CN204578885U - A kind of smart mobile phone being beneficial to heat dissipation for circuit board - Google Patents
A kind of smart mobile phone being beneficial to heat dissipation for circuit board Download PDFInfo
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- CN204578885U CN204578885U CN201520236483.5U CN201520236483U CN204578885U CN 204578885 U CN204578885 U CN 204578885U CN 201520236483 U CN201520236483 U CN 201520236483U CN 204578885 U CN204578885 U CN 204578885U
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- circuit board
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Abstract
The utility model discloses a kind of smart mobile phone being beneficial to heat dissipation for circuit board, it comprises mobile phone body, described mobile phone body is provided with circuit board and chip, described circuit board has first surface and second surface, described chip is arranged at the first surface of circuit board by solder joint, also comprise the heat conduction cover be located at above chip, described heat conduction cover connects with the first surface of circuit board, described heat conduction cover comprises the radiating base layer, heat radiation tin film, hexatomic ring carbon-based nano carbon heat dissipation film and the graphite radiating film that stack gradually, and described hexatomic ring carbon-based nano carbon heat dissipation film is corrugated.The heat that circuit board, chip produce effectively, in time can be imported the good region of heat radiation by the heat conduction cover that this smart mobile phone is arranged, thus enhances the heat dispersion of circuit board.
Description
Technical field
The utility model relates to mobile phone, particularly relates to a kind of smart mobile phone, relates to a kind of smart mobile phone being beneficial to heat dissipation for circuit board further.
Background technology
In the past few years, double-core, four cores, 4G, flat board, Android4.0, Tegra3/4 chip, cloud store the focus that these vocabulary become people's concern in succession, also become the core technology of star's product of all big enterprises in the industry simultaneously.
Along with the development of industry, mobile phone will be more intelligent, configure higher, and arithmetic speed is faster, and CPU frequency will be more and more higher.For multi-functional, the smart mobile phone of multitask, if long-play large software or game, the temperature of the devices such as CPU, LCM can uprise, and performance can sharply reduce, the same with all electrical type devices, only in suitable temperature range, just can guarantee the working properly and lasting of device.So heat radiation is to ensure that these devices are not burned on the one hand, be ensure that they are workable quite good on the other hand.Meanwhile, radio communication device, because will transmit and receive signal, is equally also can produce a large amount of heats along with the transmitting and receiving of useful signal; when temperature is too high; mobile phone will start self-protective mechanism, auto-breaking, so also can affect the normal use of mobile phone.4G communication LTE technology (abbreviation of Long TermEvolution-Long Term Evolution) of a new generation, greatly will strengthen the transmitting of radio frequency and accept the ability of data, LTE estimates the highest downloading rate 100Mbps and uploads more than 50Mbps, data, while interior of mobile phone processes more and more rapidly, also propose new challenge to the heating problem being about to the smart mobile phone occurred.
The process of current each categorles cell phone manufacturer on heat dissipation problem, the mode that basic employing is similar, main principle is exactly to be led other regions from hot spot region by the mode of outside material etc. by heat, and then again heat is derived mobile phone, the more method of current application mainly contain following some:
1, the screening cover material foreign copper-nickel alloy that all adopts heat conductivility better;
2, screening cover surface and LCM below steel disc be paved with graphite heat radiation fin;
3, fill with heat conductive silica gel between screening cover and euthermic chip.
Because the space structure of mobile phone limits, be not suitable for adopting the traditional heat-dissipating modes such as air-cooled and water-cooled, graphite and heat conductive silica gel become most suitable mobile phone heat sink material at present.
To sum up, existing smart mobile phone heat dissipation technology is all that the starting point is placed on outer handset, by Heat Conduction Material, heat being exported to outside from inside, then by being attached to the Heat Conduction Material on mobile phone surface, realizing heat-conducting effect.These heat dissipation technologys just consider the method for dispelling the heat outside circuit board of mobile phone, and ignore the heat conduction of printing board PCB inside.One piece of circuit board has the concentrated region of heating usually, if good heat conduction measure is not done in the PCB design stage in this region, so will badly influence outside heat-conducting effect, the radiating effect of mobile phone finally can be made to have a greatly reduced quality.
