CN202197491U - Heat dissipating plate formed by aluminum material and copper material in embedded manner and used for heating module - Google Patents
Heat dissipating plate formed by aluminum material and copper material in embedded manner and used for heating module Download PDFInfo
- Publication number
- CN202197491U CN202197491U CN2011203338219U CN201120333821U CN202197491U CN 202197491 U CN202197491 U CN 202197491U CN 2011203338219 U CN2011203338219 U CN 2011203338219U CN 201120333821 U CN201120333821 U CN 201120333821U CN 202197491 U CN202197491 U CN 202197491U
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- heating panel
- absorber plate
- conducting film
- heat conducting
- heat
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Abstract
The utility model discloses a heat dissipating plate formed by aluminum material and copper material in an embedded manner and used for a heating module. The heat dissipating plate formed by aluminum material and copper material in the embedded manner and used for the heating module is mainly composed of a heat dissipating plate and a heat absorbing plate connecting with the heat dissipating plate. The heat dissipating plate is provided with an embedding groove matched with the heat absorbing plate. The heat absorbing plate is arranged in the embedding groove. Compared with the prior art, the heat dissipating plate formed by aluminum material and copper material in the embedded manner and used for the heating module in the utility model has advantages and beneficial effects of low cost, simple structure and good heating effect.
Description
Technical field
The utility model relates to heating panel, specifically is meant the aluminium edge copper type heating panel to heating module.
Background technology
Heating panel is a kind of device of giving the easy heat-generating electronic elements heat radiation in the electrical equipment, and how by aluminium alloy, brass or bronze are made tabular; Sheet; Splinteries etc. will use sizable heating panel like cpu central processing unit in the computer, power supply pipe in the television set; Administration-management, the power tube in the amplifirer all will use heating panel.General heating panel in use will be coated with the last layer heat-conducting silicone grease at electronic component and heating panel contact-making surface, and the heat that components and parts are sent is more effective to be transmitted on the heating panel, goes being dispersed in the surrounding air through heating panel.
With regard to the heating panel material, every kind of its heat conductivility of material is different, arranges from high to low by heat conductivility, is respectively silver, copper, aluminium, steel.Can be too expensive if but do heating panel with silver, so best scheme is copper for adopting.Though the aluminium considerably cheaper, obviously thermal conductivity is just not as copper good (approximately have only copper about 50%).
Heating panel material commonly used at present is copper and aluminium alloy, and the two respectively has its pluses and minuses.The thermal conductivity of copper is good, but price is more expensive, and difficulty of processing is higher, weight excessive (a lot of fine copper radiators have all surpassed the quantitative limitation of CPU counterweight), and thermal capacity is less, and oxidation easily.And fine aluminium is too soft, can not directly use, and the aluminium alloy that all is to use just can provide enough hardness, and the advantage of aluminium alloy is cheap, and is in light weight, but thermal conductivity will be far short of what is expected than copper.
For domestic consumer, be enough to reach radiating requirements with the aluminium heating panel.
The radiator of north of china in winter heating also is heating panel.
Heating panel occupies important role in the formation of radiator, except that the active heat removal of fan, evaluate the quality of a radiator, depends on the heat absorption capacity and the capacity of heat transmission of heating panel itself to a great extent.
Heating panel, in the existing heating panel, its material constitutes various ways, like fine aluminium or aluminium alloy, or fine copper or copper alloy.
Cost is no doubt cheap for fine aluminium or aluminium alloy, but its heat absorption and heat radiation function are not remarkable, and generally being applied to requires to dispel the heat needs little parts.For fine copper or copper alloy, its radiating effect is remarkable, but its production cost is very high, and is big for some heat radiation requirement, is worth but the cost input requires low parts extremely not adopt.Therefore, based on above-mentioned, we need a kind of low cost, and the heating panel of high efficiency heat radiation with the solution input that reduces cost, satisfies radiating requirements simultaneously.
The utility model content
The utility model purpose is to provide a kind of heating panel of low-cost high-efficiency heat radiation, in order to solve this purpose, and a kind of aluminium edge copper type heating panel to heating module is provided, and possesses high efficiency heat radiation and drops into cheaply.
The utility model implementation is following: to the aluminium edge copper type heating panel of heating module; Mainly constitute by heating panel and the absorber plate that is connected with heating panel; Said heating panel has the mosaic groove that is complementary with absorber plate, and said absorber plate is arranged in the mosaic groove.
In order to satisfy heating panel and absorber plate solderability, said heating panel outer surface is provided with the heating panel heat conducting film; The absorber plate outer surface is provided with the absorber plate heat conducting film.
