CN204335247U - Mobile electronic device radiator structure - Google Patents
Mobile electronic device radiator structure Download PDFInfo
- Publication number
- CN204335247U CN204335247U CN201420706754.4U CN201420706754U CN204335247U CN 204335247 U CN204335247 U CN 204335247U CN 201420706754 U CN201420706754 U CN 201420706754U CN 204335247 U CN204335247 U CN 204335247U
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- China
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- electronic device
- radiator structure
- mobile electronic
- conducting element
- device radiator
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Abstract
A kind of mobile electronic device radiator structure, comprise: a LCD MODULE and back of the body lid and an at least one heat conducting element, this LCD MODULE side is provided with a substrate, this substrate is provided with at least one electronic component, this back of the body lid has an accommodation space, this LCD MODULE system is relatively arranged in this accommodation space, this heat conducting element be arranged at described electronic component and the back of the body cover between, the described electronic component of this heat conducting element side correspondence contact, the described back of the body lid of opposite side correspondence contact, by design of the present utility model, utilize described heat conducting element that the uniform thermal power of this electronic component can be helped to scatter and do not produce accumulated heat, and reach the effect promoting the inner heat radiation rapidly of action electronic device.
Description
Technical field
The present invention relates to a kind of uniform thermal power of this electronic component that helps scatter and do not produce accumulated heat problem, and reach the mobile electronic device radiator structure promoting the inner heat radiation rapidly of action electronic device.
Background technology
In electronic device evolution, more and more high operation efficiency has been trend now with the process chip with high computing clock pulse; In addition the development of electronic installation more needs to be designer trends with compact, but under must reaching high operation efficiency and compact designer trends simultaneously, the difficulty that the radiating efficiency of its relative electronic installation is also more relative.
The electronic installation of prior art is in time operating, and the chip of its inside or processor carry out computing or process time, the temperature of chip or processor itself can raise, thus unnecessary heat is produced, if for frivolous running gear, such as ultra-thin mobile computer, flat computer, intelligent mobile phone etc. hand held device, previously mainly utilized the modes such as simple perforate, heat conduction, thermal convection to set about, but those radiating modes are with cannot the load heat energy that produces of high-effect chip or processor now.
But, along with existing hand held device usefulness is more and more higher, its internal central processing unit is then marched toward double-core or the even higher usefulness of four cores, and the faster heat that it produces of the treatment efficiency processing speed of central processing unit also certainly will be more and more higher, therefore existing hand held device has the problem of accumulated heat, heat energy cannot uniformly dispersing, causes the radiating efficiency reducing hand held device inside.
The above, prior art has its own shortcomings:
1. heat energy cannot uniformly dispersing;
2. can produce accumulated heat problem;
3. reduce action electronic device internal heat dissipating efficiency.
Therefore, how to solve above-mentioned existing problem and disappearance, the inventor being this case and the relevant manufactures of being engaged in the industry desire most ardently the place, direction studied and improve.
Summary of the invention
Therefore, for effectively solving the above problems, main purpose of the present invention is to provide a kind of uniform thermal power of this electronic component that helps to scatter the mobile electronic device radiator structure not producing accumulated heat.
Secondary objective of the present invention, is to provide a kind of mobile electronic device radiator structure that significantly can promote the inner heat radiation rapidly of action electronic device.
For reaching above-mentioned purpose, the invention provides a kind of mobile electronic device radiator structure, comprising: a LCD MODULE, this LCD MODULE side is provided with a substrate, and this substrate is provided with at least one electronic component; One back of the body lid, have an accommodation space, this LCD MODULE is relatively arranged in this accommodation space; And at least one heat conducting element, be arranged between described electronic component and the back of the body cover, the described electronic component of this heat conducting element side correspondence contact, the described back of the body of opposite side correspondence contact covers.
Preferably, this LCD MODULE side is more sticked a center, and described substrate is embedded on this center.
Preferably, this heat conducting element has one first side and one second side, the described electronic component of this first side correspondence contact, the described back of the body lid of this second side correspondence contact.
Preferably, this accommodation space has more a groove, and the second side of described heat conducting element is embedded in this groove.
Preferably, to can be heat pipe or temperature-uniforming plate or high heat-conducting wherein arbitrary for this heat conducting element.
Preferably, to can be U-shaped or L-type or S type or its alloytype shape wherein arbitrary for the shape of this heat pipe.
Preferably, this back of the body covers and is provided with a upper cover, this this LCD MODULE of upper cover cover cap and cover corresponding group establish with described back of the body.
Preferably, this upper cover position has a transparency carrier, and this transparency carrier covers relatively establishes described LCD MODULE.
