CN204377143U - The encapsulating structure of micro-electro-mechanical microphone - Google Patents
The encapsulating structure of micro-electro-mechanical microphone Download PDFInfo
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- CN204377143U CN204377143U CN201520039096.2U CN201520039096U CN204377143U CN 204377143 U CN204377143 U CN 204377143U CN 201520039096 U CN201520039096 U CN 201520039096U CN 204377143 U CN204377143 U CN 204377143U
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Abstract
The utility model provides a kind of encapsulating structure of micro-electro-mechanical microphone, it comprises circuit board, assemble with this circuit board and form the housing of spatial accommodation and to be contained in described spatial accommodation and the electronic component be electrically connected with described circuit board, this housing comprises substrate housing and lid and overlays at least two-layer screening can on described substrate housing, and at least one deck in described at least two-layer screening can is the coat of metal.By micro-electro-mechanical microphone packaging structure of the present utility model, good effectiveness can be realized.
Description
[technical field]
The utility model relates to a kind of micro-electro-mechanical microphone, particularly relates to a kind of encapsulating structure of microelectromechanical-systems micro-electro-mechanical microphone.
[background technology]
Due to the progress of science and technology, no matter micro-electro-mechanical microphone all has sizable advantage in function or volume, but because micro-electro-mechanical microphone must receive extraneous sound, so be easy to be subject to the interference of external factor (as electromagnetic wave) and cause reception quality not good, and then the surcharge of related electronic products is caused relatedly to be affected.Therefore, how to promote and prevent the effect of Electromagnetic Interference from being the problem of current industry in the urgent need to improving.
And to apply conventional microelectromechanical microphone more widely be at present all for microphone chip provides electromagnetic shielding at pcb board superordinate single metal cover.Along with rapidly the increasing progressively of value volume and range of product of electronic devices and components in the electronic equipment of application micro-electro-mechanical microphone, electromagnetic environment more sophisticated residing for micro-electro-mechanical microphone is changeable, now, the defect of the electromagnetic armouring structure of single metal cover more manifests, be difficult to adapt to this electromagnetic environment complicated and changeable, the electromagnetic interference that microphone chip is subject to is obvious all the more, thus has a strong impact on the performance of micro-electro-mechanical microphone.
Therefore, the encapsulating structure that a kind of new micro-electro-mechanical microphone is provided is necessary.
[utility model content]
The purpose of this utility model is to provide the encapsulating structure of the micro-electro-mechanical microphone that a kind of water proof and dust proof performance is good.
The technical solution of the utility model is as follows: the encapsulating structure providing a kind of micro-electro-mechanical microphone, comprise circuit board, assemble with this circuit board and form the housing of spatial accommodation and to be contained in described spatial accommodation and the electronic component be electrically connected with described circuit board, this housing comprises substrate housing and lid and overlays at least two-layer screening can on described substrate housing, and at least one deck in described at least two-layer screening can is the coat of metal.
Preferably, described housing comprises first coat of metal of the outer surface of substrate housing described in plating and is plated on second coat of metal of outer surface of described first coat of metal.
Preferably, described first coat of metal and described second coat of metal adopt dissimilar metals to make.
Preferably, described housing the 3rd coat of metal that comprises the outer surface being plated on described substrate housing and the first shield shell of being located at outside described 3rd coat of metal.
Preferably, described first shield shell adopts the metal material being different from the 3rd coat of metal to make.
Preferably, described first shield shell is fixed on described circuit board.
Preferably, the outer surface of described first shield shell is concordant with the end face of described circuit board.
Preferably, described housing comprises the 4th coat of metal of the secondary shielding housing be located at outside described substrate housing and the outer surface being plated on described secondary shielding housing.
Preferably, described secondary shielding housing adopts the metal material being different from the 4th coat of metal to make.
Preferably, at least one deck in described at least two-layer screening can and described circuit board are electrically connected.
The beneficial effects of the utility model are: by substrate housing outer setting multilayer screen shell thus promote the resistance to external electromagnetic interference of micro-electro-mechanical microphone, and then improve its total quality.
[accompanying drawing explanation]
The cutaway view of the micro-electro-mechanical microphone that Fig. 1 provides for the utility model first embodiment;
Fig. 2 is the enlarged drawing at A place in Fig. 1;
The cutaway view of the micro-electro-mechanical microphone that Fig. 3 provides for the utility model second embodiment;
The cutaway view of the micro-electro-mechanical microphone that Fig. 4 provides for the utility model the 3rd embodiment.