Utility model content
Technical problem to be solved in the utility model provides a kind of smart mobile phone being beneficial to heat dissipation for circuit board for the state of the art.
The utility model solves the problems of the technologies described above adopted technical scheme: a kind of smart mobile phone being beneficial to heat dissipation for circuit board, comprise mobile phone body, described mobile phone body is provided with circuit board and chip, described circuit board has first surface and second surface, described chip is arranged at the first surface of circuit board by solder joint, also comprise the heat conduction cover be located at above chip, described heat conduction cover connects with the first surface of circuit board, described heat conduction cover comprises the radiating base layer stacked gradually, heat radiation tin film, hexatomic ring carbon-based nano carbon heat dissipation film and graphite radiating film, described hexatomic ring carbon-based nano carbon heat dissipation film is corrugated.
Wherein, CPU heat-conducting silicone grease is filled with between described chip and heat conduction cover.
Wherein, the second surface of described circuit board is provided with composite radiating layer, and described composite radiating layer comprises the silica gel heat dissipating layer, Graphene heat dissipating layer and the polyfluorinated ethylene layer that stack gradually, and described silica gel heat dissipating layer is located at the second surface of circuit board.
Wherein, the circuit board being positioned at described beneath chips is provided with thermal vias, and accordingly, described composite radiating layer is provided with the thermal vias communicated with the thermal vias on circuit board.
Wherein, the inwall of described thermal vias is provided with welding resistance green oil.
Wherein, described radiating base layer is aluminum-based copper-clad plate.
Wherein, some heat-conducting blocks are provided with between described radiating base layer and heat radiation tin film.
Wherein, the waveform vertical height of described heat radiation tin film is 10 ~ 20 μm, such as 12 μm, 15 μm, 18 μm, 19 μm.
Compared with prior art, the utility model has the advantage of: this smart mobile phone has established a heat conduction cover in the outer cup of chip, heat conduction cover comprises radiating base layer, heat radiation tin film, hexatomic ring carbon-based nano carbon heat dissipation film and graphite radiating film, because all parts of heat conduction cover all has preferably heat sinking function, the heat of circuit board is distributed by heat conduction cover; In addition, because hexatomic ring carbon-based nano carbon heat dissipation film is in playing stupefied shape, thus making heat conduction cover inside have a heat radiation cavity, being more conducive to electric hot plate heat radiation.
Secondly, this smart mobile phone by circuit board relative to thermal source concentrated area---chip place has offered the thermal vias of a thermolysis, and the heat allowing this region produce can be transmitted to the back side of circuit board by these thermal vias; Simultaneously at back of circuit board, namely the second surface of circuit board retains heat dissipation region and air circulation path, heat is imported the good region of heat radiation.
To sum up, above-mentioned heat conduction cover can allow radiating effect in the circuit board of smart mobile phone greatly promote, and has higher practicality and economy, has use value widely.
Accompanying drawing explanation
Fig. 1 is the structural representation after the utility model embodiment circuit board, chip, the connection of heat conduction cover;
Fig. 2 is the structural representation of the utility model embodiment heat conduction cover;
Fig. 3 is the structural representation of the utility model embodiment composite radiating film.
Embodiment
Below in conjunction with accompanying drawing embodiment, the utility model is described in further detail.
The smart mobile phone of the present embodiment, comprises mobile phone body, and mobile phone body is provided with circuit board 1 and chip 4, and as shown in Figure 1, circuit board 1 has first surface and second surface, and chip 4 is arranged at the first surface of circuit board 1 by solder joint 3, i.e. the front of circuit board 1.The smart mobile phone of the present embodiment also comprises the heat conduction cover 2 be located at above chip 4, heat conduction cover 2 connects with the first surface of circuit board 1, heat conduction cover 2 comprises the radiating base layer 7, heat radiation tin film 8, hexatomic ring carbon-based nano carbon heat dissipation film 9 and the graphite radiating film 10 that stack gradually from bottom to up, and hexatomic ring carbon-based nano carbon heat dissipation film 9 is corrugated.