Preferably, four corners of this heat conducting element are more formed with at least one hole, and described back of the body lid is to being formed with a fixed part in hole place, and at least one locking part runs through described hole and fixed part.
By the design of this structure of the present invention, utilize the described electronic component of described heat conducting element side correspondence contact, opposite side is the described back of the body lid of corresponding contact then, by the setting of described heat conducting element, the uniform thermal power that this electronic component can be helped to produce conducts to back of the body lid and dispels the heat, do not have the problem of accumulated heat, in addition, also can reach the effect promoting the inner heat radiation rapidly of action electronic device.
Accompanying drawing explanation
Fig. 1 is the three-dimensional exploded view of mobile electronic device radiator structure first embodiment of the present invention;
Fig. 2 is the three-dimensional combination figure of mobile electronic device radiator structure first embodiment of the present invention;
Fig. 3 is the assembled sectional view of mobile electronic device radiator structure first embodiment of the present invention;
Fig. 4 is the profile of mobile electronic device radiator structure first embodiment of the present invention;
Fig. 5 is the three-dimensional exploded view of mobile electronic device radiator structure second embodiment of the present invention;
Fig. 6 is the three-dimensional exploded view of mobile electronic device radiator structure the 3rd embodiment of the present invention;
Fig. 7 is the three-dimensional exploded view of mobile electronic device radiator structure the 4th embodiment of the present invention;
Fig. 8 is the three-dimensional exploded view of mobile electronic device radiator structure the 5th embodiment of the present invention;
Fig. 9 is the three-dimensional exploded view of mobile electronic device radiator structure the 6th embodiment of the present invention;
Figure 10 is the three-dimensional exploded view of mobile electronic device radiator structure the 7th embodiment of the present invention;
Figure 11 is the three-dimensional exploded view of mobile electronic device radiator structure the 8th embodiment of the present invention;
Figure 12 is the three-dimensional exploded view of mobile electronic device radiator structure the 9th embodiment of the present invention.
Symbol description
LCD MODULE 1
Center 11
Substrate 12
Electronic component 13
Back of the body lid 2
Accommodation space 21
Groove 22
Fixed part 23
Heat conducting element 3
First side 31
Second side 32
Hole 33
Upper cover 4
Transparency carrier 5
Locking part 6
Embodiment
Below with reference to drawing, detailed annotation embodiments of the invention:
Characteristic on above-mentioned purpose of the present invention and structure and fuction thereof, is explained the preferred embodiment according to institute's accompanying drawing.
Refer to Fig. 1 and 2 and 3 and 4, for the three-dimensional exploded view of the first embodiment of mobile electronic device radiator structure of the present invention and three-dimensional combination figure and assembled sectional view and profile, as shown in the figure, a kind of mobile electronic device radiator structure, comprise LCD MODULE 1 and back of the body lid 2 and an at least one heat conducting element 3, described LCD MODULE 1 side has been sticked a substrate 12, and this substrate 12 is provided with at least one electronic component 13;
Described LCD MODULE 1 side more can be sticked a center 11, and this substrate 12 is embedded on this center 11;
Described back of the body lid 2 has an accommodation space 21, and this LCD MODULE 1 is relatively arranged in this accommodation space 21;
Described heat conducting element 3 is arranged between described electronic component 13 and back of the body lid 2, this heat conducting element 3 has one first side 31 and one second side 32, the described electronic component 13 of this first side 31 correspondence contact, the described back of the body lid 2 of this second side 32 correspondence contact, wherein, in the first embodiment, this heat conducting element 3 explains with heat pipe, and the shape of this heat pipe is that U-shaped, S type, L-type heat pipe or its alloytype shape are regardless of;
Wherein, aforesaid back of the body lid 2 is provided with this LCD MODULE 1 of upper cover 4 cover cap, and establishes with corresponding group of described back of the body lid 2, this upper cover 4 position has a transparency carrier 512 again, and described LCD MODULE 1 established by this transparency carrier 512 relatively lid.
By the design of this structure of the present invention, the first side 31 correspondence of described heat conducting element 3 is utilized to attach described electronic component 13, and the second side 32 correspondence of this heat conducting element 3 attaches described back of the body lid 2, thus, after absorbing by described heat conducting element 3 heat energy that this electronic component 13 produces, uniform thermal power can be conducted to described back of the body lid 2 to dispel the heat, not have the generation of accumulated heat problem, and then solve the problem of action electronic device heat radiation; In addition, also can quick heat radiating in the confined space stressing light, thin, short, little action electronic device now, enter significantly to promote the radiating efficiency of action electronic device inside.