The material of said heating panel heat conducting film and absorber plate heat conducting film is: anti-oxidant Heat Conduction Material.
Said heating panel heat conducting film and absorber plate heat conducting film are: plated nickel film or gold-plated film or copper plating film.
Between said heating panel heat conducting film and the absorber plate heat conducting film heat conduction junctional membrane is set.
Further, for making heating panel and absorber plate carry out seamless link, said heat conduction junctional membrane is the soldering tunic, and said heating panel heat conducting film is welded in the absorber plate heat conducting film through the soldering tunic.
Said absorber plate has the heat absorption groove away from mosaic groove bottom one side,
Said heating panel is an aluminium sheet, and said absorber plate is a copper coin.
The notch of said mosaic groove is provided with convexity, and the groove bottom of said mosaic groove offers some little grooves, and said absorber plate is provided with the detent that is complementary with the mosaic groove convexity.
The cross section of said heat absorption groove is the little butterfly face in big centre, two.Generally speaking, in order to increase radiating efficiency, the shape of heat absorption groove and the relative set heating module in the heat absorption groove is complementary.
In the utility model; Its production program is: remove earlier the aluminum or aluminum alloy plate, dig a mosaic groove that matches with copper coin at it, using nickel plating process; With aluminium sheet or aluminium alloy plate and copper coin plating nickel on surface, or electroplate the metal of other anti-oxidant heat-conductings.With the tin metal fusing, pour tin into mosaic groove again, simultaneously copper coin is fastened on the mosaic groove, compress, make tin overflow, make copper coin closely contact with the aluminum or aluminum alloy plate to appearance.When mounted at last, heating module is directly pasted clothes in the heat absorption groove, make heating module contact with the absorber plate heat conducting film of copper coin outer surface.
The utility model utilizes the good heat conductivity of copper, and heating module is absorbed heat, and utilizes the perfect heat-dissipating of aluminum or aluminum alloy, carries out the heat of copper coin conduction is dispelled the heat.
The utility model utilizes the plate body of unlike material, in conjunction with, utilize heat conduction and heat radiation performance separately different, to carry out the heating module radiating treatment, this design is heat-treated to the heat efficiency of difference position.Satisfying on the basis of radiating requirements, and reaching economical with materials, the purpose that reduces production costs.
The utility model compared with prior art has the following advantages and beneficial effect: cost is low, and is simple in structure, good heat dissipation effect.
Description of drawings
Fig. 1 is the vertical view of the utility model.
Fig. 2 is the planing surface figure of the utility model.
Label among the figure is expressed as respectively: 1, heating panel; 2, absorber plate; 3, mosaic groove; 6, absorber plate heat conducting film; 4, heating panel heat conducting film; 5, heat absorption groove.
Embodiment
Like Fig. 1, shown in 2, to the aluminium of heating module edge copper type heating panel, mainly constitute by heating panel 1 and the absorber plate 2 that is connected with heating panel 1, heating panel 1 has the mosaic groove 3 that is complementary with absorber plate 2, and said absorber plate 2 is arranged in the mosaic groove 3.
Heating panel 1 outer surface is provided with heating panel heat conducting film 4; Absorber plate 2 outer surfaces are provided with absorber plate heat conducting film 6.
Heating panel heat conducting film 4 with absorber plate heat conducting film 6 is: plated nickel film
Between heating panel heat conducting film 4 and the absorber plate heat conducting film 6 the heat conduction junctional membrane is set.The heat conduction junctional membrane is the soldering tunic, and said heating panel heat conducting film 4 is welded in absorber plate heat conducting film 6 through the soldering tunic.
The cross section of heat absorption groove 5 is the little butterfly face in big centre, two.
Heating panel 1 is an aluminium sheet, and said absorber plate 2 is a copper coin.
The notch of mosaic groove 3 is provided with convexity, and the groove bottom of said mosaic groove 3 offers some little grooves, and said absorber plate 2 is provided with the detent that is complementary with mosaic groove 3 convexities.
To above-mentioned heat conduction junctional membrane, the heat conduction junctional membrane can also be heat conductive silica gel, and the heat conduction junctional membrane is designed to heat conductive silica gel, can make things convenient for absorber plate 2 dismountings, and the assembly process of absorber plate 2.Can save in the assembling operation of using soldering to connect.Only need silica gel is injected mosaic groove 3, re-use absorber plate 2 and be pressed on mosaic groove 3, make absorber plate 2 flush and get final product with the notch of mosaic groove 3.