In order to the heat realizing chip 4 to produce is distributed by heat conduction cover 2 in time, between chip 4 and heat conduction cover 2, be filled with CPU heat-conducting silicone grease.
Wherein, the second surface of circuit board 1, namely the reverse side of circuit board 1 is provided with composite radiating layer 6, as shown in Figure 3, composite radiating layer 6 comprises the silica gel heat dissipating layer 14, Graphene heat dissipating layer 13 and the polyfluorinated ethylene layer 12 that stack gradually, and silica gel heat dissipating layer 14 is located at the second surface of circuit board 1.
In order to strengthen radiating effect further, circuit board 1, composite radiating layer 6 respectively correspondence are provided with thermal vias 5, and thermal vias 5 is corresponding with the position at chip 4 place.Because the chip 4 of smart mobile phone is thermal source concentrated area, corresponding chip 4 place position and offer the thermal vias 5 with heat sinking function on the circuit card 1, the heat that this region can be allowed to produce can be transmitted to the back side of circuit board 1 by these thermal vias 5; Simultaneously at circuit board 1 back side, namely the second surface of circuit board 1 retains heat dissipation region and air circulation path, heat is imported the good region of heat radiation.
Wherein, the inwall of thermal vias 5 is provided with welding resistance green oil.
Wherein, radiating base layer 7 is aluminum-based copper-clad plate, and it has preferably thermal conductivity, and cost is low.
In order to strengthen thermal diffusivity further, between radiating base layer 7 and heat radiation tin film 8, be provided with some heat-conducting blocks 11.Heat-conducting block 11 and play the setting of hexatomic ring carbon-based nano carbon heat dissipation film 9 of stupefied shape, making heat conduction cover 2 of the present utility model for being similar to the structure of hollow, as shown in Figure 2, making heat conduction cover 2 inside define two heat radiation cavitys, being more conducive to heat radiation.
Wherein, the waveform vertical height of heat radiation tin film 8 controls within the scope of 10 ~ 20 μm, such as 12 μm, 15 μm, 16 μm, 17 μm, 19 μm, can ensure to form heat radiation cavity, can control again the thickness of heat conduction cover 2.
Above content is only preferred embodiment of the present utility model, for those of ordinary skill in the art, according to thought of the present utility model, all will change in specific embodiments and applications, this description should not be construed as restriction of the present utility model.
Claims (8)
1. the smart mobile phone being beneficial to circuit board (1) and dispelling the heat, comprise mobile phone body, described mobile phone body is provided with circuit board (1) and chip (4), described circuit board (1) has first surface and second surface, described chip (4) is arranged at the first surface of circuit board (1) by solder joint (3), it is characterized in that: also comprise the heat conduction cover (2) being located at chip (4) top, described heat conduction cover (2) connects with the first surface of circuit board (1), described heat conduction cover (2) comprises the radiating base layer (7) stacked gradually, heat radiation tin film (8), hexatomic ring carbon-based nano carbon heat dissipation film (9) and graphite radiating film (10), described hexatomic ring carbon-based nano carbon heat dissipation film (9) is corrugated.
2. the smart mobile phone being beneficial to circuit board (1) and dispelling the heat according to claim 1, is characterized in that: be filled with CPU heat-conducting silicone grease between described chip (4) and heat conduction cover (2).
3. the smart mobile phone being beneficial to circuit board (1) and dispelling the heat according to claim 1, it is characterized in that: the second surface of described circuit board (1) is provided with composite radiating layer (6), described composite radiating layer (6) comprises the silica gel heat dissipating layer (14), Graphene heat dissipating layer (13) and the polyfluorinated ethylene layer (12) that stack gradually, and described silica gel heat dissipating layer (14) is located at the second surface of circuit board (1).
4. the smart mobile phone being beneficial to circuit board (1) and dispelling the heat according to claim 3, it is characterized in that: the circuit board (1) being positioned at described chip (4) below is provided with thermal vias (5), accordingly, described composite radiating layer (6) is provided with the thermal vias (5) communicated with the thermal vias (5) on circuit board (1).
5. the smart mobile phone being beneficial to circuit board (1) and dispelling the heat according to claim 4, is characterized in that: the inwall of described thermal vias (5) is provided with welding resistance green oil.