Refer to Fig. 5, for the three-dimensional exploded view of the second embodiment of mobile electronic device radiator structure of the present invention, described mobile electronic device radiator structure portion of element and interelement corresponding pass identical with aforesaid mobile electronic device radiator structure, therefore do not repeat them here, only this mobile electronic device radiator structure and aforementioned topmost difference are, the accommodation space 21 of described back of the body lid 2 has more a groove 22, second side 32 of described heat conducting element 3 is embedded in this groove 22, similarly, the first side 31 correspondence of described heat conducting element 3 is utilized to attach described electronic component 13, this second side 32 is embedded in this groove 22, the heat energy of this electronic component 13 is absorbed by this heat conducting element 3, can by the distribution of uniform thermal power, do not produce accumulated heat problem, and then solve the problem of action electronic device heat radiation, and quick heat radiating can be reached in the confined space, enter significantly to promote the radiating efficiency of action electronic device inside.
Refer to Fig. 6 and 7, for the three-dimensional exploded view of the 3rd and four embodiments of mobile electronic device radiator structure of the present invention, described mobile electronic device radiator structure portion of element and interelement corresponding pass identical with aforesaid mobile electronic device radiator structure, therefore do not repeat them here, only this mobile electronic device radiator structure and aforementioned topmost difference are, described heat conducting element 3 explains with heat pipe equally, and the shape of this heat pipe can be L-type heat pipe (as shown in Figure 4) or S type heat pipe (as shown in Figure 5), that is, described heat pipe can use the heat pipe of difformity according to the difference of electronic component 13 configuration mode of action electronic device inside, whereby, the heat energy of this electronic component 13 can be made more to scatter uniformly, improve accumulated heat problem, solve the problem of action electronic device heat radiation, and quick heat radiating can be reached in the confined space, enter significantly to promote the radiating efficiency of action electronic device inside.
Refer to Fig. 8 and 9, for the three-dimensional exploded view of the 5th and six embodiments of mobile electronic device radiator structure of the present invention, described mobile electronic device radiator structure portion of element and interelement corresponding pass identical with aforesaid mobile electronic device radiator structure, therefore do not repeat them here, only this mobile electronic device radiator structure and aforementioned topmost difference are, described heat conducting element 3 is chosen as temperature-uniforming plate, similarly, the described electronic component 13 of the first corresponding attaching in side 31 of temperature-uniforming plate can be utilized, and described second side 32 correspondence attaches described back of the body lid 2, after so absorbing by described heat conducting element 3 heat energy that this electronic component 13 produces, uniform thermal power is conducted to described back of the body lid 2 to dispel the heat, do not have the generation of accumulated heat problem, and then solve the problem of action electronic device heat radiation, in addition, can form described groove 22 (as shown in Figure 9) in the accommodation space 21 of described back of the body lid 2, described temperature-uniforming plate is embedded in this groove 22 relatively, by this structure, equally also can reach aforesaid effect.
Continue and refer to Figure 10, for the three-dimensional exploded view of the 7th embodiment of mobile electronic device radiator structure of the present invention, described mobile electronic device radiator structure portion of element and interelement corresponding pass identical with aforesaid mobile electronic device radiator structure, therefore do not repeat them here, only this mobile electronic device radiator structure and aforementioned topmost difference are, four corners of described heat conducting element 3 are more formed with at least one hole 33, described back of the body lid 2 is to being formed with a fixed part 23 in hole 33 place, at least one locking part 6 runs through described hole 33 and fixed part 23, in the present embodiment, described heat conducting element 3 utilizes riveted mode to be fixed on described back of the body lid 2 by heat conducting element 3 by this locking part 6, by this structure, equally also can reach aforementioned fixing effect.
Finally, refer to Figure 11 and 12, for the three-dimensional exploded view of the 8th and nine embodiments of mobile electronic device radiator structure of the present invention, described mobile electronic device radiator structure portion of element and interelement corresponding pass identical with aforementioned mobile electronic device radiator structure, therefore do not repeat them here, only this mobile electronic device radiator structure and aforementioned topmost difference are, described heat conducting element 3 is chosen as high heat-conducting (such as copper, aluminium, graphite, gold, silver or other alloys etc.), similarly, the described electronic component 13 of the first corresponding attaching in side 31 of the element of this high heat-conducting can be utilized, and described second side 32 correspondence attaches described back of the body lid 2, after so absorbing by described heat conducting element 3 heat energy that this electronic component 13 produces, uniform thermal power is conducted to described back of the body lid 2 to dispel the heat, do not have the generation of accumulated heat problem, and then solve the problem of action electronic device heat radiation, in addition, can form described groove 22 (as shown in figure 12) in the accommodation space 21 of described back of the body lid 2, the elements relative of described high heat-conducting is embedded in this groove 22, by this structure, equally also can reach aforesaid effect.