[embodiment]
Particular content of the present utility model is described in detail below in conjunction with accompanying drawing.
The utility model micro-electro-mechanical microphone 100, can be used on mobile phone or other electronic equipments, receives acoustical signal and acoustical signal is converted into the signal of telecommunication.
Shown in please refer to the drawing 1 and Fig. 2, the micro-electro-mechanical microphone 100 that first embodiment of the present utility model provides, mainly comprise housing 1, assemble with shell 1 and form the circuit board 2 of spatial accommodation 5, the transducer 3 be arranged in spatial accommodation 5, and to be arranged in spatial accommodation 5 and the integrated chip 4 be electrically connected with transducer 3.Transducer 3 for accepting the sound wave entering spatial accommodation, and to the signal of telecommunication of converting, and the electric signal transmission of generation to integrated chip 4, and exports external circuit to by integrated chip 4, thus converts tones into the signal of telecommunication.In present embodiment, transducer 3 and integrated chip 4 are all arranged on the circuit board 2, and in fact, transducer 3 and integrated chip 4 also can be placed on housing 1, or one of them is placed on the circuit board 2, and another is placed on housing 1.In the present embodiment, transducer 3 and integrated chip 4 are electronic component.
In this embodiment, this housing 1 comprises and has towards the substrate housing 10 of the inner surface 101 of spatial accommodation 5 side and outer surface on the other side 102, be plated on first coat of metal 11 of the outer surface of substrate housing 10 and be plated on second coat of metal 12 of outer surface of first coat of metal 11.In the present embodiment, this substrate housing 10 adopts the plastics such as silica gel to make.First coat of metal 11 and second coat of metal 12 adopt different types of metal to deposit and form.The electromagnetic interference outside to shielding can be realized like this.It is two-layer that the quantity of the coat of metal is not limited only in the present embodiment, also can deposit multiple different metal level according to actual needs to improve shield effectiveness.In other examples, substrate housing 10 also can adopt different types of metal material with the coat of metal to make.In two coats of metal 11,12, at least one and circuit board 2 are electrically connected to be grounded.
With reference to figure 2, the micro-electro-mechanical microphone 200 that second embodiment of the present utility model provides, and the main distinction between the micro-electro-mechanical microphone 100 in the first embodiment is: the structure of the housing 1a of micro-electro-mechanical microphone 200 is different, structure and the assembling mode of remaining circuit board 2a, transducer 3a, integrated chip 4a etc. are all basically the same as those in the first embodiment.
In the present embodiment, housing 1a comprises and has towards the substrate housing 21 of the inner surface 201 of spatial accommodation 5a side and outer surface on the other side 202, is plated on the 3rd coat of metal 22 on the outer surface 202 of substrate housing 21 and is located at the first shield shell 23 of the 3rd coat of metal 22 outside.This first shield shell 23 adopts the metal material being different from the 3rd coat of metal to make.The coated whole substrate housing 21 of this first shield shell 23 also and is spaced a distance to form electromagnetic shielding space between substrate housing 21.First shield shell 23 to be fixed on circuit board 2a by mode that is bonding or welding and to be electrically connected with circuit board 2a, and preferably, its outer surface is concordant with the end face of circuit board 2a.In other examples, the outer surface of the first shield shell 23 can be different from one or more coats of metal of the 3rd coat of metal by plating.
With reference to figure 3, the micro-electro-mechanical microphone 300 that 3rd embodiment of the present utility model provides, be from the main distinction between the micro-electro-mechanical microphone that the first two embodiment provides: the structure of the housing 1b of micro-electro-mechanical microphone 300 is different, structure and the assembling mode of remaining circuit board 2b, transducer 3b, integrated chip 4b, spatial accommodation 5b etc. are all basically the same as those in the first embodiment.
In the present embodiment, housing 1b comprises substrate housing 31, is located at the secondary shielding housing 32 of substrate housing 31 outside and is plated on the 4th coat of metal 33 of outer surface of secondary shielding housing 32.This secondary shielding housing 32 adopts the metal being different from the 4th coat of metal 33 to make.The coated whole substrate housing 31 of this secondary shielding housing 32 also and is spaced a distance to form electromagnetic shielding space between substrate housing 31.Secondary shielding housing 32 to be fixed on circuit board 2b by mode that is bonding or welding and to be electrically connected with circuit board 2b.In order to strengthen the effect of electromagnetic shielding further, can the different coat of metal of deposit multilayer on this secondary shielding housing 32.
