exchange fin, between two end section of one of them end section first heat pipe described at least one at other of the first heat pipe described in every root.
10. a semiconductor refrigerating equipment, is characterized in that, comprising: casing, is limited with room between the storing for stored article in it;
At least one semiconductor chilling plate, between its cold junction and described storing, room is thermally coupled, thinks that between described storing, room provides cold; And
Heat-exchanger rig described in any one of claim 1-9, the heat-transfer surface of its at least one heat transfer substrate and the hot junction of at least one semiconductor chilling plate described thermally coupled, with distribute described hot junction produce heat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520278452.6U CN204612556U (en) | 2015-04-30 | 2015-04-30 | Heat-exchanger rig and there is the semiconductor refrigerating equipment of this heat-exchanger rig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520278452.6U CN204612556U (en) | 2015-04-30 | 2015-04-30 | Heat-exchanger rig and there is the semiconductor refrigerating equipment of this heat-exchanger rig |
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| Publication Number | Publication Date |
|---|---|
| CN204612556U true CN204612556U (en) | 2015-09-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520278452.6U Active CN204612556U (en) | 2015-04-30 | 2015-04-30 | Heat-exchanger rig and there is the semiconductor refrigerating equipment of this heat-exchanger rig |
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| CN (1) | CN204612556U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106197097A (en) * | 2015-04-30 | 2016-12-07 | 青岛海尔智能技术研发有限公司 | Heat-exchanger rig and there is the semiconductor refrigerating equipment of this heat-exchanger rig |
-
2015
- 2015-04-30 CN CN201520278452.6U patent/CN204612556U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106197097A (en) * | 2015-04-30 | 2016-12-07 | 青岛海尔智能技术研发有限公司 | Heat-exchanger rig and there is the semiconductor refrigerating equipment of this heat-exchanger rig |
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