CN204350460U - A kind of pcb board surface-assembled structure - Google Patents
A kind of pcb board surface-assembled structure Download PDFInfo
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- CN204350460U CN204350460U CN201420864342.3U CN201420864342U CN204350460U CN 204350460 U CN204350460 U CN 204350460U CN 201420864342 U CN201420864342 U CN 201420864342U CN 204350460 U CN204350460 U CN 204350460U
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- pcb board
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- assembled structure
- protection tool
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Abstract
The utility model discloses a kind of pcb board surface-assembled structure; pcb board comprises top coat and bottom surface layer; it is characterized in that; the bottom surface layer of described pcb board is provided with close pin chip and element; the below of pcb board is provided with protection tool, protection tool be provided with perforate for printing red glue and for the protection of chip and element and the groove mated with chip and element.Pcb board surface-assembled structure completes SMT assembling preferably by protection tool or white glue protective layer, and cost is lower and welding procedure is better.
Description
Technical field
The utility model relates to development and Design and the manufacturing field of PCBA, refers in particular to a kind of pcb board surface-assembled structure.
Background technology
Along with electronic product consumption demand is more and more personalized, product design is more and more miniaturized, the pressure of the more and more higher and cost of quality requirements, traditional four kinds of surface installation techniques (surface installation technique: Surface Mount Technology. abridges: SMT, hereinafter all represents with SMT) can not meet the manufacturing requirement of day by day miniaturized Intelligent control board completely.
Traditional SMT mode one:
By the TOP layer of paster part cloth at PCB, the TOP layer of DIP plug-in unit material also cloth at PCB, during the manufacturing, can directly adopt tin cream technique.Advantage is that efficiency and reliability are high; Shortcoming needs double sided board and large space, and material cost is high.
Traditional SMT mode two:
By the BOTTOM layer of paster part cloth at PCB, during the manufacturing, red adhesive process can be selected.Advantage to adopt single sided board, and material cost is lower; Shortcoming is reliability and produces first-pass yield not as good as tin cream technique.
Traditional SMT mode three:
Part paster part cloth is at the TOP layer of PCB, and part paster part cloth is at the BOTTOM layer of PCB.Advantage saves sheet material space, shortcoming be can not all close pin chips (chip of PIN distance≤0.4mm) and the element not meeting solder wave process requirement all cloth to TOP layer, be placed at the bottom of plate very difficult by solder wave process standard LAYOUT again; Need double sided board, cost is higher.
SMT mode four:
In recent years for solving some comparatively special SMT problems, introducing a paster part is placed on BOTTOM layer and adopts tin cream technique, then utilizes furnace tool protector sheet to cross the technology of Wave soldering furnace.Advantage to adopt single sided board to do tin cream technique, and the solder joint both having obtained high-quality has been got back cost advantage.Shortcoming has strict requirement to the distance between the paster part pad of BOTTON layer and DIP part pad, and the solder pad space length that generally need meet more than 3.0mm is best, so high to the space requirement of PCB, all applicable by the not every product of structural limitations.
China Patent Publication No. CN203942698U, publication date on November 12nd, 2014, name is called in the utility model patent of " the PCB encapsulating structures based on lightweight miniature SMT components and parts " and discloses a kind of PCB encapsulating structure based on the miniature SMT components and parts of lightweight, comprise pcb board base material, be at least two and be stretchingly distributed on this pcb board base material, and be provided with the SMT solder mask that square pads windows and window, and be arranged on square pads window in SMT pad, SMT pad is the symmetrical eight-sided formation that four equal long limits hypotenuse head and the tail equal with four connect and compose, wherein, four long limit one_to_one corresponding of SMT pad are close to the four edges that square pads is windowed, four corner one_to_one corresponding that four hypotenuses of SMT pad and square pads are windowed, and the angle between the hypotenuse of SMT pad and long limit is greater than 90 °, SMT solder mask outer peripheral shape of windowing is all identical with SMT pad with arrangement mode.Weak point is, this utility model still can not solve the problem that SMT cost is higher or efficiency is lower.
Utility model content
The purpose of this utility model overcomes the shortcoming that in prior art, SMT cost is higher or efficiency is lower, provides a kind of SMT cost lower and the pcb board surface-assembled structure that efficiency is higher.
The purpose of this utility model is achieved by following technical proposals:
A kind of pcb board surface-assembled structure; pcb board comprises top coat and bottom surface layer; it is characterized in that; the bottom surface layer of described pcb board is provided with close pin chip and element; the below of pcb board is provided with protection tool, protection tool be provided with perforate for printing red glue and for the protection of chip and element and the groove mated with chip and element.Element comprises the element that angles does not meet solder wave process requirement; close pin chip and this class component cannot meet DIP part pad and and paster pad between the LATOUT requirement of spacing >=3mm; therefore first close pin chip and this class component are adopted local tin cream technique; again by protection tool and the laminating of pcb board bottom surface layer; make the paster of other bottom surface layers adopt red adhesive process, when crossing wave-soldering, these chips utilize protection tool to avoid again welding destroyed.The effect of groove makes pcb board and protection tool perfection laminating.