By micro-electro-mechanical microphone packaging structure of the present utility model, good electromagnetic shielding can be realized, prevent external electromagnetic field from disturbing inner acoustic signals, promote the total quality of micro-electro-mechanical microphone.
Above-described is only execution mode of the present utility model; it should be pointed out that for the person of ordinary skill of the art at this, under the prerequisite not departing from the utility model creation design; improvement can also be made, but these all belong to protection range of the present utility model.
Claims (10)
1. the encapsulating structure of a micro-electro-mechanical microphone, it comprises a circuit board, assemble with this circuit board and form the housing of spatial accommodation and to be contained in described spatial accommodation and the electronic component be electrically connected with described circuit board, it is characterized in that, this housing comprises substrate housing and lid and overlays at least two-layer screening can on described substrate housing, and at least one deck in described at least two-layer screening can is the coat of metal.
2. the encapsulating structure of micro-electro-mechanical microphone according to claim 1, is characterized in that, described housing comprises first coat of metal of the outer surface of substrate housing described in plating and is plated on second coat of metal of outer surface of described first coat of metal.
3. the encapsulating structure of micro-electro-mechanical microphone according to claim 2, is characterized in that, described first coat of metal and described second coat of metal adopt dissimilar metals to make.
4. the encapsulating structure of micro-electro-mechanical microphone according to claim 1, is characterized in that, the 3rd coat of metal that described housing comprises the outer surface being plated on described substrate housing and the first shield shell be located at outside described 3rd coat of metal.
5. the encapsulating structure of micro-electro-mechanical microphone according to claim 4, is characterized in that, described first shield shell adopts the metal material being different from the 3rd coat of metal to make.
6. the encapsulating structure of micro-electro-mechanical microphone according to claim 4, is characterized in that, described first shield shell is fixed on described circuit board.
7. the encapsulating structure of micro-electro-mechanical microphone according to claim 6, is characterized in that, the outer surface of described first shield shell is concordant with the end face of described circuit board.
8. the encapsulating structure of micro-electro-mechanical microphone according to claim 1, is characterized in that, described housing comprises the 4th coat of metal of the secondary shielding housing be located at outside described substrate housing and the outer surface being plated on described secondary shielding housing.
9. the encapsulating structure of micro-electro-mechanical microphone according to claim 8, is characterized in that, described secondary shielding housing adopts the metal material being different from the 4th coat of metal to make.
10. the encapsulating structure of micro-electro-mechanical microphone according to claim 1, is characterized in that, at least one deck in described at least two-layer screening can and described circuit board are electrically connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520039096.2U CN204377143U (en) | 2015-01-20 | 2015-01-20 | The encapsulating structure of micro-electro-mechanical microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520039096.2U CN204377143U (en) | 2015-01-20 | 2015-01-20 | The encapsulating structure of micro-electro-mechanical microphone |
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| Publication Number | Publication Date |
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| CN204377143U true CN204377143U (en) | 2015-06-03 |
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| CN201520039096.2U Active CN204377143U (en) | 2015-01-20 | 2015-01-20 | The encapsulating structure of micro-electro-mechanical microphone |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107801128A (en) * | 2016-08-30 | 2018-03-13 | 广东得胜电子有限公司 | A kind of waterproof microphone |
| CN110691311A (en) * | 2019-10-28 | 2020-01-14 | 歌尔股份有限公司 | Sensor packaging structure and electronic equipment |
| WO2022000644A1 (en) * | 2020-06-30 | 2022-01-06 | 瑞声声学科技(深圳)有限公司 | Microphone |
| WO2022000646A1 (en) * | 2020-06-30 | 2022-01-06 | 瑞声声学科技(深圳)有限公司 | Microphone |
-
2015
- 2015-01-20 CN CN201520039096.2U patent/CN204377143U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107801128A (en) * | 2016-08-30 | 2018-03-13 | 广东得胜电子有限公司 | A kind of waterproof microphone |
| CN110691311A (en) * | 2019-10-28 | 2020-01-14 | 歌尔股份有限公司 | Sensor packaging structure and electronic equipment |
| WO2022000644A1 (en) * | 2020-06-30 | 2022-01-06 | 瑞声声学科技(深圳)有限公司 | Microphone |
| WO2022000646A1 (en) * | 2020-06-30 | 2022-01-06 | 瑞声声学科技(深圳)有限公司 | Microphone |
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| GR01 | Patent grant |