CN106714442A - Multilayer circuit board heat radiating structure - Google Patents
Multilayer circuit board heat radiating structure Download PDFInfo
- Publication number
- CN106714442A CN106714442A CN201510777828.2A CN201510777828A CN106714442A CN 106714442 A CN106714442 A CN 106714442A CN 201510777828 A CN201510777828 A CN 201510777828A CN 106714442 A CN106714442 A CN 106714442A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- heat radiating
- radiating
- heat
- piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to a multilayer circuit board heat radiating structure which comprises a circuit board body. The upper surface of the circuit board body is provided with a plurality of electronic chips. The side wall of one side of the circuit board body far from the circuit board body is provided with a heat conduction glue layer which is in contact with a heat radiating layer, one side of the heat radiating layer is provided with wavy heat radiating curved pieces, a plurality of first heat radiating fins are arranged between the heat radiating curved pieces, the heat radiating curved pieces and the first heat radiating fins are connected to a heat radiating net layer. The circuit board body is also provided with a plurality of second heat radiating fins. According to the multilayer circuit board heat radiating structure, under the common effect of the heat conduction glue layer, the heat radiating layer, the heat radiating curved piece, the first heat radiating fins and the second heat radiating fins, the effective heat radiation can be realized, the heat radiation speed is improved, the heat dissipation of an electronic component is facilitated, and the service life is prolonged.
Description
Technical field
The present invention relates to electronic technology field, more particularly to a kind of multilayer circuit board heat conduction and heat radiation structure.
Background technology
Printed circuit board, is the supplier of electronic component electrical connection also known as printed circuit board (PCB).It
Existing more than 100 years of development history；It is mainly designed to layout design；Using circuit board
Major advantage is the mistake for greatly reducing wiring and assembling, improves the gentle productive labor rate of Automated water.
Can be divided into single sided board, dual platen, four laminates, six laminates and other multilayer wires according to the wiring board number of plies
Road plate.
It is due to the not general end product of printed circuit board (PCB) therefore slightly chaotic in the definition of title,
For example：The motherboard of PC, referred to as mainboard, and can not directly be referred to as circuit board, although main frame
Have the presence of circuit board in plate, but and differ, therefore relevant both during assessment industry can not but say
It is identical.Again for example：Since there is integrated circuit part to load on circuit boards, thus news media claim him
It is IC plates, but substantially he is also not equal to printed circuit board (PCB).We are at the generally printed circuit board (PCB) said
Refer to the circuit board of bare board-do not go up component.
Therefore any radiator structure is had no in current traditional circuit-board, so that electronic building brick is worked
Cheng Zhonghui produces high heat, and the time overheat for being easily caused electronic building brick long causes electronic building brick
Short life.
The content of the invention
The invention aims to overcome the deficiencies in the prior art, there is provided a kind of multilayer circuit board is led
Hot radiator structure.
The present invention is to be achieved through the following technical solutions：
A kind of multilayer circuit board heat conduction and heat radiation structure, including circuit board body, in the circuit board body
Surface is provided with several electronic chips, and the circuit board body is provided with away from electronic chip side side wall
Heat conduction glue-line, the heat conduction glue-line is in contact with heat dissipating layer, and it is radiating that the heat dissipating layer side is provided with
Knee-piece, the radiating knee-piece is provided with several the first radiating fins in wavy between the radiating knee-piece
Piece, the radiating knee-piece, the first radiating fin are connected with radiating stratum reticulare respectively, the circuit board sheet
Body is provided with several the second radiating fins.
It is to be fixedly connected as the preferred technical solution of the present invention, between the heat conduction glue-line and heat dissipating layer.
Used as the preferred technical solution of the present invention, first radiating fin, the second radiating fin are aluminium
Piece or copper sheet are made.
As the preferred technical solution of the present invention, the radiating knee-piece, the first radiating fin and radiator-grid
It is fixedly connected between layer.
Compared with prior art, the beneficial effects of the invention are as follows：Simple structure of the present invention, design is closed
Reason, the present invention is by setting heat conduction glue-line, heat dissipating layer, radiating knee-piece, the first radiating fin and second
Radiating fin, so dissipates in heat conduction glue-line, heat dissipating layer, radiating knee-piece, the first radiating fin and second
Effective radiating can be realized under the collective effect of hot fin, radiating rate is improved, is conducive to electronics group
The heat of part is distributed, and is increased the service life.