As a kind of preferred version, groove and protection tool are for removably connecting.The effect removably connected makes can select flexibly, the need of employing tin cream technique, for not needing this to adopt the chip of tin cream technique to remove groove, to reach the effect of maximum using protection tool.
As a kind of preferred version, the outside of close pin chip and element is provided with white glue protective layer.The effect of white glue protective layer is identical with the effect of protection tool, coats for the close pin chip of local tin cream technique and element the welding again that white glue protective layer prevents when crossing wave-soldering.
The beneficial effects of the utility model are, pcb board surface-assembled structure completes SMT assembling preferably by protection tool or white glue protective layer, and cost is lower and welding procedure is better.
Accompanying drawing explanation
Fig. 1 is the structural representation of protection tool of the present utility model.
Wherein: 1, perforate, 2, groove.
Embodiment
Below in conjunction with drawings and Examples, the utility model is further described.
Embodiment 1: a kind of pcb board surface-assembled structure; pcb board comprises top coat and bottom surface layer; the bottom surface layer of described pcb board is provided with close pin chip and element; the below of pcb board is provided with protection tool; the structural representation of protection tool as shown in Figure 1, protection tool be provided with perforate 1 for printing red glue and for the protection of chip and element and the groove 2 mated with chip and element.Groove and protection tool are for removably connecting.
Close pin chip and the spacing do not met between the components and parts of solder wave process requirement and DIP part pad can be met when being greater than 3mm when PCB designs; product SMT assemble workshop section first with tin cream steel mesh close pin chip and the device printing not meeting solder wave process and erecting and welding is good; adopt special steel mesh to avoid already installed device again and carry out red offset printing brush; then paster solidification; cross stove when crossing wave-soldering with the device of special tool protection tin cream technique, sample just achieves local tin cream technique at the bottom of single sided board plate.
Embodiment 2: a kind of pcb board surface-assembled structure, its principle is substantially the same manner as Example 1, and difference is that the outside of close pin chip and element is provided with white glue protective layer.
Close pin chip and the spacing do not met between the components and parts of solder wave process requirement and DIP part pad cannot be met when being greater than 3mm when PCB design; product SMT assemble workshop section first with tin cream steel mesh the device printing not meeting solder wave process and erecting and welding is good; adopt special steel mesh to avoid already installed device again and carry out red offset printing brush; then paster solidification; crossing stove when crossing wave-soldering with the device of special white glue and high temperature welding resistance glue protection tin cream technique, so just achieving local tin cream technique at the bottom of single sided board plate.
Claims (3)
1. a pcb board surface-assembled structure; pcb board comprises top coat and bottom surface layer; it is characterized in that; the bottom surface layer of described pcb board is provided with close pin chip and element; the below of pcb board is provided with protection tool, protection tool be provided with perforate for printing red glue and for the protection of chip and element and the groove mated with chip and element.
2. a kind of pcb board surface-assembled structure according to claim 1, is characterized in that, described groove and protection tool are for removably connecting.
3. a kind of pcb board surface-assembled structure according to claim 1, is characterized in that, described close pin chip and the outside of element are provided with white glue protective layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420864342.3U CN204350460U (en) | 2014-12-31 | 2014-12-31 | A kind of pcb board surface-assembled structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420864342.3U CN204350460U (en) | 2014-12-31 | 2014-12-31 | A kind of pcb board surface-assembled structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204350460U true CN204350460U (en) | 2015-05-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201420864342.3U Active CN204350460U (en) | 2014-12-31 | 2014-12-31 | A kind of pcb board surface-assembled structure |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105323982A (en) * | 2015-11-16 | 2016-02-10 | 陕西航空电气有限责任公司 | Welding technology and protective jig for mix-assembled printed circuit board |
| CN109317369A (en) * | 2018-11-23 | 2019-02-12 | 东莞市奥海科技股份有限公司 | A kind of coating machine and its coating method for the red glue coating of wiring board |
-
2014
- 2014-12-31 CN CN201420864342.3U patent/CN204350460U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105323982A (en) * | 2015-11-16 | 2016-02-10 | 陕西航空电气有限责任公司 | Welding technology and protective jig for mix-assembled printed circuit board |
| CN109317369A (en) * | 2018-11-23 | 2019-02-12 | 东莞市奥海科技股份有限公司 | A kind of coating machine and its coating method for the red glue coating of wiring board |
| CN109317369B (en) * | 2018-11-23 | 2023-05-23 | 东莞市奥海科技股份有限公司 | Coating machine for coating red glue on circuit board and coating method thereof |
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