Therefore, in order to satisfy the smooth shape of entire heat dissipation plate.Absorber plate 2 need keep level with the notch of mosaic groove 3 in assembling.
As stated, then can well realize the utility model.
Claims (9)
1. inlay copper type heating panel to the aluminium of heating module; Mainly constitute by heating panel (1) and the absorber plate (2) that is connected with heating panel (1); It is characterized in that: said heating panel (1) has the mosaic groove (3) that is complementary with absorber plate (2), and said absorber plate (2) is arranged in the mosaic groove (3).
2. the aluminium edge copper type heating panel to heating module according to claim 1 is characterized in that said heating panel (1) outer surface is provided with heating panel heat conducting film (4); Absorber plate (2) outer surface is provided with absorber plate heat conducting film (6).
3. the aluminium edge copper type heating panel to heating module according to claim 2 is characterized in that the material of said heating panel heat conducting film (4) and absorber plate heat conducting film (6) is: anti-oxidant Heat Conduction Material.
4. the aluminium edge copper type heating panel to heating module according to claim 2 is characterized in that said heating panel heat conducting film (4) and absorber plate heat conducting film (6) are: plated nickel film or gold-plated film or copper plating film.
5. the aluminium edge copper type heating panel to heating module according to claim 2 is characterized in that, between said heating panel heat conducting film (4) and the absorber plate heat conducting film (6) the heat conduction junctional membrane is set.
6. the aluminium edge copper type heating panel to heating module according to claim 5 is characterized in that said heat conduction junctional membrane is the soldering tunic, and said heating panel heat conducting film (4) is welded in absorber plate heat conducting film (6) through the soldering tunic.
7. the aluminium edge copper type heating panel to heating module according to claim 5 is characterized in that said absorber plate (2) has heat absorption groove (5) away from mosaic groove (3) bottom one side.
8. according to any described aluminium edge copper type heating panel to heating module among the claim 1-7, it is characterized in that said heating panel (1) is an aluminium sheet, said absorber plate (2) is a copper coin.
9. according to any described aluminium edge copper type heating panel among the claim 1-7 to heating module; It is characterized in that; The notch of said mosaic groove (3) is provided with convexity; The groove bottom of said mosaic groove (3) offers some little grooves, and said absorber plate (2) is provided with the detent that is complementary with mosaic groove (3) convexity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203338219U CN202197491U (en) | 2011-09-07 | 2011-09-07 | Heat dissipating plate formed by aluminum material and copper material in embedded manner and used for heating module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203338219U CN202197491U (en) | 2011-09-07 | 2011-09-07 | Heat dissipating plate formed by aluminum material and copper material in embedded manner and used for heating module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202197491U true CN202197491U (en) | 2012-04-18 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203338219U Expired - Fee Related CN202197491U (en) | 2011-09-07 | 2011-09-07 | Heat dissipating plate formed by aluminum material and copper material in embedded manner and used for heating module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202197491U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109561638A (en) * | 2018-12-18 | 2019-04-02 | 东莞市金太阳精密技术有限责任公司 | A kind of aluminium edge copper base and its processing method |
| CN111465268A (en) * | 2020-04-14 | 2020-07-28 | 华为技术有限公司 | Radiator and manufacturing method thereof and electronic equipment |
-
2011
- 2011-09-07 CN CN2011203338219U patent/CN202197491U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109561638A (en) * | 2018-12-18 | 2019-04-02 | 东莞市金太阳精密技术有限责任公司 | A kind of aluminium edge copper base and its processing method |
| CN111465268A (en) * | 2020-04-14 | 2020-07-28 | 华为技术有限公司 | Radiator and manufacturing method thereof and electronic equipment |
| CN111465268B (en) * | 2020-04-14 | 2022-05-17 | 华为数字能源技术有限公司 | Radiator and manufacturing method thereof and electronic equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: CHENGDU NTS TECHNOLOGY CO., LTD. Free format text: FORMER NAME: NTS TECHNOLOGY (CHENGDU) CO., LTD. |
|
| CP03 | Change of name, title or address |
Address after: 610000, Sichuan Chengdu hi tech Zone Tianfu road hi tech incubator park information security base 3 and 4 floor Patentee after: Chengdu NTS Technology Co., Ltd. Address before: 610000, No. 3, building 6, Tianfu Road, Tianfu Road, Chengdu New District, Sichuan Patentee before: NTS Technology (Chengdu) Co., Ltd. |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120418 Termination date: 20130907 |