Brief description of the drawings
Fig. 1 is structural representation of the invention.
In figure：1. circuit board body；2. electronic chip；3. heat conduction glue-line；4. heat dissipating layer；5. radiate
Knee-piece；6. the first radiating fin；7. radiate stratum reticulare；8. the second radiating fin.
Specific embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, below in conjunction with accompanying drawing
And embodiment, the present invention will be described in further detail.It should be appreciated that described herein specific
Embodiment is only used to explain the present invention, is not intended to limit the present invention.
Fig. 1 is referred to, Fig. 1 is structural representation of the invention.
A kind of multilayer circuit board heat conduction and heat radiation structure, including circuit board body 1, the circuit board body 1
Upper surface is provided with several electronic chips 2, and the circuit board body 1 is away from the side side wall of electronic chip 2
Heat conduction glue-line 3 is provided with, the heat conduction glue-line 3 is in contact with heat dissipating layer 4, wherein heat-conducting glue layer
To be fixedly connected between 3 and heat dissipating layer 4, so it is easy to the connection between heat conduction glue-line 3 and heat dissipating layer 4.
It is radiating knee-piece 5 that the side of the heat dissipating layer 4 is provided with, and the radiating knee-piece 5 is described to dissipate in wavy
Several the first radiating fins 6, the radiating knee-piece 5, the first radiating fin are provided between hot knee-piece 5
6 are connected with radiating stratum reticulare 7 respectively, wherein the radiating knee-piece 5, the first radiating fin 6 and radiating
It is fixedly connected between stratum reticulare 7.
The circuit board body 1 is provided with several the second radiating fins 8, wherein first radiating fin
Piece 6, the second radiating fin 8 are made up of aluminium flake or copper sheet.So heat conduction glue-line 3, heat dissipating layer 4,
Can be realized effectively under the collective effect of radiating knee-piece 5, the first radiating fin 6 and the second radiating fin 8
Radiating, improve radiating rate, be conducive to the heat of electronic building brick to distribute, increase the service life.
The foregoing is only presently preferred embodiments of the present invention, be not intended to limit the invention, it is all
Any modification, equivalent and improvement for being made within the spirit and principles in the present invention etc., all should include
Within protection scope of the present invention.
Claims (4)
1. a kind of multilayer circuit board heat conduction and heat radiation structure, including circuit board body (1), the circuit
Plate body (1) upper surface is provided with several electronic chips (2), it is characterised in that：The circuit board
Body (1) is provided with heat conduction glue-line (3), the heat-conducting glue away from electronic chip (2) side side wall
Layer (3) is in contact with heat dissipating layer (4), and it is radiating knee-piece (5) that heat dissipating layer (4) side is provided with,
Radiating knee-piece (5) is provided with several and first dissipates in wavy between radiating knee-piece (5)
Hot fin (6), it is described radiating knee-piece (5), the first radiating fin (6) respectively with radiating stratum reticulare (7)
It is connected, the circuit board body (1) is provided with several the second radiating fins (8).
2. multilayer circuit board heat conduction and heat radiation structure according to claim 1, it is characterised in that：Institute
State between heat conduction glue-line (3) and heat dissipating layer (4) to be fixedly connected.
3. multilayer circuit board heat conduction and heat radiation structure according to claim 1, it is characterised in that：Institute
The first radiating fin (6), the second radiating fin (8) are stated by aluminium flake or copper sheet are made.