6. the smart mobile phone being beneficial to circuit board (1) and dispelling the heat according to claim 1, is characterized in that: described radiating base layer (7) is aluminum-based copper-clad plate.
7. the smart mobile phone being beneficial to circuit board (1) and dispelling the heat according to claim 1, is characterized in that: be provided with some heat-conducting blocks (11) between described radiating base layer (7) and heat radiation tin film (8).
8. the smart mobile phone being beneficial to circuit board (1) and dispelling the heat according to claim 1, is characterized in that: the waveform vertical height of described heat radiation tin film (8) is 10 ~ 20 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520236483.5U CN204578885U (en) | 2015-04-17 | 2015-04-17 | A kind of smart mobile phone being beneficial to heat dissipation for circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520236483.5U CN204578885U (en) | 2015-04-17 | 2015-04-17 | A kind of smart mobile phone being beneficial to heat dissipation for circuit board |
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| CN204578885U true CN204578885U (en) | 2015-08-19 |
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| CN201520236483.5U Expired - Fee Related CN204578885U (en) | 2015-04-17 | 2015-04-17 | A kind of smart mobile phone being beneficial to heat dissipation for circuit board |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106714442A (en) * | 2015-11-13 | 2017-05-24 | 建业科技电子（惠州）有限公司 | Multilayer circuit board heat radiating structure |
| CN107396618A (en) * | 2017-09-13 | 2017-11-24 | 比赫电气（太仓）有限公司 | A kind of fin of good insulating |
| CN107453104A (en) * | 2017-07-13 | 2017-12-08 | 广东欧珀移动通信有限公司 | Connector, power supply module and terminal device |
| CN107567249A (en) * | 2017-09-13 | 2018-01-09 | 比赫电气（太仓）有限公司 | A kind of corrosion resistant type fin |
| CN109608884A (en) * | 2018-11-29 | 2019-04-12 | 深圳先进技术研究院 | Thermally conductive shielding organosilicon material of one kind and preparation method thereof |
| CN109673131A (en) * | 2018-12-05 | 2019-04-23 | 郑晓燕 | A kind of new energy charging unit mainboard water-cooled plate wing temperature regulating device |
-
2015
- 2015-04-17 CN CN201520236483.5U patent/CN204578885U/en not_active Expired - Fee Related
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106714442A (en) * | 2015-11-13 | 2017-05-24 | 建业科技电子（惠州）有限公司 | Multilayer circuit board heat radiating structure |
| CN107453104A (en) * | 2017-07-13 | 2017-12-08 | 广东欧珀移动通信有限公司 | Connector, power supply module and terminal device |
| CN107453104B (en) * | 2017-07-13 | 2020-07-24 | Oppo广东移动通信有限公司 | Connector, power supply module and terminal equipment |
| CN107396618A (en) * | 2017-09-13 | 2017-11-24 | 比赫电气（太仓）有限公司 | A kind of fin of good insulating |
| CN107567249A (en) * | 2017-09-13 | 2018-01-09 | 比赫电气（太仓）有限公司 | A kind of corrosion resistant type fin |
| CN107396618B (en) * | 2017-09-13 | 2019-05-17 | 比赫电气（太仓）有限公司 | A kind of cooling fin of good insulating |
| CN109608884A (en) * | 2018-11-29 | 2019-04-12 | 深圳先进技术研究院 | Thermally conductive shielding organosilicon material of one kind and preparation method thereof |
| CN109608884B (en) * | 2018-11-29 | 2020-09-04 | 深圳先进技术研究院 | Heat-conducting shielding organic silicon material and preparation method thereof |
| CN109673131A (en) * | 2018-12-05 | 2019-04-23 | 郑晓燕 | A kind of new energy charging unit mainboard water-cooled plate wing temperature regulating device |
| CN109673131B (en) * | 2018-12-05 | 2020-12-15 | 浙江欧托电气有限公司 | New forms of energy charging device mainboard water-cooling board wing temperature regulating device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150819 Termination date: 20180417 |
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| CF01 | Termination of patent right due to non-payment of annual fee |