The above, the present invention has following advantages compared to prior art:
1. the uniform thermal power of electronic component can be made to scatter;
2. do not produce accumulated heat;
3. significantly promote action electronic device internal heat dissipating efficiency.
Although embodiment of the present utility model is open as above, but it is not restricted to listed in specification and execution mode utilization, it can be applied to various applicable field of the present utility model completely, for those skilled in the art, can easily realize other amendment, therefore do not deviating under the universal that claim and equivalency range limit, the utility model is not limited to specific details and illustrates here and the legend described.
Claims (9)
1. a mobile electronic device radiator structure, is characterized in that, comprising:
One LCD MODULE, this LCD MODULE side is provided with a substrate, and this substrate is provided with at least one electronic component;
One back of the body lid, have an accommodation space, this LCD MODULE is relatively arranged in this accommodation space; And
At least one heat conducting element, be arranged between described electronic component and the back of the body cover, the described electronic component of this heat conducting element side correspondence contact, the described back of the body of opposite side correspondence contact covers.
2. mobile electronic device radiator structure as claimed in claim 1, is characterized in that, this LCD MODULE side is more sticked a center, and described substrate is embedded on this center.
3. mobile electronic device radiator structure as claimed in claim 1, it is characterized in that, this heat conducting element has one first side and one second side, the described electronic component of this first side correspondence contact, the described back of the body lid of this second side correspondence contact.
4. mobile electronic device radiator structure as claimed in claim 3, it is characterized in that, this accommodation space has more a groove, and the second side of described heat conducting element is embedded in this groove.
5. mobile electronic device radiator structure as claimed in claim 4, it is characterized in that, it is wherein arbitrary that this heat conducting element can be heat pipe or temperature-uniforming plate or high heat-conducting.
6. mobile electronic device radiator structure as claimed in claim 5, is characterized in that, the shape of this heat pipe can be U-shaped or L-type or S type wherein arbitrary.
7. mobile electronic device radiator structure as claimed in claim 1, it is characterized in that, this back of the body covers and is provided with a upper cover, this this LCD MODULE of upper cover cover cap and cover corresponding group establish with described back of the body.
8. mobile electronic device radiator structure as claimed in claim 7, it is characterized in that, this upper cover position has a transparency carrier, and this transparency carrier covers relatively establishes described LCD MODULE.
9. mobile electronic device radiator structure as claimed in claim 5, it is characterized in that, four corners of this heat conducting element are more formed with at least one hole, and described back of the body lid is to being formed with a fixed part in hole place, and at least one locking part runs through described hole and fixed part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420706754.4U CN204335247U (en) | 2014-11-20 | 2014-11-20 | Mobile electronic device radiator structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420706754.4U CN204335247U (en) | 2014-11-20 | 2014-11-20 | Mobile electronic device radiator structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204335247U true CN204335247U (en) | 2015-05-13 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420706754.4U Withdrawn - After Issue CN204335247U (en) | 2014-11-20 | 2014-11-20 | Mobile electronic device radiator structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204335247U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105682418A (en) * | 2014-11-20 | 2016-06-15 | 奇鋐科技股份有限公司 | Heat emission structure for mobile electronic equipment |
| CN107027266A (en) * | 2016-01-29 | 2017-08-08 | 宏达国际电子股份有限公司 | Portable electronic devices |
| US10095284B2 (en) | 2016-01-29 | 2018-10-09 | Htc Corporation | Portable electronic device |
| CN110582180A (en) * | 2018-06-08 | 2019-12-17 | 广州力及热管理科技有限公司 | Electronic device casing with micro-heat pipe function |
| CN114233743A (en) * | 2020-09-09 | 2022-03-25 | 英业达科技有限公司 | Folding electronic device |
-
2014
- 2014-11-20 CN CN201420706754.4U patent/CN204335247U/en not_active Withdrawn - After Issue
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105682418A (en) * | 2014-11-20 | 2016-06-15 | 奇鋐科技股份有限公司 | Heat emission structure for mobile electronic equipment |
| CN105682418B (en) * | 2014-11-20 | 2018-09-25 | 奇鋐科技股份有限公司 | Mobile electronic device radiator structure |
| CN107027266A (en) * | 2016-01-29 | 2017-08-08 | 宏达国际电子股份有限公司 | Portable electronic devices |
| US10095284B2 (en) | 2016-01-29 | 2018-10-09 | Htc Corporation | Portable electronic device |
| CN110582180A (en) * | 2018-06-08 | 2019-12-17 | 广州力及热管理科技有限公司 | Electronic device casing with micro-heat pipe function |
| CN114233743A (en) * | 2020-09-09 | 2022-03-25 | 英业达科技有限公司 | Folding electronic device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20150513 Effective date of abandoning: 20180925 |