4. multilayer circuit board heat conduction and heat radiation structure according to claim 1, it is characterised in that：Institute
State and be fixedly connected between radiating knee-piece (5), the first radiating fin (6) and radiating stratum reticulare (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510777828.2A CN106714442A (en) | 2015-11-13 | 2015-11-13 | Multilayer circuit board heat radiating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510777828.2A CN106714442A (en) | 2015-11-13 | 2015-11-13 | Multilayer circuit board heat radiating structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106714442A true CN106714442A (en) | 2017-05-24 |
Family
ID=58931854
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510777828.2A Pending CN106714442A (en) | 2015-11-13 | 2015-11-13 | Multilayer circuit board heat radiating structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106714442A (en) |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04206601A (en) * | 1990-11-30 | 1992-07-28 | Hino Motors Ltd | Resistor of retarder |
| KR100955451B1 (en) * | 2009-12-02 | 2010-04-29 | (주) 써트론아이엔씨 | Heat radiant fpcb and method for manufacturing the same |
| KR20110003379U (en) * | 2009-09-28 | 2011-04-05 | 지흐 롱 일레트로닉스 코., 엘티디. | Molecular replacement aluminum duplicate metal structure |
| CN103415138A (en) * | 2013-08-06 | 2013-11-27 | 鑫茂电子（昆山）有限公司 | Circuit board capable of dissipating heat conveniently |
| CN203748105U (en) * | 2014-03-31 | 2014-07-30 | 昆山万正电路板有限公司 | Double-face circuit board |
| CN104048194A (en) * | 2013-03-16 | 2014-09-17 | 深圳市邦贝尔电子有限公司 | LED (Light Emitting Diode) lamp bead and optical component |
| CN104135818A (en) * | 2014-07-25 | 2014-11-05 | 江苏联康电子有限公司 | Heat dissipating PCB |
| TWM498453U (en) * | 2014-09-30 | 2015-04-01 | Man Zai Ind Co Ltd | Heat dissipation device |
| CN204313258U (en) * | 2014-12-03 | 2015-05-06 | 广州市雅江光电设备有限公司 | A kind of radiator structure |
| CN204578885U (en) * | 2015-04-17 | 2015-08-19 | 深圳辉烨通讯技术有限公司 | A kind of smart mobile phone being beneficial to heat dissipation for circuit board |
| CN204614815U (en) * | 2015-05-18 | 2015-09-02 | 厦门市晶田电子有限公司 | A kind of with heat abstractor high-power LED chip |
| CN205071462U (en) * | 2015-11-13 | 2016-03-02 | 建业科技电子（惠州）有限公司 | Multilayer circuit board heat conduction radiation structure |
-
2015
- 2015-11-13 CN CN201510777828.2A patent/CN106714442A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04206601A (en) * | 1990-11-30 | 1992-07-28 | Hino Motors Ltd | Resistor of retarder |
| KR20110003379U (en) * | 2009-09-28 | 2011-04-05 | 지흐 롱 일레트로닉스 코., 엘티디. | Molecular replacement aluminum duplicate metal structure |
| KR100955451B1 (en) * | 2009-12-02 | 2010-04-29 | (주) 써트론아이엔씨 | Heat radiant fpcb and method for manufacturing the same |
| CN104048194A (en) * | 2013-03-16 | 2014-09-17 | 深圳市邦贝尔电子有限公司 | LED (Light Emitting Diode) lamp bead and optical component |
| CN103415138A (en) * | 2013-08-06 | 2013-11-27 | 鑫茂电子（昆山）有限公司 | Circuit board capable of dissipating heat conveniently |
| CN203748105U (en) * | 2014-03-31 | 2014-07-30 | 昆山万正电路板有限公司 | Double-face circuit board |
| CN104135818A (en) * | 2014-07-25 | 2014-11-05 | 江苏联康电子有限公司 | Heat dissipating PCB |
| TWM498453U (en) * | 2014-09-30 | 2015-04-01 | Man Zai Ind Co Ltd | Heat dissipation device |
| CN204313258U (en) * | 2014-12-03 | 2015-05-06 | 广州市雅江光电设备有限公司 | A kind of radiator structure |
| CN204578885U (en) * | 2015-04-17 | 2015-08-19 | 深圳辉烨通讯技术有限公司 | A kind of smart mobile phone being beneficial to heat dissipation for circuit board |
| CN204614815U (en) * | 2015-05-18 | 2015-09-02 | 厦门市晶田电子有限公司 | A kind of with heat abstractor high-power LED chip |
| CN205071462U (en) * | 2015-11-13 | 2016-03-02 | 建业科技电子（惠州）有限公司 | Multilayer circuit board heat conduction radiation structure |
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